64 results about "Kovar" patented technology

The invention relates to the technical field of material sealing, in particular to a high-performance insulating ceramic sealing method for a neutron tube, which comprises the following steps: sequentially carrying out organic solvent ultrasonic cleaning and argon plasma etching activation treatment on a sealing surface of a cylindrical high-purity aluminum oxide ceramic piece, and depositing a titanium transition layer through magnetron sputtering, the ceramic piece with the titanium transition layer is obtained; the sealing face of the kovar alloy cylindrical flange plate is subjected to acid pickling, an oxide layer is removed, cleaning and drying are conducted, and a metal sealing part is obtained; preparing an active brazing filler metal sheet; the components are assembled in sequence to form a pre-assembled component; the pre-assembled component is placed in a vacuum brazing furnace, axial pre-tightening force is applied to the pre-assembled component, sealing is completed, then cooling is controlled, and a sealing piece with an airtight brazing joint is formed; and carrying out annealing treatment to obtain a finished product sealing assembly. Therefore, the problems of low dielectric strength, large thermal expansion coefficient difference, difficulty in interface quality control and the like in the prior art are solved.

The utility model discloses an accurate guide device for hot continuous rolling of a kovar alloy plate. The accurate guide device comprises a rack, a conveying roller, a guide mechanism, a fixing mechanism and a cleaning mechanism, the rack is fixed on the ground; the conveying rollers are evenly and rotationally connected to the machine frame through bearings, and the guiding mechanisms are symmetrically installed on the two sides of the kovar alloy plate. The fixing mechanism and the cleaning mechanism are both mounted on the guide mechanism; the guide mechanism comprises a support frame, a connecting plate, a rotating roller, a bidirectional threaded rod, a guide rod and a motor II; the two-way threaded rod is rotationally connected to the rack through a bearing, and the guide rods are fixed to the portions, on the two sides of the two-way threaded rod, of the side wall of the rack. The motor is fixed to the outer side wall of the rack, and the output end is connected with one end of the bidirectional threaded rod. According to the utility model, the Kovar alloy plate can be accurately guided; in the Kovar alloy plate guiding process, the side wall makes contact with the rotating roller, friction can be reduced, and damage to the Kovar alloy plate is further reduced.

The invention relates to a metal mask supported by a glass substrate for manufacturing an organic light emitting diode display. The mask includes a glass substrate located only outside the display area, an open-cell metal layer for providing structural stability, and forming apertures for material deposition in the display area. The perforated metal layer can be formed by methods such as electroforming, sputtering, chemical vapor deposition, evaporation or atomic layer deposition, and the used metal comprises a material with a low thermal expansion coefficient, such as invar steel, super invar steel, kovar alloy, 42 alloy, nickel, tungsten, molybdenum, tantalum or rhenium. The mask supports two structural forms: a fine metal mask and an open metal mask which are respectively used for evaporation of red, green and blue sub-pixels and a common layer. The method can be used for batch processing of a plurality of micro organic light-emitting diode display substrates, and can also be used for full-coverage processing of a single active matrix organic light-emitting diode display substrate.

The utility model relates to the technical field of microelectronic packaging tube shell application, in particular to a sectional type positioning, assembling and welding jig suitable for a split type Kovar enclosure frame, which comprises a pressing plate, an upper positioning plate, a lower positioning plate and a bottom plate, and provides a jig adopting sectional type positioning, a product is divided into two parts to be positioned, and meanwhile, the product can be separated from the bottom plate. One-time stacking, assembling and positioning are also formed, the consistency of products can be guaranteed, and the yield of the products is improved; the two parts of the product are respectively positioned, so that the skew of the product caused by overlapping, assembling and touching in the assembling process is reduced, and the assembling efficiency is improved; the pressing plate, the upper positioning plate, the lower positioning plate, the bottom plate, the first protruding block and the second protruding block are all made of graphite which is even in heat conduction, it can be guaranteed that products are evenly heated in the brazing process, glass ceramics can be prevented from being adhered to a jig in the brazing process, and demolding is easy after the products are brazed; the production cost is effectively reduced, the equipment precision requirement is reduced, the production period is shortened, and the production process is simpler, more convenient and more efficient.

