21results about How to "Improve high frequency performance" patented technology

An electrical connector includes a body having a plurality of terminal holes and a plurality of terminals housed within corresponding terminal holes. The body has an upper surface and a lower surface, with the terminal holes penetrating both surfaces. Each terminal includes a first terminal piece and a second terminal piece, independent of each other. The first terminal piece includes a first fixing portion fixed to the body and a first elastic arm extending upward from the upper surface of the body. The first elastic arm has a chip contact portion and a first overlapping portion extending downward. The second terminal piece includes a second fixing portion fixed to the body and a second overlapping portion extending upward. When the first elastic arm is forced to move downward, it causes the first overlapping portion to move until the first overlapping portion contacts the second overlapping portion, forming a conductive path. The terminal of the present invention is composed of two independent terminal pieces and can form two conductive paths, improving high-frequency performance while ensuring mechanical performance.

The invention discloses a novel high-speed coaxial connector. The connector comprises an outer conductor; an insulator having a mounting hole penetrating the front and rear ends; the central terminal is fixed in the mounting hole in a penetrating manner; the central terminal comprises a contact area located at the head and a riveting line area located at the tail, and the riveting line area is used for being riveted and fixed with a metal wire core of a coaxial line and forming electrical conduction; on the premise that the size of a matching interface is kept unchanged, the material thickness of the wire riveting area is larger than that of the contact area, so that after the wire riveting area and a small-size metal wire core are riveted and fixed, the riveting cross section area is large, and a cross section cavity is reduced to compensate impedance mutation of other areas, so that the impedance matching of the whole product is balanced, and the purpose of improving the high-frequency performance is achieved; under the condition that the inner diameter of the outer conductor in the high-speed coaxial connector is kept unchanged, the high-speed coaxial connector is suitable for wires with smaller wire diameters, required high-frequency performance is achieved, signal data can be transmitted at a high speed, and the problem of insufficient high-frequency performance caused by the wires is solved.

A semiconductor device (100) for controlling an electric current flowing between a source terminal (102) and a drain terminal (104) and a method for forming such a device are disclosed. The semiconductor device is formed from a layer stack of GaN layers, wherein a vertical junction field effect transistor JFET structure (120) and a lateral high electron mobility transistor HEMT structure (130) are provided to control the electric current.

An electric connector comprises an insulator and a plurality of terminals, the insulator comprises an upper surface, a lower surface and terminal grooves penetrating through the upper surface and the lower surface, and the terminals are arranged in the corresponding terminal grooves one by one; the plurality of terminals comprise a row of grounding terminals arranged along a first direction and a plurality of functional terminals, each functional terminal comprises a holding part and an elastic arm extending from the holding part, and the plurality of functional terminals positioned on one side of the row of grounding terminals form a first functional area; the plurality of functional terminals located on the other side of the row of grounding terminals form a second functional area, and the elastic arms of the functional terminals of the first functional area and the second functional area extend from the corresponding holding parts in the direction close to or away from the grounding terminals. According to the utility model, the functional terminals located in the first and second functional areas can perform good signal shielding through the grounding terminals, and the electric connector has good high-frequency performance.

The application relates to a source adjustable resistance circuit for a high-speed differential amplifier, belonging to the technical field of high-speed analog and radio frequency integrated circuits, comprising a high-speed differential amplifier, a degeneration resistance unit and a control unit; the degeneration resistance unit is composed of a first MOS transistor; the source and the drain of the first MOS transistor are respectively connected to two source nodes of a differential pair transistor of the high-speed differential amplifier, serving as source degeneration resistance thereof, and the gate voltage of the first MOS transistor is generated by the control unit; the control unit is used for generating the gate control voltage of the first MOS transistor. The application replaces a large resistance array with a single MOS transistor, greatly reduces the area, greatly reduces the chip cost, significantly reduces the parasitic capacitance of the degeneration node to the ground, and improves the amplifier bandwidth.

The utility model relates to flexible circuit technical field, concretely for a kind of flexible circuit substrate, comprising: PI base material, PI base material is provided with functional layer, functional layer includes the buffer layer of TiO2 or SiO2, CrxOy material setting on PI base material, sputter Cu layer setting on buffer layer and electroplated copper layer setting on sputter Cu layer, through the setting of the buffer layer of TiO2 or SiO2, CrxOy material, compared with the nickel-chromium alloy layer set in traditional technology, need not secondary etching, reduce production procedure, can reduce material impedance, improve material performance, reduce production cost, reduce the generation of etching waste liquid, more environmental protection.

