507results about How to "High glass transition temperature" patented technology

The present invention relates to an organic electroluminescent (OEL) compound that comprises at least one fluorene derivative and at least one carbazole derivative. The compound has good electrical properties, light emitting properties and charge transport ability, and thus is suitable as a host material suitable for fluorescent and phosphorescent dopants of all colors including red, green, blue, white, etc., and as a charge transport material. An OEL display device that uses an organic layer that includes the OEL compound has a high efficiency, a low voltage, a high luminance, and a long lifespan because it has superior current density.

An oligomer, uncured polymer or cured polymer comprising the reaction product of one or more polyfunctional compounds containing two or more cyclopentadienone groups and at least one polyfunctional compound containing two or more aromatic acetylene groups wherein at least some of the polyfunctional compounds contain three or more reactive groups. Such oligomers and uncured polymers may be cured to form cured polymers which are useful as dielectrics in the microelectronics industry, especially for dielectrics in integrated circuits.

It is an object to provide a novel bipolar organic compound. In particular, it is an object to provide a bipolar organic compound excellent in thermal stability. Further, it is another object to provide a bipolar organic compound which is electrochemically stable. A quinoxaline derivative represented by a general formula (1) is provided. Further, since the quinoxaline derivative represented by the general formula (1) is bipolar, the use of the quinoxaline derivative of the present invention allows fabrication of a light-emitting element and a light-emitting device with a low driving voltage and low power consumption. Furthermore, a light-emitting element with high luminous efficiency can be obtained.

Provided are a glass sheet for a CIGS solar cell which satisfies both of high power generation efficiency and high glass transition temperature, and a CIGS solar cell having high power generation efficiency. A glass sheet for a Cu—In—Ga—Se solar cell containing, in terms of mol % on the basis of the following oxides, 60 to 75% of SiO₂, 3 to 10% of Al₂O₃, 0 to 3% of B₂O₃, 5 to 18% of MgO, 0 to 5% of CaO, 4 to 18.5% of Na₂O, 0 to 17% of K₂O, and 0% or more and less than 10% of SrO+BaO+ZrO₂, wherein K₂O/(Na₂O+K₂O) is 0 to 0.5, and the glass sheet has a glass transition temperature (Tg) of more than 550° C.

A cyanate ester compound represented by the formula (1),

• • wherein Ar₂ represents a phenylene group, a naphthylene group or a biphenylene group, Ar₁ represents a naphthylene group or a biphenylene group when Ar₂ is a phenylene group, or Ar₁ represents a phenylene group, a naphthylene group or a biphenylene group when Ar₂ is a naphthylene group or a biphenylene group, R_x represents all substituents of Ar₁ each R_x is the same or different and represents hydrogen, an alkyl group or an aryl group, R_y represents all substituents of Ar₂, each R_y is the same or different and represents hydrogen, an alkyl group or an aryl group, and n is an integer of 1 to 50.

The invention relates to an epoxy resin modified water-based polyurethane emulsion and a preparation method thereof. The emulsion comprises the following components in percentage by weight: 20 to 40 percent of isophorone diisocyanate, 20 to 40 percent of polyester, 5 to 10 percent of hydrophilic chain extender, 2 to 10 percent of chain extender, 1 to 3 percent of crosslinker, 3 to 10 percent of neutralizing agent, 2 to 10 percent of epoxy resin and 10 to 20 percent of acetone. The preparation method comprises the steps of feed preparation, polyester dehydration, the synthesis and neutralization of prepolymer, and chain extension and emulsification. Compared with the prior art, the epoxy resin modified water-based polyurethane emulsion has the advantages of high hardness of film, good water resistance and solvent resistance and the like, and is widely applied in the field of packaging coatings.

