64results about How to "Reduce electrical connections" patented technology

The invention discloses a light emitting diode (LED) assembled screen. The LED assembled screen comprises a control box, a framework and at least two LED display modules, wherein the control box at least comprises two independent paths of output interfaces; each output interface is connected with one LED display module; the at least two LED display modules are assembled and fixed on the framework; each of the LED display modules comprises a box body, a circuit board, a pouring sealant, a driving chip, an input interface and a plurality of LED chips; the driving chip and the plurality of are arranged on the circuit board; the driving chip is connected with the LED chips and the input interface respectively; the input interface is formed on the box body and connected with the corresponding output interface of the control box; the box body has a flat structure, and one face of the box body is provided with an opening; the circuit board is arranged in the box body; the pouring sealant is covered on the circuit board so as to seal the opening face of the box body; and the LED chips are arranged on one side, corresponding to the opening face of the box body, of the circuit board. Due tothe LED assembled screen, the assembling flexibility of an LED display screen is improved, and the LED assembled screen is convenient to install and maintain.

The invention relates to an MEMS sensor encapsulation structure and an encapsulation method thereof, which are used for encapsulating an MEMS sensor. The MEMS sensor encapsulation structure is characterized by comprising a ceramic base, a side wall and a top cap, wherein a plurality of metal bonding pads are respectively arranged on a top layer and a bottom layer of the ceramic base; the metal bonding pads on the top layer of the ceramic base are connected with leads of the MEMS sensor; the MEMS sensor is arranged on the ceramic base; the metal bonding pads on the bottom layer of the ceramic base are connected with an external circuit; the ceramic base adopts one-layer or multi-layer perpendicularly interconnected structure; the side wall and the top cap are both made of kovar alloy. According to the invention, the ceramic base of which coefficient of thermal expansion is approximate to that of the MEMS sensor material is selected as the encapsulation material, in order to reduce influence of the base expansion stress to the MEMS sensor; meanwhile, the ceramic base can be utilized to realize one-layer perpendicular interconnection or multi-layer perpendicular interconnection; the system-level integration between the MEMS sensor and the peripheral circuit can be realized within a small area; high-density system-level encapsulation can be realized; the encapsulation flexibility and the expansibility of the MEMS sensor can be realized.

The invention discloses a DMA data transmission system based on an embedded motion control board card and a transmission method of the DMA data transmission system, wherein a self-researched embedded motion controller is adopted. The DMA data transmission system comprises an FPGA logical processing module, a DSP module and a motor control module, wherein the DMA function is embedded into the DSP module. According to the DMA data transmission method, by means of cooperative work of an upper computer, an FPGA and a DSP and reasonable distribution of a time period and a program segment, batch data interaction between the upper computer and the motion control board card and batch data interaction between internal modules of the motion control board card are achieved, and therefore accurate control over a servo motor by the motion controller is achieved.

A brake system, including four hydraulically actuatable wheel brakes. Each wheel brake is assigned in each case one outlet valve which is closed when electrically deenergized. Each wheel brake is assigned in each case one inlet valve which is open when electrically deenergized. The brake system furthermore includes a simulator which is actuatable by a brake pedal, wherein two pressure provision devices are provided for actively building up pressure in the wheel brakes, two brake circuits are hydraulically formed, wherein, in each brake circuit, in each case one pressure provision device is hydraulically connected to two wheel brakes, and wherein two separate on-board electrical systems are provided, and wherein each pressure provision device is fed in each case by one of the two on-board electrical systems.

