91 results about "Low impedance" patented technology

This invention discloses a dry bonding method for positive electrode materials and solid electrolyte layers in solid-state batteries. The method first involves dry mixing and pre-pressing positive electrode active material powder, solid electrolyte powder, and conductive agent powder to form a positive electrode composite material preform. Subsequently, the surface of the solid electrolyte layer is activated to increase its surface energy. A key step is to apply longitudinal vibration at a specific frequency and amplitude to the preform and the activated solid electrolyte layer for resonant acoustic interface coupling treatment, causing microscopic rearrangement and initial meshing of interface particles. This invention is solvent-free throughout the process. Through the synergistic effect of vibration and hot pressing, a stable interface with tight contact, strong bonding, and low impedance is constructed at the microscale, effectively solving problems such as poor interface contact, easy peeling, or performance degradation caused by solvent residue in existing dry and wet processes. It is particularly suitable for high-activity solid-state battery systems.

This application provides an electric motor, an electric propulsion device, and an aircraft. The electric motor includes: a stator having a cavity; a rotor rotatably connected to the stator via a shaft; and the rotor being insulated from the stator; a conductive component disposed within the cavity, one end of the conductive component being conductively connected to the shaft, and the other end extending to the outside of the electric motor. The electric motor of this application, by incorporating the conductive component, creates a complete low-impedance electrical path between the shaft and the conductive component, allowing current that might be input into the electric motor via the rotor hub to be output to the outside of the electric motor, thus improving the electrical protection performance of the electric motor.

The application provides a pad structure in a PCB and a method for optimizing the impedance of a pad in a PCB, and relates to the technical field of circuit board design. The pad structure comprises: a target pad formed on the PCB; a first transmission line electrically connected to the target pad, the line width of the first transmission line being smaller than the width of the target pad; a second transmission line electrically connected to the first transmission line, the line width of the second transmission line being smaller than the width of the target pad; and a third transmission line electrically connected to the second transmission line, the line width of the third transmission line being larger than the line width of the second transmission line. By setting the line widths of the first transmission line and the second transmission line to be smaller than the width of the target pad, a high-impedance thin line section is formed, and by utilizing the high characteristic impedance characteristic of the high-impedance thin line section, the capacitive low impedance of the wide pad itself can be effectively offset, so that the overall impedance of the pad area is improved without increasing the cost and process difficulty.

The application provides a power system stability analysis method based on impedance measurement data, comprising determining that the current analysis condition is a condition corresponding to an equivalent circuit diagram based on a converter topology structure diagram, wherein a disturbance voltage source is in series or a disturbance current source is in parallel; under the current analysis condition, disturbance voltage components and disturbance current components generated on the converter side are obtained to obtain converter impedance measurement data carrying amplitudes and phase angles at several frequency points, and disturbance voltage components and disturbance current components generated on the power grid side are obtained to obtain power grid equivalent impedance measurement data carrying amplitudes and phase angles at several frequency points; the converter impedance measurement data and the power grid equivalent impedance measurement data at the same frequency point are compared, and according to each comparison result, the risk of oscillation instability of the power system is judged. The application is implemented to reduce the complexity of impedance measurement operation, thereby improving the analysis accuracy.

The application discloses an electronic device and a charging method. The electronic device comprises a USB interface, a fast charging chip, a power management chip and a main chip. The fast charging chip comprises a DP module and a DM module. The power management chip comprises a DP input module, a DM input module, a DP output module and a DM output module. The USB interface is connected with the fast charging chip and the power management chip. The DP output module and the DM output module are connected with the main chip. When the power management chip detects that the port type is DCP, the DP input module and the DM input module are switched to a high impedance state, and the DP module and the DM module of the fast charging chip are switched to a low impedance state. When the power management chip detects that the port type is SDP / CDP, the DP input module and the DM input module are connected with the DP output module and the DM output module. Through the electronic device, the compatibility of fast charging and data transmission can be realized while reducing the cost.

