552results about How to "Lower breakdown voltage" patented technology

A band gap engineered, charge trapping memory cell includes a charge trapping element that is separated from a metal or metal compound gate, such as a platinum gate, by a blocking layer of material having a high dielectric constant, such as aluminum oxide, and separated from the semiconductor body including the channel by an engineered tunneling dielectric. Fast program and erase speeds with memory window as great as 7 V are achieved.

A technique for forming a gettering layer in a wafer made using a controlled cleaving process. The gettering layer can be made by implanting using beam line or plasma immersion ion implantaion, or made by forming a film of material such as polysilicon by way of chemical vapor deposition. A controlled cleaving process is used to form the wafer, which is a multilayered silicon on insulator substrate. The gettering layer removes and/or attracts impurities in the wafer, which can be detrimental to the functionality and reliability of an integrated circuit device made on the wafer.

The invention concerns novel varistors based on zinc oxide and a method for making same, which consists in using as base products nanocrystalline powders obtained by high-intensity mechanical grinding and in subjecting the mixture resulting from said nanocrystalline powders a consolidating treatment such as sintering, in suitably selected temperature and time conditions so as to retain the smallest possible grain size of ZnO. The resulting varistors have a very fine homogeneous microstructure and an average grain size characteristically not more than 3pm, i.e. five times smaller than standard materials. Said novel varistors have a larger number of grain boundaries per unit length unit and therefore a much higher breakdown voltage. Said voltage is characteristically higher than 10 kV/cm and can reach 17 kV/cm which is almost one order of magnitude above the breakdown voltage of standard varistors. The non-linearity coefficient of the current-voltage curve is also improved, and is greater than 20 and can reach values as high as 60. Moreover, the leakage currents below the breakdown voltage of said varistors, are much lower.

In a battery system, battery modules (3a, 3b) connected to each other in series respectively include: one or more single cells (3a1 to 3an, 3b1 to 3b-n) connected to one another in any one of series, parallel, and series-parallel; cell voltage switches (7a, 7b) for detecting voltages respectively of the one or more single cells; module monitoring control units (9a, 9b) each for monitoring the detected voltages respectively of the one or more signal cells; and communications level converter circuits (14a, 14b). The battery system includes a master unit (8a) for receiving information on the voltages respectively of the one or more single cells from the module monitoring control units via the communications level converter circuits. One of the communications level converter circuits includes a switch element (Q32) for transmitting a signal of a low-potential battery module to a high-potential battery module. A series circuit includes resistors R1′, R2′ and R⁵ as well as the switch element is connected between a positive electrode of the highest-potential single cell in the high potential battery module and a negative electrode of the lowest-potential single cell in the low-potential battery cell.

In a semiconductor device including a gate electrode buried in a trench of the device, the trench is constructed by a first opening with a uniform width the same as that of an upper portion of the first opening and a second opening beneath the first opening with a width larger than the uniform width. A bottom of a base region adjacent to the trench is adjacent to the second opening.

A MOSFET device that includes a first Zener diode connected between a gate metal and a drain metal of said semiconductor power device for functioning as a gate-drain (GD) clamp diode. The GD clamp diode includes multiple back-to-back doped regions in a polysilicon layer doped with dopant ions of a first conductivity type next to a second conductivity type disposed on an insulation layer above the MOSFET device, having an avalanche voltage lower than a source/drain avalanche voltage of the MOSFET device wherein the Zener diode is insulated from a doped region of the MOSFET device for preventing a channeling effect. The MOSFET device further includes a second Zener diode connected between a gate metal and a source metal of the MOSFET device for functioning as a gate-source (GS) clamp diode, wherein the GD clamp diode includes multiple back-to-back doped regions in the polysilicon layer doped with dopant ions of a first conductivity type next to a second conductivity type disposed on the insulation layer above the MOSFET device having a lower breakdown voltage than a gate oxide rupture voltage of the MOSFET device.

A problem in the conventional technique is that metal contamination on a silicon carbide surface is not sufficiently removed in a manufacturing method of a semiconductor device using a monocrystalline silicon carbide substrate. Accordingly, there is a high possibility that the initial characteristics of a manufactured silicon carbide semiconductor device are deteriorated and the yield rate is decreased. Further, it is conceivable that the metal contamination has an adverse affect even on the long-term reliability of a semiconductor device. In a manufacturing method of a semiconductor device using a monocrystalline silicon carbide substrate, there is applied a metal contamination removal process, on a silicon carbide surface, including a step of oxidizing the silicon carbide surface and a step of removing a film primarily including silicon dioxide formed on the silicon carbide surface by the step.

The present invention relates to surveillance and/or identification devices having capacitors connected in parallel or in series, and methods of making and using such devices. Devices with capacitors connected in parallel, where one capacitor is fabricated with a relatively thick capacitor dielectric and another is fabricated with a relatively thin capacitor dielectric achieve both a high-precision capacitance and a low breakdown voltage for relatively easy surveillance tag deactivation. Devices with capacitors connected in series result in increased lateral dimensions of a small capacitor. This makes the capacitor easier to fabricate using techniques that may have relatively limited resolution capabilities.

