The invention provides a film-coated
copper sheet for
interconnection of
copper electrodes on the front side of a
chip and a preparation method and application of the film-coated
copper sheet. The preparation method comprises the following steps: S1, carrying out surface treatment and single-side metallization treatment on a bare copper sheet to obtain a copper sheet with a single-side metallization layer; s2, the single-face metallization layer of the copper sheet is coated with
metal soldering paste,
drying is conducted in an
inert or
reducing atmosphere, and the copper sheet with a pre-sintered
metal film is obtained; s3, cleaning,
drying and activating the copper sheet to obtain an activated copper sheet; and S4,
coating the activated copper sheet with a
coating solution, and curing after
coating to obtain the film-coated copper sheet for
interconnection of the copper electrodes on the front surface of the
chip. According to the preparation method, the dried
metal soldering paste can be protected, sufficient
adhesive force can be provided for the film-coated copper sheet and the
chip in the
sintering process, dispensing fixation is avoided, the packaging cost is reduced, and the service reliability of a packaged device is improved.