17 results about "Body contact" patented technology

Provided are a vertical semiconductor device with a body contact, a manufacturing method, and an electronic apparatus. The semiconductor device includes: an active region vertically disposed on a substrate relative to the substrate, including lower and upper source / drain regions, and a middle portion between the lower and upper source / drain regions for defining a channel region; first and second gate stacks which are disposed on first and second sides of the active region which are opposite to each other in a lateral direction relative to the substrate; and a body contact layer disposed on the second side of the active region to overlap a part of the middle portion of the active region, so as to apply a body bias to the active region, wherein the second gate stack includes first and second portions below and above the body contact layer respectively.

Embodiments of the present application provide a path planning method and device, equipment and a storage medium, and relate to the technical field of robots. The method comprises: determining a candidate blocking gap that blocks a task execution device from going to a terminal point based on a current environment description; simulating the robot pushing a to-be-pushed obstacle in a pushing direction and for a pushing duration based on the quality of the to-be-pushed obstacle corresponding to the candidate blocking gap, the ground friction coefficient in the current environment description, and the multi-body contact constraint between obstacles, to obtain a post-pushing environment description corresponding to the candidate blocking gap; detecting whether the task execution device is reachable from a starting point to the terminal point according to the post-pushing environment description corresponding to the target feasible gap with the lowest total consumption; if reachable, generating a passable path; otherwise, updating the current environment description to the post-pushing environment description corresponding to the target feasible gap, and returning to the step of determining the candidate blocking gap based on the current environment description. Through the present solution, the accuracy of the planned passable path can be improved.

The utility model relates to a dartboard convenient for score area position adjustment, which is characterized in that a dartboard body is circular, a limiting steel ring is sleeved outside the dartboard body, the middle of the upper surface of the dartboard body is divided into a plurality of score areas through a knife net, a plurality of grooves are uniformly arranged outside the upper surface of the dartboard body, strong magnetic blocks are fixedly embedded in the grooves, a digital disc is annular, and the strong magnetic blocks are embedded in the strong magnetic blocks. The digital disc is concentrically placed above the target body, the lower end of the digital disc is in contact with the upper surface of the target body, the upper end of the digital disc is arc-shaped, a plurality of connecting plates are uniformly arranged on the inner surface of the digital disc, digital modules are integrally connected to the upper surfaces of the connecting plates, clamping grooves are formed in the middle positions of the lower surfaces of the connecting plates, and limiting iron blocks are fixedly embedded in the clamping grooves; the device has the advantages of reasonable overall structural design and time-saving and convenient score area adjustment operation.

The utility model provides a mould structure with an in-mould lens ejector block, which comprises a base, a mould and an ejector block, the mould is provided with a cavity, the cavity comprises an upper cavity and a lower cavity which are communicated with each other, the lower part of the lower cavity is communicated with a placing cavity, the area of the cross section of the placing cavity is gradually increased from bottom to top, and the placing cavity is of an inverted trapezoidal structure; wherein the top block can be connected with the placing cavity in a matched mode, so that when the top block is installed in the placing cavity from top to bottom and abuts against the placing cavity in a limited mode, the top end of the top block exactly forms the bottom of the lower cavity, the lower cavity and the placing cavity are separated in a sealed mode, the bottom side of the top block is further connected with a plurality of first ejector pins, and the first ejector pins are used for ejecting the top block out from bottom to top; the top end of the ejector block serves as a bottom plate and also serves as a main body contact surface for ejecting the lens product, so that the quality problem of deformation during ejection of the deformed lens product is avoided, the reject ratio of the lens product is reduced, the production and processing cost is reduced, and the production efficiency is improved.

The utility model discloses an industrial tool bit with a wear detection function, which comprises a tool bit body, a positioning frame is arranged on the outer side of the tool bit body, the positioning frame is fixedly mounted on the tool bit body, and a detection frame is inserted on the positioning frame. According to the industrial tool bit with the wear detection function, a limiting screw rod is rotated outwards, limitation of the limiting screw rod on a limiting clamping plate is relieved, a detection frame is integrally and horizontally moved to the front end of the tool bit body, a control top plate is rotated to drive a threaded rod to move downwards, and the threaded rod downwards pushes a transverse plate and a detection rod to move downwards; the detection rod is in contact with the tool bit body, data of movement on the data rod is recorded at the same time, the detection frame is translated and reset after recording is completed, the limiting clamping plate is limited by rotating the limiting screw rod, and after the tool bit body is used again for a period of time, the detection rod makes contact with the tool bit body again. And the movement data of the data rod is recorded and compared, so that the wear detection is realized.