The application provides an electromagnetic interference suppression system and method of a smart television, and relates to the technical field of smart television, and the system comprises a SoC main chip, a WiFi module and a multi-path power management circuit; the SoC main chip is built-in with an LVDS interface, and differential display signals are output at a 315MHz base frequency; the WiFi module works at a 2.4GHz frequency band; the multi-path power management circuit comprises a DCDC converter, an LDO stabilizer and a power switch circuit, and a first decoupling network and a second decoupling network are used to provide power supply for a core voltage input end of the SoC main chip and an analog modulator voltage input end respectively; the first decoupling network and the second decoupling network provide a low-impedance power supply path for the SoC main chip at the 315MHz base frequency to maintain signal integrity. The application realizes frequency avoidance and power integrity collaborative optimization, and low-cost and simple suppression of harmonic interference of a high-speed interface on the WiFi module.

Provided is a ceramic base that can desirably achieve low impedance of an RF rod for suppressing an increase in heat generation accompanying high frequency. The ceramic base includes: a ceramic plate in a circular plate shape having a first surface and a second surface, and in which an RF electrode and a heater electrode are embedded; a ceramic shaft in a cylindrical shape that is attached to the second surface of the ceramic plate and has an internal space; an RF rod that is directly or indirectly connected at one end to the RF electrode, extends from the second surface at the other end, and extends through the internal space; and a heater rod that is directly or indirectly connected at one end to the heater electrode, extends from the second surface at the other end, and extends through the internal space. The RF rod includes: a root portion that includes an end portion embedded in a terminal hole formed in the second surface of the ceramic plate; a core portion that extends from the root portion in a direction away from the second surface; and an outer peripheral portion that covers an outer periphery of the core portion and is composed of a non-magnetic material.

The application provides a high-reliability ultra-small high-speed switch patch diode structure, which comprises a patch diode tube body, pins are arranged at the left and right ends of the bottom of the patch diode tube body, a limiting rod is arranged in the patch diode tube body, a push plate is arranged at the bottom of the limiting plate, reinforcing strips are arranged at the side edges of the push plate, a screw rod is arranged at the bottom of the reinforcing strip, a screw cap is arranged at the top of the screw rod, a pad is arranged at the side edge of the screw rod, a sealing plate is arranged at the side edge of the pad, and an adjusting hole is arranged in the sealing plate. The high-reliability ultra-small high-speed switch patch diode structure is mounted at the bottom of the patch diode tube body through the pins, the receiving capacity of the patch diode tube body is improved, meanwhile, the pins can be used in an unbalanced way to enter the internal frequency demodulation circuit for demodulation through the pins, the resistance can obtain a high-level signal through the pins, and when no signal is received, the pins present low impedance and output a low-level signal.

Embodiments of the present application provide a display module and a display apparatus. In the display module, a first bonding layer comprises at least a first portion, the first portion is arranged at least corresponding to an edge portion, and the impedance of the first portion is greater than that of a second bonding layer, so that the first portion having higher impedance can block static electricity, and the second bonding layer having lower impedance can be made of a material having good thermal stability. Therefore, both the antistatic effect and bonding stability of the display module can be considered.

Wake-up receivers (WuRx) are provided including an antenna having a real input impedance different than 50Ω configured for receiving a radiofrequency (RF) signal, resonant circuitry configured to provide voltage gain to the received RF signal to produce a boosted RF signal, and a passive rectifier configured to at least one of recover a data signal from the boosted RF signal, or convert the boosted RF signal into a DC power signal.

An auxetic force-sensing resistor (“force sensor”) sensor system is disclosed suitable for manufacturing via common 3D printing methods like Fused Deposition Modeling (FDM) without extensive post-processing. The force sensor may comprise a plurality of interconnected cells, and may be at least partially constructed of an elastic conductive material, such as conductive TPU. Each cell may feature sidewalls that may be configured to collapse inwardly when a compressive force is applied to the cell's top or bottom. This inward collapse may create new, lower-impedance points of contact within the cell's structure, which may thereby reduce the sensor's overall electrical resistance in a controlled manner proportional to the applied force.

This invention provides a planar end-fire dielectric rod antenna fed by a substrate-integrated waveguide, belonging to the field of antennas. The dielectric layer includes a first dielectric substrate and a second dielectric substrate stacked together. A first metal layer is located on the upper surface of the first dielectric substrate; a second metal layer is located on the lower surface of the second dielectric substrate and is connected to the first metal layer through metal vias. The dielectric layer includes a feed end, a transmission end, and a radiating end connected in sequence. The radiating end includes a tapered gradient structure and a guiding dielectric block. One end of the first metal layer is connected to the feed port through a tapered microstrip line located at the feed end, and the first metal layer is located at the transmission end. The other end of the first metal layer is connected to one end of the tapered gradient structure through a tapered slot, and the other end of the tapered gradient structure is connected to the guiding dielectric block. A tapered slot is formed at the end of the second metal layer near the radiating end. This invention solves the problems of low mode conversion efficiency, narrow impedance matching bandwidth, poor in-band gain stability, and high sidelobe level.

