57results about How to "Low coefficient of thermal expansion" patented technology

A reinforced silicone resin film comprising at least one polymer layer, wherein at least one of the polymer layers comprises a cured product of at least one silicone resin, and at least one of the polymer layers comprises aluminum oxide nanofibers, wherein the nanofibers comprise at least one aluminum oxide selected from γ-AlO(OH) and γ-Al₂0₃; and a nanofiber-filled silicone composition comprising the aluminum oxide nanofibers.

The invention relates to the technical field of harmlessness treatment of smelting wastes, and especially relates to a ceramsite prepared by using smelting wastes, and a preparation method thereof. The ceramsite comprises 10-90% of smelting waste powder, 5-40% of municipal sludge, 4-20% of fly ash, 0-20% of gangue and 0.1-10% of a curing agent. The preparation method of the ceramsite comprises the following steps: 1, crushing the smelting wastes by using a crusher to prepare the smelting waste powder; 2, weighing the smelting waste powder, the municipal sludge, the fly ash, gangue and the curing agent, mixing, and uniformly stirring to prepare ceramsite powder; 3, conveying the ceramsite powder to a ball forming granulation machine, and carrying out granulation molding to prepare ceramsite balls; 4, drying the ceramsite balls; and 5, calcining he dried ceramsite balls to prepare the finished ceramsite. The ceramsite prepared in the invention has the advantages of light weight, environmental protection and wide uses; and the preparation method recycles the smelting wastes, and has good economic and social benefits.

The present invention provides a metal-graphite composite material favorable to two-dimensional diffusion of heat and having a high thermal conductivity in two axial directions, and a production method therefor. The metal-graphite composite material of the present invention includes: 20 to 80% by volume of a scaly graphite powder; and a matrix selected from the group consisting of copper, aluminium and alloys thereof, wherein the scaly graphite powder in which a normal vector to a scaly surface thereof is tilted at 20° or higher with respect to a normal vector to a readily heat-conducting surface of the metal-graphite composite material is 15% or less relative to a whole amount of the scaly graphite powder, and the metal-graphite composite material has a relative density of 95% or higher.

The present invention relates to an insulating composition for a substrate including a soluble liquid crystal thermosetting oligomer, a metal alkoxide, a graphene oxide, and a short fiber, and an insulating material and a substrate using the same. The insulating composition in accordance with the present invention can effectively reduce the coefficient of thermal expansion by the addition of the metal alkoxide and the graphene oxide. Therefore, it is possible to provide a substrate material with greatly increased strength and rigidity by the addition of the short fiber as well as to manufacture a substrate with improved thermal stability by using the insulating composition in accordance with the present invention as an insulating material of the substrate to minimize dimensional deformation due to heat.

Disclosed is a resin composition having a low thermal expansion coefficient and a high glass transition temperature used for the insulating layer of a multilayer printed wiring board, capable of forming an insulating layer having fine roughened shapes and imparting sufficient plating peel strength. Also disclosed are a resin sheet, a prepreg, a laminate, a multilayer printed wiring board and a semiconductor device, all of which comprising the resin composition. The resin composition is a resin composition comprising (A) an epoxy resin, (B) a cyanate ester resin, (C) an aromatic polyamide resin containing at least one hydroxyl group and (D) an inorganic filler, as essential components.

To provide a glass plate to be tempered, which has a low thermal expansion coefficient at relatively low temperature, and which can have a sufficiently high surface compression stress by a conventional heat tempering process, even when it is thin. A glass plate to be tempered, which contains B₂O₃ in a range of from 12.5 to 35 mol % in its composition, the difference [X−Y] between the total content X of compounds selected from MgO, CaO, BaO, Na₂O and K₂O in the composition and the content Y of B₂O₃ in the composition being within a range of from −5 to 10 mol %, and which is to be tempered by heating and quenching.