The invention discloses a miniaturized MEMS circulator with a TSV capacitor. The miniaturized MEMS circulator comprises a kovar metal layer, a first metal layer, a first silicon adapter plate layer and ferrite, first metal columns are distributed on the bottom surface of the first silicon adapter plate layer; second metal columns are distributed on the top surface of the first silicon adapter plate layer; a second metal layer; bonding the interconnection layer; a third metal layer; a second silicon adapter plate layer; an insulating spacer and a permanent magnet. According to the invention, the size is reduced and the bandwidth is improved by forming a capacitor through staggered and parallel TSVs. Besides, matching at ports is carried out through a capacitance-inductance-capacitance matching network, and an inductor in the matching network is a serpentine inductor, so that the size required by the matching network is further reduced, and miniaturization and integration of the MEMS circulator are facilitated.

The invention discloses a brazing method for a sapphire-ceramic vacuum arc-extinguishing chamber window and application of the brazing method. The brazing method comprises the steps that an activation layer, a barrier layer and a brazing layer are sequentially deposited on a sapphire brazing face, and a molybdenum-manganese method is used for sintering and chemical nickel plating is carried out on an annular trepanning area of a ceramic shell; the oxygen-free copper metal foil, the kovar alloy metal foil and the nickel metal foil are compounded into a whole, the oxygen-free copper side of the obtained annular composite transition ring is aligned with the sapphire brazing layer, the copper brazing filler metal ring is placed in the middle of the annular composite transition ring, the nickel side of the composite transition ring is aligned with the nickel-plated layer at the opening of the ceramic shell, the copper brazing filler metal ring is placed in the middle of the annular composite transition ring, and the obtained assembly is subjected to vacuum brazing. Two high-strength and high-airtightness brazed joints are formed at a time, and therefore the sapphire window is connected to the ceramic shell in a sealed mode through the composite transition ring. By introducing a multi-layer composite transition layer structure, the thermal stress matching problem is effectively solved, so that a sealing interface with ultrahigh air tightness, high mechanical strength and excellent long-term reliability is realized.

The invention discloses a hybrid photomultiplier coaxial output structure based on a microstrip line. The hybrid photomultiplier coaxial output structure comprises a semiconductor detector, a bonding wire, the microstrip line, a ground electrode, a lead pin, a medium, an outer conductor base and a detector lead pin. The semiconductor detector is used for receiving the photoelectrons converted by the photoelectric cathode and generating a current signal; the bonding wire is used for electrically connecting the semiconductor detector and the microstrip structure; the microstrip line and the ground electrode adopt gold-plated kovar alloy parts to form an in-tube microstrip structure; the guide pin and the detector guide pin are kovar alloy guide pins and form an inner conductor with a coaxial structure; the outer conductor base is a kovar alloy disc and forms an outer conductor with a coaxial structure; the medium is glass or ceramic. According to the coaxial output structure, a vacuum tube is of a 50-ohm microstrip structure, the exterior of the vacuum tube is of a 50-ohm SMA coaxial structure, and a complete 50-ohm coaxial line is formed by connecting a microstrip line and a guide pin together. The structure provided by the invention has the advantages of high transmission speed, small signal reflection and oscillation and the like, and is more beneficial to detection of ultrafast optical pulse signals.

