Method of preparing methyl phenyl polysiloxane

A technology of methylphenyl silicon and methylphenyl dichlorosilane, which is applied in the field of preparation of methylphenyl silicone resin, can solve the problems of reduced heat resistance, inability to completely overcome back sticking, easy back sticking of paint film, etc. , to achieve the effect of low curing temperature
CN101508776AActive Publication Date: 2009-08-19安徽比特海新材料股份有限公司

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
安徽比特海新材料股份有限公司
Publication Date
2009-08-19

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Abstract

The invention discloses a method for synthesizing organic silicon, in particular provides a method for preparing methyl phenyl silicone resin which has low curing temperature by self and is not sticky repeatedly. The invention uses the monomers of methyl trichlorosilane, dimethyldichlorosilance, phenyl trichlorosilane, dichloromethylphenylsilane, diphenyl dichlorosilane and the like to obtain a methyl phenyl silicone resin with low curing temperature and a paint film which is not sticky repeatedly after being cured by the processes of adjusting the proportion of raw materials, controlling proper reaction temperature and polymerization time, carrying out hydrolysis reaction and polycondensation reaction, etc. The invention has the advantages that the methyl phenyl silicone resin prepared by the method has the characteristics of low curing temperature, being not sticky repeatedly, being clear and transparent, high and low temperature resistance, weather resistance, being insulating and the like; the methyl phenyl silicone resin is in particular fit for dip varnish higher than grade H; and the methyl phenyl silicone resin is used for confecting insulated paint, weather-resistant paint and heat resistant paint higher than grade H, is used for heat resistant parting agent and also can be used in the fields with rigorous using requirements, such as heat resistant water blocking and sand prevention for oil drilling, etc.
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Description

technical field

[0001] The invention relates to a method for synthesizing organosilicon, in particular to a method for preparing methylphenyl silicone resin which itself has a low curing temperature and does not stick back. Background technique

[0002] At present, there are general-purpose methylphenyl silicone resins of existing brands at home and abroad, such as 1153, 1053 and other methylphenyl silicone resins. Their curing temperature needs to be ≥ 200°C, and the cured paint film has weak adhesion to the substrate and cannot be cured. The paint film is easy to stick back and other shortcomings. Some brands of silicone resins with low-temperature curing characteristics mainly rely on external crosslinking agents, catalysts and other components to strengthen the curing reaction. As a result, the heat resistance of the cured silicone resin is reduced, especially the high-temperature flexibility deterioration and storage Stability, but still can not completely overcome the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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