2591results about "Printed circuits" patented technology

The invention relates to the technical field of data processing, and discloses a method and system for monitoring the running state of reflow soldering equipment. The method comprises the steps of collecting data through a multi-point sensor, extracting temperature gradient, tension fluctuation and gas concentration characteristics, constructing a state recognition model, calculating a health index and setting an early warning threshold value, constructing a fault precursor extraction model to predict a future state, and finally establishing a maintenance strategy optimization system and generating an equipment maintenance plan based on fault early warning information. Through multi-dimensional data fusion and intelligent analysis, early accurate identification of the abnormal state of the equipment, accurate prediction of the fault development trend and active maintenance decision based on quality influence and cost optimization are realized, so that the welding quality stability is improved, the non-planned downtime is shortened, and the maintenance cost is reduced.

A semiconductor package according to an embodiment includes a first semiconductor structure, including a first substrate, and a semiconductor stacking structure including a plurality of semiconductor dies on the first substrate and including a top surface, a second semiconductor structure on the first semiconductor structure, a second substrate, and a plurality of integrated circuit chips on the second substrate, a plurality of core balls between the first substrate and the second substrate and electrically connecting the first semiconductor structure and the second semiconductor structure, and a molding material for molding the semiconductor stacking structure and the plurality of core balls between the first substrate and the second substrate.

Wireless chargers that can properly align and securely hold an electronic device, provide power to more than one electronic device, and fold into a compact shape. One example can provide a wireless charger having an alignment feature to align an electronic device to the wireless charger. The wireless charger can further include an attachment feature to attach the electronic device to the wireless charger such that the electronic device is securely held in place relative to the wireless charger. The wireless charger can include a first leaf having first charging components for charging a first electronic device and a second leaf having second charging components for charging a second electronic device. The first leaf and the second leaf can fold together into a compact shape.

The invention discloses a PCB double-face brazing device for a computer, and relates to the technical field of circuit board welding assistion.The PCB double-face brazing device comprises a workbench, a supporting frame is fixedly connected to the upper end face of the workbench, and a welding gun is connected to the supporting frame in a penetrating and clamping mode. By directly overturning the whole welding table, a worker can quickly weld the other side of the circuit board, so that the operation complexity is reduced, the time is saved, the welding efficiency is improved, the damage to welded elements or welding spots on the circuit board due to improper operation or overlarge force in the manual overturning process is avoided through automatic overturning, and the production efficiency is improved. According to the circuit board overturning device, the stability of the welding quality is guaranteed, the circuit board scrapping situation caused by misoperation is reduced, in the overturning process, the circuit board is stably clamped in the device, direct contact between the circuit board and an external object is reduced, and therefore the risk of scratching or pollution is reduced.

An inductor provided in the present invention includes multiple windings in the magnetic core. The multiple windings comprise a first, second, third and fourth windings. Second and third windings have been connected in series to form an integrated series winding inside the magnetic core with two leads exposed on the surface of the magnetic core for electrical connection with the power supply circuit. The first winding is magnetically coupled to the second winding, and the fourth winding is magnetically coupled to the third winding. A pair of leads at both ends of the first winding and a pair of leads at both ends of the fourth winding are exposed on the surface of the magnetic core for electrical connection with the power supply circuit. The inductor is welded on the circuit board, which saves the number of weld points, makes circuit connection more reliable and reduces DCR.

An adjustment method of a laser processing apparatus includes a spatial light modulator adjustment step of adjusting a spatial light modulator into a state ready for splitting a laser beam emitted from a laser oscillator and applying a plurality of laser beams such that laser beams will have a desired positional relation, a processing mark formation step of operating the laser oscillator to apply the laser beams to a wafer such that a plurality of processing marks is formed, an imaging step of stopping the laser oscillator, and imaging the processing marks formed at the wafer, and an aberration correction step of correcting aberration of the condenser by comparing the desired positional relation and a positional relation among the imaged processing marks, and adjusting the spatial light modulator such that the positional relation among the processing marks conforms to the desired positional relation.

Technologies for components embedded in a substrate core are disclosed. In one embodiment, power components such as deep trench capacitors are disposed in a cavity defined in a substrate core for a circuit board of an integrated circuit package, such as a processor. The power components are stacked on top of each other, allowing for the stack of power components to match the height of the substrate core, even when the height of the individual power components is less than the height of the substrate core. The stack may include, e.g., three or more power components. Through-silicon vias in some or all of the power components can allow for connections through one power component to another. Configuring the power components in this manner can provide mechanical stability to the power components and substrate core and provide power to a semiconductor die mounted on the circuit board.

