This invention relates to the field of insulating materials for porous
copper foil preparation, and particularly to an insulating material for porous
copper foil preparation and its preparation method, as well as a method for preparing porous
copper foil. The preparation method includes the following steps: perforating a
cathode plate to obtain a
cathode plate with multiple blind holes; filling the blind holes with an insulating material for porous
copper foil preparation, and curing it to obtain a pretreated
cathode plate; the raw materials for the insulating material are: resin,
reactive diluent, thixotropic agent, leveling agent,
polymerization inhibitor, and
photoinitiator. The pretreated cathode plate is used as the cathode and placed in an
electrolyte for electrodeposition to obtain porous
copper foil. When preparing porous
copper foil with the insulating material, the filling material in the blind holes can withstand more than 80
electroplating cycles without peeling off, indicating that the insulating material for porous copper foil preparation possesses excellent adhesion and
electrolyte environment durability, enabling a single-filled cathode to support stable electrodeposition over an ultra-long period, significantly extending its effective service life.