This application discloses a filtering trace structure, device, and flexible circuit board. The filtering trace structure includes at least one high-impedance trace and at least one low-impedance trace. The high-impedance and low-impedance traces are alternately arranged and connected in series. The characteristic impedance of the high-impedance trace is greater than a preset threshold, and the characteristic impedance of the low-impedance trace is less than the preset threshold. By alternately arranging and connecting at least one high-impedance and at least one low-impedance trace in series, a transmission line structure with periodic impedance changes is formed. The filtering effect is achieved by utilizing the impedance mismatch effect between the high-impedance and low-impedance segments, thereby directly integrating the filtering capability into the signal trace and effectively suppressing radio frequency interference.

The utility model discloses a kind of frequency converter anti-interference devices, including frequency converter shell, frequency converter body and filter, the inside of frequency converter shell is also provided with shielding layer, shielding layer is equipped with several through holes of shielding layer penetration;The top of frequency converter shell is equipped with cooling fan, the inner wall of frequency converter shell is equipped with several elastic supports of contact with shielding layer;The bottom of frequency converter shell is equipped with air inlet connected with shielding layer, the inside of air inlet is equipped with filter screen, the utility model relates to frequency converter technical field, through the through hole on shielding layer and wire shielding coating, form low impedance heat dissipation path while ensuring electromagnetic shielding effectiveness, effectively reduce the electromagnetic leakage risk of through-hole edge, realize the double optimization of electromagnetic interference suppression and high-efficiency heat dissipation;The multilayer composite structure of shielding layer further cooperates and optimizes electromagnetic shielding topology and heat conduction path, electromagnetic isolation and internal heat are quickly exported, avoid the temperature rise problem caused by traditional closed shielding structure.

The application discloses an electronic device, comprising: a first shell, a second shell, a matching circuit; the first shell is provided with a first antenna radiator, the first antenna radiator works in a first frequency band; the second shell is rotationally connected with the first shell, the second shell is provided with a second antenna radiator, the second antenna radiator works in a second frequency band; the matching circuit is connected with a first feeding point on the first antenna radiator, the first antenna radiator is in a low impedance state through the matching circuit; wherein, the low impedance state refers to resistance value and reactance value in impedance value being in a preset range close to zero value; in the case that the first shell and the second shell are rotated to a folding state, the matching circuit is in a first state; in the first state, the first antenna radiator works at a resonant frequency in the first frequency band, which is smaller than a resonant frequency in the second frequency band in which the second antenna radiator works.

An integrated circuit (IC) and system for providing electrostatic discharge (ESD) protection is disclosed that includes circuitry (e.g., ESD protection circuitry) electrically connected to a circuit board. The circuit may include: a functional component; a gate pad connected to the functional component; and an FET pair connected to the gate pad and forming a low impedance discharge path from the gate pad to ground to protect the functional component from an ESD event. Disclosed is an ESD protection method comprising: manufacturing a wafer comprising a plurality of circuits; cutting the wafer to form an IC (integrated circuit); packaging the IC to form a chip; attaching the chip to a printed circuit board; and applying a DC voltage exceeding a fusing voltage threshold level from the printed circuit board to a gate pad of the IC to fuse a fuse to disconnect an ESD protection circuit from the gate pad.

The utility model discloses a switch power supply circuit of preventing static, including input module, power control module, transformer T1 and output module, the output of input module is divided into two ways, one way is connected with the input of power control module, and the other way is connected with the primary side winding of transformer T1, and the output of power control module is connected with the primary side winding of transformer T1, and the secondary side winding of transformer T1 is connected with output module, and the discharge needle X3 is connected between output module and input module, when static electricity occurs, static electricity pulse enters from the output of output module, then flows into input module through discharge needle X3, makes static electricity pulse to have clear, low impedance's discharge path, avoids static electricity to accumulate in the power supply inside, effectively reduces the impact risk of static electricity to control chip, and promotes circuit anti static interference ability.