The invention discloses a high-precision circuit board laser drilling process, and particularly relates to the technical field of circuit board processing, and the high-precision circuit board laser drilling process comprises the following steps: step 1, selecting a high-quality base material and a copper-clad layer, and carrying out pretreatment on the base material, the pretreatment comprises cleaning and deoxidation, and the interaction efficiency of laser and the material is improved; 2, according to the design requirement of the circuit board, the position needing to be drilled and the aperture size are determined and completed through CAD software, a drilling data file is generated, the circuit board to be drilled is fixed to a drilling machine, and it is guaranteed that the board face is smooth and free of deformation; thirdly, a CO2 laser is selected, light beam focusing, laser power stability and laser beam uniformity of laser drilling equipment are optimized, and stability and accuracy of laser are guaranteed. According to the invention, high-precision laser drilling processing can be realized, the drilling processing quality of the circuit board can be ensured, the processing defective rate is obviously reduced, the popularization and the use are facilitated, and meanwhile, the method is suitable for a modern production process.

The invention relates to a method of coupling a battery cell to a battery cell monitoring and control circuit, the method comprising the steps of: providing a battery cell (10) comprising a multilayer structure comprising two electrode layers (11, 12) separated by a separator layer (17) and two electrically conductive outer faces (13, 14) extending parallel to the layers of the multilayer structure; providing a microcircuit (MC) comprising two connection pads (21, 22) respectively formed on opposite faces or on the same face of the microcircuit, the microcircuit being inserted into a volume defined by two planes respectively comprising an electrically conductive outer face of the battery cell; an electrically conductive connection (25, 26) is formed between each connection pad of the microcircuit and a respective electrically conductive face of the battery cell.

The utility model discloses a circuit board bearing jig and processing equipment, and belongs to the technical field of laser engraving, in the circuit board bearing jig, a driving assembly drives a negative pressure adsorption platform to be lifted, so that the negative pressure adsorption platform jacks up a circuit board to be separated from a conveying mechanism, the circuit board is supported on the negative pressure adsorption platform, and the circuit board is clamped on the negative pressure adsorption platform; the adsorption force generated by the negative pressure adsorption platform enables the circuit board to be flatly laid on the negative pressure adsorption platform and to be fixed, thereby preventing the circuit board from warping, and improving the position precision and the yield of two-dimensional code engraving. In addition, the circuit board is fixed through pressure difference generated by adsorption, and compared with a mechanical clamping and fixing mode, the surface quality of the circuit board is protected.

The present invention relates to a contact lens. The contact lens includes a lens body and a built-in module. The lens body includes an optical part and a ring-shaped wearing part surrounding the optical part. The built-in module includes a preform made of an eye-friendly material and a wiring structure embedded in the preform. The preform is completely embedded in the ring-shaped wearing part of the lens body, and the preform is ring-shaped and surrounds the outside of the optical part. The preform and the lens body are connected without any gaps to form a bonding interface, and are disposed at a distance from the rear surface and the front surface of the lens body, respectively. A local surface of the wiring structure is aligned with the surface of the preform and bonded to the ring-shaped wearing part. As a result, the wiring structure is embedded and positioned in advance in the preform, and the wiring structure can be completely embedded and positioned in the lens body.

The invention relates to the field of antenna welding devices, in particular to an RFID antenna tail end pin welding device which comprises a bottom plate, a welding gun arranged on the upper side of the bottom plate, a center column fixedly installed in the center of the upper side of the bottom plate, a transposition mechanism used for rapidly switching welding point positions and a correcting mechanism used for correcting the tail end of an antenna. The rotating base plate, the discharging base and the pushing assembly in the transposition mechanism are matched, circumferential rotation of the rotating base plate is matched with radial sliding of the discharging base, the discharging base drives a circuit board on the discharging base to slide once every time the rotating base plate rotates by a circle, and therefore automatic switching of welding point positions is achieved; the clamping plate, the pressing wheel and the wedge-shaped piece in the correcting mechanism are adopted, the wedge-shaped piece triggers the moving assembly to drive the clamping plate to clamp and straighten the tail end of the antenna, meanwhile, the pressing wheel downwards presses the tail end of the antenna, the problem of insufficient soldering or poor contact caused by antenna bending in the welding process is effectively solved, and the welding quality is ensured.

