The invention provides an electrochemical
levelling and
polishing processing method with nanometer precision and a device thereof, relating to an
electrochemical etching levelling and
polishing technology. The device is provided with a cutter with nanometer
levelling precision, an electrochemical
reaction control system capable of accurately controlling the thickness of an
etching levelling agent
liquid layer in nanoscale, a solution circulating device, a solution
thermostat and an
automatic control system. The method is implemented by the following steps: preparing the cutter with nanometer levelling precision to serve as an electrochemical
working electrode, and placing the cutter at the bottom of a container together with a workpiece; immersing the cutter in a solution, starting an electrochemical
system, generating the
etching levelling agent on the surface of the cutter, compressing the
etching levelling agent
liquid layer on the cutter surface into a nanoscale thickness, and regulating and controlling the thickness of the etching levelling agent
liquid layer; driving a tri-dimensional micro-drive device, leading the cutter to approach the workpiece gradually, and regulating and controlling the distance and parallelism between the workpiece surface and the cutter; and leading the cutter to move toward the workpiece surface, and enabling the constraint etching levelling agent liquid layer on the
cuter surface to contact with the workpiece surface until the whole workpiece is etched, leveled and polished.