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Silicone adhesive composition and method for preparing the same

A composition and organic technology, applied in conductive adhesives, adhesives, etc., can solve problems such as reducing heat transfer, and achieve the effects of low curing temperature, good adhesion, and fast curing rate

Inactive Publication Date: 2010-01-13
MOMENTIVE PERFORMANCE MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There may be an air gap between the surface of the heat sinking element and the surface of the heat generating part, which reduces the ability to transfer heat across the interface between the surfaces

Method used

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  • Silicone adhesive composition and method for preparing the same
  • Silicone adhesive composition and method for preparing the same
  • Silicone adhesive composition and method for preparing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0073] Two separate thermally conductive fillers were used in this formulation. The first filler was Denka DAW-05 alumina filler with an average particle size of 5 μm and a maximum particle size of 24 μm, and the second filler was Sumitomo's AA-04 alumina filler with an average particle size of 0.4-0.6 μm and a maximum particle size of about 1 μm. The thermally conductive filler (604.30 parts total (483.58 parts of the first filler and 120.72 parts of the second filler)) was mixed in a laboratory scale Ross mixer (1 quart capacity) at 140-160°C at approximately 18 rpm for 2.5 hours . The packing is then cooled to 35-45°C, brought to atmospheric pressure and 100 parts of a vinyl terminated polydimethylsiloxane liquid (350-450 cSt, about 0.48 wt% vinyl; SL6000-D1 from GE Silicones ) and 0.71 parts pigment masterbatch (50 wt% carbon black and 50 wt% 10,000 cSt vinyl terminated polydimethylsiloxane fluid; M-8016 from GE Toshiba) and a portion of hydride fluid—1.04 parts hydride ...

Embodiment 3

[0077] Dynamic Mechanical Analysis (DMA) was performed using a TA Instruments Ares-LS2 comparing two samples with parallel plate geometry (Example 1 vs Comparative Example 2) when the temperature was ramped from 25°C to 150°C at a rate of 2°C / min ) gel point. See Table 1 and figure 1 .

[0078] The storage (elastic) modulus G' is directly measured by the molecular weight in the polymer system. When curing starts, the molecular weight increases and the G' value increases. When the G' curves of Example 1 and Comparative Example 2 are compared, it is shown that the increase in G' of the Example 1 sample occurs at a much lower temperature than that of the Comparative Example 2 sample. Beginning at about 30°C, the slope of the G' line for the Example 1 sample is positive. In contrast, the slope of the G' curve of the sample of Comparative Example 2 remained at 0 up to about 65°C. This difference highlights the fact that the Example 1 sample starts its curing reaction at a much...

Embodiment 4

[0084] This example tests the time required to achieve complete cure as a function of different curing temperatures. The G'G" crossing points indicate the onset of cure, and complete cure is indicated by the plateau of the storage modulus (G') in the DMA test. Table 2 below shows the final G' value at the end of the isothermal hold (Final G') vs. The maximum G' value (Maximum G') obtained for each run is substantially the same. The maximum G' value is used in calculations to determine the degree of cure.

[0085] Table 2 shows that when the curing temperature is decreased from 150°C to 80°C, the maximum G' value of the sample of Example 1 is only reduced by 8%. This equivalent reduction in cure temperature for the Comparative Example 2 sample resulted in a 26% reduction in the maximum G' value. A lower G' plateau value indicates a decrease in crosslink density. The greater the reduction in G', the greater the reduction in crosslink density and the less the material cures. T...

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Abstract

A thermal interface material composition including a blend of a polymer matrix and a thermally conductive filler having particles having a maximum particle diameter no greater than about 25 microns, wherein the polymer matrix includes an organopolysiloxane having at least two silicon-bonded alkenyl groups per molecule, an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms per molecule and a hydrosilyation catalyst comprising a transition metal, wherein the transition metal is present in an amount of from about 10 to about 20 ppm by weight based on the weight of the non-filler components and the molar ratio of the silicon- bonded hydrogen atoms to the silicon-bonded alkenyl groups ranges from about 1 to about 2. A method is also provided.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to US Provisional Patent Application Serial No. 60 / 783,738, filed March 30, 2006, which is incorporated by reference in its entirety. field of invention [0003] The present invention relates to silicone adhesive compositions, and more particularly to silicone thermal interface materials. Background of the invention [0004] Many electrical components generate heat during operation. As electronic devices become denser and more highly integrated, heat flux increases exponentially. Devices also need to operate at lower temperatures for performance and reliability reasons. Reducing the temperature difference between the heat generating part of the device and the ambient temperature, which reduces the thermodynamic driving force for heat removal. Increased heat flux and reduced thermodynamic driving forces require increasingly sophisticated heat treatment techniques to facilitate heat re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K3/00C08K3/14C08K3/22C08K3/28C08K3/38C09J183/07C08L83/07
CPCC09J183/04C08K3/22C08K3/0033C08K3/38C08K3/28C08K3/013C08L83/00C08L2666/54C09J9/02
Inventor 詹妮弗·L·戴维
Owner MOMENTIVE PERFORMANCE MATERIALS INC
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