The invention discloses a 4J29 kovar alloy / 304 stainless steel composite plate and a preparation method thereof, and belongs to the technical field of metal composite plate production, a 4J29 kovar alloy plate and a 304 stainless steel plate in a cold rolling state are respectively subjected to recrystallization annealing treatment to obtain a soft 4J29 kovar alloy plate and a soft 304 stainless steel plate, then the soft 304 stainless steel plate is used as a base plate, and the 4J29 kovar alloy plate and the soft 304 stainless steel plate are subjected to heat treatment to obtain the 4J29 kovar alloy / 304 stainless steel composite plate. A soft 4J29 kovar alloy plate serves as a compound plate, the surface of the soft 4J29 kovar alloy plate is coated with a layer of water glass to serve as a protective layer, then an explosive layer is laid on the surface of the protective layer in a gradient explosive distribution mode, then explosive cladding is conducted, the composite plate is obtained, a bonding area of the composite plate has the uniform and continuous microwave shape characteristic, the interface bonding rate is larger than or equal to 98.9%, and the bonding strength is larger than 360 MPa. The explosive welding composite board with excellent performance is prepared, and corresponding technical conditions meet industrial production requirements.

The application relates to the technical field of metal plate composite technology and discloses a preparation process of a Kovar alloy-copper composite plate, which comprises the following steps: a preparation process of an Invar alloy-copper composite plate, which comprises the following steps: s1, taking one Invar alloy plate and two copper plates; s2, immersing the Invar alloy plate into liquid copper after the Invar alloy plate is heated to 250-300 DEG C; s3, positioning the two copper plates and the Invar alloy plate to form a group of initial composite plate materials; s4, heating the whole in a heating furnace, the heating temperature is 700-850 DEG C, and the heating time is 20-40 min; s5, taking out and cooling to 500-650 DEG C, and then performing hot rolling; s6, performing stress relieving annealing on the composite blank; s7, naturally cooling to normal temperature after annealing, and cold rolling to form an Invar alloy-copper composite plate with a preset thickness. The Invar alloy-copper composite plate prepared through the process is more stable and not easy to separate between the plates, the composite plate has the physical properties of the Kovar alloy and good thermal conductivity.

The embodiment of the invention discloses a crystal oscillator mixed seal welding method based on partition stripping. The method comprises the steps that a base and a kovar alloy cover plate with a nickel-plated gold layer are prepared; performing laser cleaning on the lower surface of the kovar alloy cover plate corresponding to the short straight edge sealing area, removing the nickel-gold plating layer in the area, and meanwhile, retaining the nickel-gold plating layer in the long straight edge sealing area on the kovar alloy cover plate; the kovar alloy cover plate subjected to laser cleaning correspondingly covers the base, and a long straight edge sealing area of the kovar alloy cover plate is subjected to sealing welding through parallel seam welding; and the short straight edge sealing area of the kovar alloy cover plate is subjected to sealing welding through laser welding. According to the method, through partition surface treatment, the high-airtightness seal welding reliability is ensured, meanwhile, the advantages of high-efficiency continuity of electric resistance welding and gas control of laser welding are achieved, and the method is particularly suitable for packaging and manufacturing of small-sized and high-stability patch crystal oscillators such as 3215 and the like.

The invention discloses a vacuum laser welding method for dissimilar metal materials, and aims to solve the problems of poor joint performance, multiple defects and the like caused by metallurgical incompatibility, oxidation and thermal stress in traditional welding. The method comprises the following steps that a to-be-welded part is placed in a vacuum bin to be vacuumized; argon is blown to the laser head lens for protection; a step-by-step laser process is adopted, preheating seal welding is conducted at low power, and then formal welding is completed at set power; the welded part is placed in a heat preservation box to be subjected to heat preservation treatment; and nickel or kovar alloy is pre-arranged at the joint to serve as an interlayer transition material. Oxidation and pollution are completely eradicated through the vacuum environment, generation of brittle intermetallic compounds is inhibited in combination with an interlayer material, heat circulation is optimized in cooperation with preheating and heat preservation processes, residual stress is reduced, the method is particularly suitable for connection of tool ends and other high-performance dissimilar metal parts, and the welding seam quality, the joint mechanical property and the process reliability can be remarkably improved.

