484 results about "Thermal damage" patented technology

The invention relates to the technical field of industrial control, in particular to an intelligent centerless grinding machine cooling system and method for difficult-to-machine materials, and the system comprises a multi-source sensing unit, an edge calculation module, a decision center module, a precise execution module and a digital immune memory bank; compared with the defects that in the prior art, monitoring depends on a single temperature sensor, thermal field sensing is incomplete, thermal damage early warning lags behind and the like, according to the scheme, grinding power frequency spectrum, acoustic emission signals, triaxial vibration and coolant mass spectrum data are collected in real time through a multi-source sensing unit, and a micron-sized temperature field is reconstructed in combination with an edge end space-time diagram convolutional network; full-dimensional monitoring of the grinding thermal-mechanical coupling effect is achieved, and thermal anomaly recognition sensitivity and early warning timeliness are remarkably improved.

The invention belongs to the technical field of laser processing, and particularly relates to a laser processing control method based on a neural network, and the method specifically comprises the following steps: a target definition and input stage; a physical model and database stage: establishing a basic model library; establishing a mapping database; in the AI core engine stage, a training model learns a complex nonlinear relation among laser parameters, material response and a final processing result; searching an optimal laser parameter combination by using an optimization algorithm based on the prediction model and a target set by a user; a laser parameter automatic adjustment and execution stage; a real-time monitoring and feedback stage; and an iterative learning and system improvement stage. The invention further discloses a control system, electronic equipment and a computer storage medium. According to the method, submicron precision control is achieved, thermal damage can approach to zero, the development period is shortened, online real-time regulation and control are achieved, energy consumption is reduced, the material utilization rate is increased, and the method has an interpretable decision-making mechanism and cross-material generalization ability.

The invention provides an intelligent detection method and system for the tensile property of a plastic cable tie. Gradient temperature rise control is executed through the carbon fiber heating tube array, microscopic deformation fluctuation characteristics are captured through the double-grating displacement sensor, and temperature field distribution is collected through the infrared thermal imager. Establishing dynamic correlation between deformation and a temperature field to generate a three-dimensional space-time atlas, identifying a migration path of a thermal aggregation area, recording a standard path, and calculating a thermal anomaly coefficient in combination with pressure data; analyzing temperature conduction hysteresis to generate a heat conduction parameter, and dynamically correcting a threshold value by cross-modal correlation with an abnormal coefficient; a structure degradation index is generated based on the migration path, mapping between the structure degradation index and a temperature field is established to generate a thermal damage compensation coefficient, an abnormal coefficient is calibrated accordingly, and grading early warning is triggered in combination with the path deviation degree. According to the technical scheme provided by the invention, multi-scale damage evaluation from thermodynamic associated data acquisition to molecular chain fracture inversion is realized, and the high-temperature tensile failure critical point is accurately pre-judged through a dynamic calibration early warning mechanism.

The invention discloses a single crystal turbine blade crystal orientation defect detection system based on adaptive optics, particularly relates to the field of nondestructive testing, and is used for solving the problem that thermal damage and signal consistency are difficult to consider in acoustic imaging of complex structural parts. Through partition energy threshold setting, dynamic pulse planning, photoacoustic processing and unified coordinate cross-subarea data synthesis, local thermal damage caused by excessive concentration of energy is effectively avoided in the material detection process, and the requirement for collecting high-bandwidth signals can be met in a large range. The signal-to-noise ratio and the detection efficiency are improved by regulating and controlling pulse energy and a scanning path, the amplitude comparability and the image coherence among regions are ensured through signal normalization correction and subregion image set splicing, high-resolution and comprehensive-coverage acoustic mapping is output, the crystal orientation defects of the single crystal turbine blade are positioned and evaluated, the detection precision is improved, the measurement period is shortened, and the method is suitable for large-scale popularization and application. And the method has an applicable value for aero-engine parts requiring rapid and high-precision nondestructive detection.

The invention relates to the technical field of laser processing, particularly discloses an ultrathin prepreg single-emitting laser hole forming system, and aims to solve the contradiction among precision, thermal damage and efficiency in ultrathin prepreg laser processing. According to the system, through cooperation of an ultrashort pulse laser source, precise light beam shaping and transmission, material processing and positioning, real-time monitoring and feedback and an intelligent control and optimization module, laser and material interaction is finely regulated and controlled. In a single laser event or an equivalent single laser event, high-precision and low-damage microstructure processing of the ultrathin prepreg is realized, the defects of a heat affected zone, carbonization, layering and the like are effectively reduced, and the processing quality and efficiency are improved.

