1916results about "Printed circuits" patented technology

The invention relates to the technical field of data processing, and discloses a method and system for monitoring the running state of reflow soldering equipment. The method comprises the steps of collecting data through a multi-point sensor, extracting temperature gradient, tension fluctuation and gas concentration characteristics, constructing a state recognition model, calculating a health index and setting an early warning threshold value, constructing a fault precursor extraction model to predict a future state, and finally establishing a maintenance strategy optimization system and generating an equipment maintenance plan based on fault early warning information. Through multi-dimensional data fusion and intelligent analysis, early accurate identification of the abnormal state of the equipment, accurate prediction of the fault development trend and active maintenance decision based on quality influence and cost optimization are realized, so that the welding quality stability is improved, the non-planned downtime is shortened, and the maintenance cost is reduced.

Wireless chargers that can properly align and securely hold an electronic device, provide power to more than one electronic device, and fold into a compact shape. One example can provide a wireless charger having an alignment feature to align an electronic device to the wireless charger. The wireless charger can further include an attachment feature to attach the electronic device to the wireless charger such that the electronic device is securely held in place relative to the wireless charger. The wireless charger can include a first leaf having first charging components for charging a first electronic device and a second leaf having second charging components for charging a second electronic device. The first leaf and the second leaf can fold together into a compact shape.

An adjustment method of a laser processing apparatus includes a spatial light modulator adjustment step of adjusting a spatial light modulator into a state ready for splitting a laser beam emitted from a laser oscillator and applying a plurality of laser beams such that laser beams will have a desired positional relation, a processing mark formation step of operating the laser oscillator to apply the laser beams to a wafer such that a plurality of processing marks is formed, an imaging step of stopping the laser oscillator, and imaging the processing marks formed at the wafer, and an aberration correction step of correcting aberration of the condenser by comparing the desired positional relation and a positional relation among the imaged processing marks, and adjusting the spatial light modulator such that the positional relation among the processing marks conforms to the desired positional relation.

Technologies for components embedded in a substrate core are disclosed. In one embodiment, power components such as deep trench capacitors are disposed in a cavity defined in a substrate core for a circuit board of an integrated circuit package, such as a processor. The power components are stacked on top of each other, allowing for the stack of power components to match the height of the substrate core, even when the height of the individual power components is less than the height of the substrate core. The stack may include, e.g., three or more power components. Through-silicon vias in some or all of the power components can allow for connections through one power component to another. Configuring the power components in this manner can provide mechanical stability to the power components and substrate core and provide power to a semiconductor die mounted on the circuit board.

The invention discloses a high-precision circuit board laser drilling process, and particularly relates to the technical field of circuit board processing, and the high-precision circuit board laser drilling process comprises the following steps: step 1, selecting a high-quality base material and a copper-clad layer, and carrying out pretreatment on the base material, the pretreatment comprises cleaning and deoxidation, and the interaction efficiency of laser and the material is improved; 2, according to the design requirement of the circuit board, the position needing to be drilled and the aperture size are determined and completed through CAD software, a drilling data file is generated, the circuit board to be drilled is fixed to a drilling machine, and it is guaranteed that the board face is smooth and free of deformation; thirdly, a CO2 laser is selected, light beam focusing, laser power stability and laser beam uniformity of laser drilling equipment are optimized, and stability and accuracy of laser are guaranteed. According to the invention, high-precision laser drilling processing can be realized, the drilling processing quality of the circuit board can be ensured, the processing defective rate is obviously reduced, the popularization and the use are facilitated, and meanwhile, the method is suitable for a modern production process.

The invention relates to a method of coupling a battery cell to a battery cell monitoring and control circuit, the method comprising the steps of: providing a battery cell (10) comprising a multilayer structure comprising two electrode layers (11, 12) separated by a separator layer (17) and two electrically conductive outer faces (13, 14) extending parallel to the layers of the multilayer structure; providing a microcircuit (MC) comprising two connection pads (21, 22) respectively formed on opposite faces or on the same face of the microcircuit, the microcircuit being inserted into a volume defined by two planes respectively comprising an electrically conductive outer face of the battery cell; an electrically conductive connection (25, 26) is formed between each connection pad of the microcircuit and a respective electrically conductive face of the battery cell.

