263 results about "Nickel coating" patented technology

The invention relates to the technical field of corrosion-resistant coatings, in particular to a post-treatment method for improving the corrosion resistance of a chemical nickel-plated layer in a plasma environment. Comprising the following steps: preparing composite sol, coating a workpiece, carrying out plasma-assisted curing, and then carrying out heat treatment on an inorganic-organic hybrid coating framework; an inorganic-organic hybrid coating framework firmly combined with a nickel-plated layer is formed on the surface of a chemical nickel-plated workpiece under a low-temperature condition by preparing composite sol and matching with plasma-assisted curing, and rare earth elements are immobilized in situ; the inorganic-organic hybrid coating framework is further condensed through subsequent heat treatment, pore collapse and structural densification are achieved, and therefore the final compact corrosion-resistant coating is formed, and rare earth elements are fixed in the compact corrosion-resistant coating in a chemical bonding mode; therefore, thermal stress and interface stripping risks caused by a thermocuring process are eliminated, and long-acting, stable and reliable protection on a matrix under extremely harsh working conditions is realized.

The invention relates to the technical field of ceramic microbeads, in particular to a ceramic microbead buoyancy material and a preparation process thereof.According to the ceramic microbead buoyancy material and the preparation process thereof, a nickel-plated layer is formed on the surface of each ceramic microbead, and spraying and coating treatment is conducted on the surface of each nickel-plated ceramic microbead through strengthening paint; amino groups of the aminated nano cerium oxide hollow microspheres are chelated with nickel atoms on the surfaces of the nickel-plated ceramic microspheres through coordinate bonds, so that stable combination between the coating and the nickel-plated ceramic microspheres is enhanced; in the preparation of the ceramic microbeads, the dispersity of mica powder in ceramic slurry can be improved and a multi-stage pore structure is formed by adding a reinforced compound and carrying out stepped graded heating calcination, so that the interface bonding strength of the reinforced compound in the ceramic microbeads and a ceramic matrix is improved, and the compressive strength of the ceramic microbeads is further improved.

The invention relates to the technical field of steel material surface protection, in particular to a method for plating nickel and cobalt on steel by combining direct current and pulse electrodeposition. Comprising the following steps: removing oil from a steel strip by adopting an electrochemical method to obtain an oil-removed steel strip; the oil-removed steel strip is activated, an oxide film on the surface of the base material steel strip is removed, and the pretreated steel strip is obtained; pre-plating a nickel plating layer on the pretreated steel strip by adopting direct-current electrodeposition; and plating a nickel-cobalt alloy layer on the nickel plating layer by adopting pulse electrodeposition. The nickel-plated cobalt steel strip prepared through the method has high corrosion resistance and punch forming capacity, the production efficiency is improved, and the industrial production requirement is met.

The invention provides fine grid slurry and a preparation method thereof, a solar cell and a photovoltaic module. The fine grid slurry is prepared from the following components in parts by weight: 50 to 65 parts of silver powder, 15 to 25 parts of silver modified nickel-coated copper powder, 2 to 5 parts of alloy powder, 2 to 5 parts of glass powder, 0.5 to 2 parts of aluminum oxide, 10.5 to 17.5 parts of organic carrier and 0.5 to 1.8 parts of additive, the silver-modified nickel-coated copper powder comprises a copper inner core, a nickel coating layer and a silver coating layer, wherein the outer surface of the copper inner core is sequentially coated with the nickel coating layer and the silver coating layer from inside to outside. The alloy powder comprises Ni element, B element and Si element; the aluminum oxide is spherical nano aluminum oxide; the organic carrier comprises organic silicon modified acrylic resin and epoxy resin. According to the fine grid slurry, the raw material cost is remarkably reduced, the process compatibility is good, silk-screen printing can be better supported, and the photoelectric conversion efficiency of a photovoltaic module can be better improved.

