227results about "Printed circuits" patented technology

A display device is provided. The display device includes: a display panel including at least one corner; a side frame including a horizontal portion extending along one side of the display panel from the at least one corner and facing a rear surface of the display panel, and a vertical portion extending in a direction intersecting the horizontal portion and covering the one side of the display panel; and a support member fixed to the horizontal portion at a position between the rear surface of the display panel, which is adjacent to the at least one corner, and the horizontal portion of the side frame, the support member supporting a rear surface of the corner of the display panel.

This utility model discloses a PCB board welding positioning and clamping mechanism, relating to the field of PCB board welding technology. It includes a base plate, an electric push rod fixedly connected to the surface of the base plate, and a support plate fixedly connected to the output end of the electric push rod. The support plate is parallel to the base plate and positioned above it. Gear columns are rotatably connected to both ends of the support plate. In this utility model, by fixing a rack to the outer wall of the support plate, and with the rack symmetrically positioned on the outer wall of the gear disk, the support plate moves upward via the electric push rod, simultaneously driving the rack to move. This causes the rack to rotate the gear disk downward. A rack meshes with the outer wall of the gear disk, causing the rack to drive a top plate downward to press the PCB board on the support plate surface. This arrangement allows for bidirectional pressing of the PCB board surface by the support plate and top plate through the synchronous movement of the support plate after the PCB board is placed on its surface, avoiding the problem of uneven force on the PCB board caused by current unidirectional pressing.

The utility model relates to the technical field of batteries, and provides a battery management system and a battery pack. The battery management system includes a circuit board and a busbar. The circuit board is provided with a connecting hole. The busbar includes a body portion and a connection portion. The connecting part and the body part are arranged at an angle. The connecting part passes through the connecting hole from the first side of the circuit board and is welded with the circuit board at the second side of the circuit board. Therefore, the welding difficulty can be reduced, and the welding strength is improved.

The invention relates to a composite enclosure having perfect magnetic conductor surfaces enabling the mechanical shielding of microwave systems used particularly in satellite, space, aerospace, and communication systems, as well as in other high-frequency applications, from electromagnetic interference.

A system includes input voltage terminals; a power converter integrated circuit package coupled without a fuse to the input voltage terminals and having first and second pins, the power converter integrated circuit package configured to detect a short circuit between the first and second pins; and a load circuit coupled to the power converter integrated circuit package.

An electronic device includes a display panel including a folding area defined therein. The folding area includes first and second non-folding areas defined therein and spaced apart from each other with the folding area interposed therebetween and including pixels and signal lines connected to the pixels. A plate is disposed under the display panel and includes a pattern portion overlapping the folding area, a first flat portion overlapping the first non-folding area, and a second flat portion overlapping the second non-folding area. The plate is provided with first holes defined through an upper surface and a rear surface thereof. First lines a redisposed in the first holes and are connected to the signal lines, and a circuit board is connected to the signal lines via the first lines and is disposed under the plate.

The utility model discloses a kind of double-platform automatic soldering mechanism, it includes, workbench, two tray supports are equipped on workbench, tray support is equipped on each with tray, each tray can be independently moved on tray support, spot welder bearing bracket on workbench is movably equipped with soldering machine, electric welding gun head is equipped on soldering machine, soldering machine can switch job between two trays, ensure that printed circuit board on each tray independently complete soldering operation, and the operation of two trays does not interfere with each other. The utility model is set through double platform, allow a worker to carry out mainboard handling, place and check on one tray at the same time, another tray carries out soldering operation, effectively reduce waiting time, realize seamless link, improve production efficiency and save labor cost, the rhythm of two trays, both avoid worker fatigue and operation confusion, also ensure that work flow is smooth, simultaneously make worker be able to concentrate on the operation of each tray, reduce failure, improve product quality.

The utility model relates to electronic equipment field discloses a kind of modularization circuit board plate body structure, including mounting plate, the top of mounting plate is provided with modularization component, the outside of mounting plate is provided with stabilizing mechanism;The modularization component includes data processing module, data storage module, data receiving module, power module;The stabilizing mechanism includes positioning assembly, the positioning assembly includes connecting plate, the upper surface of connecting plate is fixedly connected with pressure strip, the left surface of connecting plate front end is fixedly connected with positioning block.The utility model in, through four groups of positioning assembly that is circumferential array, utilize the extrusion of 45 ° inclination positioning groove and slider to realize the synchronous folding of connecting plate and pressure strip, make pressure strip closely adhere to modularization component top, fixed modularization component, in combination with the locking of the plug block and the jack of fixed component, can ensure the stability of fixed, provide guarantee for the stable use of circuit board module.