A laminate body containing at least two glass substrate layers and at least one inner resin composition layer existing between the adjacent two glass substrate layers, wherein the inner resin composition layer comprises an inner resin composition that contains a thermosetting resin and an inorganic filler. A laminate plate containing at least two glass substrate layers and at least one inner cured resin layer existing between the adjacent two glass substrate layers, wherein the inner cured resin layer comprises a cured product of an inner resin composition that contains a thermosetting resin and an inorganic filler. A printed wiring board having the laminate plate and a wiring provided on the surface of the laminate plate. A method for producing the laminate plate, which comprises a cured resin layer forming step of forming a cured resin layer on the surface of a glass substrate.

The invention discloses a preparation method of coal based needle coke, which comprises the following steps of: 1) adding a raw material and a diluent into a stirring kettle, stirring and separating out the solvent insoluble matter; 2) heating the mixed liquid in a 1# tubular heating furnace, and feeding the mixed liquid into a pressing hot filtration kettle; 3) filtering, filling an inert gas, pressing and performing hot filtration; 4) performing centrifugal filtration of the filtrate, and feeding the obtained purified raw material into a purified raw material tank; 5) heating the purified raw material in the 1# tubular heating furnace and performing reaction tower circular condensation polymerization, fractionating the escape component to obtain gas, light oil and heavy oil, and recycling the light oil; 6) heating the condensation polymerization concentrate in a 2# tubular heating furnace, coking by a coke tower to obtain coke, and feeding the coke oil gas into a reaction tower; and 7) feeding the prepared green coke into a calcinator, heating and calcining to obtain the product needle coke. The content of quinoline insoluble (QI) in the prepared refined purified asphalt is less than 0.15%, the yield is improved by 10-20%, the coefficient of thermal expansion of the needle coke is low, the pipeline blockage can be avoided, and the material reaction is uniform.

A cooling arrangement is described and includes a heat sink having a first thermal contact surface, an object having a second thermal contact surface and a resilient wall. The first thermal contact surface and the second thermal contact surface face each other and define a gap. The resilient wall is part of an enclosure that surrounds a space at least comprising the gap, and the cooling arrangement includes a facility to maintain a pressure difference between the space and an environment of the cooling arrangement. Additionally, a lithographic apparatus comprising such a cooling arrangement is described.

Provided are a resin composition for an optical film including an alkyl(meth)acrylate unit, a benzyl(meth)acrylate unit, a (meth)acrylic acid unit, and a unit expressed by Chemical Formula I, an optical film, a polarizing plate, and an image display device using the resin composition.

The invention provides resin compositions. Prepreg, a laminated board and a metal foil-coated laminated board which are obtained by using the resin compositions have good heat resistance, heat and humidity resistance, low coefficient of thermal expansion and low modulus. The resin compositions contain epoxy resin (A), cyanate resin (B) and bismaleimide resin (C), have structures represented by a formula (1), a formula (2), a formula (3) and a formula (4), and contain high-molecular-weight resin (D) with a weight-average molecular weight of 100,000-200,000 and inorganic filler (E).

The invention discloses a preparation method of a copper-based composite material for a cylinder sleeve. The preparation method sequentially comprises the following steps that 1, raw materials are weighed, specifically, the raw materials include, by weight, 15 parts of copper-plated carbon nano tubes, 15 parts of copper-plated grapheme, 30 parts of copper-plated carbon fibers, 2.5 parts of nickel powder, 10 parts of Fe powder and 210 parts of copper powder, then 5 parts of lubricating agents are added to the raw materials, ball-milling mixing is carried out for eight hours, and then a mixture is obtained; 2, the mixture prepared in the step 1 is pressed at the pressure of 750 Mpa, and a blank is obtained; 3, the blank prepared in the step 2 is subjected to secondary sintering, and an alloy block is obtained after sintering; and 4, the alloy block treated in the step 3 is subjected to thermal treatment, and then the copper-based composite material for the cylinder sleeve is obtained. The method adopts a specific formula and process, and the obtained cylinder sleeve has the advantages of low coefficient of thermal expansion, good heat conduction property, high high-temperature strength and good wear resistance.