The invention belongs to the technical field of hard and brittle crystal material micropore machining, and particularly relates to an ultra-precision micropore multi-energy field coupling machining method and system.The method comprises the steps that the laser pulse frequency and power are set according to the workpiece material type and the micropore depth-diameter ratio, and a laser focus is positioned at the inner hole bottom of a workpiece; a modified structure extending in the axial direction of a hole is formed by controlling matching of a light spot and a hole diameter and the movement track of the light spot, in the machining process, a plasma nozzle and laser coaxially move, a modified area is removed in real time, a heat affected zone and the hole shape taper are restrained, meanwhile, vibration is applied to a workpiece through an axial ultrasonic vibration device, and machining precision is improved. And chip discharge is promoted, and stress and crack generation are reduced. The problems of serious thermal damage, poor hole shape precision, low machining efficiency and high energy consumption in the micropore machining process in the prior art are solved, and high-quality and high-precision machining of the high-depth-diameter-ratio micropore of the hard and brittle transparent crystal material is achieved.

The invention discloses a wafer bonding method, which comprises the following steps of: 1, providing a first wafer and a second wafer, the surface of the first wafer being provided with a microstructure with a high aspect ratio; step 2, cleaning the first wafer and the second wafer; step 3, performing vacuum drying treatment on the first wafer and the second wafer, wherein the vacuum pressure is controlled to be 0.1-10 Torr in the vacuum drying treatment process; step 4, carrying out pre-bonding on the first wafer and the second wafer to form a bonding body; and step 5, carrying out annealing treatment on the bonding body. Aiming at the problem of residual water in the pre-cleaning process in the bonding process of the micro-structure wafer with a high aspect ratio, the wafer is placed in a controllable vacuum environment, phase change boiling of liquid water under the condition of no heat input is realized, and the problem of high-temperature heat damage caused by an existing heating and baking method is effectively avoided.

The invention belongs to the field of secondary battery manufacturing, and particularly relates to a composite foil current collector welding method.The composite current collector comprises an upper aluminum conducting layer, a middle high-molecular polymer layer and a lower aluminum conducting layer, and the welding method comprises the following steps that S1, micropore machining is carried out on a tab area of the composite current collector, forming a through micropore array; s2, laying a first pure metal foil on the upper surface of the tab area, and laying a second pure metal foil on the lower surface of the tab area; and S3, welding the tab area on which the pure metal foil is laid, so that the first pure metal foil, the upper aluminum conductive layer, the lower aluminum conductive layer and the second pure metal foil form through metallurgical bonding at the position of the micropore. According to the composite foil current collector welding method, ultrasonic energy is highly concentrated on a metal interface at the edge of a micropore, local metallurgical connection is achieved, overall heat input is low, hot melting and carbonization of a middle high-molecular polymer layer are effectively avoided, and an ultrathin metal layer is protected against heat damage.

The invention relates to a hard alloy micro-texture tool based on discharge plasma pressureless sintering and a preparation method. Comprising the following steps: preparing a micro-texture male die pressing head; wC-Co mixed powder is obtained; the pressure head in the step (1) is adopted to apply 150-180 MPa pressure to the WC-Co mixed powder, the pressure is maintained for 60 min, and a biscuit is obtained after demolding; putting the biscuit into a graphite mold, assembling the mold, carrying out vacuum pressureless sintering on the biscuit, heating to 1300-1400 DEG C at the heating rate of 90-110 DEG C / min, carrying out heat preservation for 10 + / -2 minutes, and then cooling to room temperature along with a furnace to obtain a hard alloy block with a micro-texture on the surface; and the micro-texture surface of the hard alloy block is only polished to be bright. According to the method, thermal damage and fusion edge collapse are thoroughly avoided, and high-precision, namely high geometric fidelity, high efficiency, namely short sintering period and low-cost preparation of the microstructure is realized.

The invention belongs to the technical field of thermal power heating surface treatment, and provides a gradient functional composite coating applied to a boiler heating surface and a preparation method of the gradient functional composite coating in order to solve the technical problems that an existing protective coating of the boiler heating surface is prone to abrasion and oxidation and high in cost. Collaborative design is formed, and gradient matching of mechanical properties and environmental failure resistance is achieved. The low-melting-point glass powder is combined with the rare earth catalytic effect, low-temperature ceramization is achieved, and thermal damage to a matrix is avoided. After the metal ceramic transition layer is sprayed, high-frequency induction remelting treatment is carried out, meanwhile, laser cladding is carried out on the surface of the ceramic surface layer, a nanocrystalline-amorphous composite structure is formed, and the bonding strength of the coating is improved.