The invention relates to the technical field of circuit board processing, in particular to a laser drilling method, a storage medium, laser drilling equipment and a high-frequency high-speed substrate. The laser drilling method comprises the steps that hole machining information of a hole structure is obtained, wherein the hole machining information comprises the hole position, the hole outer contour and the hole depth; taking the hole position as a positioning reference, and performing at least one of laser winding and cutting treatment and laser etching treatment on the high-frequency high-speed substrate to form a hole structure; wherein the laser winding and cutting treatment comprises the steps that first laser is controlled to move along a first closed path matched with the outer contour of the hole, so that the side wall of the hole structure is formed; and the laser etching treatment comprises the steps of controlling a second laser to carry out punching processing on an enclosed area of the outer contour of the hole so as to remove a base material in the enclosed area and form a bottom wall of the hole structure, and the method can be used for manufacturing the high-quality hole structure on the high-frequency and high-speed substrate and also can be used for manufacturing the high-quality hole structure on the high-frequency and high-speed substrate. And the processing efficiency of manufacturing a high-quality hole structure on the high-frequency and high-speed substrate can be obviously improved.

The power module includes a substrate, a power device, and a housing. The power device is mounted on a device pad of the substrate and arranged to provide a power circuit having a first input, a second input, and at least one output. The first and second power terminals provide the first and second inputs to the power circuit. The at least one output power terminal provides the at least one output. The housing encloses the substrate, the power device, and a portion of the first and second input power terminals as well as a portion of the at least one output power terminal.

The invention discloses a grabbing mechanism for chip machining, and belongs to the technical field of chip machining, the grabbing mechanism for chip machining comprises a mechanical arm, a support assembly is arranged at the outer end of the mechanical arm, the support assembly comprises a mounting cylinder connected with the outer end of the mechanical arm, an adsorption assembly is arranged in the mounting cylinder, and supporting rings are arranged at the two ends of the mounting cylinder correspondingly; side rings are arranged outside the mounting cylinders, a plurality of rotating rods are arranged between the mounting cylinders, sliding grooves are formed in the rotating rods, adjusting cylinders are arranged on the rotating rods in a sliding mode, transverse rods are arranged in the adjusting cylinders, transverse plates are arranged outside the adjusting cylinders, clamping columns are connected outside the transverse plates, first gear rings are arranged on the rotating rods, rotating rings are arranged between the mounting cylinders and the side rings in a sliding mode, second gear rings are arranged on the rotating rings, and sliding rods are arranged on the side rings; the sliding rods are connected with lifting rings, arc grooves are distributed outside the lifting rings, limiting rings are in sliding fit with the interiors of the arc grooves, inclined grooves are distributed in the outer sides of the rotating rings, and sliding columns are arranged on the sliding rods. The double-grabbing device has the advantages of double grabbing, disengagement prevention, damage prevention, stability, reliability, flexibility and practicability.

A power amplifier device includes a transistor die with an elongated bondpad coupled to a terminal of an integrated transistor. The device also includes a substrate formed from a stack of alternating dielectric and patterned conductive layers. An elongated die contact is exposed at a first substrate surface and is attached to the elongated bondpad to provide a uniform connection between the die contact and the elongated bondpad. A vertical interconnect structure is connected to the die contact and extends towards the second substrate surface. A circuit includes passive component(s) coupled to the second substrate surface and to the vertical interconnect structure. An encapsulation material layer covers the passive component(s) and the second substrate surface. A plurality of device interconnects are coupled to the substrate, electrically coupled to the power transistor die, and exposed at a contact surface of the power amplifier device.

A display device and a method of manufacturing the same. The display device may include a display panel that may include a first area having a display area, a second area spaced apart from the first area, and a bendable third area located between the first area and the second area; an panel bottom cover bonded to the lower surface of the display panel in the first area; a support film bonded to the lower surface of the display panel in the second area; and a bonding layer to bond the support film to the lower surface of the display panel, wherein a gap between the panel bottom cover and the support film may be disposed in the third area.

