107 results about "Thermal damage" patented technology

The present invention comprises: a high-frequency oscillator that transmits high-frequency energy and includes a control unit; a high-frequency connecting line connected to the high-frequency oscillator; and a high-frequency transmission pad connected to the other end of the high-frequency connecting line and attached to the curve of facial skin in close contact with it, wherein the high-frequency transmission pad is configured such that an adhesive pad and a bipolar pad are integrated or separate. This invention relates to a non-invasive automatic facial lifting device using high-frequency energy that adheres closely to the curves of the face to be treated, thereby enabling uniform delivery of high-frequency energy to the skin, allowing for effective treatment without separate operation, minimizing the risk of excessive thermal damage to specific areas of the skin, resolving issues such as pain, scarring, and infection associated with existing invasive technologies, enhancing user convenience and safety through an automated control system and customized settings, and providing uniform treatment effects and reducing treatment time and fatigue by monitoring skin temperature in real time and delivering high-frequency energy according to set output, time, and patterns.

The application discloses a device and a process for laser ablation induced controllable damage assisted grinding of hard and brittle materials, which adopts laser irradiation on the material surface, focuses the laser focal point on the material surface to be processed, removes and induces specific depth damage to the material by ablation. By controlling the laser power, scanning speed and ablation track, the degree and type of laser ablation induced thermal damage of the material are effectively controlled. The grinding path of the grinding wheel and the ablation path of the laser are controlled on the same axis, and the distance between the laser ablation and the grinding wheel grinding is set, and the workpiece ablation surface is ground under the preferred grinding parameters. The application systematically puts forward a quantitative control strategy for the degree of laser ablation damage of the material surface, removes the laser induced damage layer by accurate control of the material surface damage and precision grinding, and realizes high-efficiency and high-quality processing of the hard and brittle materials.

The utility model discloses a kind of construction protective fence connecting structure, belong to construction technical field, including longitudinal protective fence one, the side of longitudinal protective fence one is provided with horizontal protective fence one, the other end of horizontal protective fence one is provided with longitudinal protective fence two, the side of longitudinal protective fence two is provided with longitudinal protective fence three, the side of longitudinal protective fence three is provided with horizontal protective fence two, the utility model is connected by being provided with longitudinal protective fence connecting mechanism, longitudinal protective fence connecting mechanism adopts optimized bolt connection design, the quick installation between protective fence stand and firm connection is realized.Compared with traditional welding mode, bolt connection does not need on-site welding equipment, avoids the security risk in welding process and heat damage to material.Meanwhile, the bolt connection mode of the mechanism can be quickly disassembled and reused according to construction demand, greatly improves construction efficiency and material utilization.

The application discloses a kind of for CFRP big depth-diameter ratio array hole multi-pulse width laser composite processing system and method.The system includes: multi-pulse width laser generation module, for outputting two initial laser beams;Beam shaping module, for the optical axis of two initial laser beams is adjusted to coaxial, the initial laser beam is shaped, adjusts the polarization state of initial laser beam, initial laser beam is modulated into two sub laser beams, adjusts the energy distribution of two sub laser beams, two sub laser beams are converted into two mirror image symmetrical distribution in the focusing laser beam array of two sides of the CFRP matrix to be processed.The application can be applicable to the high-efficiency high-precision processing of CFRP big depth-diameter ratio array hole, and nanosecond laser is used to improve processing efficiency, and femtosecond laser is used to effectively inhibit carbon fiber delamination and thermal damage of resin matrix.

This invention discloses an anti-ablation multi-scale composite film and a method for its synergistic preparation and application using magnetron sputtering and plasma spraying. Belonging to the field of surface engineering and thermal protective coating technology, the method includes: pretreating a resin substrate; depositing a continuous and dense metal-based thin film on the pretreated resin substrate surface using magnetron sputtering at a temperature below the resin substrate's heat distortion temperature to form an interface transition layer; and depositing an anti-plasma ablation functional layer using plasma spraying on the interface transition layer, with the resin substrate temperature not exceeding 150°C during the spraying process, resulting in an anti-ablation multi-scale composite film formed on the resin substrate surface. This invention utilizes low-temperature deposition of a dense transition layer via magnetron sputtering combined with efficient preparation of the anti-ablation functional layer via plasma spraying, avoiding thermal damage to the resin substrate. The composite film exhibits a bonding strength ≥40 MPa and a mass ablation rate <5 mg / s after 500 ablation cycles, demonstrating high reliability under high-temperature conditions and suitability for high-temperature surface protection of various resin substrate materials.