Component comprising: a connector carrier (1), a frame (2) and an enclosure body (3), wherein the connector carrier (1), the enclosure body (3) and / or the frame (2) have different coefficients of thermal expansion; a semiconductor chip (4) which is mechanically and electrically connected to the connector carrier (1); and a metal layer (5) which is arranged between the connector carrier (1) and the frame (2), wherein the enclosure body (3) surrounds the semiconductor chip (4) and borders the connector carrier (1) and the frame (2); the metal layer (5) is not electrically connected; and the metal layer (5) extends beyond the frame (2) in a lateral direction.

This application relates to the field of transformer technology, specifically to a chip transformer and power module, including a ceramic substrate; the ceramic substrate includes a plurality of stacked ceramic diaphragms; conductive posts are provided on the ceramic diaphragms, the conductive posts extending perpendicularly to the ceramic diaphragms; helical coils are provided on the surface of the ceramic diaphragms, and the ends of adjacent helical coils are connected through the conductive posts; at least two helical coils are connected through the conductive posts to form a coil winding. The embodiments of this application can significantly increase the number of turns in the winding by using planar helical coils, effectively improving the inductance value and enhancing the coupling coefficient between the primary and secondary coils while achieving a miniaturized integrated design.

This invention provides an automatic circuit board cutting device, including a base, a laser cutting head, and a central control module. A rotating shaft is mounted on the center of the upper surface of the base via a rotation drive assembly. Multiple mounting plates are fixedly connected to the outer surface of the rotating shaft. Mounting slots are formed on the outer sides of each mounting plate. Positioning components are provided on both the front and rear sides of each mounting plate. The mounting slots are used to place the circuit board to be cut, and the positioning components are used to fix the circuit board to be cut. This invention, by setting multiple rotatable mounting plates on the base and utilizing the central control module for coordinated control, achieves multi-station switching and continuous circuit board cutting. This integrates automated feeding, positioning, cutting, finished product collection, and waste separation functions, eliminating reliance on manual intervention, realizing continuous unmanned operation, and significantly improving cutting efficiency.

The application discloses a lens driving mechanism and a base thereof. The base comprises a frame and a circuit board. The frame comprises a bottom plate and a side frame connected with the bottom plate. The circuit board is embedded in the frame by injection molding and exposed to the inner surface of the frame. The application embeds the circuit board in the frame when the frame is molded by injection molding, and exposes the inner wall of the circuit board to the inner surface of the frame, so that electronic components such as a coil group and an embedded chip can be directly attached to the exposed circuit board and obtain power supply. When the circuit scheme needs to be changed, the base mold and the embedded metal plate structure do not need to be modified, and only the embedded circuit board needs to be replaced, so that the flexibility and production efficiency of product development are greatly improved, and the mold opening cost is reduced.

A display device may include a display panel; a cover bottom on a rear surface of the display panel and including a first opening; a plate bottom on the rear surface of the display panel and overlapping the first opening; a printed circuit board on a rear surface of the plate bottom and connected to the display panel; a plurality of flexible films connecting the printed circuit board and the display panel; and a heat dissipation unit disposed between the display panel and the cover bottom. The heat dissipation unit may overlap the plurality of flexible films.

Aspects of the subject disclosure may include, for example, a packaged integrated circuit device that includes two galvanically isolated integrated circuit die. The integrated circuit die include conductive coils that can be inductively coupled for wireless communications between the two galvanically isolated integrated circuit die. One of the integrated circuit die is flip chip mounted to the other integrated circuit die with the coils facing each other across an insulating layer that includes routing to provide power to the flip chip mounted integrated circuit die. Other embodiments are disclosed.

The present invention generally relates to a device, a system comprising a plurality of devices and a method for controlled heat transfer, in particular by means of a condensing liquid, to workpieces, and in particular for soldering items to be soldered in a vapor phase zone. The vapor formed when the items to be soldered are immersed in the vapor phase zone is discharged and recovered. The immersion of the items to be soldered in the vapor phase zone and the removal of the items to be soldered from the vapor phase zone is realised in a simple manner.

The present application relates to a display device comprising a display member comprising a first zone, a second zone and a third zone defined between the first zone and the second zone; a first coating disposed on a first surface of the first zone of the display member; and a second coating disposed on a first surface of the second zone of the display member, wherein a first modulus of the first coating is less than a second modulus of the second coating.

