98 results about "Kovar" patented technology

The invention discloses a pickling-free cold heading Kovar alloy wire production process which comprises the following steps: S1, raw material preparation: preparing the following raw materials in percentage by mass: 41.5% of Ni, 0.5% of Co, less than or equal to 0.03% of C, less than or equal to 0.05% of Mn, less than or equal to 0.05% of Si, less than or equal to 0.02% of P, less than or equal to 0.02% of S and the balance of Fe; mixing the materials, and carrying out vacuum induction melting and electroslag remelting to prepare an alloy ingot; the alloy cast ingot is subjected to hot rolling treatment to form a hot-rolled wire rod with the diameter being 12.0-16.0 mm; s2, peeling treatment is conducted, specifically, surface layer defects of the hot-rolled wire rod in the step S1 are removed through a peeling machine; s3, dry-type drawing treatment is conducted, specifically, the hot-rolled wire rod treated in the step S2 is subjected to dry-type drawing through a dry-type drawing die to form an alloy wire; s4, intermediate annealing treatment is conducted, specifically, the alloy wire in the step S3 is placed in an annealing furnace, sufficient hydrogen is input into the annealing furnace, intermediate annealing is conducted under the hydrogen protection atmosphere, the annealing temperature is 950-1100 DEG C, and the annealing walking speed is 3-5 m / min; the surface quality and the size consistency of the wire can be improved, meanwhile, the defects of environmental pollution, hydrogen embrittlement and the like are reduced, and the use requirements of high-end precise cold heading parts are met.

The invention provides a Kovar alloy nano-indentation and nano-friction simulation method based on molecular dynamics. The technical key points are as follows: carrying out initial setting on a simulation system and establishing a model; defining a potential function; performing model initialization, including energy minimization, temperature initialization and system relaxation; performing nanoindentation simulation and extracting data; performing nanometer friction simulation and extracting data; and processing and analyzing simulated data, namely outputting a depth-load curve, calculating hardness, fitting and calculating an elastic modulus, calculating a friction force and a friction coefficient, and analyzing wear morphology and dislocation evolution in the alloy through a simulation process file. By analyzing the mechanical properties and the frictional wear properties of the Kovar alloy at different environment temperatures, stable and reliable simulation data is obtained, the actual experiment cost is greatly reduced, and technical guidance is provided for application of the Kovar alloy in the field of vacuum sealing elements.

The invention relates to the technical field of material sealing, in particular to a high-performance insulating ceramic sealing method for a neutron tube, which comprises the following steps: sequentially carrying out organic solvent ultrasonic cleaning and argon plasma etching activation treatment on a sealing surface of a cylindrical high-purity aluminum oxide ceramic piece, and depositing a titanium transition layer through magnetron sputtering, the ceramic piece with the titanium transition layer is obtained; the sealing face of the kovar alloy cylindrical flange plate is subjected to acid pickling, an oxide layer is removed, cleaning and drying are conducted, and a metal sealing part is obtained; preparing an active brazing filler metal sheet; the components are assembled in sequence to form a pre-assembled component; the pre-assembled component is placed in a vacuum brazing furnace, axial pre-tightening force is applied to the pre-assembled component, sealing is completed, then cooling is controlled, and a sealing piece with an airtight brazing joint is formed; and carrying out annealing treatment to obtain a finished product sealing assembly. Therefore, the problems of low dielectric strength, large thermal expansion coefficient difference, difficulty in interface quality control and the like in the prior art are solved.

The invention provides a GIS visible window preparation method, device and equipment and a storage medium, and the method comprises the following steps: firstly carrying out surface metallization treatment on sapphire transparent ceramic by using Ag-Cu-Ti soldering paste under vacuum, raising the temperature to a first high temperature, carrying out heat preservation, and then carrying out furnace cooling; then the kovar alloy and the sapphire are welded with the same soldering paste under the same conditions; and then the Al-Si-Mg brazing filler metal is used for welding the aluminum alloy and the kovar alloy under vacuum, the temperature is increased to a second low temperature lower than the first high temperature, heat preservation is conducted, and then furnace cooling is conducted. The SF6 leakage resistant sealing interface is formed through the steps. According to the method, the visual window is integrally prepared, the interior of the GIS can be directly observed, fault judgment accuracy and operation and maintenance efficiency are improved, power failure time is shortened, and stable operation of equipment is guaranteed.