The invention belongs to the technical field of electromagnetic shielding materials and conductive polymer-based composite materials, and particularly relates to a flexible aramid nanofiber conductive film and a preparation method and application thereof. The preparation method comprises the following steps: firstly, preparing an aramid nanofiber membrane through vacuum-assisted filtration, and then immersing the aramid nanofiber membrane into a nickel ion-containing solution for ultrasonic pretreatment and activation treatment by a sodium borohydride solution to obtain a modified aramid nanofiber membrane; and mixing with a chemical nickel plating solution under an external magnetic field, drying, and dip-coating with a polydimethylsiloxane packaging solution to obtain the flexible aramid nanofiber membrane. The finally obtained flexible aramid nanofiber conductive film has excellent flexibility, heat resistance and corrosion resistance. The method is easy to operate, economical and environmentally friendly, the material has excellent electromagnetic shielding performance due to the porous layered structure of the formed nanofiber membrane and the nickel coating on the surface, and the problem of mutual interference between electronic elements can be solved.

The invention relates to the technical field of metal material processing, and discloses a double-sided burr nickel-plated steel strip and a preparation method thereof.The double-sided burr nickel-plated steel strip comprises a steel strip base body, the double faces of the steel strip base body are provided with three-dimensional burrs and nickel-plated layers, and each nickel-plated layer is composed of a plurality of nickel particles protruding out of the surface of the steel strip base body; the nickel particles are in any one or more of a conical shape, a pyramid shape or an irregular shape, the height of the nickel particles is 2-8 microns, and the bottom diameter of the nickel particles is 1-4 microns. And through electroplating treatment of a double-sided burr structure, the conductivity is remarkably improved, the contact resistance is effectively reduced, and the current distribution uniformity is improved. And meanwhile, the binding force between the plating layer and the substrate is enhanced by the pulse electroplating and periodic reversing electroplating technologies, the problems of interface stripping and plating layer falling are avoided, and the service life of the battery is prolonged. According to the burr structure, by increasing the surface roughness and the microscopic protrusions, the corrosion resistance of the plating layer is remarkably improved, and salt mist and moisture permeation are reduced.

The invention belongs to the technical field of electromagnetic shielding materials and conductive composite fabrics, and particularly relates to an EMI shielding fabric and a preparation method thereof. Firstly, a layer of PDDA solution with positive charges is adsorbed on the surface of the fabric, then the fabric with the positive charges is soaked in ANF dispersion liquid prepared in advance, and the stable high-temperature-resistant fabric adsorbing the ANFs is prepared; the preparation method comprises the following steps: firstly, preparing a high-temperature-resistant fabric, then pretreating the high-temperature-resistant fabric through ultrasonic treatment, activating a fiber membrane through sodium borohydride solution treatment, and chemically plating nickel on the surface of the high-temperature-resistant fabric adsorbing ANFs through a palladium-free chemical plating process, so that the prepared high-temperature-resistant flexible fabric has excellent flexibility, heat resistance, corrosion resistance and efficient shielding effect; the method is easy to operate, economical and environmentally friendly, the porous structure of the formed flexible conductive high-temperature-resistant EMI shielding fabric and the nickel coating on the surface enable the material to have excellent electromagnetic shielding performance, and the problem of mutual interference between electronic elements can be solved.

An electrolytic cathode plate nickel coating stripping device is characterized in that polar plate clamping mechanisms, a stripping cutting tool and moving mechanisms are arranged, the moving mechanisms are correspondingly arranged on guide rails arranged on the two sides of a cathode plate, the polar plate clamping mechanisms are symmetrically arranged on the two sides of the cathode plate, the tail ends of the polar plate clamping mechanisms are fixedly connected with the stripping cutting tool, and the polar plate clamping mechanisms can stretch out and draw back to drive the stripping cutting tool to clamp or loosen the cathode plate; and the head end part of the stripping device is mounted on the moving mechanism and moves up and down along the guide rail under the driving of the moving mechanism, so that the nickel coating can be accurately stripped, and no impact is generated in the stripping process of the stripping device, so that noise and nickel slag splashing caused by the impact are avoided.

The invention discloses a surface nickel plating process for quartz glass, and aims to improve the adhesive force, uniformity and functional performance of a nickel plating layer, simplify the process flow and meet the environmental protection requirement. The process comprises the following steps: firstly, cleaning and roughening the surface of quartz glass, removing surface impurities through a 2% sodium hydroxide solution and a 10% hydrofluoric acid solution, and forming a microscopic rough structure; then treating in a sensitizing solution composed of stannous chloride and hydrochloric acid to enable the surface to adsorb stannous ions; then treating in an activating solution composed of palladium chloride and hydrochloric acid to form a catalytic active layer; then carrying out nickel plating reaction in a chemical nickel plating solution with the temperature of 85 DEG C and the pH value of 4.5, wherein the thickness of a plating layer is 5-10 microns; and finally, the waste liquid is neutralized and flocculated to realize environment-friendly discharge. The process is simple and convenient to operate, and the generated nickel coating is uniform and compact, has excellent conductivity and corrosion resistance, and can be widely applied to the fields of electronics, optics and chemistry.

