161 results about "Soft lithography" patented technology

The present invention provides methods, devices and device components for fabricating patterns on substrate surfaces, particularly patterns comprising structures having microsized and/or nanosized features of selected lengths in one, two or three dimensions. The present invention provides composite patterning devices comprising a plurality of polymer layers each having selected mechanical properties, such as Young's Modulus and flexural rigidity, selected physical dimensions, such as thickness, surface area and relief pattern dimensions, and selected thermal properties, such as coefficients of thermal expansion, to provide high resolution patterning on a variety of substrate surfaces and surface morphologies.

A build-up structure for chip to chip interconnects and System-In-Package utilizing multi-angle vias for electrical and optical routing or bussing of electronic information and controlled CTE dielectrics including mesocomposites to achieve optimum electrical and optical performance of monolithic structures. Die, multiple die, Microelectromechanical Machines (MEMs) and/or other active or passive components such as transducers or capacitors can be accurately positioned on a substrate such as a copper heatsink and multi-angle stud bumps can be placed on the active sites of the components. A first dielectric layer is preferably placed on the components, thereby embedding the components in the structure. Through various processes of photolithography, laser machining, soft lithography or anisotropic conductive film bonding, escape routing and circuitry is formed on the first metal layer. Additional dielectric layers and metal circuitry are formed utilizing multi-angle vias to form escape routing from tight pitch bond pads on the die to other active and passive components. Multi-angle vias can carry electrical or optical information in the form of digital or analog electromagnetic current, or in the form of visible or non-visible optical bussing and interconnections.

The invention is directed to methods for direct patterning of silicon. The invention provides the ability to fabricate complex surfaces in silicon with three dimensional features of high resolution and complex detail. The invention is suitable, for example, for use in soft lithography as embodiments of the invention can quickly create a master for use in soft lithography. In an embodiment of the invention, electrochemical etching of silicon, such as a silicon wafer, for example, is conducted while at least a portion of the silicon surface is exposed to an optical pattern. The etching creates porous silicon in the substrate, and removal of the porous silicon layer leaves a three-dimensional structure correlating to the optical pattern.

The present invention is directed to a thermally curable polymer composition, and a photolithographic substrate coated therewith, the composition comprising a hydroxyl-containing polymer, an amino cross-linking agent and a thermal acid generator. The thermally curable polymer composition may be dissolved in a solvent and used as an undercoat layer in deep UV lithography.

Microfluidic biofuel cells comprising a bioanode and/or a biocathode are formed using microfluidic principles and soft lithography. The enzymes utilized in the redox reactions at the bioanode and/or the biocathode are stabilized in a micellar or inverted micellar structure. The biofuel cell is used to produce high power densities.

A method for manufacturing microneedle structures is disclosed using soft lithography and photolithography, in which micromold structures made of a photoresist material or PDMS are created. The micromold manufacturing occurs quite quickly, using inexpensive materials and processes. Once the molds are available, using moldable materials such as polymers, microneedle arrays can be molded or embossed in relatively fast procedures. In some cases a sacrificial layer is provided between the forming micromold and its substrate layer, for ease of separation. The microneedles themselves can be solid projections, hollow “microtubes,” or shallow “microcups.” Electrodes can be formed on the microneedle arrays, including individual electrodes per hollow microtube.

Soft lithography with surface tension control is used to microfabricate extremely efficient solid immersion lenses (SILs) out of rubber elastomeric material for use in microscope type applications. In order to counteract the surface tension of the mold material in a negative mold that causes creep on a positive mold, material such as RTV is partially cured before use in order to allow the reticulation of polymer chains to change the viscosity of the uncured material in a controllable manner. In a specific embodiment, the techniques of soft lithography with surface tension control are used to make molded SILs out of the elastomer polydimethylsiloxane. The lenses achieve an NA in the range of 1.25. The principle of compound lens design is used to make the first compound solid immersion lens, which is corrected for higher light gathering ability and has a calculated NA=1.32. An important application of these lenses is integrated optics for microfluidic devices, specifically in a handheld rubber microscope for microfluidic flow cytometry.

The invention provides a method for preparing graphene gas sensors in batches based on nano soft lithography, belonging to the field of preparation of graphene sensors. In order to solve the problems in the existing graphene sensor preparation technology that the graphene shapes and sizes are difficult to control, and the prepared graphene sensors have inconsistent performances, thus being not beneficial to micro/nano graphene sensor integration, the method comprises the following steps: 1. preparation of a graphene film; 2. preparation of graphenes (including graphenes prepared by a reduction-oxidation method and a CVD (chemical vapor deposition) method) in regular shapes; 3. modification of graphenes; and 4. preparation of the graphene gas sensors in batches. The method is mainly used for preparing the graphene gas sensors in batches. The method has the following advantages: the advantages of nano soft lithography and the two-dimensional material graphene are given full play to; and the prepared strip graphene sensors have the same properties, laying a foundation for wide application and industrialization of the graphene sensors.