The utility model discloses a circuit board bearing jig and processing equipment, and belongs to the technical field of laser engraving, in the circuit board bearing jig, a driving assembly drives a negative pressure adsorption platform to be lifted, so that the negative pressure adsorption platform jacks up a circuit board to be separated from a conveying mechanism, the circuit board is supported on the negative pressure adsorption platform, and the circuit board is clamped on the negative pressure adsorption platform; the adsorption force generated by the negative pressure adsorption platform enables the circuit board to be flatly laid on the negative pressure adsorption platform and to be fixed, thereby preventing the circuit board from warping, and improving the position precision and the yield of two-dimensional code engraving. In addition, the circuit board is fixed through pressure difference generated by adsorption, and compared with a mechanical clamping and fixing mode, the surface quality of the circuit board is protected.

The invention relates to the field of antenna welding devices, in particular to an RFID antenna tail end pin welding device which comprises a bottom plate, a welding gun arranged on the upper side of the bottom plate, a center column fixedly installed in the center of the upper side of the bottom plate, a transposition mechanism used for rapidly switching welding point positions and a correcting mechanism used for correcting the tail end of an antenna. The rotating base plate, the discharging base and the pushing assembly in the transposition mechanism are matched, circumferential rotation of the rotating base plate is matched with radial sliding of the discharging base, the discharging base drives a circuit board on the discharging base to slide once every time the rotating base plate rotates by a circle, and therefore automatic switching of welding point positions is achieved; the clamping plate, the pressing wheel and the wedge-shaped piece in the correcting mechanism are adopted, the wedge-shaped piece triggers the moving assembly to drive the clamping plate to clamp and straighten the tail end of the antenna, meanwhile, the pressing wheel downwards presses the tail end of the antenna, the problem of insufficient soldering or poor contact caused by antenna bending in the welding process is effectively solved, and the welding quality is ensured.

The invention relates to the technical field of circuit board processing, in particular to a laser drilling method, a storage medium, laser drilling equipment and a high-frequency high-speed substrate. The laser drilling method comprises the steps that hole machining information of a hole structure is obtained, wherein the hole machining information comprises the hole position, the hole outer contour and the hole depth; taking the hole position as a positioning reference, and performing at least one of laser winding and cutting treatment and laser etching treatment on the high-frequency high-speed substrate to form a hole structure; wherein the laser winding and cutting treatment comprises the steps that first laser is controlled to move along a first closed path matched with the outer contour of the hole, so that the side wall of the hole structure is formed; and the laser etching treatment comprises the steps of controlling a second laser to carry out punching processing on an enclosed area of the outer contour of the hole so as to remove a base material in the enclosed area and form a bottom wall of the hole structure, and the method can be used for manufacturing the high-quality hole structure on the high-frequency and high-speed substrate and also can be used for manufacturing the high-quality hole structure on the high-frequency and high-speed substrate. And the processing efficiency of manufacturing a high-quality hole structure on the high-frequency and high-speed substrate can be obviously improved.

A power amplifier device includes a transistor die with an elongated bondpad coupled to a terminal of an integrated transistor. The device also includes a substrate formed from a stack of alternating dielectric and patterned conductive layers. An elongated die contact is exposed at a first substrate surface and is attached to the elongated bondpad to provide a uniform connection between the die contact and the elongated bondpad. A vertical interconnect structure is connected to the die contact and extends towards the second substrate surface. A circuit includes passive component(s) coupled to the second substrate surface and to the vertical interconnect structure. An encapsulation material layer covers the passive component(s) and the second substrate surface. A plurality of device interconnects are coupled to the substrate, electrically coupled to the power transistor die, and exposed at a contact surface of the power amplifier device.

The invention relates to the technical field of PCB inspection, and discloses a laser engraving device of a PCB appearance detection system, the laser engraving device comprises a fixing frame, the upper surface of the fixing frame is fixedly connected with a first motor, the output end of the first motor is fixedly provided with a rotating rod, the outer wall of the rotating rod is fixedly connected with a rotating plate, and the rotating plate is fixedly connected with a rotating shaft. A first rotating shaft is fixedly connected to the interior of the rotating plate, a rotating block is rotatably connected to the outer wall of the first rotating shaft, a second rotating shaft is fixedly connected to the interior of the rotating block, a sliding plate is rotatably connected to the outer wall of the second rotating shaft, a limiting block is fixedly connected to the upper surface of the sliding plate, and a limiting strip is slidably connected to the interior of the limiting block. The first motor is started to drive the rotating rod to rotate, through cooperation of the rotating plate, the first rotating shaft, the rotating block, the second rotating shaft, the sliding plate, the limiting block, the connecting plate, the spring and the clamping plates, the distance between the clamping plates is adjusted, the effect of being suitable for PCBs of different sizes and fixing the PCBs is achieved, and the stability in the transferring process is guaranteed.