The invention discloses a high-efficiency and high-leveling-capacity electronickelling solution, and relates to the technical field of electroplating. The high-efficiency and high-leveling-capacity electronickelling solution comprises the following components in parts by mass: 60-90 parts of nickel salt; 60-120 parts of a composite brightener; 40-80 parts of a stabilizer; 50 to 100 parts of an anti-pinhole agent; 40-80 parts of a dispersant; and 50-150 parts of a composite leveling agent. The composite brightener provided by the invention improves the tolerance of high current density, and especially has more prominent advantages on the compactness and binding force of a thick nickel coating; the anti-pinhole agent can reduce the porosity of the plating layer possibly caused by gas precipitation in the electroplating process, and less nickel nodule is generated, so that the toughness of the plating layer is enhanced; according to the nickel electroplating solution with the composite leveling agent matched with the composite brightening agent, the roughness Ra value of a base material with the roughness Ra value being 2.0 microns or above can be reduced to 0.4 microns or below, a dendritic crystal structure cannot occur when the leveling agent and the brightening agent are used in cooperation, and the problem of brittleness of a plating layer is avoided.

The invention belongs to the technical field of additive preparation, and particularly relates to an inner hole laser cladding composite powder material and a preparation method thereof. The invention provides an inner hole laser cladding composite powder material and a preparation method thereof in order to solve the problems that in the prior art, an inner hole laser cladding composite powder material is poor in uniformity and flowability and has limitation in the aspects of hardness, abrasion resistance and corrosion resistance. The material comprises tungsten carbide powder, NiCr alloy powder, silver and calcium fluoride-barium fluoride mixed crystals, mixed ball milling is conducted, ball milling is conducted again after presintering, then gas atomization treatment and laser pretreatment are conducted, and finally a nickel coating is formed on the surface of the powder through a chemical coating. The composite powder material has high hardness, high wear resistance, good corrosion resistance and high-temperature stability and is suitable for inner hole laser cladding, the service life of a workpiece is remarkably prolonged, and the performance of the workpiece is remarkably improved.

The invention relates to a metal plated carbon fiber which comprises a carbon fiber layer, a copper or nickel plating layer is arranged on the carbon fiber layer, and an aluminum plating layer is arranged on the copper or nickel plating layer. The invention also relates to a manufacturing method of the metal-plated carbon fiber, which comprises the following steps: S1, plating copper or nickel on the surface of the carbon fiber by magnetron sputtering: in the plating process of the copper plating layer, setting the magnetron sputtering power to be 150-300W, the argon flow to be 30-80sccm and the sputtering time to be 5-15 minutes; in the sputtering process of the nickel plating layer, the magnetron sputtering power is set to be 300-350 W, the gas ratio is set to be that the ratio of argon to nitrogen is (3.5-4.5): 1, the gas flow is 40-80 sccm, and the sputtering time is 10-20 minutes; and S2, controlled sputtering aluminum plating is conducted, specifically, in the sputtering process of the aluminum plating layer, the power is set to be 250-350 W, the flow of argon or nitrogen is 40-80 sccm, and the sputtering time is 15-25 minutes. According to the method, the stability of the composite material is enhanced, the thermal conductivity and thermal stability are improved, the mechanical property is improved, and the coating thickness can be adjusted.

The invention discloses a high-irradiation shielding granular material and a preparation method thereof, and belongs to the technical field of shielding materials. The invention aims to solve the problems that the existing radiation shielding material cannot have the gamma ray shielding performance, good flexibility, convenient constructability and the like. The particle material is composed of glass microspheres, a chemical nickel-plating layer, an electroplated lead layer, an electroplated tungsten layer and an electroplated tantalum layer. And the thickness of each layer is controlled to be 20 microns. According to the method, nickel is deposited on the surfaces of glass microspheres through a chemical nickel plating method, and then an electroplating lead layer, an electroplating tungsten layer and an electroplating tantalum layer are sequentially deposited through an electroplating method. The glass microspheres are pretreated, and nickel is deposited on the surfaces of the glass microspheres by using a chemical nickel plating method, so that other electroplated layers can be deposited on the surfaces of the glass microspheres more easily; wherein the electroplated lead layer and the electroplated tungsten layer have the characteristic of good gamma ray and neutron composite shielding performance; the metal tantalum layer has good gamma ray shielding performance and excellent mechanical property.