Embodiments of the invention provide a device called a “G-Fresnel” device that performs the functions of both a linear grating and a Fresnel lens. We have fabricated the G-Fresnel device by using PDMS based soft lithography. Three-dimensional surface profilometry has been performed to examine the device quality. We have also conducted optical characterizations to confirm its dual focusing and dispersing properties. The G-Fresnel device can be useful for the development of miniature optical spectrometers as well as emerging optofluidic applications. Embodiments of compact spectrometers using diffractive optical elements are also provided. Theoretical simulation shows that a spectral resolution of approximately 1 nm can be potentially achieved with a millimeter-sized G-Fresnel. A proof-of-concept G-Fresnel-based spectrometer with subnanometer spectral resolution is experimentally demonstrated.

A conventional semiconductor LED is modified to include a microlenslayer over its light-emitting surface. The LED may have an active layer including at least one quantum well layer of InGaN and GaN. The microlens layer includes a plurality of concave microstructures that cause light rays emanating from the LED to diffuse outwardly, leading to an increase in the light extraction efficiency of the LED. The concave microstructures may be arranged in a substantially uniform array, such as a close-packed hexagonal array. The microlens layer is preferably constructed of curable material, such as polydimethylsiloxane (PDMS), and is formed by soft-lithography imprinting by contacting fluid material of the microlens layer with a template bearing a monolayer of homogeneous microsphere crystals, to cause concave impressions, and then curing the material to fix the concave microstructures in the microlens layer and provide relatively uniform surface roughness.

The invention discloses a method and a device for detecting and separating HP ELISA. According to the method, a prepared magnetic bead provided with HP, an enzyme-labeled antibody, an enzyme reaction substrate, a gastric juice sample and a cleaning fluid are placed in different liquid storage tanks on a micro-fluidic chip by the aid of an electric fluid force, and flow of liquids in the different liquid storage tanks is electrically controlled , so that ELISA is fully and automatically detected; and a detected fluorescence signal is taken as a trigger signal, so that an HP sample is fully and automatically separated. The device comprises a platform structure, the micro-fluidic chip and an electric cabinet, wherein the micro-fluidic chip comprises a glass sheet, a PDMS (polydimethylsiloxane) square plate and a driving electrode, a micro channel, a mixed channel and a detection area are formed in the surface of the PDMS square plate in a photoetching manner by the aid of a soft lithography technology, and the liquid storage tanks are arranged on the PDMS square plate. The device for detecting and separating the HP ELISA has the advantages as follows: the device is small in size, light in weight, convenient to carry and operate and low in construction cost and can be handheld for field detection, thereby facilitating popularization and application.

The present invention relates to a silicone rubber like material and a printing device including a stamp layer (100;201) comprising such a material. The material is suitable for use in soft lithography as it enables stable features having mensions in the nanometer range to be obtained on a substrate, and also allows for the accommodation onto rough and non-flat substrate surfaces. The invention also relates to methods for manufacturing the silicone rubber like material and stamp layer (100;201) and use thereof in lithographic processes.

The invention provides a rapid intersection method for STL (stereo lithography) models of products, and belongs to the technical field of reverse engineering of products. The method is characterized in that an STL model dynamic index structure is built based on the R*-tree; the intersection range is rapidly narrowed through the intersection detection of index node bounding boxes; an intersecting triangle patch bounding box set is accurately positioned, and topological K-nearest neighbor sorting of the set is carried out; and the intersecting line sections of triangular mesh surface models in all the bounding boxes are connected in sequence, so as to rapidly extract the intersecting lines of the surface models. Examples prove that the method can effectively improve the intersection efficiency of STL surface models with intensive data and complicated shapes, and is of great significance for the clipping and splicing of the triangular mesh surface models and numerically-controlled tool path generation in reverse engineering.

The invention discloses an SLA (stereo lithography) technology of a light curing stereo homocentric sphere which is characterized by comprising the following steps: 1) designing product; 2) loading data and establishing support; 3) carrying out layering treatment on an RPDate; 4) loading SLC data based on SLA; 5) processing and manufacturing products based on SLA; 6) clearing; and 7) inspecting. In the invention, hollow sphere manufactured after process improvement has a bright and clean surface and is convenient to post process, furthermore, the cost is low, the product surface is beautified, and the product hardness is increased.

The invention relates to a method for treating a groove and forming a UMOS (U-shaped groove Metal Oxide Semiconductor) transistor, wherein the method for treating the groove comprises the step of carrying out soft lithography on the groove. The invention improves the uniformity of the dielectric layers of the side wall and the bottom of the groove; the process complexity is not increased obviously, and the production cost and the capacity are not changed obviously.

Metallic thermal emitters consisting of two layers of differently structured nickel gratings on a homogeneous nickel layer are fabricated by soft lithography and studied for polarized thermal radiation. A thermal emitter in combination with a sub-wavelength grating shows a high extinction ratio, with a maximum value close to 5, in a wide mid-infrared range from 3.2 to 7.8 μm, as well as high emissivity up to 0.65 at a wavelength of 3.7 μm. All measurements show good agreement with theoretical predictions. Numerical simulations reveal that a high electric field exists within the localized air space surrounded by the gratings and the intensified electric-field is only observed for the polarizations perpendicular to the top sub-wavelength grating. This result suggests how the emissivity of a metal can be selectively enhanced at a certain range of wavelengths for a given polarization.