1318results about "Printed circuits" patented technology

An adjustment method of a laser processing apparatus includes a spatial light modulator adjustment step of adjusting a spatial light modulator into a state ready for splitting a laser beam emitted from a laser oscillator and applying a plurality of laser beams such that laser beams will have a desired positional relation, a processing mark formation step of operating the laser oscillator to apply the laser beams to a wafer such that a plurality of processing marks is formed, an imaging step of stopping the laser oscillator, and imaging the processing marks formed at the wafer, and an aberration correction step of correcting aberration of the condenser by comparing the desired positional relation and a positional relation among the imaged processing marks, and adjusting the spatial light modulator such that the positional relation among the processing marks conforms to the desired positional relation.

The invention relates to a method of coupling a battery cell to a battery cell monitoring and control circuit, the method comprising the steps of: providing a battery cell (10) comprising a multilayer structure comprising two electrode layers (11, 12) separated by a separator layer (17) and two electrically conductive outer faces (13, 14) extending parallel to the layers of the multilayer structure; providing a microcircuit (MC) comprising two connection pads (21, 22) respectively formed on opposite faces or on the same face of the microcircuit, the microcircuit being inserted into a volume defined by two planes respectively comprising an electrically conductive outer face of the battery cell; an electrically conductive connection (25, 26) is formed between each connection pad of the microcircuit and a respective electrically conductive face of the battery cell.

The invention relates to the technical field of circuit board processing, in particular to a laser drilling method, a storage medium, laser drilling equipment and a high-frequency high-speed substrate. The laser drilling method comprises the steps that hole machining information of a hole structure is obtained, wherein the hole machining information comprises the hole position, the hole outer contour and the hole depth; taking the hole position as a positioning reference, and performing at least one of laser winding and cutting treatment and laser etching treatment on the high-frequency high-speed substrate to form a hole structure; wherein the laser winding and cutting treatment comprises the steps that first laser is controlled to move along a first closed path matched with the outer contour of the hole, so that the side wall of the hole structure is formed; and the laser etching treatment comprises the steps of controlling a second laser to carry out punching processing on an enclosed area of the outer contour of the hole so as to remove a base material in the enclosed area and form a bottom wall of the hole structure, and the method can be used for manufacturing the high-quality hole structure on the high-frequency and high-speed substrate and also can be used for manufacturing the high-quality hole structure on the high-frequency and high-speed substrate. And the processing efficiency of manufacturing a high-quality hole structure on the high-frequency and high-speed substrate can be obviously improved.

A power amplifier device includes a transistor die with an elongated bondpad coupled to a terminal of an integrated transistor. The device also includes a substrate formed from a stack of alternating dielectric and patterned conductive layers. An elongated die contact is exposed at a first substrate surface and is attached to the elongated bondpad to provide a uniform connection between the die contact and the elongated bondpad. A vertical interconnect structure is connected to the die contact and extends towards the second substrate surface. A circuit includes passive component(s) coupled to the second substrate surface and to the vertical interconnect structure. An encapsulation material layer covers the passive component(s) and the second substrate surface. A plurality of device interconnects are coupled to the substrate, electrically coupled to the power transistor die, and exposed at a contact surface of the power amplifier device.

An electronic device may include an input button assembly including an input member positioned along a side exterior surface of a housing component and defining a first input region proximate a first end of the input member and a second input region proximate a second end of the input member, the input member configured to receive a user input. The input button assembly may further include a beam structure at least partially within the enclosure and coupled to the input member, the beam structure configured to be deflected as a result of the user input, a first strain sensing element at a first location of the beam structure, and a second strain sensing element at a second location of the beam structure.

According to the mask defect in-situ repairing method, the femtosecond laser is adopted for defect repairing, and all the advantages of the femtosecond laser are absorbed. Femtosecond laser is ultrashort pulse laser with'femtosecond 'as a time unit, the pulse duration time of the femtosecond laser is extremely short (femtosecond magnitude), and the peak power of the femtosecond laser is extremely high (the maximum can reach pat watt). Therefore, according to the repairing method, the repairing precision can be reduced to 15 nm, the heat affected zone is smaller than 1 micron, the repairing time can be shortened to 100 ms for the defect of 100 nm, the roughness of the repaired surface is smaller than or equal to 0.5 nm, meanwhile, the good effects of high repairing precision, low heat affected zone, high repairing speed, low equipment cost and simple operation are achieved, and the rejection rate of the mask is reduced. The method is especially suitable for repairing advanced process masks, such as EUV and ArF, and display panel masks, such as OLED and FMM, and MEMS device masks.

