70results about How to "Low curing temperature" patented technology

The invention relates to the field of friction materials, and discloses a friction material with a stable friction coefficient for an electromagnetic brake and a preparation method of the friction material. An adhesive comprises polysiloxane modified phenolic resin, benzoxazine and butyronitrile rubber powder; the reinforcing material comprises 1414 para-aramid pulp, calcium sulfate whiskers, composite mineral fibers, copper fibers and modified needle-like wollastonite; the friction increasing material comprises macroporous shell activated carbon, friction particles, garnet powder, barite and nano hafnium nitride; the antifriction material comprises graphite fluoride, nylon and composite modified hydroxyl silicate; the composite modified hydroxyl silicate is obtained by modifying hydroxyl silicate with diisocyanate and stearic acid and then compounding silane modified micro-nano calcium carbonate. The friction material provided by the invention is used for improving the braking stability of an electromagnetic brake and reducing equipment vibration.

The invention relates to an epoxy resin composition and a preparation method thereof, and an epoxy resin prepreg and a preparation method thereof. Comprising the following steps: mixing epoxy resin, 2, 4-diphenylmethane diisocyanate and 4, 4-diphenylmethane diisocyanate, and synthesizing under the action of a catalyst to obtain a transparent toughening agent; mixing the mixed epoxy resin and the transparent toughening agent to obtain a first mixed solution; adding a defoaming agent, an ultraviolet light absorber, an antioxidant, a light stabilizer and a fluorescent agent to obtain a second mixed solution; cooling the second mixed solution to 60-70 DEG C, adding a curing agent and an accelerant, preserving heat, vacuumizing, defoaming and mixing for 0.3-0.4 hour to obtain an epoxy resin composition; the invention provides an epoxy resin composition and a preparation method thereof as well as an epoxy resin prepreg and a preparation method thereof. The preparation method of the epoxy resin composition is used for solving the technical problem of no research on heat resistance, high transparency, yellowing resistance and high toughness of an epoxy resin material at present.

The invention discloses a coating as well as a preparation method and application thereof and a coated product. According to the coating provided by the invention, the curing modification of the epoxy resin coating is realized by adjusting the components of the curing agent: a primary amine group contained in the curing agent reacts with an epoxy group to generate secondary amine and hydroxyl, and nitrogen atoms can improve the heat-resistant stability of a cross-linked network; a phenolic hydroxyl group reacts with an epoxy group to generate an ether bond and a hydroxyl group, and the ether bond can improve the overall flexibility of an epoxy resin coating; the anhydride group reacts with the epoxy group to generate various anhydride epoxy intermediates, so that the overall heat resistance of the epoxy resin is improved; the introduction of the ammonium salt can reduce the curing temperature of the epoxy resin, and the introduction of the metal ions can improve the anti-rust performance of the epoxy coating. Finally, the curing agent is used for curing the epoxy resin, so that the corrosion resistance, the adhesive property and the high-temperature resistance of the coating can be remarkably improved, and the application requirements in extremely severe environments such as high humidity and heat, acid-base corrosion and the like can be met.

The invention belongs to the technical field of carbon materials and new energy materials, and particularly relates to a modified resin-based nitrogen-containing hard carbon material as well as a preparation method and application thereof. Melamine is introduced into a phenolic resin system to synthesize phenol-melamine-formaldehyde resin, triazacyclo-covalently polymerized resin molecules are formed, an organic pore-forming agent is synchronously used for adjusting the pore channel structure of the material, and after high-temperature carbonization, the high-temperature carbonization is performed to obtain the high-temperature-resistant phenolic resin. And the hard carbon negative electrode material for the sodium ion battery, which is high in nitrogen doping, rich in closed pore structure and disordered in microstructure, is prepared. After melamine participates in the reaction, a triazacyclo ring with a stable structure is introduced into a resin molecular structure, and the nitrogen-doped hard carbon material is formed after carbonization. Nitrogen elements are uniformly distributed in the carbon material and on the surface of the carbon material, abundant active sites are provided, and the reversible capacity of sodium ion storage can be improved.