The invention discloses a vacuum arc-extinguishing chamber monitoring window brazing process based on transparent ceramic YAG and a vacuum arc-extinguishing chamber monitoring window, and the vacuum arc-extinguishing chamber monitoring window brazing process comprises the following steps: arranging a circular groove on the outer surface of aluminum oxide ceramic as a connecting surface of a monitoring hole and YAG, designing the connecting surface into a step-shaped structure, and cleaning the surface of the monitoring hole of an aluminum oxide ceramic shell and the brazing surface of the YAG; uniformly stirring molybdenum, manganese and titanium metal powder and the mixed solution, coating the surface of the monitoring hole and the brazing surface of the YAG with the mixed solution, and then performing sintering treatment to form a transition layer; and after a layer of nickel is electroplated on the transition layer, the Kovar ring is used as an intermediate metal piece, and the surface of the monitoring hole, the Kovar ring and the brazing surface of the YAG are sequentially brazed together, so that the monitoring window of the vacuum arc-extinguishing chamber is obtained. According to the method, materials and structures used in the brazing process are comprehensively optimized, so that generated thermal stress is low, the risk of brazing failure is greatly reduced, the rate of finished products is increased, and meanwhile the process complexity and cost are reduced.

The utility model belongs to the surface mounting welding ceramic packaging base technical field discloses a kind of ceramic SMD pedestal, the ceramic SMD pedestal includes top seat and pedestal fixed together, and the top surface of top seat is equipped with Kovar ring around, and first foot stand and second foot stand are equipped in the top recess surrounded by Kovar ring;The top surface of Kovar ring, first foot stand and second foot stand is sequentially equipped with ceramic base and nickel layer from inside to outside;The bottom surface of pedestal is equipped with third foot stand, fourth foot stand, fifth foot stand and sixth foot stand, and the bottom surface of third foot stand, fourth foot stand, fifth foot stand and sixth foot stand is sequentially equipped with ceramic base, nickel layer and tin layer from inside to outside.The beneficial effects of the utility model are: by using nickel layer and nickel layer and tin layer replace traditional nickel layer+gold layer, reduce the use of noble metal gold, reduce material cost.

The invention discloses an air-tight seal optical connector for aerospace and a preparation method thereof, and relates to the technical field of optical communication connectors. According to the method, the aluminum oxide ceramic ferrule is integrally prefabricated, and a titanium-tungsten metal layer is deposited through magnetron sputtering, so that the structural performance is optimized; the sealing of the optical fiber and the glass tube is realized by adopting laser welding or glass sealing, and a multi-layer air-tight sealing system is constructed by matching an end face sealing ring and a main body which are in interference fit with a leading-out end in a sealing manner; and the signal transmission stability is guaranteed through full-process high-precision coaxiality control. According to the invention, ceramic ferrule integrated design, multi-layer sealing cooperation, kovar alloy main body matching and other technologies are innovatively adopted, the problems of poor airtight reliability and weak extreme environment resistance of a traditional optical connector are solved, and the prepared connector has the advantages of high airtightness, low insertion loss, high reliability and compact structure. The harsh use requirements in the aerospace fields of satellites, spacecrafts and the like can be met, and the method has important engineering application value.

The invention discloses a stainless steel oxygen-free copper embedded T / R shell and a preparation method thereof. The shell comprises a 316L stainless steel shell body, a TU1 oxygen-free copper substrate, a radio frequency connector, a stress gradient slow release ring and a low-frequency connector. The preparation method comprises the following steps: cleaning and annealing each component; the weldability is enhanced by pre-plating nickel; the shell, the substrate and the stress slow release ring are assembled through silver-copper brazing; after nickel / gold electroplating, a plating layer on the sealing and welding surface is removed through laser; and installing the radio frequency / low frequency connector to the kovar ring through gold-tin brazing. Through gradient material design and a step-by-step brazing process, the problem of sealing failure caused by thermal expansion coefficient mismatch is solved, and the high-power heat dissipation performance and the airtight reliability are remarkably improved.

