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294results about How to "Eliminate force" patented technology

Apparatus for mounting photovoltaic power generating systems on buildings

InactiveUS20060053706A1Reduce and eliminate module-distortingReduce and eliminate and module-destructing wind uplift forcePhotovoltaic supportsSolar heating energyStructural engineeringMechanical engineering
Rectangular PV modules are mounted on a building roof by mounting stands that are distributed in rows and columns. Each stand comprises a base plate that rests on the building roof and first and second brackets of different height attached to opposite ends of the base plate. Each bracket comprises dual module-supporting members for supporting two different PV modules, and each PV module has a mounting stud adjacent to each of its four corners. At one end each module is supported by pivotal attachment of two of its mounting studs to module-supporting members of different first brackets. At its other end each module rests on module-supporting members of two different second brackets, whereby the modules assume a predetermined angle of tilt relative to the roof. Two tethers connect the other two mounting studs to the two different second brackets on which the module rests. The tethers allow the modules to pivot up away from the module-supporting members on which they rest to a substantially horizontal position in response to wind uplift forces, thereby enabling the PV modules and their supporting stands to withstand high velocity winds without the base plates being physically attached to the supporting roof structure.
Owner:THE UNITED STATES AS REPRESENTED BY THE DEPARTMENT OF ENERGY

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

A method of making a lead frame and a partially patterned lead frame package with near-chip scale packaging (CSP) lead-counts is disclosed, wherein the method lends itself to better automation of the manufacturing line as well as to improving the quality and reliability of the packages produced therefrom. This is accomplished by performing a major portion of the manufacturing process steps with a partially patterned strip of metal formed into a web-like lead frame on one side, in contrast with the conventional fully etched stencil-like lead frames, so that the web-like lead frame, which is solid and flat on the other side is also rigid mechanically and robust thermally to perform without distortion or deformation during the chip-attach and wire bond processes. The bottom side of the metal lead frame is patterned to isolate the chip-pad and the wire bond contacts only after the front side, including the chip and wires, is hermetically sealed with an encapsulant. The resultant package being electrically isolated enables strip testing and reliable singulation without having to cut into any additional metal. The use of the instant partially patterned lead frame in making ELP, ELPF and ELGA-type CSPs is also disclosed.
Owner:UNISEM M BERHAD
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