Ultraviolet curable organic silicon-acrylic resin electronic adhesive and application thereof

Abstract

The invention provides an ultraviolet curable organic silicon-acrylic resin electronic adhesive, which comprises the following components: (1) 100 parts of doublebond-containing acrylic monomers or prepolymer, (2) 5 to 500 parts of doublebond-containing organic silicon resin with a molecular weight of 1,000 to 10,000, (3) 1 to 100 parts of vinyl compound modified inorganic nano particle, (4) 1 to 50 parts of radical ultraviolet initiator, (5) 1 to 100 parts of organosilan, (6) 0 to 200 parts of inorganic reinforcing agent, and (7) 0 to 50 parts of auxiliary agent, wherein the ultraviolet curable organic silicon-acrylic resin is prepared by carrying out ultraviolet curing on the materials, and the solid content thereof is 100 weight percent. The product produced by the invention has the excellent characteristics of firm bonding with metal, glass and plastic materials and electronic devices, good optical property, good elasticity, good weather resistance, safety, non-toxicity, convenient construction and the like, can replace traditional solvent electronic adhesives, and is used for protective coatings, protective adhesives, packaging materials and the like of electronic devices, integrated circuits, printed circuits, LED chips and the like.

Description

technical field The invention relates to the fields of chemical industry, electronics, optoelectronics, etc., and relates to a novel ultraviolet curing silicone-acrylic resin electronic adhesive, and also relates to the application of the ultraviolet curing organic silicon-acrylic resin electronic adhesive. Background technique In order to ensure that circuit boards, electronic devices, LED chips, etc. maintain good insulation performance during use, avoid external impact and damage, and will not be affected by machinery, heat, humidity, dust, oily smoke, corrosive gases, etc., and improve performance and stabilization parameters, these devices need to be coated with protective coating or packaged. Because electronic glue is liquid before use, it is easy to pour and use. It is often used for bonding, sealing, potting and coating protection of electronic components and optoelectronic devices. It can prevent moisture, dust, corrosion and shock. effect. Currently commonly use...

AI Technical Summary

Problems solved by technology

The technical problem to be solved by the present invention is to provide a UV-curable silicone-acrylic resin electronic adhesive with excellent performance, safety and non-toxicity, in view of the existing electronic adhesives that are toxic, easy to crack, and pollute the environment.

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