The application is realized by the technical scheme as follows: a ceramic metal packaging shell, comprising an alumina ceramic shell, the alumina ceramic shell is provided with a frame type structure, and a convex strip is formed on the inner wall of the alumina ceramic shell; a tungsten copper bottom plate, the tungsten copper bottom plate is provided with a stepped table structure, the upper half of the tungsten copper bottom plate is a core area cavity, and the lower half is a heat sink cavity, the tungsten copper bottom plate is welded on the alumina ceramic shell, and the core area cavity corresponds to the convex strip part on the inner side of the alumina ceramic shell; and a Kovar alloy cover plate, the Kovar alloy cover plate is welded on the alumina ceramic shell. The application has the advantages that the ceramic has good air tightness, can resist the influence of extreme environments such as high temperature, high humidity, corrosion and radiation on electronic devices after packaging, the ceramic has a matching thermal expansion coefficient with metal, and has good mechanical properties, and almost no damage is caused after thermal shock test and temperature cycle test.

The invention relates to the technical field of device connection, in particular to a high-performance ultrasonic-assisted Kovar-W80Cu20 joint connection method and a precise device. Sn-Sb10 alloy brazing filler metal is adopted, and the Kovar alloy and the W80Cu20 alloy are connected through ultrasonic-assisted brazing. The obtained joint has the characteristics of low thermal expansion coefficient and high thermal conductivity, and the equivalent thermal conductivity at 25 DEG C and 125 DEG C reaches 50 + / -2W / m.K. The shear strength can still exceed 55MPa after being aged for 45 days at the temperature of 160 DEG C; after the Kovar-W80Cu20 composite material is subjected to thermal shock circulation at-40 DEG C to + 125 DEG C for 2000 cycles, the shear strength can still reach 57 MPa, excellent aging reliability and thermal shock reliability are shown, and excellent mechanical properties are attributed to interface bonding promotion by ultrasonic loading and the characteristic of low thermal expansion coefficient of the Kovar-W80Cu20 structure. According to the high-performance ultrasonic-assisted Kovar-W80Cu20 joint connection method and the precise device, the Kovar alloy and the low-expansion and high-heat-conduction W80Cu20 alloy are efficiently connected by constructing the'Kovar / SnSb10 / W80Cu20 'heterogeneous joint, an excellent heat dissipation solution is provided for the high-power precise device, and meanwhile the good CTE matching performance with a chip material is kept.

This invention discloses a low-dielectric glass material, glass-ceramic, and a method for preparing TGV through-holes for integrated circuit packaging. The glass material is composed of SiO2, B2O3, Al2O3, RO, R2O, and rare earth oxides Gd2O3 / La2O3, satisfying a SiO2 / B2O3 molar ratio of 2.0~3.5 and an Al2O3 / (Gd2O3+La2O3) molar ratio of 1:1~4:1. Through the "mixed base-like effect" and lattice distortion effect generated by the Gd2O3 / La2O3 dual doping, a dielectric constant ≤4.6, dielectric loss ≤0.001, and CTE 32~50 × 10⁻⁶ are achieved. ‑7 / °C. Further heat treatment yields a glass-ceramic containing single-crystal β-CaSiO3 phase, with a flexural strength ≥250 MPa. Based on this, laser-induced modification combined with wet etching is used to form TGV vias with an aspect ratio ≥50:1, followed by pulsed copper plating for filling, and low-temperature sealing with Kovar alloy at 975°C. Slow cooling and compressive stress design suppress bubbles and cracks. This invention solves the problems of signal loss, thermal stress failure, and insufficient mechanical strength in high-frequency packaging, and is suitable for RF connectors, MEMS, and 3D system-level packaging.