The invention provides a method for enabling an optical fiber module interface radiator to be closely attached to an indium heat-conducting sheet. The method comprises the steps that the surface of a nickel-plated layer of the interface radiator is polished to form a rough surface; preliminarily forming an indium heat-conducting sheet on the rough surface; then the workpiece is placed on a jig platform, and a mirror surface roller is arranged on the jig platform; providing a PET (Polyethylene Terephthalate) sheet which is positioned between the surface of the indium heat-conducting sheet and the mirror roller; the method comprises the following steps: pressing an indium heat-conducting sheet into a roller under the roller pressure of 40-110kgf, riveting the bottom of the indium heat-conducting sheet into a rough surface which is tightly combined with the interface radiator, so that a gap and air do not exist on the combined surface, and the top surface of the indium heat-conducting sheet is a flat smooth surface, is attached to the surface of the interface radiator and is tightly combined and molded into an indium heat-conducting thin layer; the surface of the indium heat conduction thin layer is coated with an anti-oxidation coating with the thickness of 1-5 microns; therefore, the indium heat-conducting material can be tightly adhered to the surface of the interface radiator without an adhesive, the interface radiator has excellent drawing resistance and friction resistance, and the influence of thermal resistance caused by air and the adhesive is reduced.

The invention discloses an electroplated diamond napping piece which comprises a diamond grinding layer, a base body and a cloth base and further comprises a middle nickel-plated layer, a microscopic concave-convex structure is formed on the surface of the base body through high-speed sand blasting grinding, direct current is adopted for electroplating, the middle nickel-plated layer is attached to the base body, and the middle nickel-plated layer is arranged on the base body. And then electroplating is conducted through pulse current, the diamond grinding layer is attached to the surface of the middle nickel plating layer, the base body is bonded to the front face of the cloth base, and fluff is planted on the back face of the cloth base. The invention further discloses a preparation method. The bonding strength of the diamond particles and the base material is enhanced through the middle plating layer, and the diamond particles can be uniformly distributed through electroplating by adopting pulse current, so that the durability and hardness of the product are effectively improved. The method is suitable for the technical field of grinding preparation.

This invention belongs to the field of metal powder preparation technology, and discloses a porous nickel powder, its preparation method, and its applications. The method includes: preparing nickel oxalate powder as a precursor; forming a nickel coating layer on the surface of the nickel oxalate powder by chemical plating to obtain nickel oxalate@nickel core-shell structured composite particles; subjecting the composite particles to pyrolysis annealing treatment, causing the internal nickel oxalate to decompose and generate gas, and the external nickel coating layer to transform into a porous metal framework, thereby obtaining porous nickel powder. This method is simple, low-cost, and produces nickel powder particles with uniform size, stable pore structure, good connectivity, and large specific surface area, making it suitable as a precursor for electrocatalytic active materials or porous electrode materials.

The application discloses a nickel-plated steel strip lead processing method and belongs to the technical field of metal material surface treatment. The method aims to solve the problems of poor plating layer adhesion, large internal stress and easy peeling of the existing nickel-plated steel strip lead. The process steps include: S1, steel strip oil removal treatment; S2, composite activation treatment: the oil-removed steel strip is immersed in a composite activation solution containing sodium citrate to remove the surface oxide layer and form an active adsorption film; S3, nickel plating: the activated steel strip is immersed in a sulfate plating solution containing saccharin and 1,4-butynediol as composite additives for electroplating to form a low-stress and high-density nickel plating layer; S4, post-treatment: cleaning and drying; S5, slitting and packaging. The application cooperates sodium citrate activation with a plating solution system containing stress relieving agents, significantly improves the adhesion between the substrate and the plating layer, reduces the internal stress of the plating layer, and the obtained product has no peeling and falling of the plating layer after repeated bending, low porosity and excellent comprehensive performance, and is particularly suitable for the manufacturing of high-performance electronic component leads.

