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High weather-proof thermosetting resin composite and prepreg and copper-clad laminate prepared thereby

A technology of copper-clad laminates and resin compositions, applied in epoxy resin adhesives, grafted polymer adhesives, coatings, etc., can solve problems such as metallized hole breakage, product scrapping, and circuit breakage, and achieve high heat Decomposition temperature, low cost, and simple production process

Inactive Publication Date: 2010-06-16
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Generally speaking, in a multilayer circuit board, the circuit conduction between layers is realized through hole metallization (copper). The thermal expansion coefficient of metal copper is 17ppm / °C, while the thermal expansion coefficient of general thermosetting resin is 200ppm. / °C or above, a large difference in thermal expansion coefficient will cause the metallized hole to break during the cold and heat shock during the processing (currently the processing temperature of PCB lead-free soldering is 240°C to 270°C), resulting in an open circuit and making the product scrapped

Method used

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  • High weather-proof thermosetting resin composite and prepreg and copper-clad laminate prepared thereby
  • High weather-proof thermosetting resin composite and prepreg and copper-clad laminate prepared thereby
  • High weather-proof thermosetting resin composite and prepreg and copper-clad laminate prepared thereby

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0048] Add 100g of diallyl bisphenol A (DABPA), 70g of epoxy resin (EP), and 250g of diphenylmethane bismaleimide (BDM) into the three-necked flask, start stirring, and keep the temperature at 155°C under condensing reflux After reacting for 2.5h, a viscous liquid resin was obtained after cooling to room temperature.

[0049] After adding 0.5% of 2-methyl-4-ethylimidazole, 3% of diaminodiphenylmethane and solvent DMF (dimethylformamide) to the above resin solution, adjust the solid content to 65% and then stir and mix evenly. After impregnated with glass cloth, bake in an oven at 155° C. for 6 minutes to obtain a semi-cured adhesive sheet. Stack 8 adhesive sheets together, cover both sides with copper foil, heat press in a vacuum press at 220°C for 90 minutes to obtain a copper clad laminate with a thickness of 1.6mm. The properties of the plates are shown in Table 2.

example 2

[0051] Add 100g of diallyl bisphenol A (DABPA), 110g of epoxy resin (EP), and 340g of diphenylmethane bismaleimide (BDM) into the three-necked flask, start stirring, and keep the temperature at 155°C under condensing reflux After reacting for 3h, a viscous liquid resin was obtained after cooling to room temperature. Then according to the method in Example 1, a copper clad laminate was made, and its properties are shown in Table 2.

example 3

[0053] Add 50g of diallyl bisphenol A (DABPA), 70g of epoxy resin (EP), and 230g of diphenylmethane bismaleimide (BDM) into the three-necked flask, start stirring, and keep the temperature at 155°C under condensing reflux After reacting for 4h, a viscous liquid resin was obtained after cooling to room temperature. Then according to the method in Example 1, a copper clad laminate was made, and its properties are shown in Table 2.

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Abstract

The invention relates to a high weather-proof thermosetting resin composite and prepreg and copper-clad laminate prepared thereby. The high weather-proof thermosetting resin composite comprises the following components in parts by weight: 10-40 parts of allyl compound, 8-80 parts of bismaleimide compound, 0-30 parts of epoxy resin and 0.05-5 parts of catalyst, wherein the molar ratio of allyl compound to bismaleimide compound is 1:2-4. The high weather-proof thermosetting resin composite provided by the invention has higher heat resistance, and the coefficient of thermal expansion (CTE) can be lowered to be below 2.0% to satisfy the requirements of manufacturing high multi-layer PCB. The prepreg prepared by the high weather-proof thermosetting resin composite has simple manufacture, better heat-resistant effect and high heat conductivity. The copper-clad laminate of the invention can be applied to heat-resisting and high multi-layer circuits and has simple manufacturing technology and low cost.

Description

technical field [0001] The invention relates to a thermosetting resin composition, in particular to a high heat-resistant thermosetting resin composition used in the field of copper-clad laminates, and prepregs and copper-clad laminates made of the same. Background technique [0002] With the rapid development of electronic information technology and the emergence of surface mount technology, PCB (printed circuit substrate) is developing in the direction of high density, high speed, low loss, high frequency, high reliability, multi-layer, low cost and automatic continuous production . At the same time, higher requirements are placed on the heat resistance and reliability of PCB substrates. Epoxy resin glass fiber cloth copper clad laminate (FR4-CCL) with epoxy resin as the main body has been widely used as PCB substrate. However, because FR-4 has the disadvantages of poor high temperature resistance and high dielectric constant, it cannot be used in high frequency, high te...

Claims

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Application Information

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IPC IPC(8): C08G73/10C08F283/10C08L79/08C08L63/00C08L51/08H05K1/03C09J179/08C09J163/00C09J151/08D06M15/59D06M15/55D06M15/37C03C25/42C03C25/36D21H19/24
Inventor 苏民社高冠群杨中强
Owner GUANGDONG SHENGYI SCI TECH
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