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66results about How to "Reduce electrical connections" patented technology

Connecting structure of circuit board and method for manufacturing the same

First circuit board 10 including first resin base material 12 which is softened by heating and has a fusing property, and a plurality of first conductor patterns 14 formed on a surface of first resin base material 12, and second circuit board 20 on which a plurality of second conductor patterns 24 are formed with the same pitch as that of first conductor patterns 14 are provided. In the configuration, first conductor patterns 14 and second conductor patterns 24 are brought into mechanical contact with each other to provide electrical conduction; first resin base material 12 covers first conductor patterns 14 and second conductor patterns 24 and is bonded to second resin base material 22 of second circuit board 20, thereby connecting first circuit board 10 and second circuit board 20 to each other.
Owner:PANASONIC CORP

Light emitting diode (LED) assembled screen

The invention discloses a light emitting diode (LED) assembled screen. The LED assembled screen comprises a control box, a framework and at least two LED display modules, wherein the control box at least comprises two independent paths of output interfaces; each output interface is connected with one LED display module; the at least two LED display modules are assembled and fixed on the framework; each of the LED display modules comprises a box body, a circuit board, a pouring sealant, a driving chip, an input interface and a plurality of LED chips; the driving chip and the plurality of are arranged on the circuit board; the driving chip is connected with the LED chips and the input interface respectively; the input interface is formed on the box body and connected with the corresponding output interface of the control box; the box body has a flat structure, and one face of the box body is provided with an opening; the circuit board is arranged in the box body; the pouring sealant is covered on the circuit board so as to seal the opening face of the box body; and the LED chips are arranged on one side, corresponding to the opening face of the box body, of the circuit board. Due tothe LED assembled screen, the assembling flexibility of an LED display screen is improved, and the LED assembled screen is convenient to install and maintain.
Owner:LEDMAN OPTOELECTRONICS

MEMS (Micro-Electromechanical System) sensor encapsulation structure and encapsulation method thereof

The invention relates to an MEMS sensor encapsulation structure and an encapsulation method thereof, which are used for encapsulating an MEMS sensor. The MEMS sensor encapsulation structure is characterized by comprising a ceramic base, a side wall and a top cap, wherein a plurality of metal bonding pads are respectively arranged on a top layer and a bottom layer of the ceramic base; the metal bonding pads on the top layer of the ceramic base are connected with leads of the MEMS sensor; the MEMS sensor is arranged on the ceramic base; the metal bonding pads on the bottom layer of the ceramic base are connected with an external circuit; the ceramic base adopts one-layer or multi-layer perpendicularly interconnected structure; the side wall and the top cap are both made of kovar alloy. According to the invention, the ceramic base of which coefficient of thermal expansion is approximate to that of the MEMS sensor material is selected as the encapsulation material, in order to reduce influence of the base expansion stress to the MEMS sensor; meanwhile, the ceramic base can be utilized to realize one-layer perpendicular interconnection or multi-layer perpendicular interconnection; the system-level integration between the MEMS sensor and the peripheral circuit can be realized within a small area; high-density system-level encapsulation can be realized; the encapsulation flexibility and the expansibility of the MEMS sensor can be realized.
Owner:INST OF GEOLOGY & GEOPHYSICS CHINESE ACAD OF SCI

DMA data transmission system based on embedded motion control board card and transmission method thereof

The invention discloses a DMA data transmission system based on an embedded motion control board card and a transmission method of the DMA data transmission system, wherein a self-researched embedded motion controller is adopted. The DMA data transmission system comprises an FPGA logical processing module, a DSP module and a motor control module, wherein the DMA function is embedded into the DSP module. According to the DMA data transmission method, by means of cooperative work of an upper computer, an FPGA and a DSP and reasonable distribution of a time period and a program segment, batch data interaction between the upper computer and the motion control board card and batch data interaction between internal modules of the motion control board card are achieved, and therefore accurate control over a servo motor by the motion controller is achieved.
Owner:SHANGHAI JIAO TONG UNIV

Brake system with two pressure sources, and two methods for operating a brake system