A voltage nonlinear resistor has a voltage nonlinear resistive body including zinc oxide, and a side face high-resistance layer provided on the side face of the resistive body. and the side high-resistance layer is made mainly of Bi(bismuth) and contains Zn(zinc), B(boron), Si(silicon), Al(aluminum), and Ba(barium) which lie within the ranges of ZnO=1.0-25 wt.%, B2O3=1.0-10 wt.%, SiO2=0.1-5 wt.%, Al2O3=0.05-3 wt.%, and BaO=0.05-3 wt.% in terms of oxides.

The invention discloses a high-volume diamond reinforced metal-based composite material and a preparation method and application thereof. The high-volume diamond reinforced metal-based composite material comprises a gradient boron-doped diamond reinforced metal-based composite material and a diamond layer strengthening phase, wherein the diamond layer strengthening phase coats the surface of the gradient boron-doped diamond reinforced metal-based composite material; the gradient boron-doped diamond reinforced metal-based composite material comprises a gradient boron-doped diamond reinforcementbody and a metal matrix; and the gradient boron-doped diamond reinforcement body comprises an undoped diamond reinforcement body and a gradient boron-doped diamond modified layer arranged on the surface of the diamond reinforcement body. According to the material, the preparation method and application thereof, the thermal conductivity is greatly improved by increasing the volume of diamond in the composite material, and meanwhile, due to the fact that a pure diamond layer is uniform in hardness, the pure diamond layer is easier to machine, and is more conveniently applied to various fields.

The invention discloses ceramsite sand used for casting and a preparation method thereof and belongs to the field of polymer materials. The ceramsite sand used for casting comprises the following rawmaterials, aluminium oxide, silicon dioxide, boric oxide, polytetrafluoroethylene, calcium lignosulphonate and zirconium oxide fiber. The ceramsite sand used for casting is prepared by the steps of crushing, mixing, sintering and the like. According to the ceramsite sand, polytetrafluoroethylene, calcium lignosulphonate and zirconium oxide fiber are taken as a reinforcing system, so that the thermal expansivity and collapsibility of the ceramsite sand used for casting are reduced.

A heat-dissipating plate comprises a core layer; and two cover layers formed by being laminated on the top and bottom face of the core layer, wherein, the core layer is composed of a composite material in which a carbon phase is composited in a Cu matrix, the cover layer is composed of a Mo—Cu alloy, and the thermal conductivity in the thickness direction of the heat-dissipating plate is at least 300 W/mK, and the thermal expansion coefficient of the heat-dissipating plate in a direction perpendicular to the thickness direction is at most 9×10-6/K.

The invention discloses a high-speed bullet train brake disc body and a casting method and heat treatment method thereof. The brake disc body is obtained through casting and heat treatment, an upper disc surface and a lower disc surface of the disc body are parallel to each other, and the upper disc surface and the lower disc surface of the disc body are connected through a plurality of U-shaped blocks which are uniformly distributed. According to the physical design of the disc body, a good balance degree of the disc body during high-speed rotation is guaranteed, and the amplitude during high-speed braking of the brake disc is greatly reduced; according to the design of the casting technique of the disc body, the quality of the disc body is greatly improved, and a high safety coefficient and a long service life of the disc body in long-time continuous braking are guaranteed; and according to the design of the heat treatment technology, the strength and the impact to be borne by the disc body during high-speed braking under the extremely-cold environment are reduced, and the thermal warping deformation generated in the continuous braking process is also reduced.