The invention belongs to the technical field of organic luminescence materials. The gathering luminescence material of the invention contains a triphenyl thylene structure, ketone carbonyl is converted into double bonds by substituent phenyl ketone through a Wittig reaction or a Wittig-Horner reaction during synthesis, and the triphenyl thylene structure is formed and then is connected with otheraromatic base groups. The synthesis method has simple technique and easy purification, and the synthesized organic luminescence material containing the triphenyl thylene structure not only has obvious gathering induced luminescence performance, high thermal stability, high vitrifaction transformation temperature and high luminescence intensity, but also is suitable for preparing a luminescence layer material in an organic electroluminescence material component; by introducing proper base groups, and the organic luminescence material also can be used as a fluorescent probe and organic solar battery sensitizing dyestuff.

The invention relates to a thermosetting resin composition with high heat conductivity, a prepreg manufactured by adopting the same and a copper-clad laminate. The thermosetting resin composition with high heat conductivity comprises the following components in parts by mass: 5 parts of allyl phenolic compound, 5-40 parts of bismaleimide compound, 0-30 parts of modified resin, 25-85 parts of filler and 1-8 parts of catalyst. The thermosetting resin composition with high heat conductivity, which is provided by the invention, has the superior properties of high heat conductivity, high glass transition temperature, low CTE, high heat decomposition temperature, favorable process deformability and the like; the prepreg is simple to manufacture and has better heat resisting effect and high heat conductivity; and the copper-clad laminate can be applied to the manufacture of a high multi-layer circuit with high-temperature resistance and has simple manufacture process and lower cost.

The invention relates to a preparation method of high-reaction-activity hydroxyl acrylic resin. According to the invention, a solvent in a reactor is heated to a preset temperature under the protection of an inert gas; a mixture of a monomer component A with hard monomer as a main component (and comprising a small amount of soft monomer, hydroxyl monomer and carboxyl monomer) and an initiation agent is slowly added; a reaction is carried out for a certain period of time with maintained temperature; a mixture of a monomer component B with soft monomer as a main component (and comprising a small amount of hard monomer, hydroxyl monomer and carboxyl monomer) and an initiation agent is slowly added; and reaction is carried out for a certain period of time with maintained temperature, such that acrylic resin comprising hydroxyl is obtained. The invention has the characteristic that common monomers are adopted, and only the synthesis process is changed wherein monomer dropping sequence is changed, such that resin molecular structure is substantially changed, and the synthesized hydroxyl acrylic resin shows high reaction activity during a curing reaction. The method provided by the invention also has the advantages of low cost, simple process, and suitability for industrialized productions.

An engine is made by providing a layer of material between the outer surface of a cylinder liner and the inner surface of the cylinder opening within an engine block. The material can be a polymer or a ceramic. Polyether ether ketone or polyethylene terephthalate can be a polymer used for these purposes. Zirconia or yttria can be ceramic used for these purposes. An electro-deposited paint can serve as the layer of thermally insulative material.

An image forming apparatus includes a charge roller with improved resistance to defects from prolonged periods of nonuse. The charge roller includes an outermost coating layer including a coating material and filler particles. The filler particles have an average particle size larger than an average thickness of the outermost coating layer in a portion without the filler particles. Furthermore, the filler particles are harder and have a higher glass transition temperature than the coating material.

An epoxy resin mold plastic and its production are disclosed. The mold plastic consists of liquid-crystal epoxy resin, methyl-phenolic epoxy resin, epoxy resin containing biphenyl unit structure, melamine modified linear phenolic resin, silicone micro-powder, imidazo curing improver, toughening agent and silane coupling agent. The process is carried out by treating silicone micro-powder in mixer by coupling agent for 2-5mins, adding into other components, mixing for 3-5mins, melt milling at 95-135 degree for 3-5mins, cooling, crushing, mesh screening, pressing into material cake and storing below 6degree. Its advantages include low thermal expansion coefficient, excellent heat and fire resistances, better toughness and fluidity, no phosphor, no antimony and environmental pollution. It can be used to pack large-scale circuit and electronic devices.

