146 results about "Nickel coating" patented technology

The invention relates to the technical field of corrosion-resistant coatings, in particular to a post-treatment method for improving the corrosion resistance of a chemical nickel-plated layer in a plasma environment. Comprising the following steps: preparing composite sol, coating a workpiece, carrying out plasma-assisted curing, and then carrying out heat treatment on an inorganic-organic hybrid coating framework; an inorganic-organic hybrid coating framework firmly combined with a nickel-plated layer is formed on the surface of a chemical nickel-plated workpiece under a low-temperature condition by preparing composite sol and matching with plasma-assisted curing, and rare earth elements are immobilized in situ; the inorganic-organic hybrid coating framework is further condensed through subsequent heat treatment, pore collapse and structural densification are achieved, and therefore the final compact corrosion-resistant coating is formed, and rare earth elements are fixed in the compact corrosion-resistant coating in a chemical bonding mode; therefore, thermal stress and interface stripping risks caused by a thermocuring process are eliminated, and long-acting, stable and reliable protection on a matrix under extremely harsh working conditions is realized.

The invention provides fine grid slurry and a preparation method thereof, a solar cell and a photovoltaic module. The fine grid slurry is prepared from the following components in parts by weight: 50 to 65 parts of silver powder, 15 to 25 parts of silver modified nickel-coated copper powder, 2 to 5 parts of alloy powder, 2 to 5 parts of glass powder, 0.5 to 2 parts of aluminum oxide, 10.5 to 17.5 parts of organic carrier and 0.5 to 1.8 parts of additive, the silver-modified nickel-coated copper powder comprises a copper inner core, a nickel coating layer and a silver coating layer, wherein the outer surface of the copper inner core is sequentially coated with the nickel coating layer and the silver coating layer from inside to outside. The alloy powder comprises Ni element, B element and Si element; the aluminum oxide is spherical nano aluminum oxide; the organic carrier comprises organic silicon modified acrylic resin and epoxy resin. According to the fine grid slurry, the raw material cost is remarkably reduced, the process compatibility is good, silk-screen printing can be better supported, and the photoelectric conversion efficiency of a photovoltaic module can be better improved.

The invention provides a method for enabling an optical fiber module interface radiator to be closely attached to an indium heat-conducting sheet. The method comprises the steps that the surface of a nickel-plated layer of the interface radiator is polished to form a rough surface; preliminarily forming an indium heat-conducting sheet on the rough surface; then the workpiece is placed on a jig platform, and a mirror surface roller is arranged on the jig platform; providing a PET (Polyethylene Terephthalate) sheet which is positioned between the surface of the indium heat-conducting sheet and the mirror roller; the method comprises the following steps: pressing an indium heat-conducting sheet into a roller under the roller pressure of 40-110kgf, riveting the bottom of the indium heat-conducting sheet into a rough surface which is tightly combined with the interface radiator, so that a gap and air do not exist on the combined surface, and the top surface of the indium heat-conducting sheet is a flat smooth surface, is attached to the surface of the interface radiator and is tightly combined and molded into an indium heat-conducting thin layer; the surface of the indium heat conduction thin layer is coated with an anti-oxidation coating with the thickness of 1-5 microns; therefore, the indium heat-conducting material can be tightly adhered to the surface of the interface radiator without an adhesive, the interface radiator has excellent drawing resistance and friction resistance, and the influence of thermal resistance caused by air and the adhesive is reduced.

This invention belongs to the field of metal powder preparation technology, and discloses a porous nickel powder, its preparation method, and its applications. The method includes: preparing nickel oxalate powder as a precursor; forming a nickel coating layer on the surface of the nickel oxalate powder by chemical plating to obtain nickel oxalate@nickel core-shell structured composite particles; subjecting the composite particles to pyrolysis annealing treatment, causing the internal nickel oxalate to decompose and generate gas, and the external nickel coating layer to transform into a porous metal framework, thereby obtaining porous nickel powder. This method is simple, low-cost, and produces nickel powder particles with uniform size, stable pore structure, good connectivity, and large specific surface area, making it suitable as a precursor for electrocatalytic active materials or porous electrode materials.