The invention belongs to the technical field of environmental science and water treatment, and particularly relates to a PLA-Ni-coated MOF composite membrane and a preparation method and application of the PLA-Ni-coated MOF composite membrane. Comprising a porous polylactic acid substrate film constructed by 3D printing, a metal nickel layer arranged on the surface of the polylactic acid substrate film, and a ZIF-8 nanoparticle layer arranged on the surface of the metal nickel layer, the metal nickel layer is arranged between the polylactic acid substrate film and the ZIF-8 nanoparticle layer. The PLA-Ni-coated MOF composite membrane has a three-stage hierarchical composite structure of a PLA substrate membrane, a nickel coating and a ZIF-8 particle layer, is stable in structure and excellent in performance, has good mechanical strength and acid and alkali resistance stability, and is suitable for large-scale industrial oil-water separation.

The invention discloses a chemical nickel-plated layer blackening agent and a blackening method, the chemical nickel-plated layer blackening agent comprises the following components: 400-900g / L of phosphoric acid, 400-900g / L of saturated carboxylic acid, 10-300g / L of an oxidizing agent and 10-100g / L of carbamide, the high-concentration phosphoric acid is used as a main catalyst for a chemical nickel-plated layer (nickel-phosphorus alloy layer) blackening reaction, the complex reaction can be ensured to be stably carried out, and the chemical nickel-plated layer blackening agent can be used for blackening the chemical nickel-plated layer (nickel-phosphorus alloy layer). Meanwhile, due to the high viscosity of phosphoric acid, local peroxidation reaction is prevented, and the defect that in the prior art, a black film layer is generally uneven in color after a nickel-phosphorus alloy layer is blackened is overcome; in addition, saturated carboxylic acid is used as a source of a film-forming substance nitrated carbon chain, so that the defects of poor wear resistance and poor adhesive force of a black film layer after the nickel-phosphorus alloy layer is blackened are overcome; the provided chemical blackening agent for the chemical nickel plating layer has a good blackening effect on a high-phosphorus chemical nickel plating layer, a medium-phosphorus chemical nickel plating layer or a low-phosphorus chemical nickel plating layer. The process is simple to operate, and the formed black film is uniform, has the blackness close to that of carbon black, is well combined with a base material and is not easy to fall off.

This invention belongs to the field of grinding disc manufacturing technology, specifically relating to a diamond positioning and implanted grinding disc and its manufacturing method. The grinding disc substrate undergoes a series of processes including degreasing and activation treatments, followed by basic nickel plating to form a base nickel plating layer. Then, using photolithography, a photosensitive dry film pattern with pre-drilled micro-holes is created on the surface of the nickel plating layer. Adhesive is then applied to fill the micro-holes, and diamond abrasive grains are implanted, ensuring the sharp corners remain upwards for initial fixation. Finally, the photosensitive dry film is removed, and a thicker nickel plating reinforcement treatment is performed, ensuring the diamond abrasive grains are firmly encapsulated by the nickel plating layer. This method utilizes photolithography to achieve precise positioning and uniform distribution of the diamond abrasive grains on the substrate surface, and through process control, maintains the abrasive grains in a favorable cutting posture with their sharp corners upwards, significantly enhancing the grain holding strength and effectively preventing loosening, collapse, or detachment. The resulting grinding disc exhibits superior cutting efficiency and stability.

The invention discloses a pi-shaped chip high-voltage pulse attenuation network resistor and a manufacturing method thereof, and belongs to the technical field of electronic components. The network resistor structure comprises a ceramic substrate, a resistive layer, a resistive layer R1, a resistive layer R2, a resistive layer R3, a surface electrode, a back electrode, a side electrode, an electrode nickel-plated layer, an electrode lead-tin-plated layer, a glass protection layer and an epoxy resin layer. The manufacturing method comprises the following steps: printing a surface electrode on the upper surface of a ceramic substrate, printing a back electrode on the lower surface of the ceramic substrate, printing a resistive layer bridged on the surface electrode, printing protective glass on the resistive layer, carrying out laser resistance trimming on the resistive layer, printing an epoxy resin protective layer and a mark on the protective glass, and sputtering a metal layer on the end surface. And preparing an electrode nickel-plated layer and a lead-tin-plated layer on the end surface. The problems that in the prior art, overheat burnout is likely to occur, electrodes are likely to be eroded in a humid or sulfur-containing environment, and the manufacturing precision and stability are difficult to improve and control are solved. The resistor is widely applied to the technical field of attenuation network resistors.

