557results about How to "Lower breakdown voltage" patented technology

The present application is generally directed to ultrapure synthetic carbon materials having both high surface area and high porosity, ultrapure polymer gels and devices containing the same. The disclosed ultrapure synthetic carbon materials find utility in any number of devices, for example, in electric double layer capacitance devices and batteries. Methods for making ultrapure synthetic carbon materials and ultrapure polymer gels are also disclosed.

A semiconductor device including a drain layer having a first conductivity type, a drift layer having the first conductivity type, which is formed on the drain layer and has an impurity concentration lower than that in the drain layer, and a RESURF layer having a second conductivity type and formed to extend from a surface of the drift layer into the drain layer, the RESURF layer forming a superjunction structure together with the drift layer and forming a depletion layer in the drift layer.

An MRAM device, and a process for manufacturing the device, provides improved breakdown distributions, a reduced number of bits with a low breakdown voltage, and an increased MR, thereby improving reliability, manufacturability, and error-free operation. A tunnel barrier is formed between a free layer and a fixed layer in three repeating steps of forming a metal material, interceded by oxidizing each of the metal materials. The oxidization of the third metal material is greater than the dose of the first metal, but less than the dose of the second metal. The fixed layer may include a discontinuous layer of a metal, for example, Ta, in the fixed layer between two layers of a ferromagnetic material.

An MOS device comprises a semiconductor layer of a first conductivity type and source and drain regions of a second conductivity type formed in the semiconductor layer, the source and drain regions being spaced apart from one another. A drift region is formed in the semiconductor layer proximate an upper surface of the semiconductor layer and between the source and drain regions, and a insulating layer is formed on the semiconductor layer above at least a portion of the drift region. A gate is formed on the insulating layer and at least partially between the source and drift regions. The MOS device further includes a conductive structure comprising a first end formed on the insulating layer and spaced apart from the gate, and a second end formed on the insulating layer and extending laterally toward the drain region above at least a portion of the drift region. The conductive structure is configured such that a thickness of the insulating layer under the second end of the conductive structure increases as the second end extends toward the drain region.

A fine semiconductor device having a short channel length while suppressing a short channel effect. Linearly patterned or dot-patterned impurity regions 104 are formed in a channel forming region 103 so as to be generally parallel with the channel direction. The impurity regions 104 are effective in suppressing the short channel effects. More specifically, the impurity regions 104 suppress expansion of a drain-side depletion layer, so that the punch-through phenomenon can be prevented. Further, the impurity regions cause a narrow channel effect, so that reduction in threshold voltage can be lessened.

An MOS device is formed including a semiconductor layer of a first conductivity type, and source and drain regions of a second conductivity type formed in the semiconductor layer proximate an upper surface of the semiconductor layer. The source and drain regions are spaced apart relative to one another. A drift region of the second conductivity type is formed in the semiconductor layer proximate the upper surface of the semiconductor layer and at least partially between the source and drain regions, the drift region having an impurity doping concentration greater than about 2.0e12 atoms / cm2. An insulating layer is formed on at least a portion of the upper surface of the semiconductor layer. The device further includes a gate formed on the insulating layer at least partially between the source and drain regions, and a buried layer of the first conductivity type formed in the semiconductor layer in close relative proximity to and beneath at least a portion of the drift region. A substantially vertical distance between the buried layer and the drift region, and / or one or more physical dimensions of the buried layer are configured so as to optimize a power density of the device relative to at least one of an on-resistance and a maximum drain current of the device.

A method for electrical cable testing by Pulse-Arrested Spark Discharge (PASD) uses the cable response to a short-duration high-voltage incident pulse to determine the location of an electrical breakdown that occurs at a defect site in the cable. The apparatus for cable testing by PASD includes a pulser for generating the short-duration high-voltage incident pulse, at least one diagnostic sensor to detect the incident pulse and the breakdown-induced reflected and / or transmitted pulses propagating from the electrical breakdown at the defect site, and a transient recorder to record the cable response. The method and apparatus are particularly useful to determine the location of defect sites in critical but inaccessible electrical cabling systems in aging aircraft, ships, nuclear power plants, and industrial complexes.

In a battery system, battery modules (3a, 3b) connected to each other in series respectively include: one or more single cells (3a1 to 3an, 3b1 to 3b-n) connected to one another in any one of series, parallel, and series-parallel; cell voltage switches (7a, 7b) for detecting voltages respectively of the one or more single cells; module monitoring control units (9a, 9b) each for monitoring the detected voltages respectively of the one or more signal cells; and communications level converter circuits (14a, 14b). The battery system includes a master unit (8a) for receiving information on the voltages respectively of the one or more single cells from the module monitoring control units via the communications level converter circuits. One of the communications level converter circuits includes a switch element (Q32) for transmitting a signal of a low-potential battery module to a high-potential battery module. A series circuit includes resistors R1′, R2′ and R5 as well as the switch element is connected between a positive electrode of the highest-potential single cell in the high potential battery module and a negative electrode of the lowest-potential single cell in the low-potential battery cell.

