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212results about How to "Difficult to separate" patented technology

Methods and Systems for Improved Data Input, Compression, Recognition, Correction, and Translation through Frequency-Based Language Analysis

System and method for improving data input by using word frequency to text predict input. Other systems and methods include analyzing words already contained in a document (e.g. spell checking and OCR) and using word frequency to create a proxy system to reduce the space required to store data, allowing for more efficient usage of storage and enhancing the embedded content of matrix codes. The system displays the most common words in a language based upon the previously entered or displayed word(s), or the previously entered or displayed character or characters. Words with the most common frequency of use with the prior word(s) are displayed in a table to enable the user to quickly select one of the displayed words for rapid data entry. The input device can be a touch-sensitive display or non-touch sensitive type device.
Owner:SIEGEL ABBY L

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

A method of making a lead frame and a partially patterned lead frame package with near-chip scale packaging lead-count, wherein the method lends itself to better automation of the manufacturing line and improved quality and reliability of the packages produced therefrom. A major portion of the manufacturing process steps is performed with a partially patterned strip of metal formed into a web-like lead frame on one side so that the web-like lead frame is also rigid mechanically and robust thermally to perform without distortion or deformation during the chip-attach and wire bond processes, both at the chip level and the package level. The bottom side of the metal lead frame is patterned to isolate the chip-pad and the wire bond contacts only after the front side, including the chip and wires, is hermetically sealed with an encapsulant. The resultant package being electrically isolated enables strip testing and reliable singulation.
Owner:UNISEM M BERHAD

Packet analysis system

A packet analysis system captures packets propagating through a network, and analyzes the captured packets. The packet analysis has a plurality of terminal node type sensors and a server. Each of the terminal node type sensors captures packets propagating through the network, and classifies the captured packets. A server acquires classification information from at least one of the terminal node type sensors through the network, and generates a whole report of the packet analysis system based the acquired classification information.
Owner:YOKOGAWA ELECTRIC CORP

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

A method of making a lead frame and a partially patterned lead frame package with near-chip scale packaging (CSP) lead-counts is disclosed, wherein the method lends itself to better automation of the manufacturing line as well as to improving the quality and reliability of the packages produced therefrom. This is accomplished by performing a major portion of the manufacturing process steps with a partially patterned strip of metal formed into a web-like lead frame on one side, in contrast with the conventional fully etched stencil-like lead frames, so that the web-like lead frame, which is solid and flat on the other side is also rigid mechanically and robust thermally to perform without distortion or deformation during the chip-attach and wire bond processes. The bottom side of the metal lead frame is patterned to isolate the chip-pad and the wire bond contacts only after the front side, including the chip and wires, is hermetically sealed with an encapsulant. The resultant package being electrically isolated enables strip testing and reliable singulation without having to cut into any additional metal. The use of the instant partially patterned lead frame in making ELP, ELPF and ELGA-type CSPs is also disclosed.
Owner:UNISEM M BERHAD

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

A method of making a lead frame and a partially patterned lead frame package with near-chip scale packaging (CSP) lead-counts is disclosed, wherein the method lends itself to better automation of the manufacturing line as well as to improving the quality and reliability of the packages produced therefrom. This is accomplished by performing a major portion of the manufacturing process steps with a partially patterned strip of metal formed into a web-like lead frame on one side, in contrast with the conventional fully etched stencil-like lead frames, so that the web-like lead frame, which is solid and flat on the other side is also rigid mechanically and robust thermally to perform without distortion or deformation during the chip-attach and wire bond processes. The bottom side of the metal lead frame is patterned to isolate the chip-pad and the wire bond contacts only after the front side, including the chip and wires, is hermetically sealed with an encapsulant. The resultant package being electrically isolated enables strip testing and reliable singulation without having to cut into any additional metal. The use of the instant partially patterned lead frame in making ELP, ELPF and ELGA-type CSPs is also disclosed.
Owner:UNISEM M BERHAD