An electronic device may include an input button assembly including an input member positioned along a side exterior surface of a housing component and defining a first input region proximate a first end of the input member and a second input region proximate a second end of the input member, the input member configured to receive a user input. The input button assembly may further include a beam structure at least partially within the enclosure and coupled to the input member, the beam structure configured to be deflected as a result of the user input, a first strain sensing element at a first location of the beam structure, and a second strain sensing element at a second location of the beam structure.

The present disclosure provides a package of a 3D integrated circuit. The package of the 3D integrated circuit includes a substrate structure having a first surface and a second surface opposite the first surface; the high-power bare core is arranged above the substrate structure; the low-power bare core is arranged above the high-power bare core; a first interposer disposed between the first surface of the substrate structure and the high-power die; and a second interposer disposed between the high power die and the low power die. The substrate structure includes a thermal enhancement portion underlying the high power die, and at least one of thermal conductivity or geometry of the thermal enhancement portion differs from other portions of the substrate structure. A substrate structure of a package of a 3D integrated circuit is also provided.

The invention relates to the technical field of laser cutting equipment, and discloses automatic processing equipment for a substrate of a satellite-borne circuit board, the automatic processing equipment comprises a supporting seat, a sliding table is slidably connected to the inner wall of the supporting seat, and a cooling mechanism is arranged on the inner wall of the supporting seat; the cooling mechanism comprises a cooling mechanism; the inner wall of the supporting table is fixedly connected with the inner wall of the supporting base, the inner wall of the supporting table is fixedly connected with an isolation plate, a collecting groove is formed in the surface of the isolation plate, a connecting hole is formed in the groove wall of the collecting groove, and an adsorption mechanism is arranged on the surface of the isolation plate and comprises a supporting plate; the bottom of the supporting plate is fixedly connected with the surface of the isolation plate. According to the substrate cutting device, the substrate is cooled in the substrate cutting process through the cooling mechanism, meanwhile, cutting residues are collected, the cut face of the substrate is kept flat, the situation that the substrate is cooled through negative pressure, the substrate vibrates in the cooling process due to the fact that the cut face is provided with impurities is prevented, and the cutting stability of the substrate is improved.

Provided are: a novel composite compound for a low-dielectric-loss resin composition, which suppresses the loss coefficient in a high-frequency band and has good dielectric loss; a low-dielectric-loss resin composition; a molded article for a high-frequency device; and a high-frequency device. This composite compound for a low-dielectric-loss resin composition is a composite compound for a low-dielectric-loss resin composition, and is characterized by containing a base material containing an inorganic fluoride and particles of a fluororesin held on at least a part of the surface of the base material, the dielectric loss tangent of the particles of the fluororesin is 0.002 or less at a frequency of 1 GHz or more and a temperature of 25 DEG C.

A resin composition and an article made therefrom are provided. The resin composition includes: (A) 100 parts by weight of an unsaturated bond-containing polyphenylene ether resin; (B) 20 parts by weight to 150 parts by weight of a copolymer, the copolymer having a structural unit formed by a monomer of Formula (1) and a structural unit formed by a monomer of Formula (2), and the content of the structural unit formed by the monomer of Formula (2) in the copolymer is 55 wt % to 90 wt %; and (C) 10 parts by weight to 40 parts by weight of an unsaturated bond-containing crosslinking agent. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including glass transition temperature, Z-axis ratio of thermal expansion, multi-layer board heat resistance, interconnect stress test, dissipation factor aging rate, temperature coefficient of dielectric constant, temperature coefficient of dissipation factor and branch-like pattern at laminate edges.

According to the mask defect in-situ repairing method, the femtosecond laser is adopted for defect repairing, and all the advantages of the femtosecond laser are absorbed. Femtosecond laser is ultrashort pulse laser with'femtosecond 'as a time unit, the pulse duration time of the femtosecond laser is extremely short (femtosecond magnitude), and the peak power of the femtosecond laser is extremely high (the maximum can reach pat watt). Therefore, according to the repairing method, the repairing precision can be reduced to 15 nm, the heat affected zone is smaller than 1 micron, the repairing time can be shortened to 100 ms for the defect of 100 nm, the roughness of the repaired surface is smaller than or equal to 0.5 nm, meanwhile, the good effects of high repairing precision, low heat affected zone, high repairing speed, low equipment cost and simple operation are achieved, and the rejection rate of the mask is reduced. The method is especially suitable for repairing advanced process masks, such as EUV and ArF, and display panel masks, such as OLED and FMM, and MEMS device masks.