The invention discloses a He position sensitive detector and an assembling method thereof, and relates to the technical field of nuclear detection. The detector comprises a tube shell filled with working gas, wherein insulating electrodes consisting of kovar alloy end sockets, insulating ceramics and copper tubes are arranged at two ends of the tube shell. And the two ends of the anode wire coaxially arranged in the tube shell are respectively connected with the inflating tube and the wire penetrating copper needle through an anode wire positioning piece and a spring. According to the invention, high-precision coaxial positioning of the anode wire is realized through small clearance fit between the anode wire positioning piece and the inner wall of the copper pipe; a bilateral spring structure and a unique assembly method are adopted, so that accurate control and reliable maintenance of the tension of the anode wire are ensured; and an inflation tube and a threading copper needle are multiplexed as a signal extraction electrode, so that the functions of inflation, signal extraction and mechanical support are efficiently integrated in a limited space. The problems that an existing detector anode wire is not accurate in positioning, tension maintaining is not reliable, and multifunctional integration is difficult in a compact space are effectively solved.

The invention discloses a high-temperature and high-frequency force-sensitive chip packaging structure based on nano-silver sintering and flush packaging, which comprises a kovar alloy shell and a chip main body, and is characterized in that a nano-silver sintering interconnection layer is arranged between an SOI force-sensitive chip in the chip main body and an aluminum nitride ceramic substrate; a low-melting-point glass sealing ring is arranged on the periphery of a back cavity of the SOI force-sensitive chip, a high-vacuum reference cavity is defined by the low-melting-point glass sealing ring, and a sensitive diaphragm of the SOI force-sensitive chip and the front end face of the kovar alloy shell are arranged in a coplanar mode. The process comprises the following steps of: 1, pre-treating and metalizing a substrate; 2, coating the nano-silver paste and inversely mounting the chip; 3, sintering and interconnecting the nano-silver; 4, glass ring sealing and vacuum cavity preparation; and 5, forming a flush structure and releasing stress. According to the invention, the sensitive diaphragm of the SOI force sensitive chip and the front end face of the shell are arranged in a coplanar manner, so that the lumen effect is eliminated, and the reliability of the sensor is improved; the process effectively inhibits thermal stress, improves structural stability and is suitable for the field of hot end monitoring.

The utility model relates to the technical field of solar energy application, in particular to an all-glass solar heat collection straight-through pipe with a port sealed by glass and metal, which comprises a glass inner pipe and a glass outer pipe sleeved on the periphery of the glass inner pipe. The end part of the glass inner tube and the end part of the glass outer tube are sealed through metal kovar melting, a vacuum interlayer is formed in an area enclosed by the metal kovar, the glass outer tube and the glass inner tube, and the cross section of the metal kovar is arc-shaped; the end parts of the glass outer tube and the glass inner tube are different in thickness during sealing, and the temperature difference between the glass inner tube and the glass outer tube can be prevented from being too large; the metal kovar with the arc-shaped cross section is adopted, so that different elongation of the glass inner tube and the glass outer tube caused by temperature difference in the axial direction and the radial direction can be balanced, the thermal shock of the glass inner tube and the glass outer tube can be reduced, and the safety of the solar heat collection straight-through tube is ensured.

This application relates to the field of material sealing technology, and particularly to a high-performance insulating ceramic sealing method for neutron tubes. The method includes: sequentially performing organic solvent ultrasonic cleaning and argon plasma etching activation treatment on the sealing surface of a cylindrical high-purity alumina ceramic part, followed by magnetron sputtering deposition of a titanium transition layer to obtain a ceramic part with a titanium transition layer; acid washing to remove the oxide layer from the sealing surface of a Kovar alloy cylindrical flange, followed by cleaning and drying to obtain a metal sealing part; preparing an active brazing filler metal sheet; sequentially assembling the sheet to form a pre-assembled assembly; placing the pre-assembled assembly in a vacuum brazing furnace, applying axial preload to complete the sealing, followed by controlled cooling to form a sealing part with an airtight brazed joint; and annealing to obtain the finished sealing assembly. This method solves the problems of low dielectric strength, large differences in thermal expansion coefficients, and difficulty in controlling interface quality in existing technologies.

