Electrochemical etching tailors topography of a nanocrystalline or amorphous metal or alloy, which may be produced by any method including, by electrochemical deposition. Common etching methods can be used. Topography can be controlled by varying parameters that produce the item or the etching parameters or both. The nanocrystalline article has a surface comprising at least two elements, at least one of which is metal, and one of which is more electrochemically active than the others. The active element has a definite spatial distribution in the workpiece, which bears a predecessor spatial relationship to the specified topography. Etching removes a portion of the active element preferentially, to achieve the specified topography. Control is possible regarding: roughness, color, particularly along a spectrum from silver through grey to black, reflectivity and the presence, distribution and number density of pits and channels, as well as their depth, width, size. Processing parameters that have been correlated in the Ni—W system to topography features include, for both the deposition phase and the etching phase of a nanocrystalline surface: duty cycle, current density, deposition duration, plating chemistry, polarity ratio. The relative influence of the processing parameters can be noted and correlated to establish a relationship between values for processing parameters and degree of topography feature. Control can be established over the topography features. Correlation can be made for any such system that exhibits a definite spatial distribution of an active element that bears a predecessor spatial relationship to a desired topography feature.