Panel of a ball for a ball game, a ball, and methods of making the same

The present invention provides a panel of the ball for ball game, said panel has the folding portion and the opposite folding portion on its periphery, which are opposite to each other and made of the same continuous material. The folding portion and the opposite folding portion of said leather panels have the good engaging property and difficult to separate with each other during usage because they are made of the same material. The panel has simple manufacturing process and low production cost, making the ball for ball game comprising above panels have good using properties, simple manufacturing process and low production cost.
Owner:FORCE TECH CO LTD

Negative electrode for lithium ion secondary battery and lithium ion secondary battery

A negative electrode including a negative electrode current collector, first protrusions on a surface of the negative electrode current collector, a separation-stopping area on at least a part of a surface of each first protrusion, and a negative electrode active material layer including a negative electrode active material and formed on at least a top face of the first protrusion. This structure suppresses the separation of the negative electrode active material layer from the negative electrode current collector, the degradation of the current collecting ability, and the deformation of the negative electrode itself. A lithium ion secondary battery including this negative electrode has a high battery capacity, a high energy density, and an excellent charge / discharge cycle characteristic, and is capable of stably maintaining a high power over an extended period of time.
Owner:PANASONIC CORP

Radar, radio frequency sensor, and radar detection method

In a sensor and a radar for measuring the distance and the moving speed of a target by radiating a radio frequency, particularly a millimeter wave, compatibility between cost reduction and high detection performance has been conventionally a significant problem. In the present invention, the frequency of a transmitted signal changes during a fixed time while performing digitally-frequency-modulation on frequency sweeping straight lines extending, with different slopes relative to the time axis, from plural slightly different initial values serving as starting points, the signal is transmitted after being modulated so as to periodically repeat the sweep time serving as a unit, signal components corresponding to the respective sweeping slopes are digitally sampled, in synchronization with the transmitted modulation signal, from a received signal which is reflected and returned from a target, and the received signal is analyzed.
Owner:HITACHI LTD

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

A method of making a lead frame and a partially patterned lead frame package with near-chip scale packaging (CSP) lead-counts is accomplished by performing a major portion of the manufacturing process steps with a partially patterned strip of metal formed into a web-like lead frame on one side, so that the web-like lead frame, which is solid and flat on the other side is also rigid mechanically and robust thermally to perform without distortion or deformation during the chip-attach and wire bond processes, both the chip level and the package level. The bottom side of the metal lead frame is patterned to isolate the chip-pad and the wire bond contacts only after the front side, including the chip and wires, is encapsulated. The resultant package being electrically isolated enables strip testing and reliable singulation without having to cut into any additional metal.
Owner:UNISEM M BERHAD

Connector having a lock mechanism for keeping a socket and a header coupled, and method for manufacturing the connector

A connector includes a socket having a generally rectangular shape, the socket including socket contacts, lock mechanisms and retainer mechanisms; and a header having a generally rectangular shape, the header including header contacts and lock mechanisms and being couplable with the socket. The lock mechanisms of the socket and the header are respectively formed from the socket contacts and the header contacts, the lock mechanisms of the socket being formed by cutting away a portion of the socket contacts. The lock mechanisms of the header also serve as retainer mechanisms thereof. The lock mechanisms of the socket and the header are arranged substantially in the same row as the socket contacts and the header contacts and positioned near four corners of the socket and the header, respectively. The lock mechanisms of the socket and the header are configured to keep the socket and the header in a coupled state.
Owner:PANASONIC CORP

Coaxial electrical connector

A coaxial electrical connector comprises an outer conductor (10) having a tubular section (11); a central conductor (20) having a contact section (21) extending in the axial direction in the tubular section (11); and a dielectric block (30) molded to hold together both the conductors (10, 20). The central conductor (20) has a radial section (22) extending outwardly in the radial direction from the bottom of the contact section (21) and a connection portion (23A) on the bottom face of the radial section (22) for contact with a circuit board. The central conductor 20 has a surface-processed portion so as to form at least one of a raised portion (24) and an indented portion (22A) and is in contact with the dielectric block at the surface-processed portion.
Owner:HIROSE ELECTRIC GROUP

