14results about How to "Low curing temperature" patented technology

The invention provides an epoxy curing agent as well as a preparation method and application thereof. The preparation method of the epoxy curing agent comprises the following steps: carrying out first reaction on a first mixed reaction system containing amino siloxane and a chain extender to obtain an intermediate product of which the main chain contains a-Si-O-Si-bond and the side chain contains amino; performing a second reaction on a second mixed reaction system containing the intermediate product and a cross-linking agent to obtain the epoxy curing agent, wherein the cross-linking agent comprises an acid cross-linking agent. A coating film formed by the epoxy resin coating containing the epoxy curing agent has excellent high temperature resistance and good flexibility.

The application belongs to a resin material, and aims at the technical problems that the existing phenolic resin material for casting has insufficient mechanical strength and high dependence on petroleum-based raw materials, which leads to insufficient environmental performance, and provides a biobased modified resol resin material for casting, a preparation method, an application and a 3D printed product. The resin material comprises a biobased modified resol resin, a biobased toughening agent, a thermal curing agent and other auxiliaries. The biobased modified resol resin is obtained by silanization of a phenolic mixture formed by cashew phenol and phenol after polycondensation with formaldehyde. The preparation method comprises pre-polymerization, free formaldehyde capture, silanization reaction and toughening / thermal curing mixing steps. By introducing cashew phenol and silanization modification structure, the application is beneficial to reduce the dependence on petroleum-based phenolic raw materials, improve the mechanical properties of the resin material, and reduce the free aldehyde content, and is suitable for 3D inkjet printing materials and 3D printed products for casting.

This invention discloses a rapid thermally conductive coated sand and its preparation process, relating to the field of coated sand technology. The raw materials include the following parts by weight: 100-105 parts raw sand, 6-8 parts modified resin prepolymer, 2-4 parts modified POE, 3.5-4.5 parts lubricant, and 3-5 parts nano-silicon nitride. The modified POE has a strong high-temperature toughening effect on the modified resin prepolymer and can also form chemical crosslinks with it, exhibiting strong compatibility with other raw materials in the coated sand. The modified resin prepolymer is obtained by heating and ring-opening polymerization of benzoxazine monomers obtained from the reaction of 5-nitrosalicylic acid, ethyl 2,4-ditrifluoromethyl-5-pyrimidinecarboxylate, paraformaldehyde, and furfurylamine. The modified resin prepolymer has a lower curing temperature and improved thermal stability, which helps to improve the high-temperature resistance of the coated sand.

The invention provides a carbon electrode and a preparation method and application thereof. The preparation method comprises the following steps: coating a substrate with carbon slurry to obtain a wet carbon film, and then coating the wet carbon film with liquid alkane to obtain the carbon electrode. The liquid alkane is introduced to the surface of the wet carbon film, and by means of the characteristic that the liquid alkane and the solvent of the carbon slurry are immiscible, the boiling point of a double-liquid system is reduced, the volatilization speed of the solvent in the carbon slurry is increased, the curing temperature of the carbon electrode is further reduced, and perovskite can be prevented from being decomposed at high temperature; and the damage of the solvent in the carbon slurry to the perovskite layer and other functional layers is greatly reduced, so that the efficiency of the subsequently prepared perovskite solar cell or laminated solar cell is remarkably improved. In addition, the preparation method is simple in process and low in cost, and has good development potential.

The invention discloses a full-water-based transparent coating for metal packaging, and belongs to the technical field of water-based coatings. The coating is a full water emulsion type dispersion system, and is prepared by taking an acrylate monomer, acrylonitrile and a hydroxyl-containing acrylic monomer as main film-forming substances through an anionic emulsion free radical emulsion polymerization mode. The coating does not contain an organic solvent in the preparation and use processes, film forming and curing are completed through moisture evaporation and cross-linking reaction after coating, and a transparent and compact protective coating can be formed at a low baking temperature. The obtained coating has good adhesive force, solvent resistance and flexibility, can meet the deformation requirements of metal packaging in the forming machining processes of stamping, stretching and the like, does not need to carry out chromate passivation treatment on a metal base material, meets the safety requirements of food contact materials, and is suitable for protective coating of the surfaces of metal packaging materials such as aluminum materials and tinplates.