A SPDT or SPMT switch may include a transformer having a primary winding and a secondary winding, where a first end of the secondary winding is connected to a single pole port, where a first end of the primary winding is connected to a first throw port; a first switch having a first end and a second end, where the first end is connected to ground; and a second switch, where a second end of the secondary winding is connected to both a second end of the first switch and a first end of the second switch, where a second end of the second switch is connected to a second throw port, where the first switch controls a first communication path between the single pole port and the first throw port, and where the second switch controls a second communication path between the second throw port and the single pole port.

In a step-up apparatus, a first level shift circuit receives a first clock signal to generate two phase-opposite second clock signals, and a second level shift circuit receives the first clock signal to generate two phase-opposite third clock signals. A charge pump circuit steps up a power supply voltage at a power supply voltage terminal using the second clock signals to generate a positive voltage, and a polarity inverting circuit inverts the positive voltage using the third clock signals to generate a negative voltage whose absolute value is the same as the positive voltage. A high level of the second clock signals is not higher than the positive voltage, and a low level of the second clock signals is not lower than a voltage at a ground terminal. A high level of the third clock signals is not higher than the power supply voltage, and a low level of the third clock signals is not lower than the negative voltage.

A nonvolatile memory element including: a first electrode; a second electrode; a variable resistance layer that is between the first electrode and the second electrode and includes, as stacked layers, a first variable resistance layer connected to the first electrode and a second variable resistance layer connected to the second electrode; and a side wall protecting layer that has oxygen barrier properties and covers a side surface of the variable resistance layer. The first variable resistance layer includes a first metal oxide and a third metal oxide formed around the first metal oxide and having an oxygen deficiency lower than that of the first metal oxide, and the second variable resistance layer includes a second metal oxide having an oxygen deficiency lower than that of the first metal oxide.

A method is provided for fabricating a semiconductor structure. The method includes providing a semiconductor substrate, forming an epitaxial layer on a top surface of the semiconductor substrate and having a predetermined thickness, and forming a plurality of trenches in the epitaxial layer. The trenches are formed in the epitaxial layer and have a predetermined depth, top width, and bottom width. Further, the method includes performing a first trench filling process to form a semiconductor layer inside of the trenches using a mixture gas containing at least silicon source gas and halogenoid gas, stopping the first trench filling process when at least one trench is not completely filled, and performing a second trench filling process, different from the first trench filling process, to fill the plurality of trenches completely.

A device having a radio front end is provided. The radio front end includes an inductor having a first end and a second end. A capacitor having a first end and a second end is connected to the second end of the inductor. An antenna is connected to the second end of the inductor and the second end of the capacitor. A first switch is connected to the first end of the inductor and the first end of the capacitor, wherein the inductor and capacitor form a resonant circuit when the first switch is closed. A second switch is connected to the resonant circuit, the second switch connecting the resonant circuit to ground through a low impedance when the first switch is closed. A third switch is connected to a transmit power amplifier connecting the transmit power amplifier to ground through a low impedance when the first switch is closed.

Trenches and n⁺ high impurity concentration regions are formed in a first principal surface side of a silicon carbide semiconductor substrate. In the n⁺ high impurity concentration regions, third n-type regions that respectively surround first p⁺ base regions contacting a p-type base layer and have a higher impurity concentration than the n⁺ high impurity concentration regions, as well as fourth n-type regions that respectively surround second p⁺ base regions formed at the bottoms of the trenches and also have a higher impurity concentration than the n⁺ high impurity concentration regions, are formed.

A semiconductor device includes field effect transistors, each having a semiconductor layer formed on a major surface of a semiconductor substrate, a base region formed in a surface layer portion of a semiconductor layer, a source region formed in a surface layer portion of the base region, a source electrode formed on the base region and the source region, a gate electrode formed on the semiconductor layer and the base region via a gate insulating film interposed therebetween, and a drain electrode formed on a back surface of the semiconductor substrate, and which are placed side by side. A columnar intermediate region is formed in its corresponding predetermined region of the surface layer portion of the semiconductor layer placed below each gate electrode. Connection regions are formed in the surface layer portion of the semiconductor layer to contact the intermediate region and the base regions.

A low capacitance transient voltage suppressor with reduced clamping voltage includes an n+ type substrate, a first epitaxial layer on the substrate, a buried layer formed within the first epitaxial layer, a second epitaxial layer on the first epitaxial layer, and an implant layer formed within the first epitaxial layer below the buried layer. The implant layer extends beyond the buried layer. A first trench is at an edge of the buried layer and an edge of the implant layer. A second trench is at another edge of the buried layer and extends into the implant layer. A third trench is at another edge of the implant layer. Each trench is lined with a dielectric layer. A set of source regions is formed within a top surface of the second epitaxial layer. The trenches and source regions alternate. A pair of implant regions is formed in the second epitaxial layer.

A capacitance dielectric layer is provided. The capacitance dielectric layer includes a first dielectric layer, a second dielectric layer and a silicon nitride stacked layer. The silicon nitride stacked layer is disposed between the first dielectric layer and the second dielectric layer. The structure of the capacitance dielectric layer permits an increase in the capacitance per unit area by decreasing the thickness of the capacitance dielectric layer and eliminates the problems of having a raised leakage current and a diminished breakdown voltage.