The invention belongs to the technical field of chemical nickel plating, and particularly relates to a chemical nickel plating solution and a preparation method thereof. The chemical nickel plating solution comprises the following raw materials: 30-50 parts of a nickel source, 20-40 parts of a reducing agent, 10-20 parts of a complexing agent, 3-10 parts of a pH buffer agent, 5-10 parts of a thiourea stabilizer, 0.5-2 parts of a bipyridine ionic liquid surfactant and 1000 parts of deionized water. The chemical nickel plating solution has the advantages of being high in nickel plating speed, compact and uniform in nickel plating layer, good in abrasion resistance and salt resistance and the like.

The invention discloses an IGBT substrate and a preparation method thereof, and belongs to the technical field of semiconductor devices.The IGBT substrate comprises a substrate body, the first side of the substrate body is a welding face, the opposite second side of the substrate body is a heat dissipation face, and the substrate body comprises an aluminum silicon carbide layer, an aluminum alloy layer and a nickel plating layer; aluminum alloy layers are arranged on the two opposite sides of the aluminum silicon carbide layer, nickel plating layers are arranged on the outer sides of the aluminum alloy layers on the two sides, the nickel plating layer on one side is of a plane structure and used for forming a welding face, the nickel plating layer on the other side is of an arc-shaped structure and used for forming a heat dissipation face, and a latticed solder resisting strip is arranged on the welding face. A welding area is formed in the grid of the solder resisting strip in an enclosing mode. The surface of the substrate body is coated with a layer of aluminum alloy to improve the plating performance of aluminum silicon carbide, and the surface of the substrate body is plated with nickel to improve the welding performance and the salt spray performance of the substrate.

The invention relates to a continuous annealing method for a nickel-plated plate, and belongs to the technical field of nickel-plated plates. The method comprises the steps that a nickel-plated plate is subjected to sectional continuous annealing, so that an alloy layer with the uniform thickness is attached to the surface of the nickel-plated plate, and a nickel-plated annealed plate is obtained; wherein the sectional type continuous annealing comprises continuous annealing of a preheating section, a heating section, a soaking section, a cooling section and an aging section which are sequentially arranged, and the time of the soaking section is adjusted according to the plate surface temperature of the nickel-plated plate in the soaking section. After the nickel-plated plate is continuously annealed, a nickel-iron alloy layer structure with the thickness of 1.5 microns or above can be obtained, the nickel-iron alloy layer has good ductility and compactness and can be subjected to machining such as stamping deformation along with strip steel, the nickel-plated layer cannot fall off, and good machining performance and corrosion resistance are achieved.

The invention relates to a preparation method of a high-strength and high-liquid-carrying-capacity superfine tungsten-based material electroplating diamond wire. The tungsten powder, the molybdenum powder and the lanthanum powder are prepared into rods according to a specific formula, and the steps of rotary swaging, drawing, oil removing, acid pickling, nickel layer pre-plating, sand feeding, two-time curing, drying and the like are carried out. A nickel-cobalt alloy coating is formed in curing I, so that the tensile strength and the breaking force are improved, and the line breaking risk is reduced; and a rough crystal coating obtained through curing II improves the liquid carrying capacity, and is beneficial to chip removal and reduction of diamond abrasion. According to the method, the bottleneck problem of wire thinning is solved, and the produced electroplated diamond wire adapts to the cost reduction requirement of the solar photovoltaic power generation industry, has high strength, high wear resistance, good liquid carrying capacity and process stability, can improve the silicon wafer cutting quality and efficiency, reduces silicon material loss, reduces the production cost, and provides powerful support for the development of the photovoltaic industry.