Clear polyurethane fiber reinforced composites are produced by a pultrusion process with a polyurethane-forming system that includes: (a) a clear, aliphatic polyisocyanate having a viscosity at 25° C. of no more than 1000 centipoise, (b) a colorless polyol component comprising an amine-initiated polyol having a molecular weight of from about 150 to about 400 and an OH functionality greater than or equal to 3, and (c) a catalyst. These fiber-reinforced composites are characterized by both excellent weathering characteristics and excellent physical properties.

The invention belongs to the technical field of organic light emitting materials, and discloses an aggregation-induced light emitting material simultaneously containing a triphenylethylene structure and a tetraphenylethylene structure. During synthesis, a triphenylethylene intermediate containing a functional group and a tetraphenylethylene intermediate containing a functional group are connected together by coupling reaction. A synthesis method of the invention has the advantages of simple process and convenient purification; and the synthesized organic light emitting material simultaneously containing the triphenylethylene structure and the tetraphenylethylene structure has the advantages of obvious aggregation-induced light emitting performance, high thermal stability, high glass-transition temperature and high luminous intensity and is suitable for preparing a light emitting layer material in an organic electroluminescent material device.

There are provided a vinyl compound which is excellent in heat resistance and electric characteristics and excellent in reactivity by introducing a vinyl group into a terminal of a bifunctional polyphenylene ether oligomer, and a cured product thereof which has a high glass transition temperature, has a low dielectric constant and a low dielectric loss tangent and has the excellent properties of polyphenylene ether.

The present invention provides biodegradable, biocompatible bis-(α-amino acyl)-diol-diester-containing poly(ester amide) (PEA) and poly(ester urethane) (PEUR) co-polymer compositions with mechanical properties that can be readily tailored by selection of various combinations and proportions of the building blocks of the co-polymers. The compositions are suitable for use in production of drug-releasing biodegradable particles and implantable surgical devices, such as stents and internal fixation devices. The co-polymer compositions, particles and surgical devices biodegrade in vivo by enzymatic action to release bioactive agents in a controlled manner over time as well as biocompatible breakdown products, including one to multiple different amino acids.

A polymer comprising repeat units of the formula:

wherein R¹ is independently in each occurrence C_1-20 hydrocarbyl or C1-20 hydrocarbyl containing one or more heteroatoms of S, N, O, P or Si or both R¹ may form, with the 9-carbon of the fluorene ring, a C_5-20 ring structure containing one or more heteroatoms of S, N, or O; R² is independently in each occurrence C_1-20 hydrocarbyl, C_1-20 hydrocarbyloxy, C_1-20 thioether, C_1-20 hydrocarbyloxycarbonyl, hydrocarbylcarbonyloxy, or cyano; a is independently in each occurrence a number from about 0 to about 1;

• m is a number from about 1 to about 2; and
• n is a number from about 3 or greater.

The invention discloses a modified graphene oxide and epoxy resin composite material and a method for preparing the same. The modified graphene oxide and epoxy resin composite material and the method have the advantages that graphene oxide is modified by the aid of polyether amine to obtain novel polyether amine modified graphene oxide materials, and accordingly the problems in the aspect of dispersibility of graphene in polymer matrixes can be effectively solved; as proved by test results, the tensile mechanical strength, the toughness and the bending strength of epoxy resin materials can be simultaneously greatly improved by the added polyether amine modified graphene oxide while the glass transition temperatures of the epoxy resin materials is increased by the added polyether amine modified graphene oxide, enhancement effects of the epoxy resin materials are superior to enhancement effects of epoxy resin materials with unmodified graphene oxide, and accordingly the modified graphene oxide and epoxy resin composite material and the method have broad market application prospects.

Shape memory polymers prepared by copolymerizing two monomers, which each separately produce polymers characterized by different glass transition temperatures in the presence of a multi-functional monomer whereby the copolymer formed is cross-linked during the polymerization to form a thermoset network. The transition temperature of the final polymers is adjusted by the ratio of the monomers selected, to from about 150° C. to about 270° C., while the degree of crosslinking controls the rubbery modulus plateau. The shape memory polymers can be processed as castable formulations in the form of bulk articles, coatings and films. The invention also relates to the articles of manufacture thereof and methods of the preparation and use thereof.

