346 results about "Double diffusion" patented technology

One illustrative method disclosed herein includes, among other things, forming a multi-layer patterned masking layer comprised of first and second layers of material and first and second openings that extend through both of the first and second layers of material, wherein the first opening is positioned above a first area of the substrate where the DDB isolation structure will be formed and the second opening is positioned above a second area of the substrate where the SDB isolation structure will be formed. The method also includes performing a first process operation through the first opening to form the DDB isolation structure, performing a second process operation to remove the second layer of material and to expose the first opening in the first layer of material, and performing a third process operation through the second opening to form the SDB isolation structure.

A vertical type power MOSFET remarkably reduces its ON-resistance per area. A substantial groove formation in which a gate structure is constituted is performed beforehand utilizing the LOCOS method before the formation of a p-type base layer and an n+-type source layer. The p-type base layer and the n+-type source layer are then formed by double diffusion in a manner of self-alignment with respect to a LOCOS oxide film, simultaneously with which channels are set at sidewall portions of the LOCOS oxide film. Thereafter the LOCOS oxide film is removed to provide a U-groove so as to constitute the gate structure. Namely, the channels are set by the double diffusion of the manner of self-alignment with respect to the LOCOS oxide film, so that the channels, which are set at the sidewall portions at both sides of the groove, provide a structure of exact bilateral symmetry, there is no positional deviation of the U-groove with respect to the base layer end, and the length of the bottom face of the U-groove can be made minimally short. Therefore, the unit cell size is greatly reduced, and the ON-resistance per area is greatly decreased.

The invention relates to a double diffusion intussusception forge technique of a bearing ring of a tapered roller, belongs to the technical field of forging of the bearing ring of the tapered roller and mainly aims at solving the problems that the existing ring forging technique is not suitable for various bearing rings of the large and medium size tapered rollers. The technique is mainly characterized in that: (1) a GCr15 steel material section is heated to 1050 DEG C on a medium frequency induction furnace, then upset on a press, extruded backward and forward, formed, sheathed respectively and is separated into an outer sleeve and an inner sleeve or a small outer sleeve blank; (2) the outer sleeve blank is ring-rolled on a ring rolling machine, then reeled on the press and cooled into an outer sleeve forged parts of a bearing; and (3) the inner sleeve or the small outer sleeve blank is placed on the press, upset again, extruded and punched and then a ring part is obtained which is ring-rolled on the ring rolling machine, then an inner sleeve hot forged part after being ring-rolled is reeled on the press and then cooled to obtain the inner sleeve forged part of the bearing. The technique is mainly used for manufacturing the inner and outer ring forged parts of the bearing of the large and medium size tapered roller with various types, small batch or large batch.

Fin Field Effect Transistor (FET) (FinFET) complementary metal oxide semiconductor (CMOS) circuits with single and double diffusion breaks for increased performance are disclosed. In one aspect, a FinFET CMOS circuit employing single and double diffusion breaks includes a P-type FinFET that includes a first Fin formed from a semiconductor substrate and corresponding to a P-type diffusion region. The FinFET CMOS circuit includes an N-type FinFET that includes a second Fin formed from the semiconductor substrate and corresponding to an N-type diffusion region. To electrically isolate the P-type FinFET, first and second single diffusion break (SDB) isolation structures are formed in the first Fin on either side of a gate of the P-type FinFET. To electrically isolate the N-type FinFET, first and second double diffusion break (DDB) isolation structures are formed in the second Fin on either side of a gate of the N-type FinFET.

The present invention relates to high strength carbon fibers having structured surface grooves, and a preparation method thereof. According to the present invention, a wet spinning technology is adopted, and a solvent adopted by polymerization and solidification molding is modified, such that the solvent and the modifying agent form a complex structure so as to improve solidification double-diffusion in the wet spinning solidification molding process to prepare a polyacrylonitrile precursor having a axial structured surface groove structure and a uniform and dense radial structure; and then pre-oxidation structure control is adopted in a pre-oxidation process to prepare the high strength polyacrylonitrile-base carbon fibers having the structured surface groove structure. The carbon fibers of the present invention have high tensile strength and high modulus, and are easily compounded with other materials so as to improve performances of the composite material.

The invention relates to a method for preparing a vertical double-diffusion metal oxide semiconductor device, which belongs to the technical preparation field of a semiconductor. The method comprises the main preparing steps: preparing a N<+> substrate, extending and growing N<->, oxidizing gate oxidation, depositing and adulterating polysilicon, depositing silicon dioxide, etching polysilicon windows, injecting and pushing a P trap, injecting high-concentration deep P<+>, injecting a N<+> source, oxidizing and forming a contact hole, etching a groove-shaped window by using an oxidizing layer as a mask, depositing metal, etching metal, passivating and back metalizing. The invention can manufacture a VDMOS device by only using two mask plates, the manufacturing cost of the device is greatly reduced, and meanwhile, the parasitic transistor effect of the device is weakened for the existence of a P<+> layer and the introduction of groove-shaped source contact metal, and the resistance among drain sources is reduced. The invention can be used for the production and the manufacture of the VDMOS device, other semiconductor devices (such as an insulating gate double-pole transistor) and an integrated circuit.