The utility model discloses an accurate guide device for hot continuous rolling of a kovar alloy plate. The accurate guide device comprises a rack, a conveying roller, a guide mechanism, a fixing mechanism and a cleaning mechanism, the rack is fixed on the ground; the conveying rollers are evenly and rotationally connected to the machine frame through bearings, and the guiding mechanisms are symmetrically installed on the two sides of the kovar alloy plate. The fixing mechanism and the cleaning mechanism are both mounted on the guide mechanism; the guide mechanism comprises a support frame, a connecting plate, a rotating roller, a bidirectional threaded rod, a guide rod and a motor II; the two-way threaded rod is rotationally connected to the rack through a bearing, and the guide rods are fixed to the portions, on the two sides of the two-way threaded rod, of the side wall of the rack. The motor is fixed to the outer side wall of the rack, and the output end is connected with one end of the bidirectional threaded rod. According to the utility model, the Kovar alloy plate can be accurately guided; in the Kovar alloy plate guiding process, the side wall makes contact with the rotating roller, friction can be reduced, and damage to the Kovar alloy plate is further reduced.

The invention relates to a metal mask supported by a glass substrate for manufacturing an organic light emitting diode display. The mask includes a glass substrate located only outside the display area, an open-cell metal layer for providing structural stability, and forming apertures for material deposition in the display area. The perforated metal layer can be formed by methods such as electroforming, sputtering, chemical vapor deposition, evaporation or atomic layer deposition, and the used metal comprises a material with a low thermal expansion coefficient, such as invar steel, super invar steel, kovar alloy, 42 alloy, nickel, tungsten, molybdenum, tantalum or rhenium. The mask supports two structural forms: a fine metal mask and an open metal mask which are respectively used for evaporation of red, green and blue sub-pixels and a common layer. The method can be used for batch processing of a plurality of micro organic light-emitting diode display substrates, and can also be used for full-coverage processing of a single active matrix organic light-emitting diode display substrate.

The invention relates to a double-face heat dissipation, large-current and high-surge Schottky diode and a packaging structure, and belongs to the technical field of power semiconductor device packaging, the double-face heat dissipation, large-current and high-surge Schottky diode comprises a TK3 metal ceramic tube seat and an upper electrode, the TK3 metal ceramic tube seat comprises sealing rings, a lower electrode and a ceramic frame, the upper electrode extends to the sealing rings, and the lower electrode is arranged between the sealing rings; the ceramic frame is wound on the outer side of the sealing ring, and a chip sintering area is arranged between the upper electrode and the lower electrode. The TK3 metal ceramic shell used in the invention is formed by combining molybdenum, Al2O3 ceramic, 4J42 Kovar alloy and other materials with similar linear expansion coefficients, and a step-by-step assembly and synchronous welding process is adopted; according to the double-sided heat dissipation, large-current and high-surge Schottky diode, the gold-tin solder is adopted as a welding material, stress generated in the high-temperature sintering process of different materials is reduced, secondary melting possibly occurring in the packaging and using process is effectively prevented, and the reliability of the product assembling process is improved.

A connecting structure between lead-out pins of auxiliary stationary contacts and a yoke plate of a DC relay, includes a yoke plate and a plurality of auxiliary stationary contact lead-out terminal assemblies mounted on the yoke plate; each auxiliary stationary contact lead-out terminal assembly includes a lead-out pins, a glass material body and a kovar alloy part; the lead-out terminal, the glass material body and the kovar alloy part are connected into a whole by sintering, and the lead-out terminal and the kovar alloy part are insulated from each other by glass material; the auxiliary stationary contact lead-out terminal assembly is welded and fixed to the yoke plate through the kovar alloy part.