This invention discloses a method for CO2 continuous laser cutting of CFRP material. The method employs a CO2 continuous laser engraving and cutting system to cut CFRP material. After adjusting the corresponding working parameters, a portion of the CFRP material to be cut is taken as a sample, and a rectangle is obtained through trial cutting. The diameters of the pits generated by the spot laser are measured horizontally and vertically twice, and the average diameter is calculated. Simultaneously, the continuous laser power density is calculated, and the height difference between the four corners and the center of the rectangle is measured to obtain the surface fluctuation value (Fv). Different scanning speeds, number of consecutive processing cycles, and Z-axis scale values ​​are selected, and trial cutting is repeated on the sample. When the measured Fv is at its minimum value, the thermal damage to the material is minimized. The scanning speed, number of consecutive processing cycles, and Z-axis scale value at this minimum value are used as the working parameters for cutting the CFRP material. This invention effectively controls the thermal damage to the CFRP material during processing and improves the processing effect of laser-processed CFRP material.

This invention provides a frequency-domain shaping laser-plasma resonance sintering system using aerosol jetting. The localized strong electromagnetic field excited by LSPR can induce electron cloud rearrangement and chemical bond reconstruction at the interface of adjacent nanoparticles, forming an atomic-level interdiffusion transition layer. This invention precisely controls the laser wavelength through frequency-domain shaping technology to match the LSPR characteristic peaks of the nanoparticles, maximizing the local electromagnetic field enhancement effect. This allows for the completion of nanoparticle melting and necking formation at ultra-low laser power, overcoming the energy efficiency limitations of traditional post-processing techniques such as high-temperature furnace heating. Simultaneously, this process is completed within the femtosecond to picosecond timescale, avoiding component segregation caused by high-temperature thermal diffusion and significantly improving the bonding strength of the nanoparticle interface. Furthermore, it achieves nanoscale selective heating, completing particle melting and necking formation at ultra-low laser power, avoiding overall thermal damage.

This invention relates to the field of vascular stent fabrication technology, and discloses a method for fabricating a stent with electrodes, comprising the following steps: providing a planar stent precursor with thermally responsive deformation characteristics; forming a conductive layer on the surface of the planar precursor, and patterning the conductive layer to form at least one electrode unit and at least one conductive wire unit electrically connected to the electrode unit; forming a non-conductive material layer on at least a portion of the surface of the conductive layer; placing the planar precursor under constraint and heating it to a molding temperature below 300°C to soften the planar precursor, cause a shape memory phase transition or crystal structure transformation, and shape it into a stent structure using a mold; wherein, the non-conductive material layer maintains structural integrity and insulation properties at the molding temperature, the non-conductive material layer has windows for exposing the electrode unit, and the non-conductive material layer covers the conductive wire unit, thus avoiding thermal damage to the non-conductive material layer caused by high-temperature processes.

The application is suitable for the technical field of solar cells, and provides a solar cell, a preparation method thereof, a photovoltaic module and a photovoltaic system. The method comprises the following steps: performing image processing on the back surface of a silicon substrate based on etching slurry, so as to sequentially prepare a first polarity doping layer and a second polarity doping layer on the back surface of the silicon substrate; the maximum preparation temperature of the first polarity doping layer and the maximum preparation temperature of the second polarity doping layer are both greater than or equal to 900 DEG C; a passivation layer is formed on the side of the first polarity doping layer and the second polarity doping layer away from the silicon substrate; a through hole is formed in the metalization area on the passivation layer, so as to expose the first polarity doping layer and the second polarity doping layer; and a metal layer is formed in the area of the exposed first polarity doping layer and second polarity doping layer. In this way, the preparation efficiency of the solar cell can be improved, and the thermal damage of the etching mask layer to the doping layer can be reduced.