The invention relates to the technical field of processing control, and discloses an intelligent control method and system for diamond compact laser processing equipment. The method comprises the following steps: scanning a diamond compact by adopting a spectral reflection sensor and an acoustic emission signal device to obtain a four-dimensional characteristic tensor; inputting the tensor into a two-channel convolutional network to identify the grain boundary type; a PDC-Lambda algorithm is executed to construct a crystal boundary-power response mapping matrix; and establishing a three-level power regulation and control framework based on the mapping matrix to realize accurate processing control. According to the invention, accurate classification and positioning of different grain boundary types are realized. The problem that a traditional method lacks a grain boundary-power mapping mechanism is solved, and the corresponding relation between grain boundary characteristics and optimal machining parameters is established. The problem of insufficient power regulation and control precision is solved, fine parameter control from macroscopic to microscopic is realized through a three-stage regulation and control architecture, and thermal damage and microcrack formation of a grain boundary region are effectively prevented.

A water-guided laser assembly and a precision machining assembly are fixed to the same side of a sliding plate of a vertical five-axis machine tool, an ultrasonic vibration platform is installed on a C-axis workbench of the vertical five-axis machine tool, and the water-guided laser assembly, the ultrasonic vibration platform and the precision machining assembly are controlled by an industrial personal computer to cooperate with each other; a positioning measuring head is adopted to realize relative compensation of the water jet and the cutter; the water jet cooling effect is utilized in water-guided laser processing to reduce the heat affected area and improve the processing quality; ultrasonic vibration auxiliary machining effectively reduces cutting force, inhibits the surface water return phenomenon, improves machining efficiency and prolongs the service life of a cutter; and precise machining (milling, grinding and drilling) is carried out, so that the machining size precision is accurately corrected, and the residual laser-induced damage layer is removed. Through multi-energy-field in-situ combined machining, collaborative optimization of technological parameters and coordinate compensation, the problems of insufficient precision, low efficiency, thermal damage and the like during machining of complex geometrical shapes and difficult-to-machine materials in a single machining technology are solved.

The invention relates to the technical field of medical cosmetology, discloses a laser hair removal method based on multi-parameter feedback, and aims to solve the problems of unstable curative effect and insufficient safety caused by single parameter of traditional laser hair removal. The method comprises the following steps: synchronously acquiring multi-dimensional physiological parameters such as skin type, hair follicle depth and epidermis temperature through multispectral imaging, high-frequency ultrasound and temperature sensing; constructing a personalized treatment parameter model based on a deep neural network, and generating initial energy density, pulse width and cooling parameters; laser output is regulated and controlled in real time by using a fuzzy logic controller in the treatment process, and it is ensured that thermal injury accurately acts on the hair papilla; performing adaptive optimization on the treatment strategy in combination with reinforcement learning, and continuously updating the model through a closed-loop learning mechanism; meanwhile, a treatment history database is established, curative effect prediction and parameter backtracking are supported, precision, individuation and high safety of laser depilation are achieved, depilation efficiency is remarkably improved, and the risk of skin adverse reaction is reduced.

The invention discloses a liquid nitrogen cooling and laser heating collaborative auxiliary cutting device and a cutting method thereof. The device comprises a laser heating system, a liquid nitrogen cooling system, a cutting system, a tool temperature monitoring system and a control system. Laser emitted by the laser heating system is focused on a to-be-machined area of a workpiece in front of a cutting edge after transmitting through the cutter body; the liquid nitrogen cooling system accurately sprays liquid nitrogen to the cutting edge area of the tool through a heat insulation liquid supply pipeline and a nozzle which are integrated in the tool rest. The control system dynamically and synergistically adjusts the laser output power and the liquid nitrogen injection flow based on a temperature signal sent by a thermocouple embedded in the cutter. According to the device, parallelism of the two processes of laser heating of a workpiece and liquid nitrogen cooling of a tool is achieved in space, dynamic matching and accurate balance of laser heating and liquid nitrogen cooling are achieved in time, and the problems that in laser-assisted cutting, the tool is prone to thermal damage, the cooling efficiency is low, and a thermal field is out of control are effectively solved.