An electronic device is provided. The electronic device includes a slidable housing including a first housing and a second housing, a first substrate included in the first housing and including a processor, a second substrate included in the second housing, a flexible printed circuit board (FPCB) which includes a ground line, electrically connects the first substrate and the second substrate to each other, and has a shape changed according to the movement of the slidable housing, and a matching circuit electrically connecting the first substrate and at least a portion of the ground line of the FPCB, and changing impedance under the control of the at least one processor according to the shape of the FPCB.

The application belongs to the technical field of electronic component recycling, in particular to a waste electronic component recycling device, which comprises a workbench, a clamping assembly is arranged on the upper end of the workbench, the clamping assembly comprises a first rectangular plate which is slidably arranged on the upper end of the workbench, two clamping strips are slidably arranged on the upper end of the first rectangular plate, a cylinder is slidably arranged on one side of the upper end of the first rectangular plate, a through hole is formed in the lower end of the cylinder, a hot air blower is arranged on one side of the cylinder, a baffle is arranged on the middle of the upper end of the workbench, a crushing box is arranged on one side of the workbench, an extrusion roller is rotatably arranged in the crushing box, and a discharge port is arranged on one side of the lower end of the crushing box. The device can automatically remove the resistors, capacitors and other components on the surface of the circuit board by using the heating separation method, without damaging the circuit board and the resistors, capacitors and other components, thereby reducing the harm of harmful substances to the environment.

The invention provides a drilling processing method for a ceramic substrate. The drilling processing method for the ceramic substrate comprises the following steps: forming a large hole in the ceramic substrate by adopting laser drilling, wherein the aperture of the large hole is 0.25-5mm or is 0.5 times greater than the thickness of the ceramic substrate; filling the macropores with a composite material containing a ceramic filler and thermosetting resin, and forming a supporting layer through a curing process; and the supporting layer is mechanically drilled to form small holes, and the hole diameter of the small holes is smaller than that of the large holes. According to the ceramic substrate drilling machining method, through stepped drilling of laser taper hole guiding, composite material filling and mechanical precision drilling, the problem that small holes of a thin substrate are prone to cracking during machining is solved, the yield is increased, the risk of breakage of a hard drill bit for mechanical drilling can be reduced, machining time is shortened, and the production cost is reduced; the drilling processing method is compatible with various ceramic substrates, and can solve the problem of multi-material integration of electronic packaging.

An electronic device may include an input button assembly including an input member positioned along a side exterior surface of a housing component and defining a first input region proximate a first end of the input member and a second input region proximate a second end of the input member, the input member configured to receive a user input. The input button assembly may further include a beam structure at least partially within the enclosure and coupled to the input member, the beam structure configured to be deflected as a result of the user input, a first strain sensing element at a first location of the beam structure, and a second strain sensing element at a second location of the beam structure.

Provided is a heat-curable resin composition that not only has a low dielectric tangent but also is excellent in adhesivity, and that particularly results in a cured product which exhibits an excellent desmear resistance. The heat-curable resin composition includes (A) an aromatic cyclic imide compound having a weight average molecular weight of 5,000 to 100,000, (B) an aliphatic cyclic imide compound having a weight average molecular weight of 100 to 2,000, (C) an epoxy resin having two or more epoxy groups in one molecule, (D) a curing agent for epoxy resin, (E) a curing catalyst, and (F) an inorganic filler, wherein the heat-curable resin composition contains the components (A) to (E) in a total amount of 5 to 99% by mass based on the overall composition.

