3results about How to "Low curing temperature" patented technology

This application discloses a spin-coating carbon composition, a semiconductor fabrication method, and a semiconductor device. The spin-coating carbon composition comprises a cyclic phenolic resin. The cyclic phenolic resin used in this invention has the characteristics of small molecular weight, narrow molecular weight distribution, and active crosslinking groups distributed on the resin periphery. The spin-coating carbon composition based on the cyclic phenolic resin of this invention, while maintaining excellent coating performance, can significantly improve the thermal stability, etching resistance, and pattern fidelity of the thin film, providing a new generation of hard mask materials for advanced semiconductor manufacturing.

This invention provides a silicon-based protective coating based on room-temperature curing inorganic polymerization and synergistic thermal insulation technology. The technical solution uses inorganic polysilazane as the core to construct a ceramicized layer with a loose inorganic network. The polysilazane forms an inorganic network mainly composed of Si–O–Si and Si3N4 within the system, significantly reducing thermal conductivity. Based on this, nano-hollow ceramic microspheres are added to form numerous static air cavities within the coating to block heat conduction paths. Simultaneously, titanium dioxide and aluminum powder form an intercalation structure with the network-like ceramicized polysilazane, achieving specular reflection and suppressing radiative heat transfer. These three thermal insulation mechanisms work together to form a triple synergistic thermal insulation effect. Furthermore, this invention uses nano-alumina as a filler to form a filling structure within the network-like ceramicized layer formed by the polysilazane, and it interpenetrates with nickel acetylacetonate. This infiltration and cross-linking structure lowers the curing temperature and forms a dense coating on the substrate, improving the overall physical properties of the coating.

The application discloses a kind of conformal heat-conducting insulating composite material and its preparation method and application method, it is related to semiconductor packaging and thermal management technical field.The composite material includes: organic polysilazane resin 40-60 parts, toughening agent 4-10 parts, crosslinking agent 0.1-3 parts, low dielectric heat-conducting filler 35-85 parts, heat-conducting filler dispersant 0.3-2 parts, low volume shrinkage modifier 5-10 parts, catalyst 0.1-1 part, polymerization inhibitor 0.01-0.06 parts, solvent 5-90 parts;Wherein low dielectric heat-conducting filler is hexagonal boron nitride nanosheet, spherical silicon powder and the complex of undefined aluminum nitride, low volume shrinkage modifier is cage-type silsesquioxane.The composite material of the application can perfectly fill micron chip gap, volume shrinkage rate is low after solidification, interface thermal resistance is small, has excellent temperature resistance and high insulation, can satisfy the requirement of high-end equipment manufacturing field such as aerospace, high-performance computing to thermal management material.