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56results about How to "High silver content" patented technology

Method for displacement chemical silver plating on copper powder

The invention discloses a method for displacement chemical silver plating on copper powder. The method comprises the following steps of: cleaning and oil removal, water washing, acid etching, water washing, catalytic liquid treating, chemical silver plating and the like. In the method, a catalytic liquid capable of preplanting catalytic mass points is developed; the surface of the copper powder is preplanted with discretely distributed palladium mass points after the copper powder is treated by the catalytic liquid at a room temperature by controlling components, pH value and treatment time of the catalytic liquid; and the preplanted palladium mass points can catalyze and promote the silver ion reduction to improve precipitation speed and to retard copper-ammonia complex ions to be absorbed on the copper surface so as to obtain a sliver plating layer with good cladding performance in the chemical silver-plating process for the copper powder. Compared with the conventional method of displacement chemical silver plating, the method realizes surface activation of the copper powder by pretreating the catalytic liquid, a silver content of the silver plating copper powder is greatly improved, the problems of poor cladding performance of replacement type chemical silver plating and the like are solved, and the method is simple in process and convenient to operate and has good application prospect.
Owner:GUANGDONG UNIV OF TECH

3D printed tapered electrode structure of solar cell

The invention relates to a 3D printed tapered electrode structure of a solar cell. The 3D printed tapered electrode structure comprises a substrate, a main gate line and an auxiliary gate line; the main gate line and the auxiliary gate line both are formed by virtue of 3D printing; the main gate line and the auxiliary gate line are arranged on the substrate perpendicularly and crosswise; the auxiliary gate line is of a segmental structure; the main gate line comprises a main gate line conductive layer and a main gate line seed layer; the main gate line seed layer is laid on the substrate; the main gate line conductive layer is laid on the main gate line seed layer; the auxiliary gate line comprises an auxiliary gate line conductive layer and an auxiliary gate line seed layer; the auxiliary gate line seed layer is laid on the substrate, while the auxiliary gate line conductive layer is laid on the auxiliary gate line seed layer; the auxiliary gate line conductive layer is a tapered lamellar body. Compared with the prior art, the gate lines of the electrode structure are elaborate and controllable in morphology, the closer to the main gate line the auxiliary gate line is, the higher the auxiliary gate line is; as a result, the current carrier collecting capability of the auxiliary gate line is enhanced, and the electrical conductivity of the gate lines are improved.
Owner:SHANGHAI SHENZHOU NEW ENERGY DEV

Nano silver-containing trimolybdate and preparation method and use thereof as antibacterial agent

The invention discloses nano silver-containing trimolybdate and a preparation method and use thereof as an antibacterial agent. The molecular formula of the silver-containing trimolybdate is (NH4)2-xAgxMo3O10, wherein x is equal to 0.58, and the silver-containing trimolybdate is a nanowire. The silver-containing trimolybdate is prepared by reacting ammonium heptamolybdate tetrahydrate with a silver salt in water. The invention also discloses the use of the silver-containing trimolybdate nanowire as the antibacterial agent. The use of the silver-containing trimolybdate nanowire as the antibacterial agent, which is disclosed by the invention, does not require grinding. The silver content in silver-containing trimolybdate is high, so the required amount for achieving the same antibacterial effect is small; meanwhile, the molybdenum compound also has an antibacterial function, oxy-acid radicals containing a positive hexavalent molybdenum element in the solution also have certain oxidability, and thus, the molybdenum element can promote the antibacterial effect of the silver ions; therefore, the nano silver-containing trimolybdate has double antibacterial effects, and the antibacterial capacity of the nano silver-containing trimolybdate is 1,000 times that of a micrometer antibacterial agent. The preparation method disclosed by the invention is simple, has low equipment condition requirements, reduces reaction time and is suitable for large-scale production.
Owner:PEKING UNIV

Aluminum powder surface hydration processing method and application of aluminum powder in preparing Al@Ag nuclear shell composite particle conductive and electromagnetic shielding filler

The invention relates to an aluminum powder surface hydration processing method. The aluminum powder surface hydration processing method comprises the following steps that 1, the surface of aluminum powder is washed, filtered in a suction mode and dried; 2, the washed aluminum powder is placed into a solution with the volume ratio of water to ethyl alcohol being 3: 1 for hydroxylation processing; 3, a silane coupling agent is added, sulfhydrylation decoration is conducted on the aluminum powder, and filtering, washing and drying are conducted, so that the aluminum powder obtained after sulfhydrylation decoration is obtained. The invention further provides an application of the aluminum powder obtained according to the aluminum powder surface hydration processing method in preparing Al@Ag nuclear shell composite particle conductive and electromagnetic shielding filler. The aluminum powder serves as a raw material for preparing the conductive and electromagnetic shielding filler. The sulfydryl content of the surface of the processed aluminum powder is high and the processing method is simple and efficient; prepared Al@Ag nuclear shell composite particles have the advantages of being even and dense in silver shell layer, low in silver content, low in cost and the like, and have important application prospect in the fields of conductive and electromagnetic shielding composite materials and the like.
Owner:KING STRONG MATERIAL ENG LTD