An electronic component includes a body, an inner conductor inside the body, and an outer electrode that lies on part of at least a first main surface of the body and includes an underlying electrode and a plating electrode with which the underlying electrode is covered. The underlying electrode includes a first underlying electrode on part of the first main surface and connected directly to the inner conductor and a second underlying electrode at part of the first main surface away from the first underlying electrode and closer than the first underlying electrode to the center of the body in the length direction and not connected directly to the inner conductor. The plating electrode includes first and second plating electrodes. The first underlying electrode is covered with the first plating electrode, and the second underlying electrode is covered with the second plating electrode.

Techniques are provided herein to form semiconductor devices that include a dielectric wall between adjacent semiconductor devices where the gate electrodes of the adjacent semiconductor devices are conductively connected above the dielectric wall. First and second adjacent semiconductor devices each include a gate structure around or otherwise on a semiconductor region. The gate structures each include a gate dielectric and a gate electrode. A dielectric wall may extend in the first direction between the semiconductor regions of the adjacent devices and in a third direction along a portion of a total height of the adjacent gate structures. Accordingly, a portion of the gate electrode of the first device contacts a portion of the gate electrode of the second device over a top surface of the dielectric wall. The dielectric wall separates the gate dielectric of the first device from contacting any portion of the gate dielectric of the second device.

The invention relates to the technical field of lens module AA assembly design, in particular to a lens AA assembly test device based on laser soldering and a use method thereof.The lens AA assembly test device based on laser soldering is characterized in that a square tube frame is fixed to a bottom plate through four stand columns, and three-axis soldering head assemblies are arranged at the four corners of the inner side of the square tube frame; the testing assembly comprises a six-dimensional force sensor, a square seat used for installing a lens is fixed to the top of the six-dimensional force sensor, a plurality of pins are arranged on the top of the square seat, a circuit board is connected to the pins in an inserted mode, and the circuit board is fixed to the testing table through a clamping mechanism and keeps electrically connected with the electric connector female head in the welding process. Through a cooperative measurement mechanism integrating the six-dimensional force sensor and the three-axis micrometer, the three-dimensional stress and deformation quantity of the circuit board in the laser soldering process can be accurately obtained in real time, and the problem that traditional AA soldering equipment design depends on experience debugging is solved; and reliable data support is provided for clamping force and positioning compensation design of mass production equipment.

A sensor shifting actuator includes a housing having an internal space; an image sensor, accommodated in the housing, having an imaging surface; a first moving frame, accommodated in the housing, configured to be movable in a direction parallel to the imaging surface, together with the image sensor; a second moving frame, accommodated in the housing, configured to be movable in a direction perpendicular to the imaging surface, together with the image sensor and the first moving frame; a bridge portion configured to curve in at least a portion thereof and support a movement of the image sensor in the direction parallel to the imaging surface; and a plurality of ball members, disposed between the second moving frame and the housing, configured to support another movement of the image sensor in the direction perpendicular to the imaging surface.

The invention discloses a packaging structure, a preparation method thereof and electronic equipment. The packaging structure comprises a circuit board; the organic substrate is arranged on the circuit board and electrically connected with the circuit board, and a first groove is formed in the side, away from the circuit board, of the organic substrate; the local connection assembly is embedded into the organic substrate and is electrically connected with the organic substrate, and the local connection assembly comprises a glass substrate and a rewiring layer formed on the glass substrate; the photon integrated circuit chip is arranged in the first groove; the calculation chip is electrically connected to the rewiring layer in the local connection assembly; the electrical interface chip is located on the side, away from the circuit board, of the organic substrate, and the electrical interface chip is connected with the photon integrated circuit chip through a vertical interconnection piece and connected with the calculation chip; the optical waveguide assembly is arranged on the organic substrate and at least partially located above the photonic integrated circuit chip, and the optical waveguide assembly is connected to the photonic integrated circuit chip so as to perform optical signal coupling with the photonic integrated circuit chip.