This invention provides an adaptive optimization control method for the heat-sealing splicing process parameters of umbrella canopies, comprising: collecting raw data such as heat conduction, deformation, and energy consumption using a multi-source heterogeneous sensor array; obtaining high-precision multi-dimensional process data through time-series calibration, noise removal, and data alignment; decoupling key thermodynamic features based on physical mechanisms to construct a searchable process semantic fingerprint and establishing a mapping library between states and optimal heat-sealing parameters; combining a lightweight meta-policy network, achieving parameter migration and online fine-tuning through minimal calibration learning to meet the rapid adaptation requirements of new materials or abrupt changes in working conditions; and integrating quality feedback throughout the process to achieve parameter optimization and closed-loop process control. This invention can effectively improve the quality and production efficiency of heat-sealing splicing, ensuring no warping at splicing edges, continuous adhesive lines, and controllable thermal damage.

The application provides a method for reducing thermal damage of a cooling medium and a laser processing array. The method can reduce or even avoid the formation of a thermal damage area of the laser processing, improve the processing quality, and particularly can improve the density of an array structure, and obtain a ceramic product containing a high-integration array structure.

This invention relates to the field of laser welding, and mainly discloses a laser-welded photovoltaic module, including a worktable. A laser welding device is mounted on the surface of the Y-axis conveyor mechanism, and a welding plate is mounted on the surface of the X-axis conveyor mechanism. The welding plate has a manifold groove on its surface and a laser welding area and a chip welding area. This invention utilizes a laser welding device for efficient energy concentration, resulting in a small heat-affected zone and precise application to the welding area, reducing thermal damage to surrounding plastic casings and wire insulation. Laser welding also allows for controllable weld width, effectively avoiding defects common in traditional welding such as porosity, slag inclusions, and cracks. The laser welding device, through flexible optical path design, enables precise welding in complex locations such as corners and gaps. Furthermore, the laser welding device can be combined with robots and vision positioning systems to achieve fully automated assembly line production of junction box welding, reducing human error.

The application discloses a UHPC glazed panel and a preparation method thereof. The structure of the UHPC glazed panel comprises a UHPC base body, a reaction bonding layer and a glaze layer which are sequentially stacked, and the reaction bonding layer is formed by a precursor film through a firing process, and the precursor film is diffused and reacted with raw materials of the UHPC base body and the glaze layer in the firing process. By adopting a unique UHPC base body and glaze formula, the application reduces the firing temperature, and avoids thermal damage to the base body and the risk of "thermal explosion" in the firing process. By setting the precursor film, the application initiates in-situ reaction at the interface through the firing process, generates a dense transition layer, i.e. the reaction bonding layer, which is continuously and gradually changed in composition and structure, perfectly matched in thermal expansion coefficient, and has extremely high bonding strength. The UHPC glazed panel has the advantages of high strength, high durability of the UHPC, and the advantages of wear resistance, corrosion resistance, easy cleaning and strong decoration of the glaze layer.

This invention discloses a rapid thermal treatment device, method, and application for silicon wafer surfaces based on LED light sources. The device includes an LED array light source module, a positioning mechanism, and a drive control unit. The LED array light source module emits light in the 350nm to 850nm wavelength range. The positioning mechanism maintains a working distance of 1-5cm between the emitting surface of the LED array light source module and the surface of the silicon wafer to be treated. The drive control unit is electrically connected to the LED array light source module, ensuring that the light power density irradiated onto the silicon wafer surface is greater than 5W / cm². This invention provides a rapid thermal treatment device, method, and application for silicon wafer surfaces based on LED light sources, reducing thermal damage to silicon wafers.