The utility model relates to a cable, in particular to a high-power low-loss radio frequency cable for a chariot radar. The utility model aims to provide the high-power low-loss radio frequency cable for the chariot radar, and the cable has the functions of low attenuation, high power and external electromagnetic interference resistance, and has the characteristics of light weight and high flexibility. According to the technical scheme, the high-power low-loss radio frequency cable for the chariot radar is characterized by comprising a cable core, an inner shielding layer, a middle layer, an outer shielding layer and an outer protection layer, the cable core comprises a conductor, and a first insulating layer, a second insulating layer and a third insulating layer which sequentially wrap the conductor from inside to outside.

This application provides an LCP thin film assembly, its preparation method, and its application. The preparation method includes: surface modification of the LCP thin film to obtain an activated surface rich in carboxyl and hydroxyl groups, followed by hot pressing of the LCP thin film with the activated surface; the LCP thin film assembly includes a multilayer LCP thin film bonded by hot pressing, wherein no adhesive is contained between any two adjacent LCP thin films, and the interface region between any two adjacent LCP thin films forms a homogenized molecular-level bonding layer through melt recrystallization; the preparation method of this application introduces active functional groups through surface modification methods such as alkaline hydrolysis and acid activation, achieving interlayer chemical bonding during hot pressing, significantly improving interlayer bonding strength, avoiding the risks of bubbling and delamination, and retaining the inherent excellent high-frequency performance and dielectric properties of the LCP thin film; this preparation method, when applied to the preparation of LCP thin film probe cards, can produce thin film probe cards with excellent interlayer bonding strength and high-frequency performance.

The utility model discloses a sinking plate type FAKRA connector, and relates to the field of connectors, the sinking plate type FAKRA connector comprises a center pin, a medium body installed on the center pin, an outer conductor installed on the medium body and a plastic shell installed on the outer conductor, the inner wall of the outer conductor and the outer wall of the medium body form a first clamping position, and the inner wall of the outer conductor and the outer wall of the medium body form a second clamping position. The inner wall of the medium body and the center pin form a second clamping position, and the outer wall of the medium body and the inner wall of the outer conductor form a third clamping position. The connecting structure has the effects of enhancing the connecting stability and reliability and improving the convenience and rapidness of overall assembly.

This invention provides a packaging structure. In the packaging structure, the lead frame includes at least two solder pads; the back of the chip is mounted on the lead frame, and the front of the chip has multiple solder pads. At least a portion of the solder pads of the lead frame are electrically connected to the solder pads of the chip via bonding wires; a passive device is disposed between and electrically connected to the two solder pads of the lead frame; a molding compound encapsulates the chip and bonding wires, and covers at least a portion of the surface of the solder pads and at least a portion of the surface of the passive device. This avoids mounting the passive device on the PCB outside the packaging structure, significantly reducing PCB layout space, greatly shortening the interconnection distance between the passive device and the chip, reducing the current loop area, reducing parasitic inductance of high-frequency signal paths, reducing magnetic field radiation (i.e., reducing electromagnetic interference), improving high-frequency performance, and reducing coupling with external interference, thus improving electromagnetic compatibility.

The utility model discloses an electric connector, which comprises an insulating seat body, a first row of terminals and a second row of terminals are arranged on the insulating seat body and are positioned on the same side of a slot along the left-right direction; the first row of terminals comprises first grounding terminals and first signal terminals which are alternately arranged in the front-back direction, and the second row of terminals comprises second signal terminals which are arranged corresponding to the first grounding terminals in the up-down direction and second grounding terminals which are arranged corresponding to the first signal terminals in the up-down direction. The first grounding shielding part of the first grounding terminal abuts against the first grounding arm so as to form a closed ring together with the first grounding bending part and the first grounding contact part to shield the second signal terminal in the vertical direction. The second grounding shielding part of the second grounding terminal abuts against the second grounding arm to form a closed ring together with the second grounding bending part and the second grounding contact part so as to shield the first signal terminal in the vertical direction, and the high-frequency performance of the electric connector is improved.

The utility model relates to earphone technical field, especially wireless earphone, include: casing, inside formation has accommodation space and with the acoustic cavity that communicates with accommodation space, the casing is opened with the acoustic cavity communicates with the sound hole of acoustic cavity, be equipped with in the casing's accommodation space and with the fixed connection of casing moving coil, be equipped with in the high frequency sound unit of acoustic cavity, the setting direction of high frequency sound unit with the setting direction of moving coil intersects and presents the setting angle. The utility model discloses moving coil and high frequency sound unit are combined, improve the high frequency performance of wireless earphone, further let high frequency sound unit and moving coil's setting direction intersect and present the setting angle, to this reaches the better resonance relation between high frequency sound unit and moving coil, and then obtains better high frequency tone quality and better overall performance.