The invention provides a method for processing a micropore by combining vortex beam shaping femtosecond laser with nanosecond laser, which comprises the following steps of: firstly, taking charge of melting and sublimation of a material by utilizing the high-power characteristic of the nanosecond laser, and then taking charge of finish machining of the hole wall of the processed micropore by utilizing the characteristics of small heat affected zone and high peak energy of the femtosecond laser. Therefore, the problems that the heat affected zone of the hole wall of the micropore machined by nanosecond laser is large, and the machining quality of the hole wall is poor due to material melting and recasting are solved. Therefore, the advantages of high efficiency of nanosecond laser micropore processing, small thermal damage area of femtosecond laser material processing and high micropore pattern quality of the processed micropore are combined, coarse and fine synchronous processing is finally realized, and the processing quality of the micropore wall is improved.

The invention relates to a memristor and a preparation method thereof. The preparation method comprises the following steps: providing an insulating substrate with a bottom electrode formed on the surface; depositing an aluminum oxide thin film on the bottom electrode by adopting electron beam evaporation under a room temperature condition to form a resistive function layer, and not performing high-temperature annealing treatment after deposition is completed, so that a primary oxygen vacancy defect is reserved in the thin film; and then depositing a top electrode on the resistive function layer through thermal evaporation or electron beam evaporation to obtain the memristor. The resistive function layer is an aluminum oxide film which is not densified through annealing, and internal defects of the resistive function layer provide a channel for metal ion migration, so that the reversible resistive characteristic is achieved. The memristor device is simple in structure and suitable for normal-temperature process preparation, the stable resistance switching behavior can be achieved, excessive densification of a film layer and thermal damage of an ITO electrode interface caused by high-temperature annealing are avoided, and the memristor has high cycle durability and nonvolatile data retention capacity and has the stable bipolar resistance change characteristic.

The invention, which relates to the technical field of electrified railway operation and maintenance, discloses a deep-learning-based intelligent laser clearing system for an overhead line system, comprising a time sequence baseline re-calibration module, an illumination sudden change identification module, an energy overshoot prediction module, an energy risk constraint module, a heat accumulation weakening module and a steady-state closed-loop regulation and control module. The method comprises the following steps: establishing a unified event time baseline, collecting an illumination intensity sequence of an overhead line system operation environment, constructing a non-uniform sampling re-calibration matrix, eliminating clock skew and sensing lag through time re-calibration, and obtaining a stable time sequence reference. According to the method, the illumination time sequence precision is improved through re-calibration and residual analysis, the feedforward model is combined to predict overshoot, the attitude parameters limit the high-risk interval, the dynamic threshold value and the phase compensation inhibit the laser abnormal wave crest, the thermal damage risk is reduced, and the intelligence, the safety and the stability of the difference clearing operation are improved.

The invention relates to the technical field of hybrid bonding, in particular to a laser-assisted hybrid bonding interconnection method, which comprises the following steps of: S1, processing the surface of a wafer to enable the to-be-bonded surface of the wafer to be flat; s2, cleaning a to-be-bonded surface of the wafer, and removing organic pollutants and an oxide layer; s3, aligning and fitting the surfaces to be bonded of the two wafers; s4, enabling the to-be-bonded surfaces to comprise dielectric layers and metal interconnection points, irradiating the dielectric layers with infrared laser, and carrying out the interconnection of the dielectric layers of the two to-be-bonded surfaces; and S5, the metal interconnection points are heated by blue laser, and the metal interconnection points of the two surfaces to be bonded are interconnected. In the hybrid bonding stage, the infrared laser and the blue laser are used for bonding the dielectric layer and the metal interconnection point respectively, partitioned irradiation and differentiated heating of the metal interconnection point and the dielectric layer are achieved, the problems of interface warping, microcracks and other thermal damage are effectively avoided, and the interconnection quality and the packaging reliability are improved.

The invention discloses a superhard cutter surface micro-nano structure preparation method based on ultrafast laser and a cutter. The method comprises the steps that a polycrystalline diamond cutter is fixed to a three-axis precision motion platform and precisely positioned and calibrated; after cleaning and online detection, parameters of the ultrafast laser are configured based on a result, and machining is executed; and evaluating the structure characterization of the generated laser-induced periodic surface. According to the method, thermal damage is avoided by means of the ultrafast laser near-cold machining characteristic, parameters are precisely regulated and controlled, a high-precision structure is efficiently prepared, the process is flexible and controllable, the limitation of a traditional technology is broken through, the tool performance is improved, a scheme is provided for cutting of aerospace materials difficult to machine, and non-damage microtexture preparation on the surface of the superhard tool is achieved.

