Light-cured organic silicon resin and preparation method thereof, photosensitive resin and application

A technology of photosensitive resin and silicone, applied in the direction of additive processing, etc., can solve the problems of long reaction time, slow curing rate, high energy consumption, etc., to improve curing rate, reduce molding volume shrinkage and warpage, and improve curing performance effect

Inactive Publication Date: 2018-06-22
GUANGDONG UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Patent CN 105492541 A discloses an addition-curable silicone resin, which provides materials with good transparency and adhesion, but the reaction system needs to be strictly controlled during the curing process, otherwise it will cause great defects in material properties; Patent CN105555873 A discloses a condensation curing type silicone resin, which is used as a sealing body for photoconductor materials, and improves the ease of curing while providing good adhesion of the material. However, condensation curing needs to be carried out at high temperature and consumes High energy; patent CN101939360 A discloses a free radical reaction type thermal curing silicone resin, which can obtain flexibility and high toughness after curing, but the free radical reaction type curing belongs to thermal curing, but the curing rate is slow and the precision of the product is low and many defects in the material
Therefore, the existing silicone resin curing molding methods have problems such as large energy consumption, long reaction time, and low product precision.

Method used

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  • Light-cured organic silicon resin and preparation method thereof, photosensitive resin and application
  • Light-cured organic silicon resin and preparation method thereof, photosensitive resin and application
  • Light-cured organic silicon resin and preparation method thereof, photosensitive resin and application

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preparation example Construction

[0032] The present invention also provides a method for preparing the above photocurable silicone resin, comprising the following steps:

[0033] At least one of alkyl-containing siloxane and aromatic-containing siloxane is mixed with epoxy-containing siloxane and unsaturated double bond-containing siloxane with a catalyst and a solvent at a temperature of 60 At ~80°C, react with mechanical stirring for 6-8 hours to obtain a light-curable silicone resin.

[0034] In the invention, firstly, the catalyst and the solvent are mixed and stirred to obtain a mixed solution. Wherein, the solvent is selected from ethanol and deionized water. The mixing speed is 200-300rpm, and the mixing temperature is 20-30°C.

[0035] Next, at least one of the alkyl-containing siloxane and the aromatic-containing siloxane, the epoxy-containing siloxane and the siloxane containing unsaturated double bonds are mixed with the above-mentioned mixed solution. Under 60-80°C, mechanically stir and react ...

Embodiment 1

[0053] First add 114g of water, 3.2g of hydrochloric acid and 22g of ethanol into the flask, then add 56.64g of γ-(2,3-epoxypropoxy)propyltrimethoxysilane, 59.66g of γ-methacryloxypropyltrimethoxy Base silane, 53.4g hexamethyldisiloxane and 20.3g phenyltrimethoxysilane were added to the above solution, hydrolysis-polycondensation reaction was carried out at 60°C for 8 hours, and the reaction system was separated to obtain a mixture of silicone resin and water , washed with 30% ethanol aqueous solution for 4 times, and finally vacuumed at 115° C. to remove residual solvent and low boilers to obtain the organosilicon resin mainly having the structure of formula I. Infrared spectroscopy was carried out on it, and the results were shown in figure 1 , figure 1 It is the infrared spectrogram of the photocurable silicone resin prepared in Examples 1-5. figure 1 Among them, formula I is the infrared spectrogram of the photocurable silicone resin prepared in Example 1, formula II is ...

Embodiment 2

[0058] First 119g of water, 3.7g of potassium hydroxide and 26g of ethanol were added to the flask, then 58.34g of trimethoxy[2-(7-oxabicyclo[4.1.0]hept-3-yl)ethyl]silane, Add 60.25g of allyltriethoxysilane, 60.4g of dimethyldimethoxysilane and 22.7g of phenylmethyldiethoxysilane into the above solution, and conduct a hydrolysis-polycondensation reaction at 70°C for 7 hours. The reaction system was liquid-separated to obtain a mixture of silicone resin and water, washed with 30% ethanol aqueous solution for 3 times, and finally vacuumed at 125° C. to remove residual solvent and low boilers to obtain a silicone resin with the main structure of formula II. Infrared spectroscopy was carried out on it, and the results were shown in figure 1 , figure 1 It is the infrared spectrogram of the photocurable silicone resin prepared in Examples 1-5.

[0059]

[0060] Using a mechanical stirrer, 100g of free radical-cationic photocurable silicone resin, 6.4g of cationic initiator xant...

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Abstract

The invention provides light-cured organic silicon resin. The light-cured organic silicon resin is prepared by performing cohydrolysis-polycondensation reaction on at least one of siloxane containingalkyl and siloxane containing aryl as well as siloxane containing epoxy group and siloxane containing unsaturated double bond under the action of a catalyst. Epoxy functional group and unsaturated double bond group in the light-cured organic silicon resin, serving as special functional groups, improve the curing property of organic silicon resin, improve the curing rate, reduce molding volume shrinking percentage and warping degree, and have important application in the fields of aviation, electronic engineering, light industry, mechanical engineering, chemical engineering and medicine.

Description

technical field [0001] The invention belongs to the technical field of functional polymer materials, and in particular relates to a photocurable silicone resin, a preparation method thereof, a photosensitive resin and an application thereof. Background technique [0002] Silicone resin is a functional resin that combines the characteristics of organic and inorganic materials, is stable to light and heat, and has good heat resistance. It has been widely used in aviation, electronics, light industry, machinery, chemical industry, medicine, etc. . Silicone resin mainly has three curing methods: addition curing, condensation curing and curing by free radical reaction with organic peroxide as an initiator. Patent CN 105492541 A discloses an addition-curable silicone resin, which provides materials with good transparency and adhesion, but the reaction system needs to be strictly controlled during the curing process, otherwise it will cause great defects in material properties; P...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G77/20C08G77/18C08L83/06C08L83/07B33Y70/00
CPCB33Y70/00C08G77/18C08G77/20C08L83/04C08L83/06
Inventor 向洪平刘晓暄黄鸿苏嘉辉
Owner GUANGDONG UNIV OF TECH
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