The utility model relates to the technical field of microelectronic packaging tube shell application, in particular to a sectional type positioning, assembling and welding jig suitable for a split type Kovar enclosure frame, which comprises a pressing plate, an upper positioning plate, a lower positioning plate and a bottom plate, and provides a jig adopting sectional type positioning, a product is divided into two parts to be positioned, and meanwhile, the product can be separated from the bottom plate. One-time stacking, assembling and positioning are also formed, the consistency of products can be guaranteed, and the yield of the products is improved; the two parts of the product are respectively positioned, so that the skew of the product caused by overlapping, assembling and touching in the assembling process is reduced, and the assembling efficiency is improved; the pressing plate, the upper positioning plate, the lower positioning plate, the bottom plate, the first protruding block and the second protruding block are all made of graphite which is even in heat conduction, it can be guaranteed that products are evenly heated in the brazing process, glass ceramics can be prevented from being adhered to a jig in the brazing process, and demolding is easy after the products are brazed; the production cost is effectively reduced, the equipment precision requirement is reduced, the production period is shortened, and the production process is simpler, more convenient and more efficient.

The invention discloses a large-size electronic packaging shell and a manufacturing method thereof, and belongs to the technical field of electronic packaging. The packaging shell comprises a metal shell body and a metal cover body, wherein the metal shell body is made of 4J29 kovar alloy or carbon structural steel with the carbon content ranging from 0.08% to 1.3%; the sealing insulator is embedded in the bottom of the metal shell and comprises a hollow cylindrical ceramic body, and a tungsten composite metal layer and a metal coating are sequentially formed on the inner surface and the outer surface of the ceramic body from inside to outside; the ceramic body is made of aluminum nitride or silicon nitride; and the leading pin is inserted into the ceramic insulator, and the material of the leading pin is beryllium bronze. According to the packaging shell, the problems of stress deformation of the leading-out end and damage to the sealing area caused by thermal mismatch are avoided, so that the device failure caused by the stress deformation is avoided, and the sealing performance and long-term reliability of the device are ensured.

The invention discloses a miniaturized MEMS circulator with a TSV capacitor. The miniaturized MEMS circulator comprises a kovar metal layer, a first metal layer, a first silicon adapter plate layer and ferrite, first metal columns are distributed on the bottom surface of the first silicon adapter plate layer; second metal columns are distributed on the top surface of the first silicon adapter plate layer; a second metal layer; bonding the interconnection layer; a third metal layer; a second silicon adapter plate layer; an insulating spacer and a permanent magnet. According to the invention, the size is reduced and the bandwidth is improved by forming a capacitor through staggered and parallel TSVs. Besides, matching at ports is carried out through a capacitance-inductance-capacitance matching network, and an inductor in the matching network is a serpentine inductor, so that the size required by the matching network is further reduced, and miniaturization and integration of the MEMS circulator are facilitated.

The invention discloses a brazing method for a sapphire-ceramic vacuum arc-extinguishing chamber window and application of the brazing method. The brazing method comprises the steps that an activation layer, a barrier layer and a brazing layer are sequentially deposited on a sapphire brazing face, and a molybdenum-manganese method is used for sintering and chemical nickel plating is carried out on an annular trepanning area of a ceramic shell; the oxygen-free copper metal foil, the kovar alloy metal foil and the nickel metal foil are compounded into a whole, the oxygen-free copper side of the obtained annular composite transition ring is aligned with the sapphire brazing layer, the copper brazing filler metal ring is placed in the middle of the annular composite transition ring, the nickel side of the composite transition ring is aligned with the nickel-plated layer at the opening of the ceramic shell, the copper brazing filler metal ring is placed in the middle of the annular composite transition ring, and the obtained assembly is subjected to vacuum brazing. Two high-strength and high-airtightness brazed joints are formed at a time, and therefore the sapphire window is connected to the ceramic shell in a sealed mode through the composite transition ring. By introducing a multi-layer composite transition layer structure, the thermal stress matching problem is effectively solved, so that a sealing interface with ultrahigh air tightness, high mechanical strength and excellent long-term reliability is realized.