Scintillators that are not thermally damaged by heat generated by a predetermined radiation pulse impinging on the scintillator.

The invention relates to a high-quality and high-efficiency laser drilling method. Aiming at the problems of low processing efficiency, poor hole making quality, unstable processing technology and the like in small hole laser processing of difficult-to-process materials, the method specifically comprises the following steps of: 1, performing high-feed rotary spiral hole making, and removing a large amount of materials to form through holes; namely, a proper rotating laser beam (rotating radius r1) is selected to form a laser ring, and spiral drilling is performed in a high-feed manner, so that a large amount of materials can be removed, and through holes can be formed. The second step is low-feed rotary finish machining, a small amount of materials are removed to form a through hole, the rotating radius r2 of a rotating laser beam is adjusted, the hole is subjected to finish machining at the low z-axis feeding speed, the high-quality through hole is obtained, and if the quality of the through hole or the hole repairing part is not qualified, the parameters are further adjusted. According to the method, the advantages of high femtosecond laser machining precision and small thermal damage are combined, efficient machining of the small holes is achieved, and a solution is provided for high-quality and efficient machining of the small holes.

The invention discloses a dynamic hot-pressing leveling control method and a yield improving system based on high-density LED packaging, and relates to the technical field of LED packaging. A viscoplastic flow area is formed through counterpoint preheating and selective thermal activation, contact pressure is built between the flexible leveling device and the surface of the LED chip array, solder paste is heated to be in a viscoplastic flow state, the flexible leveling device conducts posture correction on the chip, the solder paste is suddenly dropped to be below the freezing point of the solder paste through the semiconductor thermoelectric cooling module array, and then the solder paste is heated to be in the viscoplastic flow state. And fixation of the chip position and rapid solidification forming of a welding spot are realized. The method is characterized in that solder paste is heated to a viscoplastic flow state through a targeted thermal activation technology, the inherent contradiction between the thermal damage risk and a narrow process window caused by the fact that a component must be exposed to a high-temperature environment in order to obtain enough surface tension is solved, and the yield, the performance consistency and the long-term reliability of a product are remarkably improved.

The invention provides a performance test method and device, a storage medium, electronic equipment and a chip, and relates to the technical field of signal processing, and the method comprises the steps: firstly generating a multi-tone signal; carrying out the performance test of the radio frequency transmitting equipment based on the generated multi-tone signal; and then determining a performance test result of the radio frequency emission equipment. According to the technical scheme, the performance of the radio frequency transmitting equipment can be accurately tested, for example, the performance of a power amplifier can be accurately tested. Compared with the test scheme of the related technology, the performance information of the radio frequency emission equipment can be obtained by inputting the multi-tone signal at one time, scanning is not needed, and the test time can be greatly shortened. Moreover, heating is low, power consumption is low, thermal damage of the device caused by overheating is avoided, and the memory effect can be obtained.

The present invention comprises: a high-frequency oscillator that transmits high-frequency energy and includes a control unit; a high-frequency connecting line connected to the high-frequency oscillator; and a high-frequency transmission pad connected to the other end of the high-frequency connecting line and attached to the curve of facial skin in close contact with it, wherein the high-frequency transmission pad is configured such that an adhesive pad and a bipolar pad are integrated or separate. This invention relates to a non-invasive automatic facial lifting device using high-frequency energy that adheres closely to the curves of the face to be treated, thereby enabling uniform delivery of high-frequency energy to the skin, allowing for effective treatment without separate operation, minimizing the risk of excessive thermal damage to specific areas of the skin, resolving issues such as pain, scarring, and infection associated with existing invasive technologies, enhancing user convenience and safety through an automated control system and customized settings, and providing uniform treatment effects and reducing treatment time and fatigue by monitoring skin temperature in real time and delivering high-frequency energy according to set output, time, and patterns.

