The invention provides an ultraviolet curable organic silicon-acrylic resin electronic adhesive, which comprises the following components: (1) 100 parts of doublebond-containing acrylic monomers or prepolymer, (2) 5 to 500 parts of doublebond-containing organic silicon resin with a molecular weight of 1,000 to 10,000, (3) 1 to 100 parts of vinyl compound modified inorganic nano particle, (4) 1 to 50 parts of radical ultraviolet initiator, (5) 1 to 100 parts of organosilan, (6) 0 to 200 parts of inorganic reinforcing agent, and (7) 0 to 50 parts of auxiliary agent, wherein the ultraviolet curable organic silicon-acrylic resin is prepared by carrying out ultraviolet curing on the materials, and the solid content thereof is 100 weight percent. The product produced by the invention has the excellent characteristics of firm bonding with metal, glass and plastic materials and electronic devices, good optical property, good elasticity, good weather resistance, safety, non-toxicity, convenient construction and the like, can replace traditional solvent electronic adhesives, and is used for protective coatings, protective adhesives, packaging materials and the like of electronic devices, integrated circuits, printed circuits, LED chips and the like.