13368results about "Substation/switching arrangement cooling/ventilation" patented technology

An electronic device includes an upper cover, a lower cover combined with the upper cover, and a heat conducting pillar. An accommodating space is formed by the upper cover and the lower cover. The heat conducting pillar is disposed in the accommodating space and physically connected with the upper cover and the lower cover to balance the temperature of the upper cover and the lower cover.

The present invention provides a cable-air management adapter system (“CAMAS”) that addresses airflow, heat buildup and cable routing concerns in enclosures that house electronic equipment. The CAMAS allows users to work from a single frame to increase an enclosure's size by adding multiple expansion channels that form a platform on which multiple airflow, heat dissipation and cable support management options are installed, eliminating the need to replace the enclosure.

The present invention provides a cable-air management adapter system ("CAMAS") that addresses airflow, heat buildup and cable routing concerns in enclosures that house electronic equipment. The CAMAS allows users to work from a single frame to increase an enclosure's size by adding multiple expansion channels that form a platform on which multiple airflow, heat dissipation and cable support management options are installed, eliminating the need to replace the enclosure.

Systems and methods for weatherproof cabinets with variably cooled compartments are provided. One such embodiment includes a housing having a door attached thereto, and in which a cooling compartment and a battery compartment are disposed. An electronics compartment is disposed within the cooling compartment, and an external fan is also disposed within the housing. Methods are also provided for transferring heat from inside the electronics compartment to the cooling compartment, from the cooling compartment to the outside of the housing, and from the battery compartment to the outside of the housing.

A multiphase inverter has two card shaped arm modules facing each other along a stacking direction. Each module has semiconductor switching elements disposed along an element arranging direction substantially perpendicular to the stacking direction, a common heat sink plate connecting direct current electrodes of the elements with one of terminals of the power source, and phase heat sink plates connecting respective alternating current electrodes of the elements with respective multiphase terminals of a motor. The elements of each module correspond to all phases of an alternating current. Each common heat sink plate forms a principal surface of the corresponding module, and the phase heat sink plates of each module forms another principal surface. The principal surfaces of each module face each other along the stacking direction.

A cooling device for a high voltage electrical unit for a motor of a vehicle, includes: an inverter for controlling the motor that drives the vehicle; an electrical energy storing device for supplying electrical energy to the motor via the inverter; a downverter for decreasing source voltage of the electrical energy storing device, the downverter, the inverter, and the electrical energy storing device disposed under a seat of the vehicle in a concentrated manner; a fan, disposed under the seat, for moving cooling air to the electrical energy storing device and the inverter; an air inlet disposed under the seat and at an end of the seat as viewed in a width direction of the vehicle; and an air outlet disposed under the seat and at the other end of the seat as viewed in a width direction of the vehicle.

A heat sink for cooling at least one power semiconductor module, and that includes a basin for containing a cooling liquid. The basin has a contact rim for receiving the base plate and that includes a surface that is sloped inwards to the basin.

A distribution cabinet (1) for accommodating weak-current distribution installations, in particular for arranging outdoors, havinga base box (2),an outer cabinet body (3) with at least one door (4),a cabinet cover (5), andan inner installation frame (6),the installation frame (6) being made up of profile sections (50), of which the cross-sectional shapes has two insertion pockets (51a,b), of which the insertion directions (52a,b) run at right angles to one another.

An arc-resistant enclosure for electrical switchgear which includes solid front and back walls, a pair of solid side walls joined to the front and back walls, a ventilated roof joined to the side walls and the front and back walls, and a ventilated base joined to the side walls and the front and back walls. Internal partitions divide the space enclosed by the front, back, side, top and bottom walls into multiple compartments for housing different types of components. The ventilated base forms air-intake ports for admitting ambient air into a plurality of the compartments, and the ventilated roof forms air-exhaust ports for allowing air to be exhausted from the compartments. As air inside the enclosure is heated by the switchgear, the hot air rises through the switchgear compartments and is exhausted through the top air-exhaust ports, and replacement ambient air is drawn into the bottoms of the compartments through the air-intake ports.

Disclosed is a liquid cooling system for an electric machine including a frame heat conductively attachable to a stator of an electric machine. The liquid cooling system further includes a cover mechanically attached to the frame and fluidly sealed to the frame, the cover and frame defining a cavity therebetween. The cover includes at least one protrusion extending substantially a distance between the cover and the frame. A method for constructing a liquid is also provided. The method includes forming at least one protrusion in the cover and structurally affixing the cover to the frame. The cover is fluidly sealed to the frame.