The invention discloses a preparation method of an aluminum-containing high-temperature-resistant coating, which comprises a component A and a component B. The component A is prepared by mixing methyl phenyl organic silicon resin, an organic solvent, a flexibilizer, a leveling agent, an anti-settling agent, double-layer coated aluminum powder, modified carbon nanotubes and the like, and the component B is prepared by mixing the methyl phenyl organic silicon resin, the organic solvent, the flexibilizer, the leveling agent, the anti-settling agent, the double-layer coated aluminum powder, the modified carbon nanotubes and the like. And the component B is prepared by mixing polysilazane and 1-hydroxyethyl-3-methylimidazolium p-toluenesulfonate, and the component B is prepared by mixing the components. The obtained coating is low in curing temperature and has excellent corrosion resistance and high temperature resistance.

This application discloses a spin-coating carbon composition, a semiconductor fabrication method, and a semiconductor device. The spin-coating carbon composition comprises a cyclic phenolic resin. The cyclic phenolic resin used in this invention has the characteristics of small molecular weight, narrow molecular weight distribution, and active crosslinking groups distributed on the resin periphery. The spin-coating carbon composition based on the cyclic phenolic resin of this invention, while maintaining excellent coating performance, can significantly improve the thermal stability, etching resistance, and pattern fidelity of the thin film, providing a new generation of hard mask materials for advanced semiconductor manufacturing.

The application provides a kind of bio-based IMD ink and its preparation method, injection molding product and its processing method.The bio-based IMD ink includes the following components by mass fraction: ink: bio-based modified saturated polyester 50-60 parts;Dispersant 5-10 parts;Pigment 10-15 parts;Auxiliary 1-2 parts;Filler 5-8 parts;Solvent 20-30 parts;Adhesion agent 1-3 parts;Curing agent: bio-based modified PDI type curing agent 10-15 parts;Curing agent is added to ink mixture and coated on substrate film to form IMD ink layer.The bio-based IMD ink can ensure better adhesion strength and elongation performance, and has low VOC emission and environmental protection.

This application relates to the field of electrophoretic paint technology, specifically disclosing a low-temperature curing high-efficiency electrophoretic paint and its preparation method. The low-temperature curing high-efficiency electrophoretic paint comprises the following components by weight: 45-55 parts epoxy resin; 35-45 parts acrylic resin; 5-10 parts curing agent; 1-2 parts leveling agent; 1-2 parts anti-settling agent; and 5-10 parts pigment filler. The curing agent is a modified imidazole compound. The preparation method involves: mixing epoxy resin and acrylic resin by stirring; then adding the leveling agent, anti-settling agent, and pigment filler during stirring; and grinding the mixture after further stirring to obtain a resin mixture; finally, mixing the resin mixture and the curing agent to obtain the final product. The low-temperature curing high-efficiency electrophoretic paint of this application can significantly reduce the curing temperature, reduce energy consumption, reduce environmental pollution, and ensure that the electrophoretic paint has good film-forming properties, adhesion, and corrosion resistance during application.

The invention provides a single-component medium-low temperature thermocuring FPC (Flexible Printed Circuit) encapsulating adhesive and a preparation method thereof. The encapsulating adhesive is prepared from the following components in parts by weight: 20 to 50 parts of acrylate oligomer, 20 to 60 parts of reactive diluent, 0.5 to 5 parts of thermal initiator and 1 to 10 parts of rheological additive, wherein the reactive diluent is composed of a first reactive diluent and a second reactive diluent, the first reactive diluent comprises ACMO, and the second reactive diluent comprises at least one of IBOA and CTFA; the thermal initiator is prepared from at least one of azobisisoheptonitrile, azobisisobutyronitrile, benzoyl peroxide and dilauroyl peroxide. The encapsulating compound prepared by the preparation method disclosed by the invention has high efficiency, construction convenience and low energy consumption while ensuring mechanical properties.