An MOS device is formed including a semiconductor layer of a first conductivity type, and source and drain regions of a second conductivity type formed in the semiconductor layer proximate an upper surface of the semiconductor layer. The source and drain regions are spaced apart relative to one another. A drift region of the second conductivity type is formed in the semiconductor layer proximate the upper surface of the semiconductor layer and at least partially between the source and drain regions, the drift region having an impurity doping concentration greater than about 2.0e12 atoms / cm2. An insulating layer is formed on at least a portion of the upper surface of the semiconductor layer. The device further includes a gate formed on the insulating layer at least partially between the source and drain regions, and a buried layer of the first conductivity type formed in the semiconductor layer in close relative proximity to and beneath at least a portion of the drift region. A substantially vertical distance between the buried layer and the drift region, and / or one or more physical dimensions of the buried layer are configured so as to optimize a power density of the device relative to at least one of an on-resistance and a maximum drain current of the device.

The invention discloses a SiC vertical double diffusion metal oxide semiconductor structure (VDMOS) device with a composite gate dielectric structure, and belongs to the technical field of power semiconductor devices. A thought of differentiating modulation of electric fields is adopted according to difference of intensities of electric fields and difference of defect concentrations of gate dielectrics in different areas, namely, high-k gate dielectrics are adopted in channel regions with high-defect concentration and a low electric field, so that a large quantity of trap states caused by using a SiO2 / SiC interface is avoided; the influence on Fowler-Nordheim (FN) tunneling current is obviously reduced; and meanwhile, because the electric field intensity in a channel injection area is small, the reduction on gate dielectric breakdown voltage caused by small offset of conduction band / valence band is weakened; and moreover, a SiO2 gate dielectric (a junction field-effect transistor (JFET) area is formed in a way of extension and is not subjected to ion injection, the surface quality of the JFET area is good, and the SiO2 / SiC interface state is low) is adopted by the JFET area with low defect concentration and a high electric field, and enough high conduction band offset is supplied by the SiO2 dielectric, so that the ahead breakdown of the gate dielectric is avoided.

Provided is a nonvolatile memory element which is capable of performing a stable resistance change operation at a low breakdown voltage.A nonvolatile memory element (100) includes: a first electrode layer (103); a second electrode layer (105); and a variable resistance layer (104) which is placed between the electrodes (103 and 105), and whose resistance state reversibly changes between a high resistance state and a low resistance state based on a polarity of a voltage applied between the electrodes (103 and 105). The variable resistance layer (104) is formed by stacking a first oxide layer (104a) including an oxide of a first transition metal and a second oxide layer (104b) including an oxide of a second transition metal which is different from the first transition metal. At least one of the following conditions is satisfied: (1) a dielectric constant of the second oxide layer (104b) is larger than a dielectric constant of the first oxide layer (104a); and (2) a band gap of the second oxide layer (104b) is smaller than a band gap of the first oxide layer (104a).

A silicon carbide power device includes a junction field effect transistor and a protective diode, which is a Zener or PN junction diode. The PN junction of the protective diode has a breakdown voltage lower than the PN junction of the transistor. Another silicon carbide power device includes a protective diode, which is a Schottky diode. The Schottky diode has a breakdown voltage lower than the PN junction of the transistor by adjusting Schottky barrier height or the depletion layer formed in the semiconductor included in the Schottky diode. Another silicon carbide power device includes three protective diodes, which are Zener diodes. Two of the protective diodes are used to clamp the voltages applied to the gate and the drain of the transistor due to surge energy and used to release the surge energy. The last diode is a thermo-sensitive diode, with which the temperature of the JFET is measured.

A low capacitance transient voltage suppressor with reduced clamping voltage includes an n+ type substrate, a first epitaxial layer on the substrate, a buried layer formed within the first epitaxial layer, a second epitaxial layer on the first epitaxial layer, and an implant layer formed within the first epitaxial layer below the buried layer. The implant layer extends beyond the buried layer. A first trench is at an edge of the buried layer and an edge of the implant layer. A second trench is at another edge of the buried layer and extends into the implant layer. A third trench is at another edge of the implant layer. Each trench is lined with a dielectric layer. A set of source regions is formed within a top surface of the second epitaxial layer. The trenches and source regions alternate. A pair of implant regions is formed in the second epitaxial layer.