A fan controller causes a fan assembly to flow air through a computer system at a variable airflow rate to cool the computer system. The ambient air temperature to the computer system is detected, and the controller varies the airflow rate as a function of the ambient temperature within an ambient temperature range having an upper limit. The upper limit on the defined ambient temperature range that is used by a fan speed control algorithm may be selectively reduced from a default value in response to electronic input, such from a user or a software object. Correspondingly, the controller limits the air flow rate to a reduced value corresponding to the reduced upper limit. The reduction in stranded power that results from reducing the upper limit on the ambient temperature may be re-allocated, such as to other racks in the data center.

The invention relates to a switchgear cabinet air conditioning arrangement, having a central control arrangement as well as sensors communicating therewith and air conditioning components. Numerous air conditioning "strategies" are made possible, and hence an adaptation to variable conditions of use, are achieved by the measures where various air conditioning components are disposed at various locations in the switchgear and are controlled or regulated by means of the central control arrangement in dependence on sensor signals and / or adjustable or programmable controls.

A cooling device for a high voltage electrical unit for a motor of a vehicle, includes: an inverter for controlling the motor that drives the vehicle; an electrical energy storing device for supplying electrical energy to the motor via the inverter; a downverter for decreasing source voltage of the electrical energy storing device, the downverter, the inverter, and the electrical energy storing device disposed under a seat of the vehicle in a concentrated manner; a fan, disposed under the seat, for moving cooling air to the electrical energy storing device and the inverter; an air inlet disposed under the seat and at an end of the seat as viewed in a width direction of the vehicle; and an air outlet disposed under the seat and at the other end of the seat as viewed in a width direction of the vehicle.

An RF shield is fabricated from a solid piece of metal or metal alloy. Holes are cut through the metal or metal alloy at fixed positions to form an array. The diameter of the holes is selected to be significantly smaller than the RF wavelength (e.g., ⅓) it is designed to prevent from passing through the holes. The thickness of the plate (length of the holes) establishes the attenuation of the shield. The number of holes establishes the air or other fluid throughput.

Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

In a power supply unit disposed below a floor behind a seat, battery modules are disposed in a lower position, and a DC / DC converter and a motor driving inverter are disposed side by side in a vehicle width direction above the battery modules. Thus, cooling air flowing from the front side to the rear side of a vehicle body is divided into upper and lower portions to cool in parallel the DC / DC converter 41 and the motor driving inverter on the upper side and the battery modules on the lower side. Thus, it is possible to simplify a passage of the cooling air to reduce the size of the entire power supply unit, and improve mountability of the power supply unit on the vehicle body. Also, it is possible to apply cooling air at low temperature before heat exchange to all the battery module, the DC / DC converter, and the motor driving inverter, thereby enhancing cooling effect.

A method for controlling a data center, comprising a plurality of server systems, each associated with a cooling system and a thermal constraint, comprising: a concurrent physical condition of a first server system; predicting a future physical condition based on a set of future states of the first server system; dynamically controlling the cooling system in response to at least the input and the predicted future physical condition, to selectively cool the first server system sufficient to meet the predetermined thermal constraint; and controlling an allocation of tasks between the plurality of server systems to selectively load the first server system within the predetermined thermal constraint and selectively idle a second server system, wherein the idle second server system can be recruited to accept tasks when allocated to it, and wherein the cooling system associated with the idle second server system is selectively operated in a low power consumption state.

A switchgear cabinet having at least one cabinet door and a fan-assisted air circulation on an interior for cooling heat-generating devices installed inside, which are disposed one above the other in tiers. With particular air circulation, the partial cooling air flows in the tiers and can be set and adjusted, to a large extent independently of one another.

In order to achieve reduction in loss, a semiconductor power module comprises DC terminals to be connected to a condenser module and the semiconductor power module is used in combination with a cooling jacket for cooling, and the DC terminals protrude toward the condenser module beyond the cooling jacket.

A power module includes one or more semiconductor power devices bonded to an insulated metal substrate (IMS). A plurality of cooling fluid channels is integrated into the IMS.

An electric power distributor mountable on a motor vehicle for distributing power from a power source installed in the motor vehicle to a plurality of electric load units equipped in the vehicle has a plurality of semiconductor operative elements which are incorporated in a power supply circuit from the power source to the electric load units; a control circuit board incorporated with a control circuit for controlling an operation of the semiconductor operative elements; a housing for encasing the semiconductor operative elements and the control circuit board therein; and a heat releasing member provided on an outer surface of the housing to release heat transferred from the semiconductor operative elements outside of the housing. The control circuit board is arranged at such a position as to be mounted over the semiconductor operative elements from a side of the housing opposite to the mounted side of the heat releasing member with respect to the semiconductor operative elements, and is formed with a heat transfer layer on a side of the control circuit board as opposed to the semiconductor operative elements. The heat transfer layer and the heat releasing member are connected by a heat transfer member.

