The invention relates to a high-energy-density reactive compensation module, which comprises a compensation
unit group, an integrated heat dissipation structure, a high-speed switching circuit and a module
communication interface, and is characterized in that the compensation
unit group is formed by integrating a plurality of
solid-state capacitors and units in a packaging shell in a three-dimensional stacking manner; the positive
electrode and the negative
electrode of each
solid-state
capacitor unit are connected in parallel through a plurality of
layers of conductive busbars, the integrated heat dissipation structure is embedded in the packaging shell and comprises a heat conduction substrate, a micro-channel
cooling pipe and a
phase change material layer, the heat conduction substrate is in direct contact with the
solid-state
capacitor units, and the micro-channel
cooling pipe is connected with the
phase change material layer. And the micro-channel cooling pipes are distributed in the interlayer of the heat-conducting substrate. Through the design of the three-dimensional stacked solid-state
capacitor and the
copper-aluminum composite
busbar and the combination of the
hybrid isolation
driving circuit and an anti-interference structure,
microsecond-level switching response is realized, a multi-protocol
communication interface is integrated to support cooperative control of a heterogeneous
system, the problems of heat dissipation, loss and the like under high-density integration are solved, and a miniaturized and high-reliability reactive compensation solution is provided.