The invention provides boron-zirconium modified ethyl silicate-based bonding glue, a preparation method and application. The boron-zirconium modified ethyl silicate-based bonding glue comprises the following components in parts by weight: 100 parts of ethyl silicate; 10 to 15 parts of ethanol; 0.1 to 1 part of a zirconium modifier; 0.1 to 1 part of a catalyst; 10 to 15 parts of a boron modifier; 50 to 70 parts of a diluent; 50 to 60 parts of filler; and 60-80 parts of a reinforcing filler. The boron-zirconium modified ethyl silicate-based adhesive disclosed by the invention has the advantages of low curing temperature, high temperature resistance, high bonding strength, variable-temperature impact resistance, environment friendliness and the like, and is suitable for high-temperature stress test of a silicon carbide ceramic substrate.

This invention provides a silicon-based protective coating based on room-temperature curing inorganic polymerization and synergistic thermal insulation technology. The technical solution uses inorganic polysilazane as the core to construct a ceramicized layer with a loose inorganic network. The polysilazane forms an inorganic network mainly composed of Si–O–Si and Si3N4 within the system, significantly reducing thermal conductivity. Based on this, nano-hollow ceramic microspheres are added to form numerous static air cavities within the coating to block heat conduction paths. Simultaneously, titanium dioxide and aluminum powder form an intercalation structure with the network-like ceramicized polysilazane, achieving specular reflection and suppressing radiative heat transfer. These three thermal insulation mechanisms work together to form a triple synergistic thermal insulation effect. Furthermore, this invention uses nano-alumina as a filler to form a filling structure within the network-like ceramicized layer formed by the polysilazane, and it interpenetrates with nickel acetylacetonate. This infiltration and cross-linking structure lowers the curing temperature and forms a dense coating on the substrate, improving the overall physical properties of the coating.

The invention discloses an intrinsic flame-retardant epoxy resin containing a DOPO-based s-triazine ring curing agent and a preparation method thereof, and the preparation method comprises the following steps: (1) adding 2, 4-diamino-6-(4-pentenyl)-1, 3, 5-triazine into a hydrochloric acid aqueous solution, stirring, and filtering to obtain hydrochloride of 2, 4-diamino-6-(4-pentenyl)-1, 3, 5-triazine; (2) carrying out vacuum drying on the hydrochloride, adding an organic solvent and DOPO (9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide), uniformly stirring, heating to 90 + / -10 DEG C, dropwise adding a catalyst azodiisobutyronitrile solution, and carrying out heat preservation reaction; and (3) after the reaction is finished, carrying out reduced pressure distillation to remove the solvent, washing, and carrying out vacuum drying to obtain the s-triazine ring curing agent. And (4) mixing the s-triazine ring curing agent with bisphenol A epoxy resin, heating and curing to obtain the intrinsic flame-retardant epoxy resin. The prepared epoxy resin is excellent in flame retardant property, LOI reaches 42.5% or above, and the maximum LOI can reach 48.3%. And the process is simple, and the curing temperature of the curing agent can be as low as 100 DEG C or below.

The application discloses a kind of conformal heat-conducting insulating composite material and its preparation method and application method, it is related to semiconductor packaging and thermal management technical field.The composite material includes: organic polysilazane resin 40-60 parts, toughening agent 4-10 parts, crosslinking agent 0.1-3 parts, low dielectric heat-conducting filler 35-85 parts, heat-conducting filler dispersant 0.3-2 parts, low volume shrinkage modifier 5-10 parts, catalyst 0.1-1 part, polymerization inhibitor 0.01-0.06 parts, solvent 5-90 parts;Wherein low dielectric heat-conducting filler is hexagonal boron nitride nanosheet, spherical silicon powder and the complex of undefined aluminum nitride, low volume shrinkage modifier is cage-type silsesquioxane.The composite material of the application can perfectly fill micron chip gap, volume shrinkage rate is low after solidification, interface thermal resistance is small, has excellent temperature resistance and high insulation, can satisfy the requirement of high-end equipment manufacturing field such as aerospace, high-performance computing to thermal management material.