The invention relates to the technical field of epoxy adhesives, in particular to a room-temperature-curing high-temperature-resistant heat-conducting epoxy adhesive and a preparation method thereof. Comprising a component A and a component B. The component A comprises, by weight, 60-135 parts of epoxy resin, 10-30 parts of a flexibilizer, 30-85 parts of a filler and 2-15 parts of an auxiliary agent, and the component B comprises, by weight, 40-90 parts of an amine curing agent, 10-30 parts of high-temperature-resistant resin, 30-60 parts of a filler and 2-12 parts of an additive. The epoxy resin comprises bisphenol A epoxy resin, novolac epoxy resin, polyurethane modified resin and multifunctional epoxy resin. The product has good mechanical properties and excellent temperature resistance, and the toughening agent and the resin powder are reasonably matched to ensure that the product has excellent impact resistance and temperature resistance. A plurality of amine curing agents are reasonably matched, so that the product can be cured at room temperature and used at high temperature, and meanwhile, the temperature resistance of the product is further improved by adding the high-temperature-resistant resin.

The invention discloses a high-flexibility wave-absorbing coating based on sphere / sheet compounding as well as a preparation method and application thereof, and relates to the technical field of electromagnetic shielding. The wave-absorbing coating comprises a spherical absorbent, a flaky absorbent, a rubber toughening agent, a resin matrix, a curing agent, a dispersing agent and an anti-settling agent. According to the invention, through the spherical absorbent / flaky absorbent blending'seesaw 'structural design, the reflection loss performance of the wave-absorbing coating is ensured, the frictional resistance among absorbent particles is reduced, the Poisson's ratio of the coating is improved, and the flexibility of the coating is enhanced.

The invention provides a latent accelerator based on anhydride-tertiary amine dynamic ion pairs as well as a preparation method and application of the latent accelerator. The latent accelerator is a reaction product of a first component and a second component, the first component comprises a substance with an acid anhydride structure, the second component comprises a compound with a tertiary amine structure, and the latent accelerator has an acid anhydride-tertiary amine dynamic ion pair. The latent accelerator provided by the invention can realize long-term storage and medium and low temperature curing of a single-component thermosetting material, and is particularly applied to an epoxy-anhydride system, an epoxy-phenolic aldehyde system, an epoxy-dicyandiamide system, an epoxy-mercaptan system, an epoxy-hydrazide system, an epoxy-4, 4 '-dihydroxybenzenesulfonic acid system, a curing agent and a curing agent. When being used in epoxy resin systems such as 4, 4 '-diaminodiphenyl sulfone systems, the curing temperature of the epoxy resin systems can be reduced, and the epoxy resin systems can be stored for a long time.

The invention relates to the technical field of adhesives, in particular to a high-temperature reaction type adhesive film as well as a preparation method and a use method thereof. The adhesive comprises 40-60 parts of phenolic resin, 40-60 parts of nitrile rubber, 10-20 parts of tackifying resin, 10-20 parts of reactive resin, 3-9 parts of a curing agent, 0.5-2 parts of a vulcanizing agent, 0.5-2 parts of an accelerant, 5-15 parts of filler, 0.5-1 part of an antioxidant and 1-3 parts of carbon black. According to the invention, the reaction type resin is used, so that the reaction can be rapidly carried out at a certain temperature, the reaction activity of an adhesive system is improved, the adhesion to a bonding substrate is increased, the curing time and the curing pressure can be effectively reduced, and good bonding strength can be achieved under the conditions that the curing time is 2-3 minutes and the minimum curing pressure is 0.4 MPa. And the tackifying resin can provide a small amount of initial viscosity for the adhesive film, and is beneficial to bonding and positioning of the adhesive film. The problems of low curing speed and poor bonding positioning of the phenolic aldehyde-butyronitrile adhesive film are solved, and the industrial application of the adhesive film is favorably expanded. The adhesive film is simple and convenient to operate, quick, efficient, green, environment-friendly, good in comprehensive performance and suitable for the requirements of industrial production.

The present disclosure relates to the technical field of lubricating coatings, and specifically to a low-temperature curing lubricating coating for fan bearings and a preparation method thereof. The lubricating coating comprises the following components by weight: 55-65 parts of a mixed solvent, 10-15 parts of a composite bonding resin, 10-15 parts of a modified lubricating filler, 8-12 parts of a wear-resistant filler, 0.5-3 parts of a dispersant, 0.5-1 parts of micronized dicyandiamide, 0.5-2 parts of a leveling agent, 0.5-2 parts of a defoamer, and 0.5-1 parts of an anti-settling agent; wherein the composite bonding resin comprises the following components by weight: 10-20 parts of an organic silicone resin, 15-30 parts of a phenolic epoxy resin, 15-30 parts of a polyurethane acrylate, and 35-45 parts of a polyhydroxy polyether resin; the modified lubricating filler is obtained by modifying a mixed powder containing molybdenum disulfide and polytetrafluoroethylene. The present disclosure can improve the adhesion, wear resistance, and lubrication performance of the lubricating coating and reduce the curing temperature.