The invention provides a silicone resin composition for producing a silicone laminated substrate by being impregnated in a glass cloth and cured therein, comprising: (A) an organopolysiloxane with a 3-dimensional network structure composed of an R¹SiO_1.5 unit and an R²SiO_1.5 unit and a T unit represented by an RSiO_1.5 unit; (B) an organohydrogenpolysiloxane composed of an R¹SiO_1.5 unit, an R¹₂SiO unit and an R¹_aH_bSiO_(4-a-b)/2 unit; (C) a platinum group metal catalyst; and (D) a filler. There can be a silicone resin composition having a high glass transition temperature, a silicone laminated substrate excellent in properties such as heat resistance and weatherability having low thermal expansion coefficient and suppressed warp and deformation, a method for producing the same and an LED device.

The invention discloses a method for preparing refractory powder for casting coatings by using serpentine tailings and granite waste. The method comprises the following steps: (1) evenly mixing the serpentine tailings with the granite waste, crushing the obtained mixture, calcining, cooling to room temperature, and then carrying out ball-milling to obtain a ball abrasive A; evenly mixing silica powder with industrial aluminum oxide, and carrying out ball-milling to obtain a ball abrasive B; (3) evenly mixing the ball abrasive A with the ball abrasive B, then adding water, Suzhou clay and sodium hexametaphosphate into the obtained mixture, carrying out ball-milling, filtering, and drying to obtain a ball abrasive C; (4) carrying out pressing molding on the ball abrasive C by using a semidry method so as to prepare wafers; (5) sintering the wafers at high temperature, naturally cooling to the room temperature, crushing, smashing, and screening to obtain the refractory powder. The refractory powder prepared by method not only has higher refractoriness and strength as well as a lower thermal expansion coefficient and heat conductivity coefficient, but also has excellent thermal shock resistance and chemical corrosion resistance, thus being widely applied to the casting coatings.

The invention relates to an epoxy modified acrylate resin composition, prepreg, a laminated board and a laminated board covered with metal foil. The prepreg, the laminated board and the laminated board covered with the metal foil are prepared by using the epoxy modified acrylate resin composition. The resin composition comprises epoxy modified acrylate resin (A), inorganic filler (C) which is subjected to surface treatment through a silane coupling agent (B) which is of a structure shown in the formula (I), epoxy resin (D), cyanate ester resin (E) and bismaleimide resin (F). The inorganic filler (C) is modified by adopting the silane coupling agent (B) of the structure shown in the formula (I), the dispersity of the inorganic filler (C) in the epoxy modified acrylate resin (A) is improved,the interlamination binding force of the prepared laminated board and the binding force of the laminated board and the metal foil are high, and the prepreg, the laminated board and the laminated board covered with the metal foil have good heat resistance, dampness-heat resistance and low thermal expansion coefficient and modulus and are suitable for high-end encapsulation. The formula (I) is shown in the description.

The invention relates to a micro-interconnection technology in the field of microelectronic package, in particular to a solder bump/metallization (transitional) layer connecting structure body with favorable solderability in the microelectronic package and application of the solder bump/metallization (transitional) layer connecting structure body. The solder bump/metallization (transitional) layer connecting structure body and the application of the solder bump/metallization (transitional) layer connecting structure body are applied to the technical field of manufacturing of bonding pads of substrates and printed circuit boards in general microelectronic connection as well as metallization transitional layers below solder bumps in the flip-chip bonding interconnection. The connecting structure body is formed by connecting the solder bumps with the metallization layer; the metallization layer is an alloy layer formed by co-depositing 59-69 percent by weight of a ferrum element, 31-41 percent by weight of a nickel element and the balance of a cobalt element; and the solder is a tin-silver or tin-silver-copper series lead-free solder alloy with a relatively-high melting point. According to the method, a ferrum-nickel-cobalt alloy layer is plated on a copper (or nickel) layer by adopting an electroplating method. Relative to a ferrum-nickel coating, a small amount of cobalt is added so as to allow the proportion of the contents of the ferrum and the nickel to be maintained at a lower expansion coefficient in a wider range and maintained constant in a wider temperature range.