A brake system, including four hydraulically actuatable wheel brakes. Each wheel brake is assigned in each case one outlet valve which is closed when electrically deenergized. Each wheel brake is assigned in each case one inlet valve which is open when electrically deenergized. The brake system furthermore includes a simulator which is actuatable by a brake pedal, wherein two pressure provision devices are provided for actively building up pressure in the wheel brakes, two brake circuits are hydraulically formed, wherein, in each brake circuit, in each case one pressure provision device is hydraulically connected to two wheel brakes, and wherein two separate on-board electrical systems are provided, and wherein each pressure provision device is fed in each case by one of the two on-board electrical systems.
Owner:CONTINENTAL TEVES AG & CO OHG

Array substrate, display device and driving method thereof

The embodiment of the invention provides an array substrate, a display device and a driving methodthereof. The array substrate comprises a substrate, a plurality of scanning lines and a plurality of data lines. The plurality of scanning lines and the plurality of data lines are arranged in a crossed manner to form a plurality of pixel units which are arranged in an array manner. At least one row of pixel units corresponds to two scanning lines, and the two scanning lines corresponding to the same row of pixel units synchronously receive scanning signals. According to the array substrate, the two scanning lines are arranged on the same row of pixel units, the number of the electrically connected pixel units on each scanning line is reduced, then the resistance and capacitance delay on the scanning lines is reduced, and the charging time of the grid electrode is guaranteed. Moreover, the two scanning lines corresponding to the pixel units in the same row synchronously receive scanning signals, so that the grid electrodes of the pixel units in the same row are enabled to be synchronously opened, and the normal display of images is realized.
Owner:BEIHAI HKC OPTOELECTRONICS TECH CO LTD +1

Chip package substrate having soft circuit board and method for fabricating the same

A chip package substrate having a soft circuit board jas a multi-layer soft and hard composite PCB, a plurality of conducting components and a plurality of conducting holes. The conducting holes are formed in the multi-layer soft and hard composite PCB. The conducting components are electroplated on the inner edges of the conducting holes on the multi-layer soft and hard composite PCB. An image-sensing chip can thus be packaged on the chip package substrate with the soft circuit board used as external signal connection lines, thereby saving the manufacturing cost and increasing the yield thereof.
Owner:DYNA IMAGE CORPORATION

Light-transmitting module capable of responding a high-frequency over 10GHz

The laser diode of the present invention is mounted on the heat sink made of insulating material such as aluminum nitride (AlN). On the heat sink, a metal film, evaporated gold film, is provided and the laser diode is mounted on the heat sink such that the anode electrode of the laser diode faces and is in contact with the metal film. The heat sink is mounted on the grounded metal member, thus the metal member, the heat sink and the metal film forms an capacitor. The bias for the laser diode is provided via the metal film, thereby stabilizing the bias supply even when the operational frequency for the laser diode is over 10 Gbps.
Owner:MOTO AKIHIRO

Electrochemical Treatment Of Substrates

A method of electrochemically treating a substrate is provided comprising the steps of: (a) providing an electrolyte in contact with the substrate; (b) providing a device which faces the substrate and is in contact with the electrolyte, the device having: (i) a common first electrode arranged to define cells therein; and (ii) a plurality of individually addressable second electrodes, wherein a plurality of the cells contain individually addressable second electrodes; and (c) altering the potential of at least one of the second electrodes relative to the common first electrode so that: (i) the common first electrode generates a first redox product; and (ii) the at least one of the second electrodes generate a second redox product which is able to modify a region of the substrate facing the at least one electrodes, wherein the electrolyte is such that the second redox product is quenchable by the first redox product.
Owner:EGELAND RYAN D

Water level control device of humidifier and humidifier applying same

The invention discloses a water level control device of a humidifier and the humidifier applying the same. The water level control device comprises a water tank and a base of the humidifier, wherein a steam generating chamber is arranged in the base; a drain hole is formed in the water tank, and a drain valve is arranged in the drain hole; the water level control device in sleeved connection with the drain valve is arranged in the steam generating chamber, the water level control device comprises a limiting hood opened in the peripheral wall, a water outlet is formed in the top of the limiting hood, and a floating block is arranged in the limiting hood; a leak hole plug is arranged at the water outlet, and the bottom of the leak hole plug is a part in contact with the floating block; the floating block shifts up and down in the limiting hood along with change of the water level; when the floating block is in contact with the drain hole plug, the water outlet is plugged to stop draining; otherwise, the floating block is separated from the leak hole plug, and the water outlet is opened to supplement water. The water control device disclosed by the invention is simple in structure and small in occupied space, is immediately triggered to control water supplementation for the steam generating chamber, and is electric energy-saving, and the condition that the humidifier is likely to overflow or dry out is effectively avoided, so that a user can use the humidifier safely.
Owner:FOSHAN SHUNDE DEERMA ELECTRIC APPLIANCES CO LTD