An electronic device is provided. The electronic device includes a slidable housing including a first housing and a second housing, a first substrate included in the first housing and including a processor, a second substrate included in the second housing, a flexible printed circuit board (FPCB) which includes a ground line, electrically connects the first substrate and the second substrate to each other, and has a shape changed according to the movement of the slidable housing, and a matching circuit electrically connecting the first substrate and at least a portion of the ground line of the FPCB, and changing impedance under the control of the at least one processor according to the shape of the FPCB.

The application belongs to the technical field of electronic component recycling, in particular to a waste electronic component recycling device, which comprises a workbench, a clamping assembly is arranged on the upper end of the workbench, the clamping assembly comprises a first rectangular plate which is slidably arranged on the upper end of the workbench, two clamping strips are slidably arranged on the upper end of the first rectangular plate, a cylinder is slidably arranged on one side of the upper end of the first rectangular plate, a through hole is formed in the lower end of the cylinder, a hot air blower is arranged on one side of the cylinder, a baffle is arranged on the middle of the upper end of the workbench, a crushing box is arranged on one side of the workbench, an extrusion roller is rotatably arranged in the crushing box, and a discharge port is arranged on one side of the lower end of the crushing box. The device can automatically remove the resistors, capacitors and other components on the surface of the circuit board by using the heating separation method, without damaging the circuit board and the resistors, capacitors and other components, thereby reducing the harm of harmful substances to the environment.

The invention provides a drilling processing method for a ceramic substrate. The drilling processing method for the ceramic substrate comprises the following steps: forming a large hole in the ceramic substrate by adopting laser drilling, wherein the aperture of the large hole is 0.25-5mm or is 0.5 times greater than the thickness of the ceramic substrate; filling the macropores with a composite material containing a ceramic filler and thermosetting resin, and forming a supporting layer through a curing process; and the supporting layer is mechanically drilled to form small holes, and the hole diameter of the small holes is smaller than that of the large holes. According to the ceramic substrate drilling machining method, through stepped drilling of laser taper hole guiding, composite material filling and mechanical precision drilling, the problem that small holes of a thin substrate are prone to cracking during machining is solved, the yield is increased, the risk of breakage of a hard drill bit for mechanical drilling can be reduced, machining time is shortened, and the production cost is reduced; the drilling processing method is compatible with various ceramic substrates, and can solve the problem of multi-material integration of electronic packaging.

The utility model provides a multi-contact-pin welding tool. The multi-contact-pin welding tool comprises a base, a flat plate and a pressing buckle. The front surface of the base is provided with a plurality of hole structures corresponding to contact pins of to-be-welded printed boards in position, and the back surface of the base is provided with sockets matched with the to-be-welded printed boards in number; the flat plate is arranged on the front face of the base and provided with grooves corresponding to the sockets in position and used for containing printed boards to be welded. The pressing buckle is arranged on the flat plate, can rotate along a rotating shaft of the pressing buckle and is used for pressing or loosening the printed board to be welded in the groove. The device is simple in structure, convenient to operate, and capable of effectively and accurately limiting and fixing the contact pin during welding. The printed board is fixed by the elastic component, so that the printed board can be conveniently installed before welding and taken down after welding, and the damage of the elastic component to the printed board is small.

An electronic device may include an input button assembly including an input member positioned along a side exterior surface of a housing component and defining a first input region proximate a first end of the input member and a second input region proximate a second end of the input member, the input member configured to receive a user input. The input button assembly may further include a beam structure at least partially within the enclosure and coupled to the input member, the beam structure configured to be deflected as a result of the user input, a first strain sensing element at a first location of the beam structure, and a second strain sensing element at a second location of the beam structure.

A portable communication device is provided. The portable communication device includes a foldable housing including a first housing and a second housing, a hinge structure coupled with the first housing and the second housing, a flexible display accommodated in the first housing and the second housing, a communication processor accommodated in the foldable housing, and an antenna module electrically connected with the communication processor and configured to transmit and / or receive a millimeter wave signal, wherein the antenna module is disposed in a peripheral portion of the first housing such that, when the foldable housing is fully unfolded, at least a portion of the antenna module is overlapped with the hinge structure when viewed from above the hinge structure.

Provided is a heat-curable resin composition that not only has a low dielectric tangent but also is excellent in adhesivity, and that particularly results in a cured product which exhibits an excellent desmear resistance. The heat-curable resin composition includes (A) an aromatic cyclic imide compound having a weight average molecular weight of 5,000 to 100,000, (B) an aliphatic cyclic imide compound having a weight average molecular weight of 100 to 2,000, (C) an epoxy resin having two or more epoxy groups in one molecule, (D) a curing agent for epoxy resin, (E) a curing catalyst, and (F) an inorganic filler, wherein the heat-curable resin composition contains the components (A) to (E) in a total amount of 5 to 99% by mass based on the overall composition.

