A method of making a
lead frame and a partially patterned
lead frame package with near-
chip scale packaging (CSP) lead-counts is disclosed, wherein the method lends itself to better
automation of the
manufacturing line as well as to improving the quality and reliability of the packages produced therefrom. This is accomplished by performing a major portion of the manufacturing process steps with a partially patterned strip of
metal formed into a web-like
lead frame on one side, in contrast with the conventional fully etched stencil-like lead frames, so that the web-like lead frame, which is
solid and flat on the other side is also rigid mechanically and robust thermally to perform without
distortion or deformation during the
chip-attach and wire bond processes. The bottom side of the
metal lead frame is patterned to isolate the
chip-pad and the wire bond contacts only after the front side, including the chip and wires, is hermetically sealed with an encapsulant. The
resultant package being electrically isolated enables strip testing and reliable singulation without having to
cut into any additional
metal. The use of the instant partially patterned lead frame in making ELP, ELPF and ELGA-type CSPs is also disclosed.