The invention relates to a rapid superjunction longitudinal double-diffusion metal oxide semiconductor transistor which comprises a cell area, a terminal area and a transition area, wherein the terminal area is arranged at the outermost periphery of a chip; the transition area is positioned between the cell area and the terminal area; the bottoms of the cell area, the transition area and the terminal area (III) are provided with drain electrode metal; a heavy doping n-type silicon substrate is arranged on the drain electrode metal and used as a drain area of the chip; an n-type doping epitaxial layer is arranged on the heavy doping n-type silicon substrate; and a discontinuous p-type doping columnar semiconductor area is arranged in the n-type doping epitaxial layer. The rapid superjunction longitudinal double-diffusion metal oxide semiconductor transistor is characterized in that an n-type heavy doping semiconductor area is arranged in a second p-type doping semiconductor area in the transition area, and the surface of the n-type heavy doping semiconductor area is provided with a contact hole which is connected with a metal layer to form a ground contact electrode of the chip. The invention can effectively reduce the reverse recovery charge of a device and improve the reverse recovery characteristics under the conditions of not increasing the process cost or changing the main parameter of the device.

The invention discloses an N-type buried-channel silicon carbide metal oxide semiconductor field effect transistor (DEMOSFET) device and a preparation method thereof and mainly solves the problems of low inversion layer electron mobility of the silicon carbide (MOSFET) device and contradiction between reduction in on resistance and improvement on breakdown voltage in the prior art. The device is characterized in that: an N- buried channel layer (3) which has the thickness of 0.1 mu m and the nitrogen ion doped concentration of 5*10<15>cm<-3> is introduced between a SiO2 isolation medium (2) and a P<-> layer (7A) of the traditional vertical double-diffusion metal oxide semiconductor (VDMOS) device structure; an N-type current diffusion layer (8) which has the thickness of 0.5 to 0.6 mu m and the nitrogen ion doped concentration of between 5*10<16>cm<-3> and 1*10<17>cm<-3> is introduced between a P<+> layer (7B) and an N<-> epitaxial layer (10); a P well is divided into two layers, namely the P<-> layer (7A) and the P<+> layer (7B); the P<-> layer (7A) has the thickness of 0.5 mu m and the aluminum ion doped concentration of between 1*10<15>cm<-3> and 5*10<15>cm<-3>; and the P<+> layer (7B) has the thickness of 0.2 mu m and the aluminum ion doped concentration of 3*10<18>cm<-3>. The device has the advantages of high inversion layer electron mobility, high switching reaction speed and low power consumption, and can be used for high-power electrical equipment, solar modules and hybrid fuel electric vehicles.

The embodiment discloses a VDMOS (Vertical Double-diffusion Metal Oxide Semiconductor Structure) device and a manufacturing method thereof. The device comprises a substrate, an isolating area, a first body area, a second body area, a first source area, a second source area and a gate area, wherein the substrate comprises a body layer and an epitaxial layer positioned above the body layer; the body layer comprises a drain area; the isolating area is positioned in the epitaxial layer; the first body area and the second body area are positioned in the epitaxial layer at two sides of the isolating area; the first source area is positioned in the first body area; the second source area is positioned in the second body area; and the gate area is positioned between the first source area and the second source area and above the isolating area. The insulated isolating area is formed in the epitaxial layer between the first body area and the second body area, a transition zone where a conductive channel diffuses toward the epitaxial layer area between the first body area and the second body area is eliminated, a parasitic resistor of the VDMOS device is eliminated, the total conduction resistor of the device is reduced, and the electricity of the device is improved. In addition, because of the disappearance of the parasitic resistor, the occupation area of the device cell is reduced, and the utilization ratio of the substrate surface is improved.

The invention relates to a high-voltage low-on-resistance lateral double-diffusion metal oxide semiconductor (LDMOS) device and a manufacturing method thereof. The high-voltage low-on-resistance LDMOS device comprises P-epitaxy, a P-well region, an N+ anode, an N+ cathode, a P+ cathode end, an anode multi-crystal field board, a cathode multi-crystal field board, gate polycrystal, a gate oxide, a field oxide layer, a P-substrate, an N-well region and a P-type region, and also comprises the P-type region and a P-buried layer, wherein the P-type region is positioned on the surface of the N-well region; and the P-buried layer is positioned in the N-well region; the P-type region is isolated from the P-well region and the N+ anode, the P-type region is isolated from the field oxide layer; the P-type region and the N-well region form a PN junction; and the N-well region is segmented into a second N-well region and a first N-well region which are positioned above the P-buried layer by using the P-buried layer; and the P-buried layer forms PN junctions with the first N-well region and the second N-well region respectively. The high-voltage low-on-resistance LDMOS device has the advantages that: on one hand, the compatibility of the LDMOS device and a conventional low-voltage Bipolar+metal oxide semiconductor (CMOS)+double-diffusion metal-oxide-semiconductor (DMOS) (BCD) process is improved, on the other hand, the on-resistance of the LDMOS device is reduced on the premise of the same voltage resistance.