The invention discloses a hybrid photomultiplier coaxial output structure based on a microstrip line. The hybrid photomultiplier coaxial output structure comprises a semiconductor detector, a bonding wire, the microstrip line, a ground electrode, a lead pin, a medium, an outer conductor base and a detector lead pin. The semiconductor detector is used for receiving the photoelectrons converted by the photoelectric cathode and generating a current signal; the bonding wire is used for electrically connecting the semiconductor detector and the microstrip structure; the microstrip line and the ground electrode adopt gold-plated kovar alloy parts to form an in-tube microstrip structure; the guide pin and the detector guide pin are kovar alloy guide pins and form an inner conductor with a coaxial structure; the outer conductor base is a kovar alloy disc and forms an outer conductor with a coaxial structure; the medium is glass or ceramic. According to the coaxial output structure, a vacuum tube is of a 50-ohm microstrip structure, the exterior of the vacuum tube is of a 50-ohm SMA coaxial structure, and a complete 50-ohm coaxial line is formed by connecting a microstrip line and a guide pin together. The structure provided by the invention has the advantages of high transmission speed, small signal reflection and oscillation and the like, and is more beneficial to detection of ultrafast optical pulse signals.

The invention discloses a 4J29 kovar alloy / 304 stainless steel composite plate and a preparation method thereof, and belongs to the technical field of metal composite plate production, a 4J29 kovar alloy plate and a 304 stainless steel plate in a cold rolling state are respectively subjected to recrystallization annealing treatment to obtain a soft 4J29 kovar alloy plate and a soft 304 stainless steel plate, then the soft 304 stainless steel plate is used as a base plate, and the 4J29 kovar alloy plate and the soft 304 stainless steel plate are subjected to heat treatment to obtain the 4J29 kovar alloy / 304 stainless steel composite plate. A soft 4J29 kovar alloy plate serves as a compound plate, the surface of the soft 4J29 kovar alloy plate is coated with a layer of water glass to serve as a protective layer, then an explosive layer is laid on the surface of the protective layer in a gradient explosive distribution mode, then explosive cladding is conducted, the composite plate is obtained, a bonding area of the composite plate has the uniform and continuous microwave shape characteristic, the interface bonding rate is larger than or equal to 98.9%, and the bonding strength is larger than 360 MPa. The explosive welding composite board with excellent performance is prepared, and corresponding technical conditions meet industrial production requirements.

The application relates to the technical field of metal plate composite technology and discloses a preparation process of a Kovar alloy-copper composite plate, which comprises the following steps: a preparation process of an Invar alloy-copper composite plate, which comprises the following steps: s1, taking one Invar alloy plate and two copper plates; s2, immersing the Invar alloy plate into liquid copper after the Invar alloy plate is heated to 250-300 DEG C; s3, positioning the two copper plates and the Invar alloy plate to form a group of initial composite plate materials; s4, heating the whole in a heating furnace, the heating temperature is 700-850 DEG C, and the heating time is 20-40 min; s5, taking out and cooling to 500-650 DEG C, and then performing hot rolling; s6, performing stress relieving annealing on the composite blank; s7, naturally cooling to normal temperature after annealing, and cold rolling to form an Invar alloy-copper composite plate with a preset thickness. The Invar alloy-copper composite plate prepared through the process is more stable and not easy to separate between the plates, the composite plate has the physical properties of the Kovar alloy and good thermal conductivity.