The utility model belongs to the technical field of high-speed core wire processing, and particularly relates to a welding jig which comprises a base, a fixed seat fixedly connected to the base and a wire arranging clamp rotationally connected to the upper end of the fixed seat, a second movable groove is formed in the fixed seat, a guide rod is fixedly connected in the second movable groove, the guide rod is movably sleeved with a plurality of clamping blocks, and the clamping blocks are fixedly connected to the upper end of the fixed seat. A movable groove III is formed in the clamping block; a second movable groove is formed in the fixing base, a plurality of clamping blocks movably connected to the outer portion of the guide rod in a sleeving mode are arranged in the second movable groove, and the adjacent clamping blocks are movably connected, so that the distance between the adjacent clamping blocks can be adjusted, and the distance between the clamping blocks and the inner wall of the second movable groove can also be adjusted; in this way, the clamping blocks can clamp and position line bodies of different sizes, when products of different sizes are welded, jigs on the whole production line do not need to be replaced, the workload is reduced, and meanwhile the cost for customizing the jigs is saved.

The invention relates to the technical field of PCB inspection, and discloses a laser engraving device of a PCB appearance detection system, the laser engraving device comprises a fixing frame, the upper surface of the fixing frame is fixedly connected with a first motor, the output end of the first motor is fixedly provided with a rotating rod, the outer wall of the rotating rod is fixedly connected with a rotating plate, and the rotating plate is fixedly connected with a rotating shaft. A first rotating shaft is fixedly connected to the interior of the rotating plate, a rotating block is rotatably connected to the outer wall of the first rotating shaft, a second rotating shaft is fixedly connected to the interior of the rotating block, a sliding plate is rotatably connected to the outer wall of the second rotating shaft, a limiting block is fixedly connected to the upper surface of the sliding plate, and a limiting strip is slidably connected to the interior of the limiting block. The first motor is started to drive the rotating rod to rotate, through cooperation of the rotating plate, the first rotating shaft, the rotating block, the second rotating shaft, the sliding plate, the limiting block, the connecting plate, the spring and the clamping plates, the distance between the clamping plates is adjusted, the effect of being suitable for PCBs of different sizes and fixing the PCBs is achieved, and the stability in the transferring process is guaranteed.

A wire bonding apparatus (100) comprises: a supply (108) of bond wire (102); a first motor (114) to advance the bond wire (102) from the supply (108); a wedge (110) to perform wire bonding by forming a first bond and a second bond, the second bond separated by a distance from the first bond; a wire guide (104) adjacent the wedge (110) for guiding the bond wire (102) toward the wedge (110); and a second motor (118) to advance the bond wire (102) into the wire guide (104), the second motor (118) configured to feed a length of the bond wire (102) after formation of the first bond and before formation of the second bond, the length greater than the distance between the first and second bonds.

Provided is a display device comprising a display panel including a display area and a non-display area and an electrostatic protection circuit disposed in the non-display area. The electrostatic protection circuit includes a first stage circuit including a (1-1)-th diode which causes a forward current to flow from a first node to a second node and a first capacitor and a first resistor connected in parallel to the (1-1)-th diode, a second stage circuit including a (2-1)-th diode which causes a forward current to flow from the second node to a third node and a second capacitor and a second resistor connected in parallel to the (2-1)-th diode, and a third stage circuit including a (3-1)-th diode which causes a forward current to flow from the third node to a fourth node and a third capacitor and a third resistor connected in parallel to the (3-1)-th diode.

An electronic device may include an input button assembly including an input member positioned along a side exterior surface of a housing component and defining a first input region proximate a first end of the input member and a second input region proximate a second end of the input member, the input member configured to receive a user input. The input button assembly may further include a beam structure at least partially within the enclosure and coupled to the input member, the beam structure configured to be deflected as a result of the user input, a first strain sensing element at a first location of the beam structure, and a second strain sensing element at a second location of the beam structure.

The present disclosure provides a package of a 3D integrated circuit. The package of the 3D integrated circuit includes a substrate structure having a first surface and a second surface opposite the first surface; the high-power bare core is arranged above the substrate structure; the low-power bare core is arranged above the high-power bare core; a first interposer disposed between the first surface of the substrate structure and the high-power die; and a second interposer disposed between the high power die and the low power die. The substrate structure includes a thermal enhancement portion underlying the high power die, and at least one of thermal conductivity or geometry of the thermal enhancement portion differs from other portions of the substrate structure. A substrate structure of a package of a 3D integrated circuit is also provided.