The invention provides a crosswise DMOS with cupped source electrode contact and a method for forming the crosswise DMOS. The crosswise DMOS comprises a cupped source electrode contact, wherein the cupped source electrode contact comprises a cupped part which longitudinally extends and penetrates the source area of the crosswise DMOS and contacts the body area,and the cupped part is electrically coupled with the source area and the body area. The crosswise DMOS not only has smaller size, but also is low in production cost.

The invention relates to a method for manufacturing a double diffusion type optical avalanche diode with incident light on a back surface by adopting epitaxial equipment. MOCVD epitaxial equipment is used for carrying out epitaxial treatment once on an avalanche photodiode on an indium phosphide substrate; a double diffusion method of the MOCVD epitaxial equipment is used for doping; a sputtering method is used for manufacturing a P-surface electrode; the substrate is thinned and polished; a wet corrosion method is used for manufacturing a light incidence window and an anti-reflection layer; the sputtering method is used for manufacturing a N-surface electrode; and the N-surface electrode is alloyed. By using the double diffusion method, in the diffusion process, the invention realizes gradient doping of different regions and different concentration by controlling the flow rate of a diffusion source; and an abrupt junction is formed in diffusion. The invention has good diffusion uniformity and high rate of finished products of pieces; and the manufactured avalanche photodiode with incident light on the back surface has the characteristics of small dark current, high sensitivity, small series resistance, high reliability and the like.

The invention discloses a preparation method of a hollow fiber nanofiltration membrane, and provides the preparation method of the hollow fiber nanofiltration membrane continuous in technical process, uniform in nanofiltration functional layer and few in deficiencies. The method comprises the following steps of: using polyelectrolyte aqueous alkali as an outer coagulating bath and a mixed liquor of water and a solvent for the coagulating bath as an inner coagulating bath, spinning and forming a hollow fiber nanofiltration membrane spinning and membrane forming system through a hollow spinning nozzle and a double diffusion process, and initially curing and forming a hollow fiber membrane; and adding the initially cured hollow fiber nanofiltration membrane into an aqueous liquor of polyamine, erasing the suspended liquid on the surface, adding the membrane into an organic liquor of polyacyl chloride, and drying and curing the membrane to obtain the hollow fiber nanofiltration membrane. The method provided by the invention is continuous in technical process, uniform and controllable in nanofiltration functional layer and few in defects, and has a wide prospect in the fields of seawater and brackish water desalination, treatment and recovery of sewage and wastewater, preparation of ultrapure water and the like.

A double diffusion MOSFET is disclosed which comprises: a drain region 13 of an N-type semiconductor layer formed on a semiconductor substrate 11; a body region 15 of a P-type semiconductor region formed in the drain region 13; an N-type source region 16 formed in the body region 15; and a gate electrode 21 formed on a surface of the body region 15, wherein the drain region 13 contains N+ type drain contact regions 18 and P+ type regions 19 such that those are put at an equal potential.

A VDMOS (Vertical Double-Diffusion Metal-Oxide-Semiconductor) device with a non-uniform floating island structure belongs to the technical field of semiconductor power. For the VDMOS device, the non-uniform floating island structure is drawn into a first conductive type semiconductor drift region of a common VDMOS and comprises at least two layers of second conductive type semiconductor floating islands which are respectively an upper layer of second conductive type semiconductor floating island and a lower layer of second conductive type semiconductor floating island, wherein the upper layer of second conductive type semiconductor floating island is larger in transverse width dimension and lower in doping density, and the lower layer of second conductive type semiconductor floating island is smaller in transverse width dimension and higher in doping density. Compared with the common VDMOS, the VDMOS with the non-uniform floating island, provided by the invention, can adopt higher electrical resistivity of an epitaxial layer under the condition the same puncture voltage, thereby the on-resistance is greatly reduced; compared with a VDMOS with a uniform floating island, the VDMOS with the non-uniform floating island is wider in current path and also can lead the on-resistance to be reduced; and compared with a super-junction VDMOS, the VDMOS is better in the reverse recovery characteristic of a body diode and is relatively simple in process.