The embodiment of the invention discloses a crystal oscillator mixed seal welding method based on partition stripping. The method comprises the steps that a base and a kovar alloy cover plate with a nickel-plated gold layer are prepared; performing laser cleaning on the lower surface of the kovar alloy cover plate corresponding to the short straight edge sealing area, removing the nickel-gold plating layer in the area, and meanwhile, retaining the nickel-gold plating layer in the long straight edge sealing area on the kovar alloy cover plate; the kovar alloy cover plate subjected to laser cleaning correspondingly covers the base, and a long straight edge sealing area of the kovar alloy cover plate is subjected to sealing welding through parallel seam welding; and the short straight edge sealing area of the kovar alloy cover plate is subjected to sealing welding through laser welding. According to the method, through partition surface treatment, the high-airtightness seal welding reliability is ensured, meanwhile, the advantages of high-efficiency continuity of electric resistance welding and gas control of laser welding are achieved, and the method is particularly suitable for packaging and manufacturing of small-sized and high-stability patch crystal oscillators such as 3215 and the like.

The invention discloses a vacuum laser welding method for dissimilar metal materials, and aims to solve the problems of poor joint performance, multiple defects and the like caused by metallurgical incompatibility, oxidation and thermal stress in traditional welding. The method comprises the following steps that a to-be-welded part is placed in a vacuum bin to be vacuumized; argon is blown to the laser head lens for protection; a step-by-step laser process is adopted, preheating seal welding is conducted at low power, and then formal welding is completed at set power; the welded part is placed in a heat preservation box to be subjected to heat preservation treatment; and nickel or kovar alloy is pre-arranged at the joint to serve as an interlayer transition material. Oxidation and pollution are completely eradicated through the vacuum environment, generation of brittle intermetallic compounds is inhibited in combination with an interlayer material, heat circulation is optimized in cooperation with preheating and heat preservation processes, residual stress is reduced, the method is particularly suitable for connection of tool ends and other high-performance dissimilar metal parts, and the welding seam quality, the joint mechanical property and the process reliability can be remarkably improved.

The invention discloses a vacuum arc-extinguishing chamber monitoring window brazing process based on transparent ceramic YAG and a vacuum arc-extinguishing chamber monitoring window, and the vacuum arc-extinguishing chamber monitoring window brazing process comprises the following steps: arranging a circular groove on the outer surface of aluminum oxide ceramic as a connecting surface of a monitoring hole and YAG, designing the connecting surface into a step-shaped structure, and cleaning the surface of the monitoring hole of an aluminum oxide ceramic shell and the brazing surface of the YAG; uniformly stirring molybdenum, manganese and titanium metal powder and the mixed solution, coating the surface of the monitoring hole and the brazing surface of the YAG with the mixed solution, and then performing sintering treatment to form a transition layer; and after a layer of nickel is electroplated on the transition layer, the Kovar ring is used as an intermediate metal piece, and the surface of the monitoring hole, the Kovar ring and the brazing surface of the YAG are sequentially brazed together, so that the monitoring window of the vacuum arc-extinguishing chamber is obtained. According to the method, materials and structures used in the brazing process are comprehensively optimized, so that generated thermal stress is low, the risk of brazing failure is greatly reduced, the rate of finished products is increased, and meanwhile the process complexity and cost are reduced.

The utility model belongs to the surface mounting welding ceramic packaging base technical field discloses a kind of ceramic SMD pedestal, the ceramic SMD pedestal includes top seat and pedestal fixed together, and the top surface of top seat is equipped with Kovar ring around, and first foot stand and second foot stand are equipped in the top recess surrounded by Kovar ring;The top surface of Kovar ring, first foot stand and second foot stand is sequentially equipped with ceramic base and nickel layer from inside to outside;The bottom surface of pedestal is equipped with third foot stand, fourth foot stand, fifth foot stand and sixth foot stand, and the bottom surface of third foot stand, fourth foot stand, fifth foot stand and sixth foot stand is sequentially equipped with ceramic base, nickel layer and tin layer from inside to outside.The beneficial effects of the utility model are: by using nickel layer and nickel layer and tin layer replace traditional nickel layer+gold layer, reduce the use of noble metal gold, reduce material cost.