The invention discloses a copper oxide photocatalytic formaldehyde removal fiber and a dust removal duster prepared from the same, relates to the technical field of fibers, and provides a preparation method of the copper oxide photocatalytic formaldehyde removal fiber and application of the copper oxide photocatalytic formaldehyde removal fiber to the dust removal duster, and formaldehyde in air is degraded through photocatalysis while dust is removed, so that the indoor air quality is improved. A silicon dioxide-carbon compound is further prepared, the good formaldehyde adsorption effect can be achieved, then the silicon dioxide-carbon compound is subjected to nickel plating treatment, nano yttrium oxide is added into a nickel plating solution, the roughness of a nickel plating layer can be increased through addition of the nano yttrium oxide, and the formaldehyde adsorption effect is improved. The specific surface area of the nickel-plated silicon dioxide-carbon compound is increased, and the next step of copper plating treatment is facilitated, so that the formaldehyde removal capability of the copper oxide photocatalytic formaldehyde removal fiber is enhanced.

The present invention discloses a preparation method of an electromagnetic shielding material and the electromagnetic shielding material, which comprises the following steps: sequentially performing electroless nickel plating and electroless copper plating on a plant fiber fabric to obtain a fabric with double-layer coating; coating a polydimethylsiloxane solution on both the front and back sides of the fabric with double-layer coating, and drying to obtain the electromagnetic shielding material; the inner layer of the fabric with double-layer coating is a nickel coating layer, and the outer layer is a copper coating layer. The electromagnetic shielding material of the present invention can effectively reduce the electromagnetic reflection loss, enhance the electromagnetic absorption loss, is beneficial to the absorption and conversion of electromagnetic energy, and avoids the secondary pollution of electromagnetic waves.

The invention discloses a nickel-plated titanium alloy vapor chamber and a preparation method thereof, and relates to the technical field of vapor chamber preparation. The vapor chamber is composed of an upper cover and a lower cover which are made of titanium alloy materials, the surface of the vapor chamber is coated with a nickel plating layer, and the preparation method of the vapor chamber comprises the steps that a part welded with a capillary structure is subjected to monomer passivation, then the upper cover and the lower cover are subjected to laser sealing and vacuumizing pre-sealing, and a semi-finished product with a high-vacuum-degree inner cavity is formed; and then the surface of the semi-finished product is subjected to nickel plating treatment, and finally opening breaking, liquid injection and sealing are conducted. According to the method, vacuumizing and pre-sealing are carried out before nickel plating, the technical problems that in a traditional technology, due to high-temperature baking, a vapor chamber swells, and an inner cavity is polluted by nickel plating liquid medicine are effectively solved, meanwhile, it is guaranteed that high binding force exists between a nickel plating layer and a titanium alloy base body, and the product has the light weight, high reliability and excellent heat dissipation performance.

The utility model discloses a cyanide-free imitation gold plating layer structure of an aluminum alloy part, which comprises an aluminum alloy substrate, and a chemical zinc deposition layer, a citrate pre-nickel plating layer, a nickel-copper alloy plating layer, a bright nickel plating layer, a cyanide-free imitation gold plating layer and an electrophoretic varnish coating which are sequentially prepared on the aluminum alloy substrate from inside to outside. According to the cyanide-free gold-imitating plating layer structure of the aluminum alloy part disclosed by the utility model, the binding force of the plating layer is tested by a thermal shock method according to the GB / T 5270-2005'metal covering layer electro-deposition and chemical deposition layer adhesion strength test method on a metal matrix ', the binding force meets the standard requirement, an acetate fog test is carried out for 168 hours according to the GB / T 10125-2021'artificial atmosphere corrosion test and salt spray test', and the binding force meets the standard requirement. And no red corrosives are generated on the surface of a plated part, and the plating layer structure has good corrosion resistance.

This invention relates to a nickel-plated steel sheet with excellent corrosion resistance for battery casings and a method for manufacturing the same. In one specific embodiment, the nickel-plated steel sheet comprises: a base steel sheet; a nickel plating layer formed on at least one surface of the base steel sheet; and a nickel-iron diffusion layer formed between the base steel sheet and the nickel plating layer. The nickel plating layer and the nickel-iron (Ni-Fe) diffusion layer are formed by heat treatment after forming an electroplated nickel layer on the base steel sheet and a chemically plated nickel layer on at least a portion of the surface of the electroplated nickel layer. The nickel plating layer contains one or more vacancy elements selected from phosphorus (P), boron (B), tungsten (W), cobalt (Co), molybdenum (Mo), and copper (Cu) on its surface.