The invention belongs to a field of semiconductor technology and specifically relates to an HK SOI LDMOS (Lateral Double-Diffusion Metal Oxide Semiconductor) device. The device has the following characteristics. First, the device has three separated grating structures including a plane grate and two channel grates. In an open state, the three-grating structure an form a plurality of crosswise and longitudinal channels, thus increasing channel density, increasing current and reducing specific on-resistance. Second, high K mediums are embedded into drifting zones adjacent to a semiconductor zone and are arranged in alternation with the drifting zones. In the open state, electron accumulation layers are formed on side walls of the drifting zones adjacent to the high K mediums, so that low resistance channels are provided and the specific on-resistance is reduced. In a closed state, the high K mediums assist to drain the drifting zones, so that the drifting zone doping is improved, the electric field is improved and the specific on-resistance is reduced and the voltage holding performance is improved further. Third, an SOI structure is adopted, so that longitudinal voltage holding performance is improved, leakage current is reduced and a latch-up effect is eliminated.

The invention discloses a vertical double-diffusion metal oxide semiconductor field effect transistor (MOSFET), which comprises a metallization drain 1, an N<+> substrate 2, an N<-> drift region 3, a deep P body region 5, an N type heavy doping source region 6, a P type heavy doping region 7, an N type buried layer channel 8, a P type epitaxial layer 9, a gate oxidation layer 10, a polysilicon gate electrode 11 and a metallization source 12. When the vertical double-diffusion MOSFET is switched on, the switch-on resistance of a device is greatly reduced through the common electricity conducting mechanism of two channels; and when the vertical double-diffusion MOSFET is switched off, electric fields of the channels are shielded through a P+N junction barrier, so that a higher voltage-resisting level of more than 1,000V is realized.

The invention discloses a method for homogenizing, solidifying and forming polyacrylonitrile precursor. By adopting a wet spinning technology, a polyacrylonitrile spinning solution trickles in a coagulating bath to be subjected to double diffusions through solvent and precipitator and then solidified and separated so that the polyacrylonitrile precursor is formed. According to the method disclosed by the invention, an ammonia-containing compound is added in the a coagulating bath; the ammonia-containing compound is served as a third component and can be used for retarding the double-diffusion speed in the solidification process of the polyacrylonitrile spinning solution; therefore, the solidifying and forming homogenization is realized; and the high-performance polyacrylonitrile precursor and carbon fibre can be obtained.

The invention relates to a consumption type N-type lateral double-diffusion metal-oxide semiconductor for reducing voltage, which comprises a P-type semiconductor substrate, wherein an N-type buried layer, a P-type well region, an N-type well region and an N-type drift region are arranged on the P-type semiconductor substrate; a P-type contact region, an N-type source region and an N-type channelinjection region are arranged near the left side of the surface of the P-type well region; a P-type injection region is arranged in the P-type well region; the left end boundary of the P-type injection region is arranged below the N-type source region; the right end boundary of the P-type injection region is adjacent to the N-type drift region on a drain terminal; and the P-type contact region and a polycrystalline silicon electrode are connected through an interconnection metal cable to be used as a grid. The structure of the invention greatly reduces the threshold voltage of the consumptiontype N-type lateral double-diffusion metal-oxide semiconductor; a metal cable of a drain is directly connected to a high-voltage power supply in circuit application; the metal cable of the grid is grounded; and the metal cable of the drain is directly connected to a low-voltage circuit so as to provide a low-voltage power supply for the low-voltage circuit.

A design methodology for routing for an integrated circuit is disclosed. The method includes placement of cells having double diffusion breaks, which create an extended intercell region. Metal layer prohibit zones are defined to prohibit any M1 structures in the prohibit zones. Metal layer allow zones are placed adjacent to outer metal lines, and jogs are formed in the metal layer allow zones. Vias and viabars may then be applied on the jogs.

The invention relates to a flat acrylic fiber and a production method thereof. The flat acrylic fiber consists of the following components in percentage by weight: 91-94 percent of acrylonitrile and 6-9 percent of vinyl acetate, wherein the length-width ratio of the flat acrylic fiber is (2-13):1. The method for producing the flat acrylic fiber comprises the following steps: carrying out copolymerization reaction on the acrylonitrile and the vinyl acetate to prepare dried polyacrylonitrile powder, dissolving the powder in a solvent to form a stock solution, extruding from a rectangular hole of a spinneret plate after heating, and performing double diffusion to form a nascent fiber in a coagulating bath; washing the nascent fiber by water, and drawing the fiber through a drawing machine; oiling tows; and drying the tows and setting, so as to obtain the flat acrylic fiber. The contents of the acrylonitrile and the vinyl acetate in a copolymer, the molecular weight of the copolymer and a specific process flow are adjusted, so that the prepared flat acrylic fiber is good in handfeel, the softness and handfeel of the fiber can be improved, the rebound resilience, hydrophobicity and spinnability of the fiber can be guaranteed, and the acrylic fiber is easy to color.