Electric contact and socket for electrical part

An electric contact of a socket for an electrical part is disposed between a first electrical part and a second electrical part so as to electrically connect the first and second electrical parts, and includes: a first electrical part side contact member contacting the first electrical part; a second electrical part side contact member contacting the second electrical part, the coil spring including a first spring portion abutting against the first electrical part side contact member and a second spring portion abutting against the second electrical part side contact member. When the first electrical part contacts the first electrical part side contact member, an axis of the first spring portion inclines with respect to an axis of the second spring portion, and then, a portion of the first electrical part side contact member on a side contacting the first electrical part is transversely moved.
Owner:ENPLAS CORP

Electric power distribution unit for electric connection box and electric connection box

Unit-forming bus bars including input terminal bus bars and output terminal bus bars are secured through an insulation layer to a rear surface of a heat radiation member that is exposed outside an electric connection box case, and switching devices are mounted on the bus bars. Relay switches that are different from the switching devices are mounted on a relay board. The relay board and a control circuit board for controlling driving of the switching devices are disposed on a surface facing away from the rear surface of the heat radiation member, and are parallel to each other.
Owner:AUTONETWORKS TECH LTD +2

Self-driven sensing system based on friction nanogenerator capacitive load matching effect

The invention provides a self-driven sensing system which comprises a friction nanogenerator and a capacitance-type sensor. The friction nanogenerator is used for converting external mechanical energyinto electric energy and outputting an electric signal to an external circuit; the capacitance-type sensor is connected with the friction nanogenerator so as to be powered by the friction nanogenerator and used for detecting a sensing signal. The self-driven sensing system provided by the invention can be applied to any occasion capable of producing the mechanical energy, and can supply power tothe sensor in real time. The self-driven sensing system is characterized in that no external power supply is needed, the power supply problem of the sensor is solved, the adaptability of an internet-of-things device is improved, and the size and the weight of the system are greatly reduced. According to the system provided by the invention, the stability and the controllability are greatly improved. The friction nanogenerator and the sensor are separated, so that a friction material and a sensing material do not influence each other, a material selecting range is enlarged without being influenced by a mechanical movement frequency, and the system has an actual application value.
Owner:SUZHOU UNIV

Connection element for electrically connecting a fluid-coolable individual line, fluid-coolable individual line unit, and charging cable

ActiveUS20220029329A1Robust compression jointReduces electrical connection resistanceCharging stationsContact member assembly/disassemblyElectrical conductorElectrical connection
The invention relates to a connection element for electrically connecting an individual line which has a concentric conductor arrangement (32) and a central passage (33) for a cooling fluid. The connection element comprises an electrically conductive housing (2) with a sleeve-shaped pressing portion which is suitable for producing a press connection to the concentric conductor arrangement (32). The electrically conductive housing (2) here has an internal cooling passage (10) with a connection opening (11) for an external cooling line, said cooling passage leading into a space surrounded by the sleeve-shaped pressing portion. In addition, the connection element comprises a counterpressure element (3) which can at least partially lie in the space surrounded by the sleeve-shaped pressing portion. The counterpressure element (3) is furthermore configured to support the concentric conductor arrangement (32) on the inner side thereof when the sleeve-shaped pressing portion is compressed during the production of a press connection. The invention furthermore relates to a fluid-coolable individual line unit and to a charging cable having a charging connector.
Owner:BRUGG ECONNECT AG

Prismatic sealed battery module

A prismatic sealed battery module includes: a prismatic battery case; an electrode plate group constituted by alternately layering positive and negative electrode plates with a separator arranged therebetween; and an electrolyte. The positive or negative electrode plates protruding from each end face of the electrode plate group are bonded to a collector member. A metal connector is fixed to the central part of the collector member facing the inner surface of the side end wall of the battery case. The collector member is connected, at the metal connector, to an external terminal using an externally connecting bolt.
Owner:PANASONIC CORP +1