The invention relates to the technical field of connector pin welding, and discloses multi-specification connector welding equipment capable of adjusting a pin positioning clamp, the multi-specification connector welding equipment comprises a supporting table, a lifting table is slidably connected to the upper end of the supporting table, and clamping seats are symmetrically slidably connected to the lifting table; the lower end of the lifting table is connected with a linkage part for driving the two clamping seats to approach synchronously, the two clamping seats are connected with an isolation part for preventing soldering tin from overflowing, and the isolation part comprises a moving plate. The multi-specification connector welding equipment capable of adjusting the pin positioning clamp can effectively solve the problems that in the prior art, in the welding process, if pressing force is too large, a bonding pad on a circuit board is likely to deform, tilt and even be separated from a substrate, and due to the fact that soldering paste is too large, a temperature curve is unreasonable, a Pin coating is poor or the bonding pad is improperly designed, the bonding pad is prone to deformation, upwarp and even be separated from the substrate. And fused soldering tin is easy to connect adjacent pins to cause short circuit, which may cause equipment failure or burning of components.

A discrete power semiconductor package includes a semiconductor chip, a heatsink, a first lead, a second lead, and a clip. The heatsink is adjacent the semiconductor chip and draws heat away from the semiconductor chip. The clip binds the semiconductor chip to the heatsink and includes a chip linker, a first terminal, and a second terminal. The chip linker is atop the semiconductor chip. The first terminal connects to the first lead and the second terminal connects to the second lead.

The present application discloses an electrical connector, an electrical connector module, and a sheet including an electrical connector module. An electrical connector module has an opening in an insulating support that is selectively positioned to limit dielectric losses in a signal. The connector may include a first conductor and a second conductor, the first conductor and the second conductor including a first side and a second side between a first edge and a second edge. The insulating support holds the first conductor adjacent to the second conductor and may have at least five base portions, wherein a first base portion contacts a first side of the first conductor, a second base portion contacts a second side of the first conductor, a third base portion contacts a first side of the second conductor, a fourth base portion contacts a second side of the second conductor, and at least a portion of a fifth base portion is disposed between two edges of the first conductor and the second conductor. The width of the base portion may be less than the width of the first side and the second side of the first conductor and the second conductor.

A mobile phone may include an enclosure including a housing component and a front cover coupled to the housing component and defining a front exterior surface of the mobile phone. The mobile phone may further include a display positioned below the front cover and a sensor module positioned below a front-facing sensor region of the front cover and including a biometric sensing system. The biometric sensing system may include a first lens, a light emitter positioned below the first lens and configured to emit light onto an object, a second lens, and a light sensor below the second lens and configured to capture an image of the object. The sensor module may further include a proximity sensing system positioned between the first lens of the biometric sensing system and the second lens of the biometric sensing system.

The present disclosure provides an apparatus for joining electronic components to an electronic substrate including a frame, a first conveyor section and a second conveyor section, and a support device. The first and second conveyor sections are supported by the frame and arranged spaced apart from each other along a conveying direction of the electronic substrate, and the first and second conveyor sections have first and second conveying surfaces, respectively. A receiving area is provided between the first and second conveyor sections. The support device is coupled to the frame and movable between a supporting position and a rest position relative to the first conveyor section and the second conveyor section. The support device has a supporting surface. In the supporting position, the support device is at least partially located and held in the receiving area and the supporting surface is substantially flush with the first conveying surface and the second conveying surface. In the rest position, the support device exits the receiving area. Since the support device of the present disclosure can provide support when the electronic substrate is conveyed between the adjacent conveyor sections, the stability of conveying of the electronic substrate can be improved.

Techniques are provided herein to form semiconductor devices that include a dielectric wall between adjacent semiconductor devices where the gate electrodes of the adjacent semiconductor devices are conductively connected above the dielectric wall. First and second adjacent semiconductor devices each include a gate structure around or otherwise on a semiconductor region. The gate structures each include a gate dielectric and a gate electrode. A dielectric wall may extend in the first direction between the semiconductor regions of the adjacent devices and in a third direction along a portion of a total height of the adjacent gate structures. Accordingly, a portion of the gate electrode of the first device contacts a portion of the gate electrode of the second device over a top surface of the dielectric wall. The dielectric wall separates the gate dielectric of the first device from contacting any portion of the gate dielectric of the second device.