The invention discloses a wafer centralization alignment jig. The wafer centralization alignment jig comprises a first limiting assembly. The first limiting assembly is provided with a first hollow body, a plurality of first limiting pieces and a first hollow plate body. The first limiting pieces are embedded in the first hollow body in a radial moving mode, the first hollow plate body can move relative to the first hollow body, the top face of the first hollow plate body makes contact with the bottom faces of the first limiting pieces, the first limiting pieces movably penetrate through the first hollow plate body, and when the first hollow plate body rotates relative to the first hollow body, the first limiting pieces can move relative to the first hollow plate body. The first limiting pieces move in the radial direction. Therefore, the object can be placed in the center of the first hollow body and the center of the first hollow plate body without depending on the manual operation of an operator, so that the alignment accuracy and the production efficiency are improved.

This application relates to digit lines and body contacts for semiconductor devices. Systems, methods, and apparatus are provided for an array of vertically stacked memory cells having horizontally oriented access devices with a first source / drain region and a second source / drain region separated by a channel region, and a gate opposite the channel region, and vertically oriented access lines coupled to the gate and separated from the channel region by a gate dielectric. The memory cells have a horizontally oriented storage node coupled to the second source / drain region and a horizontally oriented digit line coupled to the first source / drain region. Vertical body contacts are formed in direct electrical contact with a body region of one or more of the horizontally oriented access devices and separated from the first source / drain region and the horizontally oriented digit line by a dielectric.

The invention relates to a device (100) configured to capture perspiration from a perspiring body and to be attached to an electronic component, comprising a multilayer structure (9) having a contact surface (1) configured to be placed in contact with the body, the structure (9) comprising a microfluidic channel (5) connecting a fluid inlet (3) to a fluid outlet (19), and at least one pair of electrical conductors (27a, 27b), each conductor (27a, 27b) of the pair of conductors (27a, 27b) comprising at a first end, an electrode (23a, 23b) having a surface area extending along a wall of the microfluidic channel (5), and at a second end, a connecting portion (25a, 25b), the connecting portion (25a, 25b) being accessible by an adjacent surface (22a, 22b) or a surface (17) opposite the contact surface (1) and being configured to be electrically coupled to the electronic device.

The disclosure relates to semiconductor structures, and more particularly to body-contacted transistors and methods of manufacture. The structure comprises: an active gate structure on a semiconductor substrate; at least one body contact extending through the active gate structure and connected to a body region, the body region including a channel of the active gate below the active gate structure; and an insulator material isolating the at least one body contact from the active gate structure.

The utility model discloses a novel high-cleanliness wafer box, which relates to the technical field of wafers and comprises a wafer, the surface of the wafer is provided with a wafer box assembly, and the inside of the wafer box assembly is provided with a dismounting mechanism. According to the utility model, the wafer is placed in the storage groove of the wafer box body, the storage groove of the wafer box body is arc-shaped, so that only the edge of the wafer is in contact with the wafer box body, pollutants attached to the surface of the wafer are reduced, at the moment, the connecting plate is placed on the surface, then the cover body is placed on the surface of the wafer box body, and the bump II is aligned with the cover body; when the second protruding block makes contact with the cover body, the cover body slightly deforms until the bottom end of the second protruding block makes contact with the wafer box body to complete clamping and closing, at the moment, the bottom end of the cover body is pressed downwards to enable the pressing plate to cover the wafer, the wafer is limited under the condition that only the edge of the wafer is in contact, and the adaptability of the device is improved.

This application relates to the field of processing parameter control technology and discloses a dynamic flow rate control method based on multi-body contact deformation calculation. The method includes: acquiring processing parameters and structural parameters of the loading component and the substrate; analyzing and modeling the Z-axis deformation of the loading component and the substrate based on their structural parameters to obtain contour curves of the lower edge of the loading component and the upper edge of the substrate; constructing a flow rate calculation model based on the contour curves; calculating the real-time slurry flow rate based on the flow rate calculation model; acquiring the target slurry flow rate and calculating the slurry flow rate error; collecting the support load of the loading component; calculating processing stability indicators based on the support load; formulating a feedback adjustment strategy based on the processing stability indicators and the slurry flow rate error; and adjusting the slurry flow rate in real time based on the feedback adjustment strategy. This application achieves refined control of the slurry flow rate by using multi-body contact deformation analysis to provide real-time feedback adjustment of pressure and propulsion speed.

The invention relates to the technical field of processing parameter control, and discloses a flow dynamic regulation and control method based on multi-body contact deformation calculation, and the method comprises the steps: obtaining processing parameters and structure parameters of a loading component and a printing substrate; analyzing and modeling the Z-direction deformation of the loading component and the printing substrate based on the structural parameters of the loading component and the printing substrate to obtain profile curves of the lower edge of the loading component and the upper edge of the printing substrate; constructing a flow calculation model based on the contour curve; calculating real-time slurry flow based on the flow calculation model; obtaining a target slurry flow and calculating a slurry flow error; collecting the bearing load of the loading component; calculating a machining stability index based on the bearing load; and formulating a feedback adjustment strategy based on the processing stability index and the slurry flow error, and adjusting the slurry flow in real time based on the feedback adjustment strategy. The pressure and the propelling speed are fed back and adjusted in real time through multi-body contact deformation analysis, and refined regulation and control of the slurry flow are achieved.