Electrostatic discharge protection circuit

InactiveUS8194373B2Minimizes physical sizeReducing electrical connection complexitySemiconductor/solid-state device detailsSolid-state devicesEngineeringElectrostatic discharge protection
An integrated circuit having a plurality of circuit blocks, each block having one or more positive voltage supply pads, one or more negative voltage supply pads, and one or more signal pads. The integrated circuit further comprises an electrostatic protection circuit comprising a first electrostatic discharge protection rail for connection to a positive voltage supply point, a second electrostatic discharge protection rail for connection to a negative voltage supply point, and first protection circuitry coupling each said signal pad to both said first and second electrostatic discharge protection rails, the first protection circuitry being configured to provide a conduction path to one of the first and second rings in the event of an excessive voltage being present on one of said signal pads.
Owner:TOUMAZ TECH

Electrical connection box

There is provided a downsized electrical connection box in which the reliability of the mechanical connection between blocks provided in the electrical connection box is improved. The electrical connection box 1 includes a plurality of electric components, a first block 3 mounted with the electric components and a second block mounted with the electric components. The first block 3 includes a tubular-shaped first member32, 33 projecting towards the second block 5. The second block 5 includes a second member 52, 53 arranged to be slidably inserted into the first member. The first and the second blocks 3, 5 are coupled to each other by slidably inserting the second member 52, 53 into the first member 32, 33. At least one electric component 8 of the plurality of electric components is received inside the first and the second members 32, 52, 33, 53.
Owner:YAZAKI CORP

Method for fabricating semiconductor package having conductive bumps on chip

InactiveUS20060118944A1Easy positional recognitionImprove product yield and reliabilitySemiconductor/solid-state device detailsSolid-state devicesSolder maskSemiconductor package
A semiconductor package having conductive bumps on a chip and a fabrication method thereof are provided. A plurality of the conductive bumps are deposited respectively on bond pads of the chip. An encapsulation body encapsulates the chip and conductive bumps while exposing ends of the conductive bumps. A plurality of conductive traces are formed on the encapsulation body and electrically connected to the exposed ends of the conductive bumps. A solder mask layer is applied over the conductive traces and formed with openings for exposing predetermined portions of the conductive traces. The exposed portions of the conductive traces are connected to a plurality of solder balls respectively. The conductive bumps on the bond pads of the chip allow easy positional recognition of the bond pads, making the conductive traces well electrically connected to the bond pads through the conductive bumps and assuring the quality and reliability of the semiconductor package.
Owner:SILICONWARE PRECISION IND CO LTD

FCM packaging chip machine manufacturing method, packaging chip machine and camera module product

The invention provides an FCM packaging chip machine manufacturing method, a packaging chip machine and a camera. A small-sized camera which is provided with an FCM and does not need a circuit board comprises a lens, a base and the FCM, the FCM mainly utilizes a camera module packaging sheet (Flip Chip Module for short) which is manufactured by combining an FPC-free circuit board lead bracket and an advanced semiconductor packaging technology (Flip Chip), and the FCM is a packaging sheet module integrating an optical filter, an image chip, a driving / storage chip, an electronic component and a connector into a whole). According to the scheme, a circuit board is not needed to serve as a connection bridge any more, meanwhile, most precise assembly procedures are saved, and equipment and manpower cost investment is reduced. Moreover, the accumulated tolerance of the simplified assembly process is also reduced, the offset and inclination can be better controlled, and the product yield is improved.
Owner:SHENZHEN E WELLY ELECTRONICS

Semiconductor device

A semiconductor device according to the present disclosure includes an electrically conductive first electrode block, an electrically conductive submount, an insulating layer, a semiconductor element, an electrically conductive bump, and an electrically conductive second electrode block. The submount is provided in a first region of the upper surface of the first electrode block, and electrically connected to the first electrode block. The semiconductor element is provided on the submount, and has a first electrode electrically connected to the submount. The bump is provided on the upper surface of a second electrode, opposite the first electrode, of the semiconductor element, and electrically connected to the second electrode. A third region of the lower surface of the second electrode block is electrically connected to the bump via an electrically conductive metal layer. An electrically conductive metal sheet is provided between the metal layer and the bump.
Owner:PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

