The invention provides an
ultraviolet curable organic
silicon-
acrylic resin electronic
adhesive, which comprises the following components: (1) 100 parts of doublebond-containing
acrylic monomers or
prepolymer, (2) 5 to 500 parts of doublebond-containing organic
silicon resin with a molecular weight of 1,000 to 10,000, (3) 1 to 100 parts of vinyl compound modified inorganic nano particle, (4) 1 to 50 parts of radical
ultraviolet initiator, (5) 1 to 100 parts of organosilan, (6) 0 to 200 parts of inorganic reinforcing agent, and (7) 0 to 50 parts of auxiliary agent, wherein the
ultraviolet curable organic
silicon-
acrylic resin is prepared by carrying out ultraviolet curing on the materials, and the
solid content thereof is 100 weight percent. The product produced by the invention has the excellent characteristics of firm bonding with
metal, glass and
plastic materials and electronic devices, good
optical property, good elasticity, good
weather resistance, safety, non-
toxicity, convenient construction and the like, can replace traditional
solvent electronic adhesives, and is used for protective coatings, protective adhesives, packaging materials and the like of electronic devices, integrated circuits, printed circuits, LED chips and the like.