The utility model discloses an auxiliary fixing device for the welding of PCB board relates to PCB board welding technical field, including work table, work table top surface skew angle symmetry has four guide grooves, four guide grooves all sliding have the sliding block, and the sliding block section is C shape, and the sliding block is equipped with the clamping plate in, and the clamping plate top surface rotation is equipped with the bolt, and the bolt one end penetrates the sliding block top surface, the utility model discloses the sliding cooperation of sliding block and guide groove, and it is convenient according to the flexible adjustment clamping plate position of PCB board size, has improved the convenience of adaptation different size PCB board, and then can realize the steady clamping function of various size PCB board, and through the rotation cooperation of bolt and clamping plate again, it is convenient to accurate control clamping plate's clamping intensity to PCB board, has improved the stability and welding quality when PCB board welding.

The present disclosure relates to an electronic device (12) for a camera module (1) having a housing (2) forming a light entrance opening (4), the electronic device comprising: a substrate (14) having a first side (18) and a second side (20), the first side being arranged in the housing (2) to face the light entrance opening (4) and the second side being opposite the first side (18); and an image sensor (16) having a photosensitive portion, designed as a flip-chip, and mounted to the second side (20). The substrate (14) is formed to be translucent at least in the region of the photosensitive portion of the image sensor (16). The disclosure further relates to a camera module (1) comprising the electronic device and a method for manufacturing the electronic device (12).

The utility model relates to DIP package wave -soldering fixture technical field, and disclose a kind of DIP package wave -soldering fixture, positioning carrier plate is installed in the upper portion of support frame seat with functional module form, flexible dressing can be carried out to positioning carrier plate according to welding piece specification when working, and connecting installation is carried out to the clamping limit of overturning clamping block buckling limit by stopper plate through positioning guide column direction support cooperation, and the welding element on the upper portion of circuit substrate is supported by pressing spring, and by elastic pressing, the uneven stress problem caused by component height difference can be avoided, the support limit stability of component and positioning accuracy greatly improve, limit pressing block is connected and installed using sliding slot structure, according to the component distribution situation on the upper portion of circuit substrate, appropriate down pressure support position is selected in the edge portion by sliding adjustment, the limit installation of different specifications circuit substrate can be flexibly adapted, limit pressing block uses elastic down pressure structure, and the stable down pressure limit support of circuit substrate can be realized.

The conductive traces may be conformally wrapped around a side of the display panel that includes the array of display pixels. The conductive traces may electrically connect contacts on the top surface of the display panel to corresponding contacts on a flexible printed circuit attached to the bottom surface of the display panel. The side-wrap conductive traces may be interposed between a first insulating layer and a second insulating layer. The flexible printed circuit may have a multi-step interface that is electrically connected to the side-wrap conductive traces. A system-in-package including a display driver integrated circuit may be mounted on the flexible printed circuit. The system-in-package may include a plurality of redistribution layers that electrically connect contacts on the display driver integrated circuit to contacts on the flexible printed circuit.

The application relates to the technical field of flexible electronics, and specifically discloses a liquid metal-based flexible hybrid electronic device for monitoring human pulse rate and a preparation method. The device comprises an intrinsically stretchable circuit formed by patterning liquid metal on a rubber substrate, and micro functional elements integrated in the form of a patch, which are collectively encapsulated by an elastomer. The preparation method comprises six steps of circuit printing, hot pressing, chemical etching, selective infiltration, stripping transfer and integrated encapsulation. The key is to utilize the selective infiltration of liquid metal to copper for patterning, and utilize the characteristics of semi-solid polymer for soft transfer. The device of the application benefits from its intrinsic stretchable characteristics, can conformally attach to human skin and synchronously deform, effectively suppresses motion artifacts, and thus realizes accurate, real-time and long-term monitoring of pulse rate in various states such as sitting, walking and running. The preparation method is simple in process and low in cost, and is suitable for large-scale production.

The utility model discloses a kind of semiconductor device, circuit board assembly, electric control box and electrical equipment, semiconductor device has horizontal direction and longitudinal direction, horizontal direction and longitudinal direction are perpendicular to each other, semiconductor device includes: plastic package body;Substrate, substrate is set in plastic package body, substrate includes first inverter power pad portion, second inverter power pad portion and PFC (power factor correction) power pad portion that are arranged at interval in horizontal direction;Drive side pin frame, drive side pin frame includes first inverter drive pin frame, second inverter drive pin frame and PFC drive pin frame arranged at interval in horizontal direction, first inverter drive pin frame, second inverter drive pin frame and PFC drive pin frame are respectively provided with first inverter drive chip, second inverter drive chip and PFC drive chip.Wherein, at least two of first inverter drive chip, second inverter drive chip and PFC drive chip are integrated chip, reduce the number of parts, reduce semiconductor device production difficulty.

