Thermosetting resin composition for integrated circuit as well as prepreg and laminated board both fabricated by using composition

Abstract

The invention discloses a thermosetting resin composition for an integrated circuit. The thermosetting resin composition comprises (a) 10-60 parts of an allyl modified bismaleimide resin prepolymer, (b) 10-40 parts of an anhydride compound, (c) 10-50 parts of benzoxazine resin, (d) 5-50 parts of epoxy resin, (e) 5-50 parts of a fire retardant, (f) 0-5 parts of a curing accelerator and (g) 0-35 parts of inorganic stuffing, wherein the number-average molecular weight of the allyl modified bismaleimide resin prepolymer is 1500-8000 g / mol. The resin composition provided by the invention keeps high heat resistance and high Tg characteristic of the allyl modified bismaleimide resin prepolymer, and achieves UL94V-0 level in halogen-free flame retardant aspect on the basis of low phosphorus content, and simultaneously, has low dielectric constant of the anhydride; and therefore, the resin composition is capable of meeting the requirements of the production process of high-performance printed circuit boards such as a high-density interconnected integrated circuit package.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and relates to a thermosetting resin composition used for integrated circuits, a prepreg and a laminate made using the same, and can be applied to the fields of high-density interconnected integrated circuit packaging and the like. Background technique [0002] In recent years, with the diversification of electronic products and the continuous innovation of electronic science and technology, electronic products have become lighter and thinner, and electronic information transmission has increased in speed, and printed electronic circuits have developed in the direction of high multi-layer and high wiring density. This puts forward higher and higher requirements for the basic material of the circuit board - copper clad laminate, not only requires the copper clad laminate substrate to have a high glass transition temperature (Tg), excellent thermal stability, and low thermal expansion c...

AI Technical Summary

Problems solved by technology

Chinese invention patent 200910189765.3 discloses the use of benzoxazine resins to improve the water absorption of epoxy anhydride curing systems, but phosphorus-containing compounds are used in this curing system to meet the requirements of halogen-free flame retardant for boards. These phosphorus-containing flame retardants It is mainly a reactive resin, which can participate in the construction of the cross-linked network of the curing system. After introducing these components, the flame retardancy of the board can be improved, but at the same time, the moisture resistance and dielectric properties of the system are greatly reduced, which cannot meet the requirements Application requirements in high-performance fields such as high-density interconnection integrated circuit packaging

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