This application relates to the photovoltaic field, providing a method for fabricating a solar cell, a solar cell, and a photovoltaic module. The method includes: providing a pre-formed silicon wafer with a pre-formed surface; controlling multiple first pulses in a pulsed laser to scan sites on the pre-formed surface to form active sites by activating the sites; controlling multiple second pulses in the pulsed laser to scan the active sites to selectively etch the pre-formed silicon wafer to obtain a silicon wafer; the etched pre-formed surface forms a textured surface, and the selective etching characterizes the etching of portions at the active sites on the pre-formed silicon wafer. The multiple first pulses and multiple second pulses are multiple pulses emitted sequentially by the pulsed laser in the same scanning step, and the energy density of the pulses in the pulsed laser is lower than the energy threshold for polishing the pre-formed surface. This application at least helps to improve the problems of low cell efficiency caused by disordered textured surfaces, large thermal damage, and poor passivation performance in laser texturing in the prior art.

This invention relates to the field of circuit board technology, specifically to a process for preparing an aluminum foil-based copper-clad laminate for printed circuit boards. The process involves immersing copper foil in a sulfuric acid solution to form activated copper foil, preparing a co-deposition solution, placing the activated copper foil in the co-deposition solution to obtain a composite-plated copper foil, and grafting the composite-plated copper foil to obtain a reinforced copper foil. In this invention, the aluminum substrate is laser-clad to introduce boron nitride and nanodiamonds, improving its hardness and thermal conductivity. The copper foil undergoes co-deposition of a nanodiamond gradient layer and silane grafting to enhance the coating adhesion and surface activity. Vacuum pressurization and annealing processes reduce interfacial porosity and residual stress, increasing the density of the composite copper plate. The active paste promotes chemical bonding between the aluminum substrate and the copper foil. Laser scanning achieves precise and efficient local connections, avoiding thermal damage. The final product possesses high thermal conductivity, high insulation, high thermal stability, and strong interfacial adhesion.

Methods, systems and adaptors for multiphoton imaging of, and laser-tissue interactions with, non-transparent tissue, such as ocular and periocular tissue, are provided. Aspects of the present invention include methods of imaging a structure through non-transparent tissue, such as ocular or periocular tissue, comprising: deploying an excitation source to transmit light energy to a structure through non-transparent tissue, such as ocular or periocular tissue, detecting light emitted from the structure via multiphoton excitation through the non-transparent tissue, such as ocular or periocular tissue, and imaging the structure based on the detected light. Aspects of the present invention further include methods of treating tissue, such as ocular or periocular tissue or dermatologic tissue, by manipulating an imaged structure, including, for example, providing non-incisional therapy, photo-tissue interactions, multi-photon-mediated damage, such as thermal damage, photo-disruption, photo cross-linking, blood vessel coagulation or ablating tissue. Aspects of the present invention further include methods of imaging dermatologic tissues or providing dermatologic treatments. Aspects of the present invention further include methods of providing cosmetic treatments. Aspects of the present invention further include methods of guiding delivery of gene therapy or cellular therapy in ocular or periocular tissue. Also provided are systems and adaptors for performing the methods described herein.

This invention relates to the field of surface modification technology for metallic materials, specifically to a method for wear-resistant modification of titanium alloys based on femtosecond laser nitridation. The method includes: pretreating the surface of a Ti6Al4V titanium alloy; placing the sample in a nitrogen atmosphere and irradiating the surface with a femtosecond laser beam, wherein the energy flux density of the femtosecond laser is controlled within the range of 0.10 J / cm² to 0.30 J / cm²; and finally characterizing the treated sample. By optimizing the energy flux density parameters, particularly preferably within the range of 0.25–0.30 J / cm², this invention can prepare a high-hardness, high-wear-resistant modified layer rich in titanium nitride (TiN) on the surface of titanium alloys, significantly improving its surface hardness and wear resistance while avoiding thermal damage to the substrate. This method is process-controllable and highly efficient, suitable for applications in aerospace, biomedicine, and other fields with stringent requirements for the wear resistance of titanium alloys.