A laminate body containing at least one resin composition layer and at least one glass substrate layer, wherein the resin composition layer comprises a resin composition containing a thermosetting resin and an inorganic filler and the glass substrate layer accounts for from 10 to 95% by volume of the entire laminate body. A laminate plate containing at least one cured resin layer and at least one glass substrate layer, wherein the cured resin layer comprises a cured product of a resin composition that contains a thermosetting resin and an inorganic filler and the glass substrate layer accounts for from 10 to 95% by volume of the entire laminate plate. A printed wiring board having the laminate plate and a wiring provided on the surface of the laminate plate. A method for producing the laminate plate comprising a cured resin layer forming step of forming a cured resin layer on the surface of a glass substrate.

The invention discloses a benzodiacyclic dianhydride and low-dielectric-constant polyimide precursor film. The preparation method comprises the following steps: completely dissolving diamine into an aprotic polar solvent; adding benzodiacyclic dianhydride and performing reaction at the temperature of -10 to 35 DEG C for 0.5 to 5 hours under the protection of nitrogen or inert gas to obtain a polyimide precursor solution; coating a base material with the polyimide precursor solution, and performing imidization and stress relief to prepare the low-dielectric-constant polyimide precursor film. The polyimide precursor film prepared by the method has low dielectric constant, low dielectric loss and low water-absorbing rate, and still has low dielectric constant and low dielectric loss after absorbing water; furthermore, the polyimide precursor film has excellent heat stability and mechanical property and can meet the requirement on dielectric materials by 5G communication and high-frequencyhigh-speed electronic industry.

The glass composite has a linear thermal expansion coefficient α_(20-300) of 1.8×10⁻⁶K⁻¹ to 2.4×10⁻⁶K⁻¹, a glass transformation temperature Tg of less than 650° C., and a composition, in weight percent based on oxide content, of: 5-9, B₂O₃; 1-3, Na₂O; 15-22, Al₂O₃; 61-68, SiO₂; 0.2-0.5, K₂O; and 5.5-8.5, MgO. It can be made by sintering a mixture of 40 to 60 wt. % of a borosilicate glass powder and 60 to 40 wt. % of a cordierite powder. The powder mixture can be used to make a glass solder for joining parts, to make a sintered body with thermal shock resistance, or for glazing or soldering PZT ceramics.

The invention discloses a modified polyamic acid resin slurry, which has the characteristics of proper viscosity, good leveling coating performance, strong adhesion and the like, and is wide in raw material source range, low in cost and suitable for large-scale production. According to the invention, the adhesive-free copper-clad plate prepared from the modified polyamic acid resin slurry and a copper foil has excellent dielectric properties, low hygroscopicity and dimensional stability, can meet the specification requirements of a high-frequency flexible printed circuit board on a copper-cladplate, and improves the quality of the circuit board; and more importantly, an adhesive-free copper-clad plate prepared from the modified polyamide acid resin slurry and a copper foil has a great cost advantage. The invention also discloses a preparation method of the modified polyamide acid resin slurry.

A process is provided for producing petroleum coke that is high in strength and sufficiently small in thermal expansion coefficient and sufficiently suppressed from puffing. The process includes coking a feedstock containing a first heavy oil having a sulfur content of 1.0 percent by mass or less, a nitrogen content of 0.5 percent by mass or less, and an aromatic index of 0.1 or greater, produced by hydrodesulfurizing a heavy oil with a sulfur content of 1 percent by mass or more under conditions (1) where the total pressure is 10 MPa or greater and less than 16 MPa and the hydrogen partial pressure is 5 MPa or greater and 16 MPa or less or conditions (2) where the total pressure is 20 MPa or greater and 25 MPa or less and the hydrogen partial pressure is greater than 20 MPa and 25 MPa or less, and a second heavy oil with an aromatic index of 0.3 or greater and an initial boiling point of 150° C. or higher.