The present invention provides a secondary battery, battery pack, and electronic device that improve the energy density of the secondary battery while simultaneously preventing thermal damage to the separator. [Solution] The secondary battery includes a case and an electrode assembly housed within the case, the electrode assembly includes a winding structure formed by stacking and winding a positive electrode sheet, a separator and a negative electrode sheet, along the axial direction of the winding structure, the positive electrode current collector of the positive electrode sheet includes a positive electrode coated region and a positive electrode uncoated region, the negative electrode current collector of the negative electrode sheet includes a negative electrode coated region and a negative electrode uncoated region, a part of the positive electrode uncoated region is folded to form a positive electrode tab stacking region, the positive electrode tab stacking region includes a positive electrode tab stacking number stable region, within the positive electrode tab stacking number stable region, the number of stacked positive electrode tabs is m, a part of the negative electrode uncoated region is folded to form a negative electrode tab stacking region, the negative electrode tab stacking region includes a negative electrode tab stacking number stable region, within the negative electrode tab stacking number stable region, the number of stacked negative electrode tabs is n, where m > n.

The application discloses a device and a process for laser ablation induced controllable damage assisted grinding of hard and brittle materials, which adopts laser irradiation on the material surface, focuses the laser focal point on the material surface to be processed, removes and induces specific depth damage to the material by ablation. By controlling the laser power, scanning speed and ablation track, the degree and type of laser ablation induced thermal damage of the material are effectively controlled. The grinding path of the grinding wheel and the ablation path of the laser are controlled on the same axis, and the distance between the laser ablation and the grinding wheel grinding is set, and the workpiece ablation surface is ground under the preferred grinding parameters. The application systematically puts forward a quantitative control strategy for the degree of laser ablation damage of the material surface, removes the laser induced damage layer by accurate control of the material surface damage and precision grinding, and realizes high-efficiency and high-quality processing of the hard and brittle materials.

Optical energy for example, ultra-short laser beam pulses are delivered to a substrate by applying a temporal group 17 of optical pulses 16 to a region of the substrate 24. The temporal group 17 which

The utility model discloses an opening and closing mechanism and a vehicle with the opening and closing mechanism, and relates to the technical field of vehicles. The opening and closing mechanism comprises a cover plate, a blade assembly and a transmission assembly. The cover plate is provided with a window corresponding to a light-emitting unit of the lamp. The blade assembly comprises at least two blades, the blade assembly has a maximum position and a minimum position, all the blades are arranged in the circumferential direction of the window in the maximum position and define a maximum opening, and all the blades are arranged in the circumferential direction of the window in the minimum position so as to completely cover the window or define a minimum opening; the maximum opening and the minimum opening are arranged corresponding to the window, and the area of the minimum opening is smaller than that of the maximum opening. The transmission assembly is connected with all the blades of the blade assembly so as to drive the blade assembly to be switched between the maximum position and the minimum position, and the opening area defined by all the blades is adjusted. The opening and closing mechanism provided by the embodiment of the utility model is used for shielding the lamp and reducing direct light so as to avoid high temperature caused by focusing and thermal damage to peripheral components.

The utility model discloses a kind of construction protective fence connecting structure, belong to construction technical field, including longitudinal protective fence one, the side of longitudinal protective fence one is provided with horizontal protective fence one, the other end of horizontal protective fence one is provided with longitudinal protective fence two, the side of longitudinal protective fence two is provided with longitudinal protective fence three, the side of longitudinal protective fence three is provided with horizontal protective fence two, the utility model is connected by being provided with longitudinal protective fence connecting mechanism, longitudinal protective fence connecting mechanism adopts optimized bolt connection design, the quick installation between protective fence stand and firm connection is realized.Compared with traditional welding mode, bolt connection does not need on-site welding equipment, avoids the security risk in welding process and heat damage to material.Meanwhile, the bolt connection mode of the mechanism can be quickly disassembled and reused according to construction demand, greatly improves construction efficiency and material utilization.

The application provides a high-temperature-resistant small optical system packaging structure and a packaging method, and relates to the technical field of optical system packaging. The packaging method first uses high-temperature-resistant ceramics to prepare a high-temperature-resistant ceramic packaging structure base, and then sequentially stacks small optical systems and bonds the small optical systems on the high-temperature-resistant ceramic packaging structure base; then, in a water-free and oxygen-free environment, an indium-based sealing ring is used to complete the welding between the high-temperature-resistant ceramic packaging shell, the indium-based sealing ring and the high-temperature-resistant ceramic packaging structure base at low temperature. The low-temperature welding has small thermal damage to the devices in the small optical system, small residual thermal stress, good physical system airtightness, and the obtained packaging structure can maintain high stability and airtightness in a high-temperature environment. The packaging structure base and the packaging shell of the packaging structure both use high-temperature-resistant ceramics, and the overall thermal expansion of the packaging structure is consistent, so that damage caused by inconsistent stress when working in a high-temperature environment is avoided.