The invention relates to the technical field of semiconductor devices, and discloses a semiconductor device, a wafer and a wafer processing method. The semiconductor device includes: a substrate; an epitaxial layer; an ohmic contact layer; the device electrode layer is located on the side, away from the substrate, of the ohmic contact layer; the at least one interconnection layer is electrically connected with the device electrode layer in the device area and located on the side, away from the substrate, of the device electrode layer, and the at least one interconnection layer comprises a top interconnection layer farthest away from the substrate; the dielectric layer is located between the top interconnection layer and the device electrode layer; the heat absorption layer is located on the side, away from the substrate, of the dielectric layer, the heat absorption layer is at least located in the cutting edge area, and the absorptivity of the heat absorption layer to light of the preset wave band is larger than that of the dielectric layer to the light of the preset wave band. According to the semiconductor device provided by the embodiment of the invention, the problem of non-uniform heat distribution in the thickness direction during laser cutting in the process of manufacturing the semiconductor device can be relieved, so that the problem of cutting thermal damage to the edge of the semiconductor device is relieved.

The application provides a multifunctional protective film system for vertebroplasty, comprising: a protective film with a multilayer structure, which has a composite film wall, the composite film wall at least comprising: an intermediate support layer, which is a three-dimensional porous mesh stent, and pores of the three-dimensional porous mesh stent are fixedly filled with phase change microcapsules; an inner layer, which covers an inner surface of the intermediate support layer, and an inner surface of the inner layer is provided with an anchoring structure; a delivery sheath; a push rod, which is slidably arranged in the delivery sheath; and a releasable connecting structure, which is arranged between a proximal end of the protective film and a distal end of the delivery sheath, and is used for unlocking or breaking the connection of the protective film to the delivery sheath, and is configured to release the protective film under the pushing of the push rod. The application can systematically solve three problems of leakage, thermal damage and interface instability, and can realize accurate and controllable release.

This invention relates to a device and method for repairing defects in semiconductor materials, specifically a device and method for repairing defects in semiconductor materials based on pulsed electron irradiation. It solves the technical problems of existing semiconductor material defect repair methods, which easily introduce thermal damage and secondary defects, leading to poor repair results, or lack of in-situ, real-time monitoring and feedback of repair effects. This invention utilizes a high-energy, short-pulse electron beam generated by a pulsed electron beam source to irradiate semiconductor materials. This allows for the injection of a high-energy-density pulsed electron beam in a very short time, avoiding the thermal damage and secondary defects caused by traditional high-temperature annealing and steady-state electron beams, significantly improving the repair effect. Simultaneously, a repair effect monitoring system acquires real-time changes in the microstructure and optical properties of the semiconductor material during the repair process, enabling in-situ, real-time evaluation of the repair effect. Based on the evaluation results, the parameters of the pulsed electron beam source can be dynamically adjusted to form a closed-loop control, significantly improving repair efficiency, accuracy, and success rate.

The application discloses a fixed-intercept zooming ring pumping orthogonal polarization controllable vortex double-ring laser, which comprises a fiber-coupled output semiconductor laser array (1), a plano-convex lens (2), a fixed-intercept zooming ring pumping beam generating system (3), a first conical mirror (4), a laser gain medium (5), a V-shaped crystal conical mirror (6), a plane mirror (7) and a second conical mirror (8). The laser can realize orthogonal polarization controllable vortex double-ring laser output, and the topological charge number of the laser vortex phase can be continuously adjusted. The fixed-intercept zooming ring pumping system can make the laser maintain high mode matching degree during the adjustment process. The spin angular momentum and the orbital angular momentum carried by the laser beam can improve the particle trapping efficiency and reduce the thermal damage of the biological cells caused by the laser beam. The double polarization characteristics of the inner ring tangential and the outer ring radial can be fully utilized, the particle can be captured, and high-resolution imaging can be performed at the same time, so that the application of the vector vortex light field in the biomedical field can be greatly expanded.