Metallic separtor for fuel cell and production method for the same

A metallic separator for a fuel cell has excellent corrosion resistance and contact resistance, even when a gold coating is applied directly without a surface treatment by a nickel coating. The metallic separator for a fuel cell, comprising stainless steel having a surface, can be obtained by coating at 2.3 to 94 % of area rate on the surface without a surface treatment.
Owner:HONDA MOTOR CO LTD

Retroreflective sheeting having printed layer

Retroreflective sheeting including a retroreflective base having a light-incident layer on its light-incident side and a fluorine-containing resin film having a total light transmittance of 80% or more which is provided on the light-incident layer by an adhesive layer, a printed layer made of discontinuous printed parts is provided between the film and the adhesive layer. The printed layer does not cause the film to separate.
Owner:NIPPON CARBIDE KOGYO KK

Bonding structure and bonding method for cemented carbide element and diamond element, cutting tip and cutting element for drilling tool, and drilling tool

A cutting tip for a drilling tool includes a cemented carbide cutting base 11, a diamond element 12 supported by the cutting base 11, and a bonding layer formed between the cutting base 11 and the diamond element 12 in order to bond them. The bonding layer 13 includes diffusion layers S1 and S2 in which one or two or more metals selected from a group consisting of Fe, Ni, Co, Ti, Zr, W, V, Nb, Ta, Cr, Mo, and Hf diffuses into at least one of the cemented carbide or the diamond.
Owner:MITSUBISHI MATERIALS CORP

Solar cell module

A solar cell module includes: a reflector; a encapsulant that includes a first corrugated portion that corresponds to a corrugated shape of the reflector; and a solar cell that is encapsulated in the encapsulant, wherein the encapsulant is fixed to the reflector and the solar cell; and at least one of a surface of the encapsulant fixed to the reflector and a surface of the encapsulant fixed to the solar cell is provided with a second corrugated portion that has a smaller protrusion than a protrusion of the first corrugated portion.
Owner:TOYOTA JIDOSHA KK

Protective Film for Polarizing Plate

A protective film for polarizing plate made by laminating k layers (k is an integer of 2 or more) of thermoplastic resin, in which a refractive index ni(λ) at a wavelength in the range of 380 to 780 nm of the i th thermoplastic resin layer as well as a refractive index ni+1(λ) at a wavelength in the range of 380 to 780 nm of the i+1 th thermoplastic resin layer have a relationship of ∥ni(λ)−ni+1(λ)|≦0.05 (where, i is an integer of 1 to k−1); and a polarizing plate comprising a laminate the protective film for polarizing plate and a polarizer.
Owner:ZEON CORP

Light-emitting device and method for manufacturing light-emitting device

A light-emitting device includes: a substrate; a light-emitting section provided on an upper surface of the substrate, the light-emitting section including an LED chip and a sealing resin containing fluorescent material covering the LED chip; and a silicon oxide insulating film provided between the substrate and the light-emitting section, the silicon oxide insulating film being formed directly on an upper surface of the substrate or an alumina insulating film, the sealing resin containing fluorescent material formed directly on an upper surface of the silicon oxide insulating film so as to cover the LED chip. Thus, this invention provides the light-emitting device capable of making the sealing resin difficult to be separated from the substrate and a method for manufacturing the light-emitting device.
Owner:SHARP KK

Oxidative Halogenation of C1 Hydrocarbons to Halogenated C1 Hydrocarbons

An oxidative halogenation process involving contacting methane, a C1 halogenated hydrocarbon, or a mixture thereof with a source of halogen and a source of oxygen, at a molar ratio of reactant hydrocarbon to source of halogen in a feed to the reactor greater than 23 / 1, and / or at a molar ratio of reactant hydrocarbon to source of oxygen in a feed to the reactor greater than about 46 / 1; in the presence of a rare earth halide or rare earth oxyhalide catalyst, to produce a halogenated C1 product having at least one more halogen as compared with the C1 reactant hydrocarbon, preferably, methyl chloride. The process can be advantageously conducted to total conversion of source of halogen and source of oxygen. The process can be advantageously conducted with essentially no halogen in the feed to the reactor, by employing a separate catalyst halogenation step in a pulse, swing or circulating bed mode. The production of methyl halide can be integrated into downstream processes for manufacture of valuable commodity chemicals.
Owner:PODKOLZIN SIMON G +3