The invention discloses an air-tight seal optical connector for aerospace and a preparation method thereof, and relates to the technical field of optical communication connectors. According to the method, the aluminum oxide ceramic ferrule is integrally prefabricated, and a titanium-tungsten metal layer is deposited through magnetron sputtering, so that the structural performance is optimized; the sealing of the optical fiber and the glass tube is realized by adopting laser welding or glass sealing, and a multi-layer air-tight sealing system is constructed by matching an end face sealing ring and a main body which are in interference fit with a leading-out end in a sealing manner; and the signal transmission stability is guaranteed through full-process high-precision coaxiality control. According to the invention, ceramic ferrule integrated design, multi-layer sealing cooperation, kovar alloy main body matching and other technologies are innovatively adopted, the problems of poor airtight reliability and weak extreme environment resistance of a traditional optical connector are solved, and the prepared connector has the advantages of high airtightness, low insertion loss, high reliability and compact structure. The harsh use requirements in the aerospace fields of satellites, spacecrafts and the like can be met, and the method has important engineering application value.

The high-voltage direct-current relay brazing jig comprises an upper cover, a base and a positioning mechanism, a kovar frame piece is placed at the bottom of the inner side of the base and clamped, then a square welding flux piece is placed at the top of the kovar frame piece, the inner side of the square welding flux piece is clamped with the positioning mechanism, ceramic is placed at the top of the square welding flux piece, and the positioning mechanism is clamped with the inner side of the square welding flux piece. A round solder piece is placed on the outer side of the top end of an installation hole in the top end of the ceramic, the bottom of a copper contact is inserted into the installation hole, an upper cover is pressed at the top end of the ceramic, the inner wall of the upper cover is clamped to the side wall of the ceramic and the copper contact at the top end of the ceramic, and meanwhile the inner wall of a base is clamped to the outer side wall of the upper cover. And finally, the whole jig is placed in a brazing furnace for welding, through mutual clamping matching of the jig and the ceramic assembly, the copper contact and the ceramic are pressed and limited on the inner side of the upper cover, the upper cover is limited on the inner side of the base, the copper contact, the ceramic and the kovar frame piece cannot move relatively, the welding quality is high, the sealing performance of the ceramic cavity is guaranteed, and the welding quality is improved. And the yield of the product is improved.

The present application relates to the field of Kovar alloy production, and particularly relates to a preparation method of a Kovar alloy mother electrode, comprising: loading raw materials into an electric arc furnace for smelting to obtain a first mixture, wherein the raw materials comprise iron-nickel-cobalt scrap and first auxiliary materials; loading the first mixture into an AOD furnace for blowing to obtain a second mixture; and loading the second mixture, nickel, iron, cobalt and manganese into a vacuum induction furnace for smelting to obtain the Kovar alloy mother electrode. In the present application, high temperature in the electric arc furnace promotes oxidation of impurities on the surface of scrap steel into gas or slag, and by adding limestone, fluorite and other slagging agents, an alkaline furnace (CaO~MgO~SiO2) is formed to adsorb silicon oxide, phosphorus oxide and other inclusions. When the AOD furnace is used for blowing, oxygen or argon is blown in to promote the aggregation and floating of inclusions to the slag layer, and by adding silicon iron, aluminum powder and other reducing agents, part of the oxidized inclusions are reduced and deoxidized, the oxygen content is reduced, and the gas content and inclusion grade of the Kovar alloy mother electrode are reduced.

The invention discloses a stainless steel oxygen-free copper embedded T / R shell and a preparation method thereof. The shell comprises a 316L stainless steel shell body, a TU1 oxygen-free copper substrate, a radio frequency connector, a stress gradient slow release ring and a low-frequency connector. The preparation method comprises the following steps: cleaning and annealing each component; the weldability is enhanced by pre-plating nickel; the shell, the substrate and the stress slow release ring are assembled through silver-copper brazing; after nickel / gold electroplating, a plating layer on the sealing and welding surface is removed through laser; and installing the radio frequency / low frequency connector to the kovar ring through gold-tin brazing. Through gradient material design and a step-by-step brazing process, the problem of sealing failure caused by thermal expansion coefficient mismatch is solved, and the high-power heat dissipation performance and the airtight reliability are remarkably improved.