The application discloses a nickel-plated steel strip lead processing method and belongs to the technical field of metal material surface treatment. The method aims to solve the problems of poor plating layer adhesion, large internal stress and easy peeling of the existing nickel-plated steel strip lead. The process steps include: S1, steel strip oil removal treatment; S2, composite activation treatment: the oil-removed steel strip is immersed in a composite activation solution containing sodium citrate to remove the surface oxide layer and form an active adsorption film; S3, nickel plating: the activated steel strip is immersed in a sulfate plating solution containing saccharin and 1,4-butynediol as composite additives for electroplating to form a low-stress and high-density nickel plating layer; S4, post-treatment: cleaning and drying; S5, slitting and packaging. The application cooperates sodium citrate activation with a plating solution system containing stress relieving agents, significantly improves the adhesion between the substrate and the plating layer, reduces the internal stress of the plating layer, and the obtained product has no peeling and falling of the plating layer after repeated bending, low porosity and excellent comprehensive performance, and is particularly suitable for the manufacturing of high-performance electronic component leads.

The invention belongs to the technical field of environmental science and water treatment, and particularly relates to a PLA-Ni-coated MOF composite membrane and a preparation method and application of the PLA-Ni-coated MOF composite membrane. Comprising a porous polylactic acid substrate film constructed by 3D printing, a metal nickel layer arranged on the surface of the polylactic acid substrate film, and a ZIF-8 nanoparticle layer arranged on the surface of the metal nickel layer, the metal nickel layer is arranged between the polylactic acid substrate film and the ZIF-8 nanoparticle layer. The PLA-Ni-coated MOF composite membrane has a three-stage hierarchical composite structure of a PLA substrate membrane, a nickel coating and a ZIF-8 particle layer, is stable in structure and excellent in performance, has good mechanical strength and acid and alkali resistance stability, and is suitable for large-scale industrial oil-water separation.

This invention belongs to the field of grinding disc manufacturing technology, specifically relating to a diamond positioning and implanted grinding disc and its manufacturing method. The grinding disc substrate undergoes a series of processes including degreasing and activation treatments, followed by basic nickel plating to form a base nickel plating layer. Then, using photolithography, a photosensitive dry film pattern with pre-drilled micro-holes is created on the surface of the nickel plating layer. Adhesive is then applied to fill the micro-holes, and diamond abrasive grains are implanted, ensuring the sharp corners remain upwards for initial fixation. Finally, the photosensitive dry film is removed, and a thicker nickel plating reinforcement treatment is performed, ensuring the diamond abrasive grains are firmly encapsulated by the nickel plating layer. This method utilizes photolithography to achieve precise positioning and uniform distribution of the diamond abrasive grains on the substrate surface, and through process control, maintains the abrasive grains in a favorable cutting posture with their sharp corners upwards, significantly enhancing the grain holding strength and effectively preventing loosening, collapse, or detachment. The resulting grinding disc exhibits superior cutting efficiency and stability.

The invention discloses a pi-shaped chip high-voltage pulse attenuation network resistor and a manufacturing method thereof, and belongs to the technical field of electronic components. The network resistor structure comprises a ceramic substrate, a resistive layer, a resistive layer R1, a resistive layer R2, a resistive layer R3, a surface electrode, a back electrode, a side electrode, an electrode nickel-plated layer, an electrode lead-tin-plated layer, a glass protection layer and an epoxy resin layer. The manufacturing method comprises the following steps: printing a surface electrode on the upper surface of a ceramic substrate, printing a back electrode on the lower surface of the ceramic substrate, printing a resistive layer bridged on the surface electrode, printing protective glass on the resistive layer, carrying out laser resistance trimming on the resistive layer, printing an epoxy resin protective layer and a mark on the protective glass, and sputtering a metal layer on the end surface. And preparing an electrode nickel-plated layer and a lead-tin-plated layer on the end surface. The problems that in the prior art, overheat burnout is likely to occur, electrodes are likely to be eroded in a humid or sulfur-containing environment, and the manufacturing precision and stability are difficult to improve and control are solved. The resistor is widely applied to the technical field of attenuation network resistors.