The application discloses a transmission type laser pyroelectric sensor, a laser power meter and a laser power measurement method, and belongs to the technical field of laser power measurement. The sensor comprises a substrate, a thermoelectric pile and a heat sink. The thermoelectric pile comprises a plurality of series-connected thermocouples arranged on the surface of the substrate to divide the substrate into a light transmission area without the thermocouples and an area where the thermocouples are located. The material of the light transmission area has an absorption rate of less than 5% to the wavelength of the laser to be measured, so as to allow the laser to be measured to be transmitted, and the heat absorbed by the material from the laser to be measured is lower than the heat damage threshold of the material. The hot end of the thermocouple is close to the light transmission area, and the cold end is away from the light transmission area. The heat sink is in contact with the substrate and / or the thermoelectric pile. The application has the advantages of high damage threshold, fast response speed, adjustable sensitivity, compact structure and on-line measurement, and is suitable for real-time monitoring of kilowatt to ten-kilowatt high-power lasers, especially fiber lasers.

The utility model discloses a kind of thin perovskite indoor photovoltaic modules, belong to photovoltaic module technical field.The thin perovskite indoor photovoltaic module of the utility model has the advantages of high-reliability light and thin backboard package, electrode wire leads out of no damage enough strength, double-layer package film of aluminium plastic film plus butyl rubber film, excellent water-oxygen barrier packaging effect is achieved through cheap film material, packaging thickness is significantly lower than glass packaging, module is lighter and thinner, through the round metal adhesive tape sticking wire, mechanical damage is minimum, does not affect battery efficiency, through the buffering effect of round metal adhesive tape, the mechanical damage and thermal damage of low-temperature soldering tin soldering wire can be reduced, through the round metal adhesive tape sticking cooperation double-layer package film sticking, the connection mechanical strength of round metal adhesive tape and perovskite sub-cell is strengthened, through Sn-Bi, Sn-Bi-In etc. low-temperature alloy soldering tin wire replaces traditional soldering tin wire, reduce soldering thermal damage to perovskite sub-cell The harm and efficiency loss brought about.

This invention provides a ureteroscopic irrigation catheter, belonging to the field of medical device technology. The ureteroscope includes a scope body and a tubing. An imaging probe is installed at the end of the tubing. An infusion catheter is inserted through the tubing, and the gap between the catheter and the inner wall of the tubing forms a return channel. The inner wall of the catheter is equipped with a spiral flow-guiding structure to generate centrifugal force to evenly disperse the water flow. This invention systematically solves the problems of thermal damage and visual interference in ureteroscopic holmium laser lithotripsy through fluid dynamics optimization and a dual-channel drainage structure, combining clinical safety and ease of operation.

This invention provides a perovskite solar cell, its fabrication method, and a three-terminal tandem solar cell, specifically relating to the field of solar cell fabrication technology. The fabrication method for this perovskite solar cell involves first preparing a first transport layer on a silicon substrate. Using atomic layer deposition (ALD) technology, a perovskite thin film is formed on the surface of the first transport layer, followed by in-situ annealing to obtain a perovskite absorber layer. Then, a second transport layer, a buffer layer, and a transparent conductive layer are sequentially fabricated on the surface of the perovskite absorber layer to obtain the perovskite solar cell. ALD's self-limiting reaction is insensitive to silicon textured surfaces, overcoming the bottleneck of uneven film formation in traditional processes. This results in a perovskite layer with precise thickness, dense density without pinholes, and consistent grain orientation, significantly suppressing interface / bulk recombination and improving carrier lifetime. In-situ annealing avoids thermal damage and promotes hydrogen passivation of the silicon surface, synergistically improving Voc and FF.

This invention provides a sapphire wafer processing control system based on dynamic laser power adjustment. By dynamically adjusting the laser energy distribution and the coordinated control of the processing path, it effectively suppresses thermal damage and simultaneously improves surface precision during sapphire material processing. By establishing a real-time mapping relationship between thickness gradient and temperature field, and employing a multi-parameter closed-loop feedback mechanism, the heat-affected zone is precisely defined, thus avoiding remelting and cracking defects caused by heat accumulation in traditional processing. It is particularly suitable for high-precision processing requirements in areas with uneven thickness or edge regions. Adaptive energy distribution significantly improves the uniformity of material removal, enabling the surface roughness and geometric tolerances of optical components to consistently reach sub-micron levels. This globally optimized control strategy not only improves processing yield but also expands the machinability boundaries of complex optical components, providing a reliable technical guarantee for the mass production of high-precision optical devices.