Highly-integrated electrical control board and electrical appliance

The invention discloses a highly-integrated electrical control board and an electrical appliance. The control board includes a first substrate and a second substrate, wherein the first substrate and the second substrate are disposed opposite to each other; a strong current element which is disposed on a side surface, close to the second substrate, of the first substrate and comprises a highly-integrated intelligent power module which integrates a compressor intelligent power module and a fan intelligent power module; a weak current element which is disposed one a side surface, closes to the first substrate, of the second substrate and includes a micro-control unit. The strong current element is electrically connected with the weak current element, and a packaging material is disposed between the first substrate and the second substrate. The electrical control board has higher long-term use reliability, longer service life, and lower manufacturing cost.
Owner:GD MIDEA AIR-CONDITIONING EQUIP CO LTD +1

Power module and electric transportation apparatus incorporating the same

A power module includes a plurality of first semiconductor devices disposed so as to define a first layer in a substantially common plane, a plurality of second semiconductor devices disposed so as to define a second layer in a substantially same plane, and at least one metal plate electrically connected to at least two semiconductor devices selected from among the plurality of first and second semiconductor devices. The first layer and second layer are stacked such that the plurality of second semiconductor devices do not overlap the plurality of first semiconductor devices.
Owner:YAMAHA MOTOR CO LTD

Bridge connection type of chip package and fabricating method thereof

A chip package having at least a substrate, a chip and a conductive trace is provided. The substrate has a first surface, a second surface, a cavity and at least one substrate contact all positioned on the first surface of the substrate. The chip has an active surface with at least one chip contact thereon. The chip is accommodated inside the cavity with at least one sidewall having contact with one of the sidewalls of the cavity. The active surface of the chip and the first surface of the substrate are coplanar. The conductive trace runs from the active surface of the chip to the first surface of the substrate so that the chip contact and the substrate contact are electrically connected.
Owner:ADVANCED SEMICON ENG INC

Electrical connection box

There is provided a downsized electrical connection box in which the reliability of the mechanical connection between blocks provided in the electrical connection box is improved. The electrical connection box 1 includes a plurality of electric components, a first block 3 mounted with the electric components and a second block mounted with the electric components. The first block 3 includes a tubular-shaped first member 32, 33 projecting towards the second block 5. The second block 5 includes a second member 52, 53 arranged to be slidably inserted into the first member. The first and the second blocks 3, 5 are coupled to each other by slidably inserting the second member 52, 53 into the first member 32, 33. At least one electric component 8 of the plurality of electric components is received inside the first and the second members 32, 52, 33, 53.
Owner:YAZAKI CORP

Sensor arrangement for determining at least one parameter of a fluid medium flowing through a channel structure

A sensor system is provided for determining at least one parameter of a fluid medium flowing through a channel structure, e.g., an air mass flow of an internal combustion engine. The sensor system has a sensor housing, e.g., a plug-in sensor that is introduced or can be introduced into a flow tube, in which the channel structure is formed, and at least one sensor chip, situated in the channel structure, for determining the parameter of the fluid medium. The sensor housing has an inlet into the channel structure, oriented opposite a main direction of flow of the fluid medium, and an outlet from the channel structure. The channel structure includes a main channel and a measurement channel. The measurement channel branches off from the main channel. The sensor chip is in the measurement channel. The main channel and the measurement channel discharge together into the outlet from the channel structure.
Owner:ROBERT BOSCH GMBH

Connecting structure of circuit board and method for manufacturing the same

First circuit board 10 including first resin base material 12 which is softened by heating and has a fusing property, and a plurality of first conductor patterns 14 formed on a surface of first resin base material 12, and second circuit board 20 on which a plurality of second conductor patterns 24 are formed with the same pitch as that of first conductor patterns 14 are provided. In the configuration, first conductor patterns 14 and second conductor patterns 24 are brought into mechanical contact with each other to provide electrical conduction; first resin base material 12 covers first conductor patterns 14 and second conductor patterns 24 and is bonded to second resin base material 22 of second circuit board 20, thereby connecting first circuit board 10 and second circuit board 20 to each other.
Owner:PANASONIC CORP
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