This invention discloses a
wafer lamination
machine, belonging to the field of
wafer lamination technology, comprising: a base; a
material handling section, which includes a lifting module and a
material handling unit, the lifting module lifting the
material handling unit; a lamination section, which includes a side plate, a lamination driving structure, and a lamination tensioning structure, the lamination driving structure clamping and driving the
film material, and the lamination tensioning structure mounted on the side plate; a pressing section, which includes a pressing driving module and a pressing roller; and a
cutting section, which is mounted on the side plate and located above the base, the
cutting section including a
cutting driver, a cutting cylinder, and a cutting blade. This invention achieves automated operation of the
wafer lamination process through the coordinated operation of the base, material handling section, lamination section, pressing section, and cutting section. The overall structure is rationally laid out, achieving a high degree of functional integration within a limited space, with a high level of
automation control, simple operation, and strong stability.