Method for displacement chemical silver plating on copper powder
A technology of electroless silver plating and copper powder, applied in liquid chemical plating, coating, metal material coating process, etc. The problem of further replacement of copper, etc., achieves the effect of promoting reduction deposition, improving compactness and silver content, and simple composition
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Embodiment 1
[0032] 1) Clean and degrease the 200-mesh copper powder at room temperature, rinse with distilled water
[0033] 2) Use a nitric acid solution containing 5wt% at room temperature until the oxides on the surface of 75 grams of 200-mesh copper powder are removed, and rinse with distilled water;
[0034] 3) Put the pickled copper powder into a catalytic solution consisting of 0.035g / L palladium chloride and 20g / L hydrochloric acid, and wash it repeatedly with distilled water after 30 minutes at room temperature until the filtrate does not contain Cl - up to ions;
[0035] 4) Configure electroless silver plating solution: 28g / L silver nitrate, 60g / L trisodium citrate and triethylenetetramine mixed complexing agent, use ammonia water and sodium hydroxide to adjust the pH of the silver plating solution to 10.5;
[0036] 5) Put the activated copper powder into the silver plating solution, and react with electromagnetic stirring for 20 minutes
[0037] 6) Stop plating, wash and filt...
Embodiment 2
[0040] 1) Clean and degrease the 200-mesh copper powder at room temperature, rinse with distilled water
[0041] 2) Use a sulfuric acid solution containing 7wt% at room temperature until the oxides on the surface of 65 grams of 200-mesh copper powder are removed, and rinse with distilled water;
[0042] 3) Put the acid-washed copper powder into a catalytic solution composed of 0.098g / L palladium chloride, 25g / L hydrochloric acid and citric acid. Containing Cl- ions;
[0043] 4) Configure the electroless silver plating solution: 34g / L silver nitrate, 110g / L sodium lactate and ethylenediamine mixed complexing agent, use ammonia water and sodium hydroxide to adjust the pH of the silver plating solution to 12.5;
[0044] 5) Put the activated copper powder into the silver plating solution, mechanically stir and react for 20min
[0045] 6) Stop plating, wash and filter the silver-plated copper powder, and dry it under vacuum at 100°C.
[0046] The obtained silver-plated copper po...
Embodiment 3
[0048] 1) Clean and degrease the 400-mesh copper powder at room temperature, rinse with distilled water
[0049] 2) Use phosphoric acid solution containing 9.5wt% at room temperature until the oxide on the surface of 15 grams of 400 mesh copper powder is removed, and rinse with distilled water;
[0050]3) Put the pickled copper powder into an activation solution consisting of 0.130g / L palladium dichlorotetraammine and 15g / L ammonia water. After 10 minutes of treatment at room temperature, use distilled water to wash repeatedly until the filtrate does not contain Cl- ion so far;
[0051] 4) Configure an electroless silver plating solution: a mixed complexing agent of 25g / L silver nitrate, 96g / L sodium lactate and tetraethylenepentamine, use ammonia water and sodium hydroxide to adjust the pH of the silver plating solution to 13;
[0052] 5) Put the activated copper powder into the silver-plating solution, and stir it mechanically and electromagnetically for 20 minutes;
[005...
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