The utility model relates to the technical field of controller, specifically speak a kind of connecting structure of plug-in capacitor and aluminium substrate. It includes aluminium substrate and capacitor body, and connecting piece is arranged between the capacitor body and aluminium substrate, the capacitor body is welded on the aluminium substrate, the connecting piece is provided with the through-hole corresponding with the capacitor angle of capacitor body, the capacitor angle passes through the corresponding through-hole, and the capacitor angle bending, is pressed on connecting piece in the capacitor angle of one end close to aluminium substrate, so that the outer wall surface of capacitor angle is in abutment with the lower end surface of connecting piece, the fixed connection of capacitor body and connecting piece, the section capacitor angle bending is welded with the aluminium substrate. Through the above technical scheme, the utility model solves the problem that the capacitor body is difficult to be welded on the aluminium substrate.

The utility model relates to electronic communication technical field discloses a kind of LVDS adapter plate, comprising: a PCB board;A LVDS male head, installation fixed on the PCB board, and with the PCB board electric connection, the LVDS male head includes a shell and the plug-in part of a plug-in part being set in the shell;A LVDS female head, for being connected with a LVDS wire, set on the PCB board and with the PCB board electric connection, the LVDS female head is electrically connected with the plug-in part of the LVDS male head by the PCB board;And a reinforcing plate, installed on the PCB board, and the reinforcing plate one side wall surface and the shell are abutted. Through such mode, improve connection stability.

The utility model relates to a novel embedded packaging structure, including PCB board, chip and backing plate, the upper surface of backing plate is opened with mounting hole, the chip sintering is installed in mounting hole and is flush with the upper surface of backing plate and forms chip unit, the lower surface of PCB board is connected with a plurality of chip unit. This structure directly adopts the backing plate of copper material and is welded or sintering connection with PCB, need not to be plated copper, has reduced the process complexity, has reduced the chip warping risk, and the process is more environmental protection;The present application need not laser drilling, uses mature mechanical drilling + plating process instead reduces the process complexity, improves the yield rate;Move the chip to the outside of PCB, avoid the warping deformation caused by the big CTE difference between chip and PCB material, avoid the equipment damage, the mounting difficulty etc. caused by the high warping of PCB;The radiator is in direct contact with the backing plate through the connecting layer, and the heat dissipation path is shorter, the thermal resistance is lower, and the heat dissipation efficiency is improved.

This utility model relates to the technical field of chip desoldering devices and discloses a Mini LED chip desoldering device. It adopts a sleeve-type closed and isolated heating structure. The sleeve is provided with exhaust slots on its periphery. During the desoldering process, the sleeve shields and isolates the outside of the chip to be desoldered. The exhaust slots located at the upper part allow hot air to be discharged directionally from the upper position, which can effectively avoid secondary rework of the circuit board caused by blowing air to heat nearby components. The sleeve shielding can effectively improve the heating efficiency of the chip inside the sleeve, which is conducive to improving the chip desoldering efficiency. Furthermore, it adopts a vacuum suction cup-type chip picking structure. Before heating, the suction cup base is pushed by a spring to make stable contact with the upper part of the chip. With the vacuum suction generated by the exhaust, the chip can be firmly separated and picked up when it is heated and moved upward. During the process, the chip can be protected from hard external force, which provides excellent protection for the chip and the circuit board structure.

The purpose of this utility model is to provide an electromagnetic pump soldering furnace, aiming to solve the problem of excessive heating time and solder ash buildup in existing electromagnetic pump soldering furnaces, which leads to defects. This utility model provides the following technical solution: an electromagnetic pump soldering furnace, including a pump body and a furnace body assembly. The furnace body assembly includes a shell and a furnace body. The furnace body includes an upper furnace body and a lower furnace body connected to each other. The upper furnace body is connected to the shell, and the lower furnace body is connected to the pump body. The upper furnace body is installed in the shell, and the lower furnace body is installed in the pump body. A groove is provided on the outer side of the lower furnace body, and an electric heating element is embedded in the groove. This utility model relates to the technical field of soldering furnace products.