A semiconductor laser fiber coupling module comprises a tube shell, a fiber jumper, a nickel stainless steel sleeve and a Kovar alloy ring; the tube shell comprises a copper ring frame and a copper base, the copper ring frame is open at both ends in the up-down direction, the copper ring frame is provided with a through hole penetrating through the copper ring frame in the direction intersecting the up-down direction, and the copper base seals and closes the copper ring frame from below; the copper base and the copper ring frame are integrally formed as a single piece; the Kovar alloy ring is sealingly installed in the through hole of the copper ring frame, the Kovar alloy ring has an outer peripheral surface and an axial outer end surface, the outer peripheral surface of the Kovar alloy ring is sealed with the through hole of the copper ring frame, and the axial outer end surface of the Kovar alloy ring is exposed outside the copper ring frame; the nickel stainless steel sleeve is sleeved on the outer periphery of the end portion of the fiber jumper and exposes the end portion of the fiber jumper, and the nickel stainless steel sleeve has an axial end surface; the exposed end portion of the fiber jumper is inserted into the Kovar alloy ring from the outside of the copper ring frame; and the axial end surface of the nickel stainless steel sleeve and the axial outer end surface of the Kovar alloy ring face each other and are laser welded together.

This invention relates to the field of electromagnetic relay manufacturing technology, and discloses an ultra-high frequency induction brazing device for an electromagnetic relay contact spring system, comprising: a worktable, a fixture, a moving mechanism, and an ultra-high frequency induction brazing machine; the fixture is disposed on the worktable surface and is used to clamp and fix the contact spring system; during welding, a spring sheet is sleeved on the Kovar alloy lead-out rod in the contact spring system to form a welding point between the two; the output end of the moving mechanism can move along a first direction and a second direction, and the induction brazing head of the ultra-high frequency induction brazing machine is disposed on the moving mechanism; during operation, the moving mechanism drives the induction brazing head to move along the first direction and the second direction, so that the induction coil of the induction brazing head is aligned with each welding point. This device adopts non-contact induction heating, completely avoiding the use of carbon rod electrodes, eliminating the generation of excess carbon powder from the source, and greatly improving the internal cleanliness and long-term operational reliability of the electromagnetic relay.

The invention discloses a preparation process of a Kovar copper Kovar sandwich lead. The preparation process comprises the following steps: 1, preparing two Kovar alloy plates and a copper plate; 2, one kovar alloy plate is selected as a substrate, a copper plate is placed on the substrate, another kovar alloy plate is placed on the copper plate, and a kovar alloy plate-copper plate-kovar alloy plate stacked structure is formed; 3, controlling a vacuum environment; 4, selecting and arranging explosives; 5, annealing and hot rolling of the composite blank; sixthly, the kovar-copper-kovar composite board obtained in the fifth step is tested, leveled, cut and polished; 7, the qualified composite board is drawn to obtain coiled wires, and the coiled wires are drawn to the size of a finished product; the method has the advantages that the Kovar and copper welding quality and strength are guaranteed, the packaging reliability problem caused by insufficient binding force is solved, the transmission performance and conductivity are improved by adopting the copper core, the outer-layer Kovar alloy is matched with the thermal expansion coefficient of glass, and the method is suitable for packaging of high-power devices.

The utility model relates to the technical field of microelectronic packaging tube shell application, in particular to a split type assembled kovar enclosure frame structure which comprises a body, the body comprises a kovar ring, a first groove, a second groove, a first kovar supporting column and a second kovar supporting column, the first groove and the second groove are both formed in the kovar ring, and the first kovar supporting column and the second kovar supporting column are arranged on the body. The detachable assembled kovar enclosure frame structure comprises two first grooves, two second grooves, two first kovar supporting columns and two second kovar supporting columns, the first kovar supporting columns are arranged on the first grooves, the second kovar supporting columns are arranged on the second grooves, the number of the first grooves and the number of the second grooves are both two, and the number of the first kovar supporting columns and the number of the second kovar supporting columns are both two. Compared with the original kovar enclosure frame, the problem of production cost caused by high production difficulty can be reduced, and the verification process of the subsequent process is accelerated.