The application is realized by the technical scheme as follows: a ceramic metal packaging shell, comprising an alumina ceramic shell, the alumina ceramic shell is provided with a frame type structure, and a convex strip is formed on the inner wall of the alumina ceramic shell; a tungsten copper bottom plate, the tungsten copper bottom plate is provided with a stepped table structure, the upper half of the tungsten copper bottom plate is a core area cavity, and the lower half is a heat sink cavity, the tungsten copper bottom plate is welded on the alumina ceramic shell, and the core area cavity corresponds to the convex strip part on the inner side of the alumina ceramic shell; and a Kovar alloy cover plate, the Kovar alloy cover plate is welded on the alumina ceramic shell. The application has the advantages that the ceramic has good air tightness, can resist the influence of extreme environments such as high temperature, high humidity, corrosion and radiation on electronic devices after packaging, the ceramic has a matching thermal expansion coefficient with metal, and has good mechanical properties, and almost no damage is caused after thermal shock test and temperature cycle test.

The invention discloses a welding flux for welding ceramic and kovar alloy, a welding structure and a preparation method of the welding flux. The welding flux is prepared from, by mass, 20%-50% of silver, 20%-45% of copper, 20%-45% of titanium, 5%-20% of yttrium oxide and 5%-20% of aluminum oxide. The components of the solder are optimized, so that the solder is suitable for connection of the ceramic and the kovar alloy, the welding strength and the thermal shock and impact resistance of connection of the ceramic and the kovar alloy can be improved, and the preparation method is simple in process, easy to operate and control and beneficial to industrial production.

The invention relates to the technical field of device connection, in particular to a high-performance ultrasonic-assisted Kovar-W80Cu20 joint connection method and a precise device. Sn-Sb10 alloy brazing filler metal is adopted, and the Kovar alloy and the W80Cu20 alloy are connected through ultrasonic-assisted brazing. The obtained joint has the characteristics of low thermal expansion coefficient and high thermal conductivity, and the equivalent thermal conductivity at 25 DEG C and 125 DEG C reaches 50 + / -2W / m.K. The shear strength can still exceed 55MPa after being aged for 45 days at the temperature of 160 DEG C; after the Kovar-W80Cu20 composite material is subjected to thermal shock circulation at-40 DEG C to + 125 DEG C for 2000 cycles, the shear strength can still reach 57 MPa, excellent aging reliability and thermal shock reliability are shown, and excellent mechanical properties are attributed to interface bonding promotion by ultrasonic loading and the characteristic of low thermal expansion coefficient of the Kovar-W80Cu20 structure. According to the high-performance ultrasonic-assisted Kovar-W80Cu20 joint connection method and the precise device, the Kovar alloy and the low-expansion and high-heat-conduction W80Cu20 alloy are efficiently connected by constructing the'Kovar / SnSb10 / W80Cu20 'heterogeneous joint, an excellent heat dissipation solution is provided for the high-power precise device, and meanwhile the good CTE matching performance with a chip material is kept.

The invention discloses a Kovar cover plate cladded with gold-tin alloy and a preparation method of the Kovar cover plate, and relates to the technical field of electronic packaging. The preparation method comprises the following steps: S1, carrying out surface metallization treatment on a kovar cover plate to obtain a metallized cover plate; s2, the gold-tin solder is formed through mechanical punching, and a gold-tin soldering sheet is prepared; s3, the gold-tin soldering sheet is placed on the metalized cover plate, and a cover plate with gold and tin placed is obtained; and S4, the cover plate with the placed gold and tin is placed under an infrared laser welding machine to be subjected to laser cladding, and the Kovar cover plate cladded with the gold and tin alloy is prepared. According to the Kovar cover plate cladded with the gold-tin alloy and the preparation method of the Kovar cover plate, the problem that the cladding time is long when a tunnel furnace is used for heating is solved, and the influence of long-time welding flux in a molten state on the accuracy of subsequent welding and positioning with a tube shell is avoided; and the problem of subsequent welding temperature rise or poor welding caused by the welding flux and too much gold-plated layer erosion is avoided.