The invention belongs to the technical field of stealth materials, and particularly discloses a radar wave-absorbing repair coating capable of being rapidly cured at low temperature as well as a preparation method and application of the radar wave-absorbing repair coating. Comprising the following raw materials: 18%-22% of organic silicon resin, 3%-7% of epoxy modified organic silicon resin, 4%-8% of a diluent, 56%-64% of an absorbent, 2.5%-3.5% of a curing agent, 1.5%-2.5% of an accelerant, 1.5%-2.5% of a thermal initiator and 1%-3% of an auxiliary agent. Wherein the curing agent is formed by compounding a reaction type curing agent and a catalytic type curing agent, and the mass percent of the reaction type curing agent to the catalytic type curing agent is (2-3): (1-1.5). The radar wave-absorbing repair coating provided by the invention can realize low-temperature rapid curing, has good tensile bonding strength, impact resistance and long-term test temperature resistance, is mature and controllable in process, and completely meets the application of external field rapid repair of radar wave-absorbing coatings of various equipment.

The invention belongs to the technical field of printed circuit boards, and discloses a rapid bonding resin composition, an adhesive film and application. The rapid bonding resin composition is prepared from the following raw materials in parts by mass: 15 to 25 parts of carboxyl-containing benzoxazine resin, 5 to 10 parts of epoxy resin, 17 to 26 parts of solid carboxy nitrile rubber, 0.25 to 0.5 part of cross-linking agent and 3 to 8 parts of inorganic filler. The adhesive film prepared from the resin composition can be quickly adhered, has high peel strength and good acid and alkali resistance and thermal shock resistance, and meets the production and adhesion requirements of flexible printed circuit boards.

The invention discloses perfluoropolyether siloxane, a preparation method thereof and an anti-fingerprint agent, and belongs to the field of anti-fingerprint agents. The preparation method comprises the following steps: firstly, preparing a perfluoropolyether intermediate containing an epoxy group, and then reacting with secondary amino siloxane and halogenated alkyl siloxane in sequence to obtain perfluoropolyether siloxane containing a tertiary amine bond. According to the perfluoropolyether siloxane, due to the existence of tertiary amine bonds, the curing temperature can be effectively reduced, and the purpose of curing to form a film at normal temperature is achieved. In addition, after being prepared into an anti-fingerprint agent, the anti-fingerprint agent can act on the surfaces of base materials made of different materials and is cured to form a film, and meanwhile, the anti-fingerprint agent has excellent fingerprint resistance, friction resistance and the like. The preparation method is simple to operate and mild in condition, and has a wide application prospect.

The present invention relates to a MDF formaldehyde-free powder coating, which comprises the following components by weight: 50-70 parts of epoxy resin, 50-70 parts of polyester resin, 3-6 parts of curing accelerator, 2-10 parts of silicon-titanium self-cleaning agent, 10-40 parts of barium sulfate, 1-4 parts of leveling agent, and 1-4 parts of benzoin. The present invention also discloses a silicon-titanium self-cleaning agent and a preparation method for the MDF formaldehyde-free powder coating. The MDF formaldehyde-free powder coating disclosed by the present invention has low curing temperature, excellent formaldehyde removal effect, and also has a lasting formaldehyde removal effect.

The application discloses a high-temperature-resistant heat-conducting insulating composite material and preparation and application thereof, and is composed of one-component solvent-free composite material of boron phenolic resin 25-35 parts, trifunctional or tetrafunctional epoxy active diluent 20-30 parts, vinyl-terminated polysilazane 10-15 parts, elastic saturated polyester resin 3-8 parts, coupling agent 1-5 parts, nano nitride 10-15 parts, latent curing agent 10-15 parts, defoaming agent 0.5-1 part, dispersing agent 0.5-1 part and coloring pigment 0.5-3 parts. The application can effectively solve the problem that high-end electronic packaging materials cannot realize long-term heat resistance, high-efficiency heat conduction and high-insulation performance cooperation simultaneously under high-temperature working conditions above 450 DEG C.