This application provides a common-mode inductor, a switching power supply, an inverter, and communication equipment. The common-mode inductor includes a U-shaped magnetic core, an enameled flat copper wire winding, and a fixing structure. The enameled flat copper wire winding is wound vertically on the U-shaped magnetic core. This vertical winding method allows the enameled flat copper wire to be wound perpendicular to the plane of the U-shaped magnetic core. This winding method can improve the filling rate of the winding, reduce the space occupied by the winding, and also help reduce eddy current losses and proximity effects at high frequencies, thus improving the high-frequency performance of the inductor. The enameled flat copper wire has good conductivity and insulation properties, which can meet the operating requirements of the inductor under high current and high voltage environments. The fixing structure is used to fix the U-shaped magnetic core and the enameled flat copper wire winding, ensuring the stability of the winding's position on the U-shaped magnetic core and preventing loosening or displacement of the winding during inductor operation, thereby ensuring the electrical performance and mechanical stability of the inductor.

The utility model provides a high-speed connector, which comprises an insulating main body and a conductive terminal assembly, the insulating main body extends along a first direction, a plurality of mounting grooves are arranged at intervals along the first direction, the mounting grooves are arranged along a second direction, the insulating main body is provided with plugging grooves extending along the first direction, the plugging grooves are communicated with the mounting grooves, and the conductive terminal assembly is arranged on the insulating main body. The plug-in groove is used for plugging external expansion equipment, the conductive terminal assembly comprises a plurality of signal terminals and ground terminals, the signal terminals and the ground terminals enter the plug-in groove through the mounting groove to contact the external expansion equipment, the signal terminals transmit differential signals, and the ground terminals are located on the two sides of the signal terminals to reduce interference. The middle part of the ground terminal is widened along the second direction and covers the signal terminal along the first direction, so that the anti-interference effect is enhanced. By widening the ground terminal and covering the adjacent signal terminals, the effective sectional area of the ground terminal is enlarged, shielding is enhanced, signal interference is suppressed, and the crosstalk problem is solved.

A bridgeless Cuk power factor correction topology circuit and its control strategy are disclosed. The circuit includes an AC voltage source, a filter energy storage module, a bridgeless rectifier module, a power frequency ripple coupling module, a buck filter module, and an equivalent load RL. This circuit uses transistors instead of traditional rectifier bridge diodes, reducing the number of components and solving the problem of high conduction losses in traditional diodes. It also offers advantages such as reduced power consumption and high reliability, improving the efficiency of the Cuk PFC converter. Furthermore, based on the bridgeless Cuk power factor correction topology circuit, this invention proposes a simple and easy-to-implement dead-time control strategy and a zero-crossing control strategy, ensuring the integrity of the inductor freewheeling path. Compared to traditional totem-pole bridgeless PFC converters, it has lower requirements for controller performance and better robustness.

This invention discloses a material structure and epitaxial method for a gallium nitride Schottky diode, comprising, in the epitaxial order: a substrate; an aluminum nitride (AlN) nucleation layer; a lower aluminum gallium nitride (AlGaN) stress modulation layer; an unintentionally doped (Uid) GaN buffer layer; and an upper AlGaN stress modulation layer; n + -Heavy GaN layer; n ++ -GaN ohmic highly doped layer; n-GaN transition layer; n ‑ -GaN lightly doped layer. Based on the metal-organic chemical vapor deposition (MOCVD) method, a stress modulation layer of AlGaN underlayer is introduced at the interface between the AlN nucleation layer and the UidGaN buffer layer to reduce thermal mismatch stress; and a stress modulation layer of AlGaN underlayer is introduced at the interface between the UidGaN buffer layer and the n + - The GaN heavily doped layer interface introduces a stress modulation layer on top of AlGaN to reduce lattice mismatch stress; in n ++ -GaN ohmic highly doped layer and n ‑ An n-GaN transition layer is introduced between the lightly doped GaN layers, and n ‑ - The GaN lightly doped layer is produced using a high-temperature, low-growth-rate process to improve n ‑ - Quality and electronic transport properties of lightly doped GaN layers. The GaN SBD epitaxial material achieved by this method has high quality, low stress, and low sheet resistance, which is beneficial to improving the performance of GaN SBD devices.