A laminated glass may be obtained by integrally bonding glass sheets through an adhesive, the adhesive comprising a hydrogenated block copolymer obtained by introducing an alkoxysilyl group into a hydrogenated block copolymer that is obtained by hydrogenating unsaturated bonds of a block copolymer that comprises at least two polymer blocks and at least one polymer block, the polymer block comprising a repeating unit derived from an aromatic vinyl compound as a main component, the polymer block comprising a repeating unit derived from a linear conjugated diene compound as a main component, and a ratio (wA:wB) of a weight fraction wA of the polymer block in the block copolymer to a weight fraction wB of the polymer block in the block copolymer being 30:70 to 60:40. The laminated glass may employ a block copolymer hydrogenation product comprising an alkoxysilyl group and excellent light-fastness, heat resistance, moisture resistance and transparency.

The invention discloses a making method of benzoxazine intermediate with active functional group, which is characterized by the following: adopting diamine, dihydric phenol and formaldehyde as raw material; introducing the unit of diamine and dihydric phenol into the intermediate of benzoxazine; polymerizing under heating condition; reducing the ring-opening polymerizing temperature of benzoxazine; fitting for making high-property structural material, electric insulating material, electronic packing material, flame-proof material or braking material with temperature over 155 deg.c.

The present invention discloses an epoxy/silicone polymer composite material and a preparation method and application thereof. The present invention includes mixing 100 parts by weight of epoxy resin, 5-500 parts by weight of alkyl methylpolysiloxane and 10-200 parts by weight of MQ silicon resin for curing processing at 20-180 DEG C to obtain the epoxy/silicone polymer composite material. The epoxy resin not only self-crosslinks, but also occurs curing crosslinking with the MQ silicon resin through the alkyl methylpolysiloxane or forms interpenetrating network with high strength and glass transition temperature to achieve improvement of adhesiveness of epoxy/silicone polymer composite material. The MQ silicon resin makes the film surface roughness of the epoxy/silicone polymer composite material significantly increase by forming a multi-structure, and the water contact angle be greatly improved. The epoxy/silicone polymer composite material is available in raw materials, low in cost, and simple in preparation process. The prepared epoxy/silicone polymer composite material has excellent water resistance and stain resistance, mechanical strength, adhesion, corrosion resistance and high-temperature resistance performances.

Compositions made from a polyarylate or polyester carbonate containing greater than about 50 mole % resorcinol based ester linkages give miscible blends with polyimide resins, addition of alkyl amide compounds improves mold release and melt flow while maintaining transparency. The blends also have high refractive index and low haze.

The invention relates to a high-frequency resin composition and a high-frequency circuit substrate manufactured by using the same. The high-frequency resin composition comprises the following solid components: (A) an ethylene rhodanate compound with a molecule comprising at least two cyanato bases or a preformed polymer thereof; (B) active ester and (C) epoxy resin with a molecule comprising at least one arylidene alkyl. According to the weight parts of the solid components, the total weight of the ethylene rhodanate compound with the molecule comprising at least two cyanato bases or the preformed polymer thereof in the component (A) and the active ester of the component (B) is 10-70 parts by weight, the dosage of the epoxy resin with the molecule comprising at least one arylidene alkyl is 30-90 parts by weight in the component (C), and the weight ratio of the ethylene rhodanate compound with the molecule comprising at least two cyanato bases or the preformed polymer thereof in the component (A) and the active ester of the component (B) is 0.2-5:1. The high-frequency circuit substrate manufactured by using the high-frequency resin composition comprises a plurality of layers of mutually-stacked semi-solid pieces and copper foil which is respectively pressed on both sides of the semi-solid piece, wherein the plurality of layers of mutually-stacked semi-solid pieces comprise a base material and a high-frequency resin composition which is attached to the base material after being impregnated and dried.