The invention relates to a cathodic disbonding resistant coating which comprises a component A and a component B. The mass ratio of the component A to the component B is 20: (3-5). The component A comprises the following components in parts by weight: 25-31 parts of bisphenol A epoxy resin; 4-5 parts of a reactive diluent; 0.5 to 1.5 parts of an anti-sagging auxiliary agent; 0.3 to 0.8 part of a dispersant; 8 to 12 parts of titanium dioxide; 2-5 parts of iron oxide red; 5-8 parts of an anti-rust pigment; 2-3 parts of polyamide wax; 28-37 parts of a functional filler; the component B is phenolic aldehyde amine resin; the cathodic disbonding resistant coating disclosed by the invention is simple in preparation method, excellent in corrosion resistance, capable of being thickly coated and suitable for a long-term application environment.

The present invention relates to a high-performance resin matrix suitable for room temperature RTM process and a preparation method thereof, belonging to the technical field of epoxy resin preparation. The high-performance resin matrix comprises the following components in parts by weight: 80-120 parts of multifunctional epoxy resin, 1-15 parts of epoxy diluent, 80-220 parts of anhydride curing agent, and 1-3 parts of catalyst. The present invention selects a glycidyl ester epoxy resin with low viscosity as the resin matrix, and reduces the viscosity of the resin and increases its operating time by introducing a small amount of active epoxy diluent; adds anhydride curing agent to further reduce the viscosity of the resin formula and increase its operating time; adds a suitable catalyst to reduce the operating temperature of the resin to room temperature and reduce the curing temperature, so that the resin has the advantages of low viscosity, ultra-long room temperature operating time and low curing temperature; at the same time, it has excellent comprehensive mechanical properties and heat resistance, and is suitable for the RTM molding process of large composite material structural parts.

The invention discloses a photoresponsive epoxy resin based on an azopyridine structure, and its preparation method is as follows: the amino derivatives containing azopyridine structure and epoxy resin monomer are dissolved in N, N-dimethylformamide, poured into a mold, and after drying the solvent at 50 ° C in an oven, heated to 120-160 ° C for curing reaction for 4-5h to obtain a photoresponsive epoxy resin. The photoresponsive method of the photoresponsive epoxy resin is: the epoxy resin is stretched 5%-100% at 70-150 ° C and then cooled to room temperature, and the epoxy resin is deformed under ultraviolet light irradiation of 340-380nm, and the deformed position is continuously irradiated with visible light of 420-460nm, and the epoxy resin returns to its original state. The preparation method of the photoresponsive epoxy resin based on the azopyridine structure prepared by the present invention is simple, the curing temperature is low, the curing reaction time is short, and the material has excellent mechanical properties, shape memory properties and photoresponsive properties, and has broad application prospects in the field of smart materials.

The invention discloses a modified tetraphenylacetylene silane resin prepolymer and a preparation method thereof. Specifically, the invention discloses a modified tetraphenylacetylene silane resin prepolymer which is of a three-dimensional network structure and has a repeated structural unit shown in the specification. # imgabs0 #

The invention provides a preparation method of a normal-temperature curing high-temperature-resistant thermocouple adhesive, which comprises the following steps: heating and stirring a dihydric phosphate aqueous solution until the solution is transparent, adding an oxalic acid solution, and cooling to obtain a viscous aluminum phosphate adhesive aqueous solution; the preparation method comprises the following steps: stirring and mixing a solvent, water, ammonia water, tetraethoxysilane, alkali metal oxide and ceramic powder, dropwise adding a replenishing solution in the stirring process to obtain a mixed solution, and continuously stirring, aging, filtering, washing and drying the mixed solution to obtain a coated curing agent; the filling curing agent and the aluminum phosphate adhesive aqueous solution are stirred and mixed, and the normal-temperature curing high-temperature-resistant thermocouple adhesive is obtained.The prepared adhesive is low in curing temperature, capable of resisting the high temperature of 1200 DEG C, good in insulating property, free of pungent smell during coating, safe and environmentally friendly.

The invention provides an epoxy curing agent as well as a preparation method and application thereof. The preparation method of the epoxy curing agent comprises the following steps: carrying out first reaction on a first mixed reaction system containing amino siloxane and a chain extender to obtain an intermediate product of which the main chain contains a-Si-O-Si-bond and the side chain contains amino; performing a second reaction on a second mixed reaction system containing the intermediate product and a cross-linking agent to obtain the epoxy curing agent, wherein the cross-linking agent comprises an acid cross-linking agent. A coating film formed by the epoxy resin coating containing the epoxy curing agent has excellent high temperature resistance and good flexibility.