Modular processing systems are provided. In one aspect, a modular processing system includes a first electronics module including a first printed circuit board (PCB) and a first electronic component on the first PCB, a second electronics module including a second PCB and a second electronic component on the second PCB, and a cold plate arranged between the first electronics module and the second electronics module. The cold plate is configured to circulate a coolant to cool the first PCB and the second PCB. At least a portion of the cold plate is included in the first electronics module. The first electronics module is removably secured to the second electronics module.

The present disclosure relates to a display apparatus, and the display apparatus includes a display panel on which a plurality of sub-pixels are disposed, the plurality of sub-pixels each including an organic light-emitting diode, a base voltage node connected to a cathode electrode of the organic light-emitting diode, a plurality of driving voltage lines disposed on the display panel and configured to supply a driving voltage of the organic light-emitting diode to the plurality of sub-pixels, a controller configured to control a gate driving circuit and a data driving circuit, and a defect detection circuit configured to determine whether a defect occurs in the driving voltage line based on a voltage sensed at the base voltage node, wherein, based on a defect signal output from the defect detection circuit, an output of at least one of the controller, the gate driving circuit, and the data driving circuit is controlled.

A semiconductor package including a printed circuit board, a plurality of semiconductor chips arranged apart from the printed circuit board in a vertical direction and a plurality of bonding wires. Each of the bonding wires including a first end in contact with the printed circuit board, and a second end in contact with a chip pad included in each of the plurality of semiconductor chips. The semiconductor package further including a first encapsulation layer filling spaces between lower surfaces of the plurality of semiconductor chips and an upper surface of the printed circuit board and spaces between the plurality of bonding wires, and a second encapsulation layer covering an upper surface of the first encapsulation layer and the plurality of semiconductor chips and including a flat upper surface arranged apart from the upper surface of the printed circuit board by a same height in all areas.

A resin composition includes 100 parts by weight of a thermosetting resin, 10 parts by weight to 40 parts by weight of a fluorene-containing compound and 210 parts by weight to 400 parts by weight of silica. The resin composition may be used to make various articles, including a resin film, a prepreg, a laminate or a printed circuit board, and at least one or more of the following properties can be improved, including PCT water absorption ratio, dielectric constant, dissipation factor, copper foil peeling strength, thermal conductivity and glass transition temperature.

Provided is a laser lift-off apparatus, and a substrate lift-off method using a laser lift-off apparatus. The laser lift-off apparatus is configured to convert a first beam into a second beam having a width in a first direction and in a second direction different from the first direction, the laser lift-off apparatus including a laser beam generator configured to generate the first beam, a homogenizer configured to homogenize the first beam, and a beam cutter including a first beam cutter and a second beam cutter defining at least two openings having different respective lengths in the first direction, and configured to generate the second beam by transmitting and blocking respective portions of the first beam.

Disclosed is a resin composition, including 100 parts by weight of maleimide resin and 0.3 parts by weight to 10.0 parts by weight of organophosphine compound having a structure shown in Formula (1), wherein —R— includes a substituted or unsubstituted phenylene group, biphenylene group, or naphthylene group. Also disclosed are a use of the resin composition in preparing a product, and at least a portion of the product made from the resin composition. The product includes a prepreg, a resin film, a laminate, a printed circuit board, or a cured insulator.

A laser repair method includes a repair process of performing repair work by setting a laser radiation range for a defect part in a multi-layer film substrate and irradiating the defect part with a laser beam under set laser working conditions. In the repair process, spectrum data of the defect part is acquired, and the laser working conditions of the laser beam, with which the defect part is to be irradiated, are set using a neural network after learning on the basis of the spectrum data, and the neural network has undergone machine learning using, as learning data, measurement data including multi-layer film structure data, spectrum data of each multi-layer film structure, and laser working experimental data of each multi-layer film structure.

A display device is provided. The display device includes: a display panel including at least one corner; a side frame including a horizontal portion extending along one side of the display panel from the at least one corner and facing a rear surface of the display panel, and a vertical portion extending in a direction intersecting the horizontal portion and covering the one side of the display panel; and a support member fixed to the horizontal portion at a position between the rear surface of the display panel, which is adjacent to the at least one corner, and the horizontal portion of the side frame, the support member supporting a rear surface of the corner of the display panel.