The invention relates to the technical field of
tissue engineering, and particularly discloses a lamina-free three-dimensional
aneurysm chip as well as a preparation method and application thereof. The method comprises the following steps: firstly, designing a non-layered three-dimensional
aneurysm chip mold which comprises a semi-
aneurysm part capable of being accurately matched with aneurysm physiological structural characteristics, then preparing a non-layered three-dimensional aneurysm
chip mold blank by adopting a photocuring 3D printing technology, and then
coating a photosensitive resin mixture to obtain the non-layered three-dimensional aneurysm chip mold. Laminated lines on the
surface layer of the mold blank are eliminated through the steps of
spin coating treatment,
ultraviolet curing and the like, the roughness of the surface of the mold blank is optimized, and finally the three-dimensional aneurysm chip is prepared through the soft photoetching technology. According to the method, through a series of combined processes of mold design, mold blank 3D printing, mold blank layer grain
elimination and soft photoetching of the chip, the recarving precision of the three-dimensional aneurysm chip is remarkably improved, and the strict requirement of an aneurysm in-vitro
simulation experiment for the structural precision is met; the technical defects that an existing three-dimensional aneurysm chip is low in precision, obvious in lamina and the like are overcome.