The invention discloses an IGBT substrate and a preparation method thereof, and belongs to the technical field of semiconductor devices.The IGBT substrate comprises a substrate body, the first side of the substrate body is a welding face, the opposite second side of the substrate body is a heat dissipation face, and the substrate body comprises an aluminum silicon carbide layer, an aluminum alloy layer and a nickel plating layer; aluminum alloy layers are arranged on the two opposite sides of the aluminum silicon carbide layer, nickel plating layers are arranged on the outer sides of the aluminum alloy layers on the two sides, the nickel plating layer on one side is of a plane structure and used for forming a welding face, the nickel plating layer on the other side is of an arc-shaped structure and used for forming a heat dissipation face, and a latticed solder resisting strip is arranged on the welding face. A welding area is formed in the grid of the solder resisting strip in an enclosing mode. The surface of the substrate body is coated with a layer of aluminum alloy to improve the plating performance of aluminum silicon carbide, and the surface of the substrate body is plated with nickel to improve the welding performance and the salt spray performance of the substrate.

The invention relates to a continuous annealing method for a nickel-plated plate, and belongs to the technical field of nickel-plated plates. The method comprises the steps that a nickel-plated plate is subjected to sectional continuous annealing, so that an alloy layer with the uniform thickness is attached to the surface of the nickel-plated plate, and a nickel-plated annealed plate is obtained; wherein the sectional type continuous annealing comprises continuous annealing of a preheating section, a heating section, a soaking section, a cooling section and an aging section which are sequentially arranged, and the time of the soaking section is adjusted according to the plate surface temperature of the nickel-plated plate in the soaking section. After the nickel-plated plate is continuously annealed, a nickel-iron alloy layer structure with the thickness of 1.5 microns or above can be obtained, the nickel-iron alloy layer has good ductility and compactness and can be subjected to machining such as stamping deformation along with strip steel, the nickel-plated layer cannot fall off, and good machining performance and corrosion resistance are achieved.

The invention discloses a copper oxide photocatalytic formaldehyde removal fiber and a dust removal duster prepared from the same, relates to the technical field of fibers, and provides a preparation method of the copper oxide photocatalytic formaldehyde removal fiber and application of the copper oxide photocatalytic formaldehyde removal fiber to the dust removal duster, and formaldehyde in air is degraded through photocatalysis while dust is removed, so that the indoor air quality is improved. A silicon dioxide-carbon compound is further prepared, the good formaldehyde adsorption effect can be achieved, then the silicon dioxide-carbon compound is subjected to nickel plating treatment, nano yttrium oxide is added into a nickel plating solution, the roughness of a nickel plating layer can be increased through addition of the nano yttrium oxide, and the formaldehyde adsorption effect is improved. The specific surface area of the nickel-plated silicon dioxide-carbon compound is increased, and the next step of copper plating treatment is facilitated, so that the formaldehyde removal capability of the copper oxide photocatalytic formaldehyde removal fiber is enhanced.

The invention discloses a nickel-plated titanium alloy vapor chamber and a preparation method thereof, and relates to the technical field of vapor chamber preparation. The vapor chamber is composed of an upper cover and a lower cover which are made of titanium alloy materials, the surface of the vapor chamber is coated with a nickel plating layer, and the preparation method of the vapor chamber comprises the steps that a part welded with a capillary structure is subjected to monomer passivation, then the upper cover and the lower cover are subjected to laser sealing and vacuumizing pre-sealing, and a semi-finished product with a high-vacuum-degree inner cavity is formed; and then the surface of the semi-finished product is subjected to nickel plating treatment, and finally opening breaking, liquid injection and sealing are conducted. According to the method, vacuumizing and pre-sealing are carried out before nickel plating, the technical problems that in a traditional technology, due to high-temperature baking, a vapor chamber swells, and an inner cavity is polluted by nickel plating liquid medicine are effectively solved, meanwhile, it is guaranteed that high binding force exists between a nickel plating layer and a titanium alloy base body, and the product has the light weight, high reliability and excellent heat dissipation performance.