The utility model discloses a manual assembly tool for a power tube shell cover plate, and relates to the field of power device tube shell assembly, the manual assembly tool comprises a placement tray, a kovar alloy cover plate, a plane tray and an outer protective shell, the exterior of the placement tray is fixedly connected with a first limiting column, the exterior of the placement tray is provided with a double-layer groove, and the bottom of the double-layer groove is provided with a round hole; the upper side of the kovar alloy cover plate is fixedly connected with a kovar alloy enclosure frame, and a first limiting hole is formed in the outer portion of the plane tray. The lower side of the outer protective shell is fixedly connected with a silicon rubber sleeve, a second limiting hole is formed in the outer portion of the outer protective shell, and the upper side of the outer protective shell is fixedly connected with a second limiting column. According to the device, batch upper covers are manually assembled on tube shell cover plates, a series of mistaken touch problems caused by manual operation are reduced, the working efficiency is high, a large amount of labor is saved, and compared with a traditional chip mounter, the price is more advantageous; compared with a chip mounter needing complex programming operation, the tool only needs simple operation and is high in flexibility.

This invention discloses a low-dielectric glass material, glass-ceramic, and a method for preparing TGV through-holes for integrated circuit packaging. The glass material is composed of SiO2, B2O3, Al2O3, RO, R2O, and rare earth oxides Gd2O3 / La2O3, satisfying a SiO2 / B2O3 molar ratio of 2.0~3.5 and an Al2O3 / (Gd2O3+La2O3) molar ratio of 1:1~4:1. Through the "mixed base-like effect" and lattice distortion effect generated by the Gd2O3 / La2O3 dual doping, a dielectric constant ≤4.6, dielectric loss ≤0.001, and CTE 32~50 × 10⁻⁶ are achieved. ‑7 / °C. Further heat treatment yields a glass-ceramic containing single-crystal β-CaSiO3 phase, with a flexural strength ≥250 MPa. Based on this, laser-induced modification combined with wet etching is used to form TGV vias with an aspect ratio ≥50:1, followed by pulsed copper plating for filling, and low-temperature sealing with Kovar alloy at 975°C. Slow cooling and compressive stress design suppress bubbles and cracks. This invention solves the problems of signal loss, thermal stress failure, and insufficient mechanical strength in high-frequency packaging, and is suitable for RF connectors, MEMS, and 3D system-level packaging.

The invention discloses a He position sensitive detector and an assembling method thereof, and relates to the technical field of nuclear detection. The detector comprises a tube shell filled with working gas, wherein insulating electrodes consisting of kovar alloy end sockets, insulating ceramics and copper tubes are arranged at two ends of the tube shell. And the two ends of the anode wire coaxially arranged in the tube shell are respectively connected with the inflating tube and the wire penetrating copper needle through an anode wire positioning piece and a spring. According to the invention, high-precision coaxial positioning of the anode wire is realized through small clearance fit between the anode wire positioning piece and the inner wall of the copper pipe; a bilateral spring structure and a unique assembly method are adopted, so that accurate control and reliable maintenance of the tension of the anode wire are ensured; and an inflation tube and a threading copper needle are multiplexed as a signal extraction electrode, so that the functions of inflation, signal extraction and mechanical support are efficiently integrated in a limited space. The problems that an existing detector anode wire is not accurate in positioning, tension maintaining is not reliable, and multifunctional integration is difficult in a compact space are effectively solved.