The invention discloses a high-performance low-temperature curing powder coating and a preparation method thereof, and belongs to the technical field of powder coating. The raw materials of the powder coating include: 80-90 parts of acrylic resin, 10-20 parts of epoxy resin, 20-30 parts of curing agent, 10-20 parts of filler, 5-10 parts of pigment, 4-8 parts of auxiliary agent, 4-6 parts of photoinitiator, 2-6 parts of degassing agent, 1-1.5 parts of tetrabutylammonium-di[methylphenyl disulfide] complex copper, 0.2-0.8 parts of leveling agent, 0.8-1.2 parts of antioxidant, and 0.2-0.4 parts of benzoin. There is a chemical reaction between the filler and the auxiliary agent containing nitrogen, phosphorus and silicon elements, and there is a chemical reaction between the auxiliary agent and the acrylic resin, and the three constitute a hybrid cross-linked network, so the powder coating is heat-resistant and high-temperature-resistant, and has an excellent and stable flame retardant effect. The auxiliary agent synergizes with the degassing agent, the leveling agent, etc., so that the powder coating has a low curing temperature, a fast curing speed and an excellent leveling effect.

The application belongs to a resin material, and aims at the technical problems that the existing phenolic resin material for casting has insufficient mechanical strength and high dependence on petroleum-based raw materials, which leads to insufficient environmental performance, and provides a biobased modified resol resin material for casting, a preparation method, an application and a 3D printed product. The resin material comprises a biobased modified resol resin, a biobased toughening agent, a thermal curing agent and other auxiliaries. The biobased modified resol resin is obtained by silanization of a phenolic mixture formed by cashew phenol and phenol after polycondensation with formaldehyde. The preparation method comprises pre-polymerization, free formaldehyde capture, silanization reaction and toughening / thermal curing mixing steps. By introducing cashew phenol and silanization modification structure, the application is beneficial to reduce the dependence on petroleum-based phenolic raw materials, improve the mechanical properties of the resin material, and reduce the free aldehyde content, and is suitable for 3D inkjet printing materials and 3D printed products for casting.

The invention provides an adhesive for a flexible copper-clad plate as well as a preparation method and application of the adhesive, and relates to the technical field of organic synthesis. Specifically, the adhesive comprises a first component and a second component, wherein the first component comprises 60-80 parts of polyester resin, 20-30 parts of phenolic resin, 0.5-1 part of a coupling agent and a plurality of solvents; the second component comprises epoxy resin; and the polyester resin is obtained by polycondensation of components including dibasic acid, dihydric alcohol, diamine, tribasic acid and trihydric alcohol. The adhesive disclosed by the invention can effectively overcome the defects of low heat resistance, long curing time, short storage period and the like of a conventional epoxy system; the adhesive disclosed by the invention has the advantages of low-temperature curing, high heat resistance, high toughness, high peel strength, long storage period and the like, and has a good application prospect.

The invention discloses a reducing sugar-fatty amine adhesive which is prepared by the following steps: adding fatty amine into a reducing sugar aqueous solution with the mass concentration of 20-60%, uniformly mixing, and reacting in a water bath at 40-60 DEG C for 10-60 minutes or stirring at room temperature for 24-48 hours, the curing temperature of the adhesive is 100-140 DEG C. The adhesive disclosed by the invention has the advantages of simplicity in preparation, low price, easily available raw materials, no formaldehyde release, excellent performance, low curing temperature and the like, and when the reducing sugar-aliphatic amine adhesive is applied to wood and bamboo bonding, excellent bonding strength and water resistance are shown; the adhesive is suitable for industrial popularization and application in the production field of plywood and shaving boards.

The present invention relates to the technical field of epoxy resin curing agents, and provides a trifunctional modified imidazole curing agent, a preparation method thereof, and an application thereof. The present invention introduces a benzene ring group having good compatibility with epoxy resin into the structure of the modified imidazole curing agent, and at the same time increases the functionality of the curing agent, thereby improving the curing degree of the epoxy resin and improving the mechanical properties of the cured product. The trifunctional modified imidazole curing agent provided by the present invention has a low curing temperature and a high hardness of the cured product, and has very important application significance in the field of low-temperature curing of epoxy powder coatings. The present invention also provides a preparation method of the trifunctional modified imidazole curing agent described in the above scheme, which adopts the glycidyl ether of the triphenol methane structure and the common imidazole curing agent as the main raw materials to prepare the trifunctional modified imidazole curing agent, which has low cost, simple process, and is suitable for industrial production.