The utility model discloses a cyanide-free imitation gold plating layer structure of an aluminum alloy part, which comprises an aluminum alloy substrate, and a chemical zinc deposition layer, a citrate pre-nickel plating layer, a nickel-copper alloy plating layer, a bright nickel plating layer, a cyanide-free imitation gold plating layer and an electrophoretic varnish coating which are sequentially prepared on the aluminum alloy substrate from inside to outside. According to the cyanide-free gold-imitating plating layer structure of the aluminum alloy part disclosed by the utility model, the binding force of the plating layer is tested by a thermal shock method according to the GB / T 5270-2005'metal covering layer electro-deposition and chemical deposition layer adhesion strength test method on a metal matrix ', the binding force meets the standard requirement, an acetate fog test is carried out for 168 hours according to the GB / T 10125-2021'artificial atmosphere corrosion test and salt spray test', and the binding force meets the standard requirement. And no red corrosives are generated on the surface of a plated part, and the plating layer structure has good corrosion resistance.

This invention relates to a nickel-plated steel sheet with excellent corrosion resistance for battery casings and a method for manufacturing the same. In one specific embodiment, the nickel-plated steel sheet comprises: a base steel sheet; a nickel plating layer formed on at least one surface of the base steel sheet; and a nickel-iron diffusion layer formed between the base steel sheet and the nickel plating layer. The nickel plating layer and the nickel-iron (Ni-Fe) diffusion layer are formed by heat treatment after forming an electroplated nickel layer on the base steel sheet and a chemically plated nickel layer on at least a portion of the surface of the electroplated nickel layer. The nickel plating layer contains one or more vacancy elements selected from phosphorus (P), boron (B), tungsten (W), cobalt (Co), molybdenum (Mo), and copper (Cu) on its surface.

The utility model discloses a cross-shaped light-permeable switch elastic sheet which comprises a switch elastic sheet body, the switch elastic sheet body comprises an outer convex ring, the inner side of the outer convex ring is fixedly connected with an inner concave ring, the outer side of the outer convex ring is fixedly connected with a supporting ring, and the outer side of the circumference of the supporting ring is fixedly connected with a plurality of supporting legs. The top of the switch elastic sheet body is punched to form a light hole, the switch elastic sheet body is a stainless steel switch elastic sheet, the outer side of the switch elastic sheet body is provided with a wear-resistant layer, the inner side of the switch elastic sheet body is provided with an adhesion layer, and the wear-resistant layer and the adhesion layer are nickel-plated layers. According to the utility model, the arrangement of the light-transmitting hole facilitates the transmission of the light of the indicating lamp, thereby facilitating the lamp tube indication of the switch elastic sheet at night, and further facilitating the diversified use of the switch elastic sheet.

The invention provides a copper foil for a current collector suitable for a silicon-based negative electrode active material and a preparation method and application of the copper foil. The copper foil comprises a copper foil substrate and a nickel-plated layer, at least one surface of the copper foil substrate is provided with a nanoscale concave-convex structure. The copper foil for the current collector provided by the invention can effectively solve the two mass problems of pinholes and soft folding marks of the copper foil in the prior art, enhances the adaptability between the copper foil and a silicon-based negative electrode material, and remarkably improves the stability and rate capability of a battery in the cycle process; therefore, the urgent requirements of the fields of new energy automobiles, large-scale energy storage systems and the like on the high-energy-density lithium secondary battery are met. Compared with the prior art, the number of pinholes of the copper foil is reduced by more than 80%, the occurrence rate of breakage caused by soft creases is reduced by more than 90%, and the process is simple and easy to industrialize.

The application relates to a high-radiation shielding particle material and a preparation method thereof, and belongs to the technical field of shielding materials. The application aims to solve the problems that the existing radiation shielding materials cannot have the shielding performance of gamma rays, good flexibility and convenient construction performance and the like, and the particle material is composed of glass microspheres, a chemical nickel plating layer, an electroplated lead layer, an electroplated tungsten layer and an electroplated tantalum layer. The thickness of each layer is controlled to be 20 mu m. The method is that nickel is deposited on the surface of the glass microspheres by a chemical nickel plating method, and then an electroplated lead layer, an electroplated tungsten layer and an electroplated tantalum layer are sequentially deposited by an electroplating method. The glass microspheres are pretreated, and nickel is deposited on the surface of the glass microspheres by a chemical nickel plating method, so that other electroplated layers can be more easily deposited on the surface; the electroplated lead layer and the electroplated tungsten layer have the characteristics of good combined shielding performance of gamma rays and neutrons; and the metal tantalum layer has good gamma ray shielding performance and excellent mechanical performance.