Low cost coaxial cable connector for multiple cable sizes

A coaxial cable connector for connecting a coaxial cable to an RF port, wherein the cable connector is comprised of a connector subassembly and a compression cap. The connector subassembly is of simple inexpensive construction and is comprised of a fastener, a tubular post, and a connector body. The connector subassembly may function a stand-alone crimpable cable connector. The compression cap may be placed over the end of a coaxial cable, and compressed onto the connector subassembly to secure a prepared end of the cable within the compressed and assembled connector.
Owner:PPC BROADBAND INC

Production method for semiconductor chip

A semiconductor wafer is applied to a support disk via an intervening adhesive layer with the front side of the semiconductor wafer facing the adhesive layer, which is sensitive to a certain exterior factor for reducing its adhesive force; the semiconductor wafer is ground on the rear side; the wafer-and-support combination is applied to a dicing adhesive tape with the so ground rear side facing the dicing adhesive tape, which is surrounded and supported by the circumference by a dicing frame; the certain exterior factor is effected on the intervening adhesive layer to reduce its adhesive force; and the intervening adhesive layer and support disk are removed from the semiconductor wafer or chips without the possibility of damaging the same.
Owner:DISCO CORP

Process for separating ti from a ti slurry

A method of separating metal particulates from a slurry of original constituents of liquid metal and metal particulates and salt particulates is disclosed. The metal and salt particulates are concentrated by removing at least some of the liquid metal, and then, liquid metal or a liquid of the original salt constituent or a mixture thereof is passed through the particulates at a temperature greater than the melting point of the original salt constituent to further concentrate the metal particulates. The metal particulates are then separated from the remaining original constituents or a mixture of the salt constituent. Density differences between the liquid metal and salt are also used to facilitate separation.
Owner:CRISTAL US INC

Method and apparatus for the recovery and deep treatment of polluted acid

A method and an apparatus for recovery and deep treatment of a polluted acid. The method comprises the following main steps: (1) selectively adsorbing rare and noble metals, such as rhenium, selenium and the like; (2) separating copper from arsenic to recover the copper; (3) carrying out efficient vulcanization to perform deep arsenic removal; (4) carrying out electrodialysis to pre-concentrate acid; (5) evaporating and concentrating the acid; (6) carrying out an air-stripping method to remove fluorine and chlorine. The polluted acid treatment apparatus mainly comprises a precision filtering tank, a special adsorbing tank, a copper-arsenic separation device, a vulcanization device, an electrodialysis device, an evaporative concentration device, and an air-stripping device. The method and the apparatus can implement efficient recovery of valuable elements in polluted acid wastewater and separate treatment harmful elements, has obvious economical, social and environmental benefits, and has wide application prospects.
Owner:CENT SOUTH UNIV

Gas turbine combustor

A combustor for a gas turbine has an arrangement to form a layer of cooling-air on an inner surface of a liner of a combustion chamber. This layer of the cooling air extends from a fuel nozzle block of the combustor toward a downstream side with respect to the liner.
Owner:MITSUBISHI HITACHIPOWER SYST LTD

Production of xylitol from a mixture of hemicellulosic sugars

ActiveUS20130217070A1Reduce D-xyloseMinimal productionBacteriaFermentationEnvironmental engineeringSugar
Materials and methods are described to produce xylitol from a mixture of hemicellulosic sugars by several routes. Examples include either as a direct co-product of a biorefinery or ethanol facility, or as a stand-alone product produced from an agricultural or forestry biomass feedstock including using, e.g. ethanol waste streams.
Owner:THE BOARD OF TRUSTEES OF THE UNIV OF ILLINOIS +1
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