The invention relates to a polyamide composition with high dimensional stability and a preparation method thereof. The polyamide composition comprises the following components in parts by weight: 60 to 90 of fatty polyamide composition, 2 to 10 of compatilizer, 1 to 10 of inorganic metal compound, 0 to 5 of polysiloxane with low molecular weight and 0 to 2 of auxiliary agent. The preparation method comprises the following steps of: premixing the raw materials in a high-speed mixer for 10 to 30min, controlling the temperature to be 40 to 60 DEG C, then adding premix into a double-screw extruder, conveying, melting, shearing, extruding, cooling and granulating so as to prepare a polyamide composition product with high dimensional stability. Compared with the prior art, the invention shows excellent dimensional stability and heat distortion temperature with high retention rate, is suitable for occasions with higher requirement to the dimensional stability, such as the panel of the air conditioner of an automobile, an instrument panel, a camera bracket, a sports apparatus and the like, and can be directly processed by injection molding or other forming methods.

The invention relates to a method for preparing epoxy resin composite, in particular to a method for preparing graphene/epoxy resin composite. The method aims to solve the problems that existing epoxy resin is high in brittleness, poor in impact resistance and prone to cracking. The method comprises the steps that first, graphene is prepared through a chemical oxidation method, second, the graphene is dispersed in epoxy resin, and third, the graphene and the epoxy resin are compounded. The method has the advantages that the preparation method is simple, ethyl alcohol is adopted as solvent, organic solvent is avoided, better environment friendliness is achieved, and the ethyl alcohol is volatile and is easy to eliminate, and has no influence on preparation of the graphene/epoxy resin composite; compared with pure epoxy resin, tensile strength of the graphene/epoxy resin composite is improved by 34.9%-124.8%, impact strength of the graphene/epoxy resin composite is improved by 15.4%-105.1%, and glass-transition temperature is improved by 5-19 DEG C.

An epoxy resin curing agent having a number average molecular weight of 500 to 3,000, represented by the formula (1), and a cured product thereof.

Provided are a polyimide that demonstrates low coefficient of hygroscopic expansion and low water absorption coefficient when used as an insulation film, as well as an ester group-containing tetracarboxylic acid dianhydride expressed by the general formula below, and a novel polyesterimide precursor derived therefrom and polyesterimide, for use in the production of such polyimide:

In the formula, each R is independent and represents a straight or branched-chain alkyl group with 1 to 6 carbon atoms or straight or branched-chain alkoxyl group with 1 to 6 carbon atoms, n is an integer of 0 to 4, and m is an integer of 2 to 4, with the proviso that if m=2, n is an integer of 1 to 4.

The invention discloses an epoxy functionalized chain extender for bio-base and biodegradation-base polymers, and a preparation method and application thereof. The chain extender is prepared from the following raw materials in parts by mass: 50-75 parts of styrene monomer, 25-50 parts of acrylic acid glyceride monomer and 2-12 parts of initiator. The preparation method of the epoxy functionalized chain extender, which comprises the following steps: selecting the reaction monomers and initiator, adding the reaction monomers and initiator into a reaction kettle in a preset sequence, copolymerizing at proper temperature and mixing speed, removing the solvent from the reaction product, and granulating to obtain the product. The epoxy functionalized chain extender can be used for extending and crosslinking bio-base and biodegradable plastic molecular chains of which polylactic acid (PLA) and polypropylene carbonate (PPC) have fatty group polyester structure. The epoxy functionalized chain extender has the characteristics of narrow molecular weight distribution, high glass transition temperature, simple preparation process, and shorter reaction time since all the raw materials are mixed to react at the solvent reflux temperature.

Disclosed herein are a resin composition for insulation, and an insulating film, a prepreg, and a printed circuit board, manufactured using the same, the resin composition including: a cellulose nanoparticle or a cellulose nanofiber; a liquid crystalline oligomer or a soluble liquid crystalline thermohardenable oligomer; an epoxy resin; and an inorganic filler, so that the resin composition, the insulating film, and the prepreg can have a low coefficient of thermal expansion, a high glass transition temperature, and high rigidity.