The present disclosure relates to a nickel plated steel sheet for a battery case having excellent corrosion resistance and a method for manufacturing the same. In one embodiment, the nickel plated steel sheet comprises: a base steel sheet; a nickel plating layer formed on one or more surfaces of the base steel sheet; and a nickel-iron (Ni—Fe) diffusion layer formed between the base steel sheet and the nickel plating layer; wherein the nickel plating layer and the nickel-iron (Ni—Fe) diffusion layer are formed by forming an electro-nickel plating layer on the base steel sheet and an electroless nickel plating layer on at least a portion of the surface of the electro-nickel plating layer, followed by heat treatment, and the nickel plating layer includes one or more co-deposited elements selected from phosphorus (P), boron (B), tungsten (W), cobalt (Co), molybdenum (Mo), and copper (Cu) on its surface.

The invention discloses a brazing method for a sapphire-ceramic vacuum arc-extinguishing chamber window and application of the brazing method. The brazing method comprises the steps that an activation layer, a barrier layer and a brazing layer are sequentially deposited on a sapphire brazing face, and a molybdenum-manganese method is used for sintering and chemical nickel plating is carried out on an annular trepanning area of a ceramic shell; the oxygen-free copper metal foil, the kovar alloy metal foil and the nickel metal foil are compounded into a whole, the oxygen-free copper side of the obtained annular composite transition ring is aligned with the sapphire brazing layer, the copper brazing filler metal ring is placed in the middle of the annular composite transition ring, the nickel side of the composite transition ring is aligned with the nickel-plated layer at the opening of the ceramic shell, the copper brazing filler metal ring is placed in the middle of the annular composite transition ring, and the obtained assembly is subjected to vacuum brazing. Two high-strength and high-airtightness brazed joints are formed at a time, and therefore the sapphire window is connected to the ceramic shell in a sealed mode through the composite transition ring. By introducing a multi-layer composite transition layer structure, the thermal stress matching problem is effectively solved, so that a sealing interface with ultrahigh air tightness, high mechanical strength and excellent long-term reliability is realized.

This invention discloses a cathode plate mesh for water electrolysis, its preparation method, and an electrolysis apparatus, relating to the field of hydrogen production through water electrolysis. Molten nickel and aluminum droplets are sprayed onto the heated electrode plate mesh surface using atmospheric plasma spraying. This facilitates diffusion between the heated electrode plate mesh surface and the molten nickel and aluminum droplets, increasing the contact area between nickel / aluminum and nickel / nickel, while simultaneously promoting the diffusion of numerous elements to form a strong bond. Heating the nickel-aluminum mixed coating surface promotes interfacial bonding of deposited particles and facilitates diffusion at the nickel-aluminum interface, forming a nickel-aluminum alloy. This further enhances the surface activity of the porous nickel coating after aluminum removal and activation. The preparation method provided in this invention enables the preparation of a catalytic nickel coating on the electrode plate mesh surface, resulting in a porous nickel coating with high interfacial bonding strength and high activity, meeting the requirements for efficient and stable operation in an electrolyzer.

To provide a nickel plated laminate capable of easily changing the concentration of phosphorus included in a plurality of nickel layers; a semiconductor device; an apparatus for manufacturing the nickel plated laminate; a method for manufacturing the nickel plated laminate; and a method for manufacturing the semiconductor device.SOLUTION: A method for manufacturing a nickel plated laminate 2 comprises: the step (S1) of preparing a nickel (Ni) plating solution 200 including phosphorus (P) and a sulfur additive and a material 1 to be plated; and the step (S2) of forming the nickel plated laminate 2 on the material 1 to be plated using the nickel plating solution 200. The nickel plated laminate 2 includes nickel layers 20 having different phosphorus concentrations.SELECTED DRAWING: Figure 4