The application discloses a receiving antenna integrated with a low-impedance terahertz detector, which comprises a low-impedance terahertz detector located at the center, one crab claw-shaped metal sheet on each side, crab claw connecting arm metal sheets located between the terahertz detector and the two crab claw-shaped metal sheets and serving as connecting arms, and the overall structure is symmetric about the center. The application realizes effective integration of the on-chip low-impedance antenna and the low-impedance terahertz detector, realizes different working modes in different frequency bands, works in a resonant mode in a low frequency band and works in a traveling wave mode in a high frequency band, and realizes different working bandwidths in different frequency bands, that is, narrowband in the low frequency band and wideband in the high frequency band.

This application relates to the field of ultrasonic transducer technology, and in particular to a broadband, low-impedance ultrasonic transducer with uniform amplitude and its application. The transducer includes a front cover plate, a rear cover plate, a piezoelectric vibrator, a matching layer, a backing block, and electrode leads. The front and rear cover plates are connected by bolts. The backing block is bolted to the inner side of the rear cover plate, and the piezoelectric vibrator is bolted to the side of the backing block away from the rear cover plate. This technical solution, through the coordinated operation of various adjustment mechanisms, enables multi-dimensional angle adjustment of the ultrasonic transducer body. Its bottom can rotate 360 ​​degrees laterally, and the angle can be adjusted simultaneously during rotation. It can seamlessly and quickly adjust any angle, including front-back, left-right, sideways, and oblique directions, adapting to complex operating angles and offering high adjustment flexibility, thus suitable for various ultrasonic cutting scenarios.

This invention provides an impedance conversion circuit designed to reduce noise voltage. [Solution] The impedance conversion circuit 1 uses the microphone's capacitor C MIC The input signal from is received, and the input signal is received with high impedance so as not to attenuate, and the load 2 is driven with a low impedance output. The gate of the PMOS transistor M1 is the input T IN Connected to the source, output T OUT The current source 4 supplies current to the source of the PMOS transistor M1. The back gate potential supply circuit 8 converts the source potential of the PMOS transistor M1 and supplies it as the back gate potential of the PMOS transistor M1. The back gate potential supply circuit 8 has resistors R1 and R2 connected in series, and the back gate potential is adjustable according to the ratio of resistors R1 and R2.

This invention provides an impedance conversion circuit designed to reduce noise voltage. [Solution] The impedance conversion circuit 1 uses the microphone's capacitor C MIC The input signal from is received, and the input signal is received with high impedance so as not to attenuate, and the load 2 is driven with a low impedance output. The gate of the PMOS transistor M1 is the input T IN Connected to the source, output T OUT It is connected to the current source 4, which supplies current to the source of the PMOS transistor M1. The back gate potential supply circuit 8 supplies the power supply voltage V DD The back gate potential of PMOS transistor M1 is generated from this and supplied to PMOS transistor M1.

The utility model provides a kind of impedance matching test circuit board suitable for crystal network analyzer, it is related to electronic component testing technical field, the circuit board includes: input impedance conversion network, the input end of input impedance conversion network is used to connect the first port of network analyzer, input impedance conversion network is used to convert the transmission line impedance of network analyzer into preset low impedance value;Output impedance conversion network, the output end of output impedance conversion network is used to connect the second port of network analyzer, output impedance conversion network is used to convert back transmission line impedance from preset low impedance value;Test interface, test interface includes first test probe and second test probe, first test probe connects the output end of input impedance conversion network, second test probe connects the input end of output impedance conversion network, and first test probe and second test probe are respectively used to connect the two functional pins of crystal resonator.

A time domain reflectometry (TDR) controlled-impedance testing system includes one or more ultra-low impedance testing channels (e.g., having a characteristic impedance of less than 10 ohms, or less than 5 ohms, or less than 2 ohms) to couple a test signal to a test target ("device under test"). In one example, the TDR testing system includes one or more printed circuit boards (PCBs) on which at least a portion of the testing channel is implemented. The PCB includes an ultra-wide impedance-controlled trace and one or more return conductors constituting at least a portion of an ultra-low impedance PCB RF transmission line having a characteristic impedance of less than 10 ohms (or less than 5 ohms, or less than 2 ohms).