Provided is a styrene resin, a hydroxy resin, a method for producing a hydroxy resin, a method for producing a styrene resin, a resin composition containing a styrene resin, a cured product, a prepreg, a metal foil-clad laminate, a resin composite sheet, a printed wiring board, and a semiconductor device. Provided is a hydroxy resin represented by Formula (T-OH) and having a number average molecular weight of 850 to 4000. In Formula (T-OH), R is a group containing structural units represented by Formula (Tx-OH).

An electronic component includes a body, an inner conductor inside the body, and an outer electrode that lies on part of at least a first main surface of the body and includes an underlying electrode and a plating electrode with which the underlying electrode is covered. The underlying electrode includes a first underlying electrode on part of the first main surface and connected directly to the inner conductor and a second underlying electrode at part of the first main surface away from the first underlying electrode and closer than the first underlying electrode to the center of the body in the length direction and not connected directly to the inner conductor. The plating electrode includes first and second plating electrodes. The first underlying electrode is covered with the first plating electrode, and the second underlying electrode is covered with the second plating electrode.

The welding auxiliary device comprises an operation table, a fixing assembly is arranged on the rear side of the upper end of the operation table, a welding gun is fixedly connected to the front side of the upper end of the operation table, a moving assembly is arranged at the upper end of the operation table, and a blowing and sucking assembly is arranged at the upper end of the operation table. And a cleaning assembly is arranged above the moving assembly. A limiting groove is matched with a limiting roller and other structures, after welding is finished, a PCB can be automatically turned over by 180 degrees, the PCB can be further matched with a liquid bag and other structures to achieve spraying and cleaning of the welded PCB, meanwhile, through an annular pipe, a spraying ring and other structures, dust and small particles at the upper end of the PCB are blown up and flow downwards through airflow, and the dust and the small particles are prevented from falling off. And the PCB is adsorbed and fixed by the multilayer board, so that the effect of blow-drying the cleaning agent on the PCB can be achieved, and the drying and cleaning of the PCB can be ensured.

Techniques are provided herein to form semiconductor devices that include a dielectric wall between adjacent semiconductor devices where the gate electrodes of the adjacent semiconductor devices are conductively connected above the dielectric wall. First and second adjacent semiconductor devices each include a gate structure around or otherwise on a semiconductor region. The gate structures each include a gate dielectric and a gate electrode. A dielectric wall may extend in the first direction between the semiconductor regions of the adjacent devices and in a third direction along a portion of a total height of the adjacent gate structures. Accordingly, a portion of the gate electrode of the first device contacts a portion of the gate electrode of the second device over a top surface of the dielectric wall. The dielectric wall separates the gate dielectric of the first device from contacting any portion of the gate dielectric of the second device.

A semiconductor package may include a semiconductor die stack in a stepped pattern, an encapsulation layer sealing the semiconductor die stack and including a first surface coplanar with a bottommost surface of the semiconductor die stack and a second surface opposite the first surface, the second surface having a groove, a printed circuit board on the second surface of the encapsulation layer and including a conductive pad facing the second surface of the encapsulation layer, a conductive connector filling the groove, and a bonding wire group penetrating the conductive connector in a vertical direction and connecting the semiconductor die stack to the conductive pad of the printed circuit board. A width of the conductive connector in a lateral direction may be greater than or equal to a width of the conductive pad in the lateral direction.

The utility model relates to the technical field of welding jigs, and discloses a wave-soldering jig which comprises a jig body, the upper surface of the jig body is rotationally connected with two swing plates, the other ends of the two swing plates are fixedly connected with a heat dissipation plate, clamping grooves are formed between the two swing plates, a clamping column is clamped between the two clamping grooves, and the clamping column is fixedly connected with the heat dissipation plate. Two sliding grooves are formed in the inner bottom wall of the jig body. According to the wave-soldering jig, the welding effect of equipment can be improved through the cooperation of the installation tin dragging pins and external flux paste, the tin connection phenomenon is avoided, the one-time qualification rate is improved, the circuit board body can be conveniently disassembled through the cooperation of the installation supporting plate and the spring, the circuit board can be actively popped out after welding of the circuit board is completed, and the welding efficiency is improved. And through cooperation of the swing plate and the heat dissipation plate, the heat dissipation plate can make close contact with the circuit board, meanwhile, heat dissipation can be conducted on the circuit board body, and deformation of the circuit board due to high temperature is avoided.