The invention relates to the technical field of electronic components, in particular to a high-moisture-proof multi-layer resistor and a preparation method of the high-moisture-proof multi-layer resistor. The resistor comprises an aluminum oxide substrate, a front electrode, a back electrode and a resistance layer between the front electrode and the back electrode; a first protective layer made of glass, a second protective layer which correspondingly covers the laser cutting line groove and is made of thermosetting ink, a third protective layer and a fourth protective layer which are made of at least two layers of epoxy resin, and a fifth protective layer which is positioned at the lap joint of the electrode and the protective layer and is made of resin silver are sequentially laminated on the resistive layer; the outer side of the electrode is provided with a nickel-plated layer and a tin-plated layer which extends and is lapped to the surface of the fourth protective layer; the preparation method comprises the steps of printing and sintering each functional layer and forming each protective layer in a targeted manner. According to the invention, through a multi-layer synergetic sealing structure, especially enhanced protection of a laser groove and an electrode interface, and epitaxial lap joint of a metal coating, excellent moisture resistance, long-term electrical stability and high reliability are realized, and the device is suitable for a harsh environment.

The invention discloses a concentrating cell module and a preparation method thereof, and the concentrating cell module comprises a concentrating gallium arsenide solar cell, a buffer layer, a first silver-gold plating layer, a front copper foil, a substrate, a back copper foil, a nickel plating layer, a palladium plating layer and a gold plating layer, and the front copper foil and the back copper foil are respectively arranged on the front side and the back side of the substrate. A nickel plating layer, a palladium plating layer and a gold plating layer are sequentially plated on the back face of the back copper foil, a first silver-gold plating layer is plated on the front face of the front copper foil, a cell fixing area is preset on the front face of the front copper foil, a buffer layer is plated on the back face of the light-gathering gallium arsenide solar cell, and the buffer layer is a second silver-gold plating layer or a gold-tin plating layer. The light-gathering gallium arsenide solar cell is placed in the cell fixing area, the positive electrode of the light-gathering gallium arsenide solar cell is connected with the positive electrode of the front copper foil, and the negative electrode of the light-gathering gallium arsenide solar cell and the negative electrode of the front copper foil are conducted through resistance welding. According to the invention, the problem of poor heat dissipation performance of the light-condensing gallium arsenide solar cell in high-power light-condensing application can be effectively solved.

One embodiment of the present invention provides a lead tab comprising: a metal substrate; the nickel plating layers are arranged on the two sides of the metal substrate; and a metal layer on the nickel plating layer, in which the metal layer contains 70 to 99.9 wt% of chromium, and in which the adhesive strength of the lead tab is 1.4 N / mm or more.

A cooling roller for producing non-oriented silicon steel ultra-thin strip by plane flow casting, which is composed of a cooling copper roller, characterized in that a nickel plating layer is provided on the surface of the cooling copper roller, and the thickness of the nickel plating layer is controlled to be 30-60 microns; the preparation method comprises the following steps: oil removal; pickling; alkali washing; chemical nickel plating; rinsing; drying; standby. The application can ensure that the B 50 ≥1.63T, P 1T / 400Hz ≤10.21W / kg, thickness is 0.02-0.16 mm, the nickel plating layer is formed by chemical nickel plating on the surface of the cooling copper roller, the adhesion of the cooling copper roller can be increased by 10% compared with that of the cooling copper roller, the production cost is relatively reduced by 25% compared with the current one, the surface of the cooling copper roller is not easy to be oxidized, and the qualified rate of the prepared non-oriented silicon steel ultra-thin strip is increased from the current 76% to not less than 85%.

The present application relates to a kind of high-grade surface flash nickel-plated cold-rolled plate and its production method, when flash nickel-plated, control the following process: 1) the upper surface and the lower surface of the strip steel are simultaneously sprayed with plating solution, and nickel is electroplated;2) the liquid supply flow is adjusted according to the set nickel plating layer thickness;3) the process temperature of plating solution is 50-60 ℃ when flash nickel-plated, heating heat exchanger is used to heat the plating solution when the flash nickel-plated unit starts, and the plating solution is cooled by cooling heat exchanger when the flash nickel-plated unit works normally;4) the plating solution is recycled, and a pre-coated backwash filter device is used to filter the plating solution.The present application is based on the formation mechanism of flash nickel-plated layer, and the main technical means is to improve the uniformity of plating solution distribution and the cleanliness of filtered plating solution, to realize the stable control of the surface quality of high surface grade flash nickel-plated cold-rolled plate, to improve the production efficiency of high surface grade flash nickel-plated cold-rolled plate, to improve the product competitiveness, and to meet the growing market demand, which has great significance.