Polyamide silver-plated fiber and preparation method thereof

The invention provides a preparation method for a polyamide silver-plated fiber. The preparation method comprises the steps that a polyamide fiber is sensitized in a sensitizing solution to obtain a sensitized fiber; a silver ammonia solution and a diethyl triamine pentaacetic acid are dissolved into water, and the pH value of the solution is adjusted to be 9.8-10.2 to obtain a plating solution; and silver plating treatment for the sensitized fiber is carried out in the mixed solution comprising the plating solution and glucose to obtain the polyamide silver-plated fiber. According to the preparation method for the polyamide silver-plated fiber, the glucose is used for replacing formaldehyde as a reducing agent for silver plating reaction, and the diethyl triamine pentaacetic acid is added into the plating solution to form a silver plating solution system matched with the plating solution, the reduction rate of silver ions in the plating solution system and the deposition rate of silver elementary substances on the surface of the fiber are adjusted, and therefore the fiber has the good conductivity and shows the good silver plating efficiency. The silver-plated fiber has the characteristics of low resistance and high silver content, wherein the minimum resistance value is about 138 omega/10cm, the highest silver content is 15%, and the silver plating rate can reach 97%.
Owner:ZHEJIANG SCI-TECH UNIV

Preparation method of multielement nanomaterials and solar cell electronic silver paste containing multielement nanomaterials

The invention discloses a preparation method of multielement nanomaterials and solar cell electronic silver paste containing the multielement nanomaterials. The multielement nanomaterials are prepared through a bottom-up technology. Metal organics are sequentially fed in high temperature resistant organic solvents, so that the metal organics are resolved to form metallic oxide nano-particles until the required multielement nanomaterials are formed. The multielement nanomaterials are separated from the organic solvents from a rotating centrifugal machine to be washed and dried into a powder shape. Consequently, the finished products of the multielement nanomaterials are obtained. The multielement nanomaterials are small in grain size, and capable of filling the same size on the condition that the dosage (wt%) is low, can be dispersed more evenly in electronic silver paste, improves the silver content in the paste and the conductivity of the paste after sintering, so that better ohmic contact is obtained, and photoelectric conversion efficiency is finally improved. The prepared silver paste can reduce series resistance by 80%, and improve the photoelectric conversion efficiency by 0.5%-2%.
Owner:DK ELECTRONICS MATERIALS INC

Method for copper powder displacement for chemical silver plating

The invention discloses a method for displacement chemical silver plating on copper powder. The method comprises the following steps of: cleaning and oil removal, water washing, acid etching, water washing, catalytic liquid treating, chemical silver plating and the like. In the method, a catalytic liquid capable of preplanting catalytic mass points is developed; the surface of the copper powder is preplanted with discretely distributed palladium mass points after the copper powder is treated by the catalytic liquid at a room temperature by controlling components, pH value and treatment time of the catalytic liquid; and the preplanted palladium mass points can catalyze and promote the silver ion reduction to improve precipitation speed and to retard copper-ammonia complex ions to be absorbed on the copper surface so as to obtain a sliver plating layer with good cladding performance in the chemical silver-plating process for the copper powder. Compared with the conventional method of displacement chemical silver plating, the method realizes surface activation of the copper powder by pretreating the catalytic liquid, a silver content of the silver plating copper powder is greatly improved, the problems of poor cladding performance of replacement type chemical silver plating and the like are solved, and the method is simple in process and convenient to operate and has good application prospect.
Owner:GUANGDONG UNIV OF TECH

Communication circuit layer structure and circuit printing method thereof

The invention discloses a communication circuit layer structure, which comprises a flexible circuit board, and is characterized in that a plurality of signal circuits are printed on a thin film circuit board, each signal circuit comprises an adjustment section, and the adjustment sections are printed by electronic paste with different resistance values. Through the above arrangement, the electronic paste with different resistance values is printed on each signal circuit, so that each signal circuit has an independent resistance value range, and trigger signals with different ranges are generated; the signal circuit is made of a small-resistance material, the resistance is adjusted by utilizing the electronic paste of the adjustment section, the control is accurate, and the resistance control range is expanded, so that the communication circuit can have a wider range of communication signal selection; and due to the expansion of the signal range, the same circuit structure can be applicable to more occasions, so that the situation of mutual interference of multiple combination keys is avoided during combination control among the signal circuits, and the programming design is facilitated.
Owner:深圳市璞瑞达薄膜开关技术有限公司

Processing method of black-and-white photographic materials

A method of processing an exposed black-and-white silver halide photographic film material, the method having the steps of developing in a developer solution, fixing in a fixer solution, replenishing of fixer and developer solution, rinsing in a washing solution and drying, characterized in that fixing is performed in one step and under such conditions that a "silver equilibrium ratio" of less than 2.0 is maintained, the said ratio being defined as the ratio between actual by the film material in the rinsing step through carry-over (cross-over) of silver from the fixing solution to the washing solution and amount of silver brought into the washing solution and the total amount of silver that theoretically could be brought into the washing solution by the film material by such carry-over; a "fixer to film silver ratio" of less than 0.2 is obtained, this ratio being defined as the ratio between silver content in "running equilibrium condition of the fixer" and amount of silver in the film material to be fixed in the fixing step, wherein said "running equilibrium condition of the fixer" is the condition attained after having replenished said fixing solution twice. By this method an ecologically favourable minimization of silver content in the washing solution has been obtained without impairing the processing speed, without enhancing processing costs and without excessive regeneration.
Owner:AGFA GEVAERT AG
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