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1321results about How to "Low curing temperature" patented technology

Method for preparing environmentally-friendly adhesive for lignin-based timber

The invention discloses a method for preparing an environmentally-friendly adhesive for a lignin-based timber. The method comprises the following steps of: 1) adding phenol, formaldehyde solution, lignin, first alkali liquor and diluting water into a reactor, heating to the temperature of between 75 and 85 DEG C and reacting for 2.5 to 3.5 hours, wherein the molar ratio of formaldehyde to the phenol is 2.20:1-2.40:1; the formaldehyde solution is added for three times in a mass ratio of 1.5 to 1.0 to 1.0; and the reaction time ratio of the added formaldehyde solution is 1.2 to 1.0 to 1.0; 2) cooling to 70 DEG C, adding a formaldehyde collector and second alkali liquor, and reacting at the temperature of between 65 and 70 DEG C for 20 to 50 minutes; and 3) cooling to the temperature of between 30 and 40 DEG C, adding an intensifier, stirring for 10 to 30 minutes, cooling and discharging. In the method, a 50 to 60 percent petroleum-based phenol raw material can be substituted; the methodis stable in reaction, easy to control and easy for industrial production; formaldehyde emission of a plywood reaches E0 level; adhesive strength meets the requirements of national class I plates; and a new approach is provided for the development of an environmentally-friendly biomass-based timber adhesive and recycling of wastes.
Owner:青岛生物能源与过程研究所

Method of preparing methyl phenyl polysiloxane

The invention discloses a method for synthesizing organic silicon, in particular provides a method for preparing methyl phenyl silicone resin which has low curing temperature by self and is not sticky repeatedly. The invention uses the monomers of methyl trichlorosilane, dimethyldichlorosilance, phenyl trichlorosilane, dichloromethylphenylsilane, diphenyl dichlorosilane and the like to obtain a methyl phenyl silicone resin with low curing temperature and a paint film which is not sticky repeatedly after being cured by the processes of adjusting the proportion of raw materials, controlling proper reaction temperature and polymerization time, carrying out hydrolysis reaction and polycondensation reaction, etc. The invention has the advantages that the methyl phenyl silicone resin prepared by the method has the characteristics of low curing temperature, being not sticky repeatedly, being clear and transparent, high and low temperature resistance, weather resistance, being insulating and the like; the methyl phenyl silicone resin is in particular fit for dip varnish higher than grade H; and the methyl phenyl silicone resin is used for confecting insulated paint, weather-resistant paint and heat resistant paint higher than grade H, is used for heat resistant parting agent and also can be used in the fields with rigorous using requirements, such as heat resistant water blocking and sand prevention for oil drilling, etc.
Owner:安徽比特海新材料股份有限公司

Sulfur-containing hyperbranched epoxy resin and preparation method thereof

The invention belongs to the technical field of epoxy resins and preparation method thereof and in particular discloses a sulfur-containing hyperbranched epoxy resin and a preparation method thereof. The preparation method comprises the following steps: stirring and reacting a trithiol compound and a diolefin compound at the temperature of 10 DEG C below zero and 20 DEG C for 2-5 hours and preparing an acrylate monomer with polyfunctionality; stirring and reacting the monomer and bithiol secondary amine at the temperature of 20-80 DEG C for 5-10 hours and obtaining a first generation mercapto-terminated hyperbranched polymer NP1-HSH; stirring and reacting the NP1-HSH and methacrylic acid glycidyl ester at the temperature of 10 DEG C below zero and 20 DEG C for 2-5 hours and obtaining a first generation sulfur-containing hyperbranched epoxy resin; and sequentially carrying out the previous three reactions on NP1-HSH to prepare a second-fourth generation sulfur-containing hyperbranched epoxy resin with the molecular weight of about 2,000-30,000 g/mol. The method is simple in process and low in reaction temperature, the obtained product can reduce the curing temperature and is expected to be applied to the fields of reinforcing and toughening of epoxy resins, solvent-free coatings and the like.
Owner:SOUTH CENTRAL UNIVERSITY FOR NATIONALITIES
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