The present application relates to the technical field of corrosion-resistant coating, in particular to a post-treatment method for improving corrosion resistance of electroless nickel coating in plasma environment. The method comprises composite sol preparation, workpiece coating, plasma-assisted curing and subsequent heat treatment of inorganic-organic hybrid coating framework. The method makes the surface of electroless nickel workpiece form a firm inorganic-organic hybrid coating framework combined with the electroless nickel coating at low temperature by preparing composite sol and plasma-assisted curing, and in-situ immobilizes rare earth elements. The subsequent heat treatment promotes the further condensation of the inorganic-organic hybrid coating framework, realizes pore collapse and structure densification, thereby forming a final dense corrosion-resistant coating, and fixes the rare earth elements in the dense corrosion-resistant coating by chemical bonding. Thus, the risk of thermal stress and interface peeling caused by heat curing process is eliminated, and long-term, stable and reliable protection of the substrate under extremely harsh working conditions is realized.

The invention relates to a high-grade surface flash nickel-plated cold-rolled sheet and a production method thereof. The flash nickel-plating process comprises the following steps: 1) electroplating nickel in a manner of spraying a plating solution on the upper surface and the lower surface of strip steel at the same time; (2) the liquid supply flow is adjusted according to the set nickel plating layer thickness; (3) the process temperature of the plating solution during nickel flash plating is 50-60 DEG C, a heating heat exchanger is adopted to heat the plating solution when the nickel flash plating unit is started, and a cooling heat exchanger is adopted to cool the plating solution when the nickel flash plating unit normally works; and (4) recycling the plating solution, and filtering the plating solution by adopting a pre-coating type backwashing filtering device. Based on the forming mechanism of the flash nickel plating layer, the stable control of the surface quality of the high-surface-grade flash nickel plating cold-rolled sheet is realized by taking the improvement of the distribution uniformity of the plating solution and the improvement of the cleanliness of the plating solution after filtration as main technical means, and the method has great significance in improving the production efficiency of the high-surface-grade flash nickel plating cold-rolled sheet and improving the product competitiveness. And the method has great significance in meeting the ever-increasing market demand.

The application relates to the technical field of metal electroplating, and particularly discloses an electroplating method of molybdenum copper material. The electroplating method of molybdenum copper material comprises the following steps: S1, molybdenum copper material is sequentially subjected to oil removal, water washing, oxidation, water washing, pickling, water washing, activation and water washing treatment to obtain pretreated molybdenum copper material; S2, the pretreated molybdenum copper material is first immersed in a nickel plating solution to perform bottom nickel plating, then immersed in a flash nickel plating solution to perform flash nickel plating, finally immersed in a nickel plating solution to perform nickel plating, and then subjected to water washing to obtain a nickel-plated molybdenum copper material; S3, the nickel-plated molybdenum copper material is immersed in a gold plating solution to perform gold plating, and then subjected to water washing to obtain a gold-plated nickel-plated molybdenum copper material; the nickel plating solution comprises a nickel salt, boric acid, a eutectic solvent, a chitosan-based ionic liquid, a brightener and a dispersant; the electroplating method has the advantages of simple steps, low cost, strong bonding force of the obtained nickel plating layer, smooth and flat surface and wide market prospect.

The invention relates to a nickel electroplating bath for depositing a decorative nickel coating on a substrate to be treated, characterized in that the electroplating bath comprises at least one source of nickel ions, at least one amino acid and / or at least one carboxylic acid other than an amino acid; wherein the total concentration of the amino acids is in the range of from 1 to 10 g / l, and wherein the total concentration of carboxylic acids, not amino acids, is in the range of from 10 to 40 g / l; wherein the electroplating bath is free of boric acid; wherein the total concentration of the nickel ions is in the range of 55 to 80 g / l; and wherein the nickel electroplating bath has a chlorine content in the range of 7.5 to 40 g / l. The invention also relates to a method for depositing a nickel coating on a substrate to be treated; and the use of such a nickel electroplating bath according to the invention for depositing bright, semi-bright, satin, matte or non-conductive particle-containing nickel coatings by carrying out this method.