The embodiment of the invention provides an array substrate, a display device and a driving methodthereof. The array substrate comprises a substrate, a plurality of scanning lines and a plurality of data lines. The plurality of scanning lines and the plurality of data lines are arranged in a crossed manner to form a plurality of pixel units which are arranged in an array manner. At least one row of pixel units corresponds to two scanning lines, and the two scanning lines corresponding to the same row of pixel units synchronously receive scanning signals. According to the array substrate, the two scanning lines are arranged on the same row of pixel units, the number of the electrically connected pixel units on each scanning line is reduced, then the resistance and capacitance delay on the scanning lines is reduced, and the charging time of the grid electrode is guaranteed. Moreover, the two scanning lines corresponding to the pixel units in the same row synchronously receive scanning signals, so that the grid electrodes of the pixel units in the same row are enabled to be synchronously opened, and the normal display of images is realized.

A chip package substrate having a soft circuit board jas a multi-layer soft and hard composite PCB, a plurality of conducting components and a plurality of conducting holes. The conducting holes are formed in the multi-layer soft and hard composite PCB. The conducting components are electroplated on the inner edges of the conducting holes on the multi-layer soft and hard composite PCB. An image-sensing chip can thus be packaged on the chip package substrate with the soft circuit board used as external signal connection lines, thereby saving the manufacturing cost and increasing the yield thereof.

Unit-forming bus bars including input terminal bus bars and output terminal bus bars are secured through an insulation layer to a rear surface of a heat radiation member that is exposed outside an electric connection box case, and switching devices are mounted on the bus bars. Relay switches that are different from the switching devices are mounted on a relay board. The relay board and a control circuit board for controlling driving of the switching devices are disposed on a surface facing away from the rear surface of the heat radiation member, and are parallel to each other.

The invention provides a self-driven sensing system which comprises a friction nanogenerator and a capacitance-type sensor. The friction nanogenerator is used for converting external mechanical energyinto electric energy and outputting an electric signal to an external circuit; the capacitance-type sensor is connected with the friction nanogenerator so as to be powered by the friction nanogenerator and used for detecting a sensing signal. The self-driven sensing system provided by the invention can be applied to any occasion capable of producing the mechanical energy, and can supply power tothe sensor in real time. The self-driven sensing system is characterized in that no external power supply is needed, the power supply problem of the sensor is solved, the adaptability of an internet-of-things device is improved, and the size and the weight of the system are greatly reduced. According to the system provided by the invention, the stability and the controllability are greatly improved. The friction nanogenerator and the sensor are separated, so that a friction material and a sensing material do not influence each other, a material selecting range is enlarged without being influenced by a mechanical movement frequency, and the system has an actual application value.

The invention relates to a connection element for electrically connecting an individual line which has a concentric conductor arrangement (32) and a central passage (33) for a cooling fluid. The connection element comprises an electrically conductive housing (2) with a sleeve-shaped pressing portion which is suitable for producing a press connection to the concentric conductor arrangement (32). The electrically conductive housing (2) here has an internal cooling passage (10) with a connection opening (11) for an external cooling line, said cooling passage leading into a space surrounded by the sleeve-shaped pressing portion. In addition, the connection element comprises a counterpressure element (3) which can at least partially lie in the space surrounded by the sleeve-shaped pressing portion. The counterpressure element (3) is furthermore configured to support the concentric conductor arrangement (32) on the inner side thereof when the sleeve-shaped pressing portion is compressed during the production of a press connection. The invention furthermore relates to a fluid-coolable individual line unit and to a charging cable having a charging connector.

A prismatic sealed battery module includes: a prismatic battery case; an electrode plate group constituted by alternately layering positive and negative electrode plates with a separator arranged therebetween; and an electrolyte. The positive or negative electrode plates protruding from each end face of the electrode plate group are bonded to a collector member. A metal connector is fixed to the central part of the collector member facing the inner surface of the side end wall of the battery case. The collector member is connected, at the metal connector, to an external terminal using an externally connecting bolt.

An integrated circuit having a plurality of circuit blocks, each block having one or more positive voltage supply pads, one or more negative voltage supply pads, and one or more signal pads. The integrated circuit further comprises an electrostatic protection circuit comprising a first electrostatic discharge protection rail for connection to a positive voltage supply point, a second electrostatic discharge protection rail for connection to a negative voltage supply point, and first protection circuitry coupling each said signal pad to both said first and second electrostatic discharge protection rails, the first protection circuitry being configured to provide a conduction path to one of the first and second rings in the event of an excessive voltage being present on one of said signal pads.