The invention discloses an epoxy resin composition for winding a fiber prepreg tape and a preparation method of the epoxy resin composition, and relates to the technical field of composites.The epoxy resin composition is prepared from 50-100 parts of liquid epoxy resin, 10-40 parts of solid epoxy resin, 3-10 parts of curing agent, 3-10 parts of accelerant and 0.1-2 parts of auxiliaries. Stirring at 100 DEG C until the mixture is molten, and cooling to 65 DEG C to obtain a component A; the curing agent, the accelerant, the liquid epoxy resin and the auxiliaries are additionally stirred and subjected to three-axis grinding to serve as a component B; and adding the component B into the component A, stirring for 30 minutes, and then sub-packaging and freezing to overnight. According to the epoxy resin composition for winding the fiber prepreg tape and the preparation method of the epoxy resin composition, the epoxy resin composition has proper operability and can be well matched with a dry winding process, and key processing variables such as the fiber direction and the resin content are conveniently and accurately controlled in the dry winding process, so that the quality of a finished product is more uniform and consistent.

The invention relates to a preparation process of a nano-silver composite conductive adhesive. The nano-silver composite conductive adhesive comprises the following components in parts by weight: 100 parts of epoxy resin, 50-60 parts of a curing agent, 1-3 parts of an accelerant, 1-5 parts of a coupling agent, 1-3 parts of a performance additive, 1-5 parts of gaseous silicon, 100-200 parts of a diluent, 100-200 parts of nano-silver powder and 600-700 parts of common silver powder. According to the preparation process of the nano-silver composite conductive adhesive, the intermediate and the intermediate added with the two silver powder are subjected to three-roller grinding through three-time high-speed uniform stirring and simultaneous first-time stirring and last-time stirring, the grinding fineness is relatively fine, the nano-silver powder can be uniformly dispersed in a system, and the huddling phenomenon is avoided. And after a certain proportion of nano silver powder is introduced into the conductive adhesive with the same silver content, the electrical conductivity and the thermal conductivity are greatly improved.

The present invention relates to the technical field of photosensitive dielectric materials, and in particular, to a photosensitive polyimide composition, a cured product and an electronic component. The photosensitive polyimide composition comprises the following components: (a) a block polymer soluble in an alkaline aqueous solution; its structural formula is shown in the following formula 1: #imgabs0##imgabs1# wherein k+m=5-200, m / k=0.01-0.5; Ar1 ​​is selected from a 4-valent organic group, Ar2 is selected from a 2-valent organic group, and Ar3 is selected from a 4-valent organic group; (b) a photosensitizer; (c) a thermal crosslinking agent. The photosensitive polyimide composition can be developed with an alkaline aqueous solution, can effectively replicate fine patterns, has a high film retention rate after development, has excellent chemical resistance stability after curing, has an excellent cured residual film rate and good adhesion, and has a low curing temperature.

The invention discloses a preparation method of a cathode wire for an electric dust remover, which comprises the following steps: phosphating the cathode wire to form a layer of phosphating film with a microporous structure on the surface of the cathode wire; coating the cathode wire with a nano ceramic coating, and enabling the nano ceramic coating to permeate into the microporous structure of the phosphating film in a wet film state; the nano ceramic coating comprises the following raw materials: nano particles and a solvent, and baking the cathode wire at 90-120 DEG C for 20-40 minutes, so that the coating on the surface of the cathode wire is cured to form a nano ceramic coating with the thickness of 10-50 microns, thereby obtaining the cathode wire for the electric dust remover. The cathode wire is subjected to phosphating treatment and paint coating, so that the cathode wire has excellent dust sticking prevention and easy cleaning performance, the adopted nano ceramic paint can well permeate into a microporous structure in a phosphating film under the capillary action in a wet film state, and the corrosion resistance of the coating can be further improved through the action of chemical bonds; and the binding force between the coating and the substrate is improved.

This invention discloses a rapid thermally conductive coated sand and its preparation process, relating to the field of coated sand technology. The raw materials include the following parts by weight: 100-105 parts raw sand, 6-8 parts modified resin prepolymer, 2-4 parts modified POE, 3.5-4.5 parts lubricant, and 3-5 parts nano-silicon nitride. The modified POE has a strong high-temperature toughening effect on the modified resin prepolymer and can also form chemical crosslinks with it, exhibiting strong compatibility with other raw materials in the coated sand. The modified resin prepolymer is obtained by heating and ring-opening polymerization of benzoxazine monomers obtained from the reaction of 5-nitrosalicylic acid, ethyl 2,4-ditrifluoromethyl-5-pyrimidinecarboxylate, paraformaldehyde, and furfurylamine. The modified resin prepolymer has a lower curing temperature and improved thermal stability, which helps to improve the high-temperature resistance of the coated sand.