The invention discloses a conductive terminal and an electric connector, the conductive terminal comprises a first terminal, a second terminal and a third terminal, the second terminal and the first terminal are oppositely arranged in a first direction, the third terminal is located between the first terminal and the second terminal, and an elastic part of the third terminal has elasticity of stretching in a second direction. The elastic part comprises a first bending section, a second bending section and a connecting section, the first bending section is connected with any adjacent second bending section through the connecting section, the connecting section is provided with a first abutting part to abut against the second terminal, and in the third direction, the second bending section is provided with a second abutting part to abut against the second terminal. The third terminal forms a second abutting part and a third abutting part on the two sides of the first abutting part to abut against the first terminal, the connecting section, the first bending section correspondingly connected with the connecting section and the second bending section correspondingly connected with the connecting section are provided with the first abutting part, the second abutting part and the third abutting part, and the capacitance coupling length of the third terminal and the first terminal and the capacitance coupling length of the third terminal and the second terminal are shortened; and the high-frequency performance of the electric connector is improved.

The invention discloses a high-frequency low-loss transformer based on amorphous alloy magnetic cores and staggered windings in the technical field of planar transformers, which comprises a magnetic core assembly, a winding mechanism and a liquid cooling assembly, the winding mechanism and the liquid cooling assembly are arranged in the magnetic core assembly, and the winding mechanism comprises an annular primary winding unit and an annular secondary winding unit which are stacked in a staggered manner. According to the invention, the primary winding units and the secondary winding units are distributed in a staggered manner on the hierarchy, and the diameters are also distinguished by adopting large diameters and small diameters, so that flow channels are formed between the upward adjacent winding units, and the flow channels are connected in series end to end to form a spiral heat dissipation channel by arranging the spirally distributed blocking parts and the overflowing holes, so that the heat dissipation efficiency is improved. Self-circulation is formed based on the principle of thermal expansion and cold contraction, the temperature of the winding is effectively controlled, the problem that the saturation value of the magnetic core is reduced due to the influence of the temperature is effectively solved, and the high-frequency performance under the staggered winding is greatly improved.

The application discloses a metal pipe water pressure vibration testing machine and relates to the technical field of pipe performance testing. The machine comprises a rack, a water receiving tray, a control box, a vibration device, a clamping device and a folding splash-proof cover. The water receiving tray is fixedly arranged on the rack and is used for collecting leaked water during the test. The control box is fixedly arranged on one side of the rack and is internally provided with a PLC controller. The vibration device is arranged in the control box and is fixedly connected with the rack through a mounting bracket. The clamping device is arranged on the water receiving tray and is used for fixing two ends of a metal pipe to be tested. The folding splash-proof cover is arranged on the top of the rack, can be opened and closed and covers above the clamping device, and is used for preventing water splashing during the test. The metal pipe water pressure vibration testing machine adopts the above structure, a stepping motor drives a zero-adjusting screw to rotate, 1:2 proportional opposite or reverse movements are generated between an adjusting flange nut and an adjusting nut, the eccentricity of a cross slide and a driven wheel is accurately changed, and automatic adjustment of the amplitude is realized.

This invention discloses a novel inductor coil and circuit. The novel inductor coil includes at least one pair of inductor units. Each pair of inductor units consists of a first inductor and a second inductor with identical structures. The first inductor is connected in series at one end of the load, and the second inductor is connected in series at the other end of the load. The center-to-center distance between the first and second inductors is D, where D ≥ 0. The first and second inductors are symmetrically distributed along the centerline of D / 2. Both the first and second inductors are frameless arc-shaped hollow coils with an arc θ satisfying 0 < θ ≤ π and curvature k2 ≥ 0; when θ = π, D > 0. The inductor provided by this invention does not form a common-mode inductor, which can effectively reduce electromagnetic interference and external electromagnetic radiation. It can also be used on the main power path, and its heat dissipation performance is improved, with flexible adjustment of inductor parameters.

The utility model provides an ultrathin storage communication connector, comprising a lengthwise insulation body provided with a lengthwise slot, and lengthwise side walls on the upper and lower sides of the slot are respectively provided with a plurality of terminal grooves; the plurality of terminals comprise an upper-layer terminal and a lower-layer terminal, the lower-layer terminal and the upper-layer terminal are inserted into the insulating body from the front side and the rear side of the insulating body respectively, each terminal comprises a holding part, a welding part and an elastic arm, the welding part and the elastic arm extend from the two ends of the holding part respectively, and the elastic arm of the lower-layer terminal is formed by obliquely extending upwards from the holding part of the lower-layer terminal; the inclined high end of the elastic arm of the lower-layer terminal is a contact part, the top surface of the contact part is a contact surface, the top surface of the contact part is located in the inclined upward extending direction of the top surface of the elastic arm of the lower-layer terminal, and the contact part and the elastic arm of the lower-layer terminal share the same top surface; the ultrathin storage communication connector can be made thinner and can improve high-frequency performance.