A terminal structure provides interfacing with power electronics circuitry and external circuitry. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the terminal structure and the circuits through fluid circulating through the support. The support may form a shield from both external EMI / RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

A heat sink or heat transfer device particularly for integrated circuits, uses a phase change working fluid in a cyclic flow path having at least one evaporator that serves multiple heat sources. The evaporator can be an integral vessel made of thermally conductive material to which the multiple heat sources are coupled, preferably at evaporation points that are placed on opposite sides of a fluid reservoir for the liquid phase of the working fluid that feeds the evaporation points via capillary flow through a picking material.

An electron beam (area beam) having a fixed area is irradiated onto the surface of a semiconductor sample, and reflected electrons from the sample surface are imaged by the imaging lens, and images of a plurality of regions of the surface of the semiconductor sample are obtained and stored in the image storage unit, and the stored images of the plurality of regions are compared with each other, and the existence of a defect in the regions and the defect position are measured. By doing this, in an apparatus for testing a pattern defect of the same design, foreign substances, and residuals on a wafer in the manufacturing process of a semiconductor apparatus by an electron beam, speeding-up of the test can be realized.

The invention provides a power distribution cabinet with a directional heat dissipation function, which comprises a cabinet body, a cabinet door, longitudinal guide rails, a transverse guide rail, a rack and the like. The cabinet body is of a cuboid frame structure; five surfaces of the cabinet body are formed by welding steel plates with a specification of 3mm; the cabinet door is rotationally connected with the cabinet body; two longitudinal guide rails which are vertically mounted are arranged inside the cabinet door; and the longitudinal guide rails are of a cylindrical structure, and are mounted inside the cabinet door by guide rail mounting bases. According to the power distribution cabinet provided by the invention, an infrared temperature sensor is driven by movable sliding blocks to measure temperatures of electrical devices in the cabinet body, so that positions of the electrical devices with high temperatures can be accurately monitored; and then a fan is used for carrying out focused heat dissipation on the electrical devices, so that a heat dissipation effect is improved.

A metal clad switchgear assembly comprising multiple compartments defined within an electrical enclosure is provided. The compartments interchangeably accommodate electrical components, for example, current transformers, a circuit breaker, a control power transformer, an epoxy encapsulated potential transformer, etc., electrical cables, and bus bars in predetermined positions for allowing front access and / or rear access to them. One or more compartments are configured for enabling the electrical cables to enter into and / or exit out from the electrical enclosure for allowing front and / or rear access to the electrical cables. A mounting block assembly is positioned in one or more of the compartments for mounting, enclosing, and providing front access to the electrical components. One or more infrared windows and inspection windows are positioned on a front side and / or a rear side of the switchgear assembly for scanning and providing a visual indication of the electrical components, the electrical cables, and the bus bars.

An assembly of devices including at least one switchgear cabinet and a cooling device. The switchgear cabinet has a closed interior, in which electric installations can be housed. The cooling device is attached in the vicinity of or near a lateral surface of the switchgear cabinet that runs vertically with respect to the front face, extending at least over part of the height of the switchgear cabinet and having a spatial connection with the interior via at least one air inlet and at least one vent outlet. The cooling device includes a receiving chamber that houses at least one heat exchanger. This invention facilitates the adaptation of the cooling device in superstructures of this type to modified cooling requirements. To achieve this, at least sections of the receiving chamber of the cooling device are divided into two or more receiving sub-chambers that are situated one above the other and a cooling module is housed in at least one of the receiving sub-chambers.

An exemplary embodiment relates to a cooling system and a method for cooling an electronic display. A preferred embodiment includes a transparent gas cooling chamber. The transparent gas cooling chamber may have a linear polarizer. The components in the system are preferably housed within the electronic display housing. The cooling chamber defines a gas compartment that is anterior to and coextensive with the electronic display surface. Fans may be used to propel the isolated gas through the cooling chamber. The circulating gas removes heat directly from the electronic display surface by convection. The isolated gas is transparent or at least semi-transparent. The image quality of an exemplary embodiment remains essentially unchanged, even though the gas is flowing through a narrow channel over the visible face of the electronic display surface.