A tray (40) for a fusion work is a tray used in a fusion work of an optical fiber, and includes a tray main body (41) and a first body contact member (70). The tray main body (41) includes a pair of long wall portions (42) opposed to each other and extending in a first direction, and a pair of short wall portions (43) opposed to each other and extending in a second direction intersecting the first direction. A placement portion (51) on which a fusion splicer is placed is provided in a rectangular region defined by the pair of long wall portions and the pair of short wall portions in the tray main body. The first body contact member (70) has an outer surface configured to contact a body of an operator using the fusion splicer, and is fitted to the tray main body on one of the pair of long wall portions. The first body contact member (70) is movable between a deployed state in which the outer surface is deployed in a third direction intersecting the first direction and the second direction, and a housed state in which the first body contact member is housed from the deployed state.

Embodiments of the present application provide a path planning method and device, equipment and a storage medium, and relate to the technical field of robots. The method comprises: determining a candidate blocking gap that blocks a task execution device from going to a terminal point based on a current environment description; simulating the robot pushing a to-be-pushed obstacle in a pushing direction and for a pushing duration based on the quality of the to-be-pushed obstacle corresponding to the candidate blocking gap, the ground friction coefficient in the current environment description, and the multi-body contact constraint between obstacles, to obtain a post-pushing environment description corresponding to the candidate blocking gap; detecting whether the task execution device is reachable from a starting point to the terminal point according to the post-pushing environment description corresponding to the target feasible gap with the lowest total consumption; if reachable, generating a passable path; otherwise, updating the current environment description to the post-pushing environment description corresponding to the target feasible gap, and returning to the step of determining the candidate blocking gap based on the current environment description. Through the present solution, the accuracy of the planned passable path can be improved.

Disclosed is a vertical semiconductor device having a body contact, a method of manufacturing the same, and an electronic device including the semiconductor device. According to embodiments, the semiconductor device can include an active region vertically disposed on a substrate with respect to the substrate, including a lower source / drain region, an upper source / drain region, and a middle portion between the lower source / drain region and the upper source / drain region to define a channel region; a gate stack disposed on a first side of the active region in a lateral direction with respect to the substrate to at least overlap the middle portion of the active region; and a body contact layer disposed on a second side of the active region opposite the first side in the lateral direction to overlap the middle portion of the active region to apply a body bias to the active region, wherein, in a vertical direction with respect to the substrate, a portion of the middle portion of the active region overlapping the body contact layer is a first spaced distance from the lower source / drain region and a second spaced distance from the upper source / drain region.

The invention is suitable for the technical field of contact simulation, and provides a multi-rigid-body contact rigidity detection method and device, electronic equipment and a program product. The method comprises the following steps: respectively dividing surfaces corresponding to a first rigid body and a second rigid body into a plurality of triangular patches to obtain a first triangular patch corresponding to the first rigid body and a second triangular patch corresponding to the second rigid body; determining intersected triangular patch combinations and intersection points corresponding to the triangular patch combinations; determining a contact area of the first rigid body and the second rigid body according to each triangular patch combination and each intersection point; and for each contact area, determining the curvature radius corresponding to the contact area according to the triangular patch corresponding to the contact area, and determining the contact rigidity corresponding to the contact area according to the curvature radius corresponding to the contact area. By means of the method, the appropriate contact rigidity can be determined through the electronic equipment, and the efficiency of obtaining the simulation result of the multi-rigid-body collision process is improved.

The application discloses a surface-embedded material point method for a multi-body contact problem, and belongs to the technical field of computational mechanics and numerical simulation. In a first step, a physical model of a multi-body contact system is discretized and parameters are set. In a second step, contact forces are calculated. In a third step, physical quantities of material points of contact bodies are transferred to background grid nodes to obtain node mass, momentum and force. In a fourth step, a grid is updated. In a fifth step, velocities, displacements, stresses and densities of the material points are updated. In a sixth step, background grid physical quantities are reset. In a seventh step, the first, fourth, fifth and sixth steps are repeated to update physical quantities of material points of other contact bodies and to allocate corresponding contact body background grid nodes in a memory. In an eighth step, after all contact bodies are updated, a current time is updated to obtain a dynamic simulation result. The application can accurately represent object boundaries, effectively simulate complex problems such as impact and multi-body contact, and has good stability and low memory consumption.