This invention relates to the field of electronic paste preparation technology, and discloses a low
sheet resistance tungsten-
copper electronic paste and its preparation method, comprising the following steps: Step 1, preparing
tungsten-
copper composite
powder: spherical
tungsten powder with a
diameter of 1-10 μm and
copper powder with a size of 1-3 μm are mixed by mechanical mixing, with a tungsten to copper weight ratio of 3:1-6:1. Before mixing, the copper powder needs to undergo
graphene coating pretreatment; Step 2, preparing an inorganic binder: the inorganic binder includes, but is not limited to, the following components: glass powder, CuO, TiO2, La2O3, Pu6O11; Step 3, preparing an organic carrier: the organic carrier includes a
solvent, an organic binder, and a thickener; Step 4, preparing the tungsten-copper paste. The tungsten-copper paste of this invention has widely available raw materials, a simple preparation process, and is suitable for
mass production. Although
graphene, a high-priced material, is added, the amount added is small and the performance is particularly excellent, making the cost of the tungsten-copper paste of this invention far lower than that of similar foreign products, resulting in a very high cost-
performance ratio.