The invention relates to the technical field of chip production equipment, in particular to a welding device for chip production packaging and a control method of the welding device. The interference area between the abnormal moisture migration area and the maximum susceptibility range is obtained, the welding loss probability that the moisture invasion sensitive chip is damaged due to the abnormal moisture migration area is calculated based on the interference area and the vulnerability index of the moisture sensitive chip, and the chip conveying mechanism is controlled to preheat the moisture invasion sensitive chip according to the welding loss probability; and distributing a steady-state control voltage of each circuit component in the accurate circuit control topological graph based on the expected control logic effect to obtain a steady-state drift difference value of each chip control node, and according to the steady-state drift difference value, deciding a welding process of a packaging type and planning welding scheduling of subordinate welding equipment. According to the invention, precise element preheating control can be carried out on the chip affected by air humidity in the chip packaging and welding process, and the accuracy, efficiency and qualified rate of chip packaging and welding are improved.

A display device includes a substrate having a first side surface adjacent to an upper surface, a second side surface adjacent to a lower surface, and an opening surrounded by the second side surface, a pad clad surrounded by the first side surface of the substrate and including a pad contact hole, a pad disposed on the pad clad and inserted into the pad contact hole, a fan-out line disposed on the pad and electrically connected to the pad, a transistor electrically connected to the fan-out line, and a flexible film disposed under the substrate and including a lead electrode inserted into the opening of the substrate and in contact with the pad.

A display device according to an example of the present disclosure includes at least one transparent display panel, a plurality of routing lines disposed on an outside surface of at least one side of the transparent display panel, and a transparent wiring substrate disposed on a rear surface or a top surface of the transparent display panel and having a plurality of connection lines connected to the plurality of routing lines. The connection lines extend to a rear surface of the transparent display panel to overlap a part of the transparent display panel, and a degree of freedom of an attachment position of the transparent display panel can be ensured.

An electronic device is provided. The electronic device includes a first housing, a second housing coupled to the first housing through a hinge structure to be rotatable about a first axis that faces a first direction, a first cover covering a rear surface of the first housing, a second cover covering a rear surface of the second housing, a flexible display defining a front surface of the electronic device and disposed over the first housing and the second housing, an antenna module, and at least one processor electrically connected to the flexible display and the antenna module, wherein the hinge structure is disposed in an area having a first width in a second direction that is perpendicular to the first direction with respect to the first axis, wherein the first housing has a first structure covering the hinge structure within the first width, wherein the first structure has an accommodation groove, in which the antenna module is accommodated, and wherein the at least one processor is configured to transmit and receive a high-frequency (millimeter wave) signal corresponding to a third direction that is perpendicular to both the first direction and the second direction by using the antenna module.

After peel-off layers have been formed in a workpiece of monocrystalline silicon such as an ingot, a bare wafer, or a device wafer with use of a laser beam having a wavelength transmittable through monocrystalline silicon, a substrate is separated from the workpiece along the peel-off layers acting as separation initiating points. The process results in increased productivity for the manufacture of substrates, compared with a process of manufacturing substrates from a workpiece with use of a wire saw.

Various embodiments of the teachings herein include a method for operating an electronics production line for producing electronic assemblies. The electronics production line comprises a device to apply joining material onto component carriers, an assembly device to place electronic components onto the component carriers, a joining device to join the electronic components to the component carriers, and a transport to transport the component carriers through the production line. An example method includes: transporting a process parameter acquisition system through the electronics production line on the transport; measuring actual process parameter values with the process parameter acquisition system; providing setpoint process parameter values; determining any deviations between actual and setpoint process parameter values; and providing a dataset including the deviations.

The invention relates to the technical field of laser cutting equipment, and discloses automatic processing equipment for a substrate of a satellite-borne circuit board, the automatic processing equipment comprises a supporting seat, a sliding table is slidably connected to the inner wall of the supporting seat, and a cooling mechanism is arranged on the inner wall of the supporting seat; the cooling mechanism comprises a cooling mechanism; the inner wall of the supporting table is fixedly connected with the inner wall of the supporting base, the inner wall of the supporting table is fixedly connected with an isolation plate, a collecting groove is formed in the surface of the isolation plate, a connecting hole is formed in the groove wall of the collecting groove, and an adsorption mechanism is arranged on the surface of the isolation plate and comprises a supporting plate; the bottom of the supporting plate is fixedly connected with the surface of the isolation plate. According to the substrate cutting device, the substrate is cooled in the substrate cutting process through the cooling mechanism, meanwhile, cutting residues are collected, the cut face of the substrate is kept flat, the situation that the substrate is cooled through negative pressure, the substrate vibrates in the cooling process due to the fact that the cut face is provided with impurities is prevented, and the cutting stability of the substrate is improved.