The invention provides an FCM packaging chip machine manufacturing method, a packaging chip machine and a camera. A small-sized camera which is provided with an FCM and does not need a circuit board comprises a lens, a base and the FCM, the FCM mainly utilizes a camera module packaging sheet (Flip Chip Module for short) which is manufactured by combining an FPC-free circuit board lead bracket and an advanced semiconductor packaging technology (Flip Chip), and the FCM is a packaging sheet module integrating an optical filter, an image chip, a driving/storage chip, an electronic component and a connector into a whole). According to the scheme, a circuit board is not needed to serve as a connection bridge any more, meanwhile, most precise assembly procedures are saved, and equipment and manpower cost investment is reduced. Moreover, the accumulated tolerance of the simplified assembly process is also reduced, the offset and inclination can be better controlled, and the product yield is improved.

A semiconductor device according to the present disclosure includes an electrically conductive first electrode block, an electrically conductive submount, an insulating layer, a semiconductor element, an electrically conductive bump, and an electrically conductive second electrode block. The submount is provided in a first region of the upper surface of the first electrode block, and electrically connected to the first electrode block. The semiconductor element is provided on the submount, and has a first electrode electrically connected to the submount. The bump is provided on the upper surface of a second electrode, opposite the first electrode, of the semiconductor element, and electrically connected to the second electrode. A third region of the lower surface of the second electrode block is electrically connected to the bump via an electrically conductive metal layer. An electrically conductive metal sheet is provided between the metal layer and the bump.

A connector device connectable to an electronic device is provided. The connector device includes a body housing, a cap unit coupled to the body housing, and a cable electrically connected to the body housing and the cap unit. The cap unit is provided with a terminal protection module that senses a temperature due to heat generated when the body housing and the cable are electrically connected, and disconnects the electrical connection.

There is provided a downsized electrical connection box in which the reliability of the mechanical connection between blocks provided in the electrical connection box is improved. The electrical connection box 1 includes a plurality of electric components, a first block 3 mounted with the electric components and a second block mounted with the electric components. The first block 3 includes a tubular-shaped first member 32, 33 projecting towards the second block 5. The second block 5 includes a second member 52, 53 arranged to be slidably inserted into the first member. The first and the second blocks 3, 5 are coupled to each other by slidably inserting the second member 52, 53 into the first member 32, 33. At least one electric component 8 of the plurality of electric components is received inside the first and the second members 32, 52, 33, 53.

A sensor system is provided for determining at least one parameter of a fluid medium flowing through a channel structure, e.g., an air mass flow of an internal combustion engine. The sensor system has a sensor housing, e.g., a plug-in sensor that is introduced or can be introduced into a flow tube, in which the channel structure is formed, and at least one sensor chip, situated in the channel structure, for determining the parameter of the fluid medium. The sensor housing has an inlet into the channel structure, oriented opposite a main direction of flow of the fluid medium, and an outlet from the channel structure. The channel structure includes a main channel and a measurement channel. The measurement channel branches off from the main channel. The sensor chip is in the measurement channel. The main channel and the measurement channel discharge together into the outlet from the channel structure.

First circuit board 10 including first resin base material 12 which is softened by heating and has a fusing property, and a plurality of first conductor patterns 14 formed on a surface of first resin base material 12, and second circuit board 20 on which a plurality of second conductor patterns 24 are formed with the same pitch as that of first conductor patterns 14 are provided. In the configuration, first conductor patterns 14 and second conductor patterns 24 are brought into mechanical contact with each other to provide electrical conduction; first resin base material 12 covers first conductor patterns 14 and second conductor patterns 24 and is bonded to second resin base material 22 of second circuit board 20, thereby connecting first circuit board 10 and second circuit board 20 to each other.