This application discloses an anti-interference error monitoring device, method, system, and electronic device, relating to the field of anti-interference circuit technology. The device includes a signal generation unit, a frequency-selective filtering network, and a digital processing module. The signal generation unit outputs a reference signal for error calibration. The frequency-selective filtering network is disposed between the signal generation unit and the secondary side acquisition circuit of the instrument transformer, used to couple the reference signal and the power frequency signal to form a mixed signal. The frequency-selective filtering network includes an isolation capacitor and a tuning inductor connected in series with the isolation capacitor. The tuning inductor and the isolation capacitor are configured to resonate in series at the reference signal frequency, resulting in low impedance at that frequency and high impedance at the fundamental power frequency and / or higher harmonic frequencies. The digital processing module is used to extract the signal components in the mixed signal and determine the error parameters. This application can be used for online error monitoring of instrument transformers.

This application discloses a high-power amplifier feed circuit structure, including a multilayer hybrid voltage board and high / low impedance lines. The high / low impedance lines consist of low-impedance and high-impedance lines, corresponding to a first and a second reference ground layer, respectively. The vertical distance between the second reference ground layer and the high / low impedance lines is greater than that between the first and second reference ground layers, to maintain the impedance of the high-impedance lines while increasing their physical width. This structure, by adjusting the reference ground layer distance, improves overcurrent capability and weakens voltage overshoot, achieving RF signal suppression of over 100dB in the target frequency band. It features a simple structure and low cost.

This invention relates to the field of drive circuit technology, and discloses a highly reliable gate drive circuit, drive chip, and power semiconductor device. The circuit breaks through the existing passive compromise scheme that relies solely on adjusting the turn-off resistor. It uses a detection unit to collect the gate voltage of the IGBT unit in real time, a latch unit to output a stable square wave signal when the voltage reaches a preset threshold, and a pull-down unit to simultaneously provide a low-impedance discharge path, actively suppressing abnormal gate voltage rise caused by the Miller effect. The design of the Miller suppression unit avoids the switching speed reduction and device overheating problems caused by increasing the turn-off resistor, while effectively suppressing the risk of mis-turn-on caused by crosstalk between the upper and lower bridge arms, achieving dual optimization of crosstalk suppression and switching performance. This significantly improves the reliability and stability of the gate drive, extends the lifespan of the power semiconductor device, and is suitable for various power topologies such as half-bridge and full-bridge, with wide application scenarios and strong practicality.

The present application belongs to the field of road engineering detection, and provides a kind of electrically conductive asphalt concrete resistivity measurement method and system based on charge discharge topology, comprising: main control unit, for driving tri-state commutation bridge, and synchronously triggering differential acquisition unit to carry out data acquisition, and calculating the resistivity of electrically conductive asphalt concrete according to acquisition data;Constant current source, for generating constant direct current to tri-state commutation bridge;The tri-state commutation bridge is arranged between the output end of constant current source and four probe components, for the switching of three kinds of working modes of forward injection mode, reverse injection mode and zero-state discharge mode.The present application utilizes tri-state commutation bridge, in positive and negative pulse switching gap, control bridge enters zero-state discharge mode, constructs the low impedance short circuit loop of probe against ground, and quickly releases the interface polarization charge in asphalt material, which physically eliminates the interference of residual charge on reverse measurement.

The application discloses a soft start system and control method suitable for a low dropout linear regulator. The soft start system comprises a ramp voltage generation module for generating a ramp voltage Vramp with a slow ramp-up; a voltage selection module for selecting a minimum value Vmin from the ramp voltage Vramp or Vref and outputting; a voltage clamping module for temporarily clamping the output voltage of the comparison module in the initial stage of power supply power-on, limiting the input voltage of the power stage through a buffer stage, thereby suppressing the sharp peak current; a comparison module for comparing the minimum value Vmin and a feedback voltage Vfb, and adjusting the current of the power stage according to the comparison result; and a buffer stage module for providing a low-impedance output voltage Vg_power. The application can reduce the average current in the start-up process, suppress the short-time sharp peak current appearing on the power tube, protect the LDO and the load circuit from the electromagnetic interference problem caused by the sharp peak current, and reduce the risk of circuit burning.