The utility model relates to high -voltage direct current relay kovar assembly drawing force testing arrangement, including kovar insert block, the ceramic arc extinguishing chamber is set on, passes through the ceramic arc extinguishing chamber along the connecting hole on the ceramic arc extinguishing chamber, support block contacts kovar insert block, wherein the recess is formed between the cover body of ceramic arc extinguishing chamber and kovar metal, kovar insert block is inserted into the recess, support block contacts kovar insert block away from the surface of kovar metal, one end of the pull column away from kovar insert block stretches out the ceramic arc extinguishing chamber, the one end of pull column close to kovar insert block is provided with first reducing section, the diameter of first reducing section is greater than the diameter of connecting hole, the utility model can test the drawing force between ceramic arc extinguishing chamber and kovar metal by pulling away support block and pull column, avoid directly clamping fragile ceramic arc extinguishing chamber, also avoid directly clamping small area kovar metal, simplify clamping.

The invention relates to the technical field of brazing, in particular to silver-based brazing filler metal for brazing CVD diamond and kovar alloy and a method. The silver-based brazing filler metal comprises Ag-Cu-In-Ti alloy powder and B powder; the Ag-Cu-In-Ti alloy powder is prepared from, by mass, 12%-15% of In, 1.5%-3.5% of Ti, 23%-30% of Cu and the balance Ag. And the B powder accounts for 0.2 wt%-2wt% of the Ag-Cu-In-Ti alloy powder. The content of a melting reduction element In in the brazing filler metal is low, and generation of brittle compounds containing In is reduced; and by adding the B powder, Ni3Ti and Fe2Ti in a brazed joint can be reduced, diffusion of the Ni element into the brazing filler metal is limited, high enrichment of the Ti element is promoted, a small amount of TiB and Cu-Ti strengthening phases can be generated, the strength of the joint is strengthened, and high-strength connection of the CVD diamond and the Kovar alloy can be achieved under the low-temperature brazing condition.

The application discloses a 4J29 Kovar alloy / 304 stainless steel composite plate and a preparation method thereof, and belongs to the technical field of metal composite plate production. Cold-rolled 4J29 Kovar alloy plates and 304 stainless steel plates are respectively subjected to recrystallization annealing treatment to obtain soft 4J29 Kovar alloy plates and soft 304 stainless steel plates, then the soft 304 stainless steel plates are used as base plates, the soft 4J29 Kovar alloy plates are used as composite plates, a layer of water glass is applied on the surface of the soft 4J29 Kovar alloy plates as a protective layer, then an explosive layer is laid on the surface of the protective layer by using a gradient drug laying mode, and then explosion compounding is carried out to obtain the composite plate, the bonding area of the composite plate presents a uniform and continuous micro-wave shape feature, the interface bonding rate is greater than or equal to 98.9%, and the bonding strength is greater than 360 MPa. The application prepares an explosion-welded composite plate with excellent performance, and the corresponding technical conditions meet the requirements of industrial production.

This invention discloses a method for ensuring the coaxiality of a high-energy electron gun body, belonging to the field of high-energy electron guns. The method includes: (1) first assembling the flange connector, Kovar ring I, Kovar ring II, and ceramic tubing onto an argon arc welding fixture I, and then using argon arc welding to weld Kovar ring I to the flange connector and flange to obtain a flange ceramic assembly; (2) milling the installation reference surface after welding; (3) argon arc welding the square cavity weldment; (4) machining the square cavity weldment after welding; (5) ion beam welding the anode plate; (6) ion beam welding the square cavity weldment; (7) brazing the ceramic tubing to Kovar ring I and Kovar ring II. By rationally arranging the welding and milling processes using this method, the coaxiality of the gun body can be ensured, thereby improving the assembly accuracy of the high-energy electron gun and the performance of the electron beam. This invention provides a method for the processing and manufacturing of a high-energy electron gun body, and this method also has guiding significance for the production and manufacturing of electron guns.