122results about How to "Prevent bad connection" patented technology

Refrigerator including a body forming an outer appearance of the refrigerator, a terminal detachably mounted on the body for controlling the refrigerator, a power supply device at one side of the body, for receiving power from an outside of the refrigerator, converting to a predetermined charge power, and supplying to the terminal, and an electric connection part connected between the power supply device and the terminal.

Embodiments provide a wiring board which is structured to be suitable for connection with components, whereby its reliability can be improved. An embodied wiring board of the invention has pads and a solder resist in which opening portions which expose the pads are formed. Protrusion-shaped members are fixed to some of the surfaces of the pads. The surfaces of the pads and the surfaces of the protrusion-shaped members are covered with solder bumps. The height of the solder bumps is larger than the height H1 and H2 of the protrusion-shaped members. The opening portions have different inner diameters, and the volume of the protrusion-shaped members increases as the diameter of the opening portion decreases.

An electrical connector includes a plug connector and a receptacle connector detachably fitted with each other. The plug connector comprises a plurality of coaxial cables, a flexible printed circuit board and a ground bar. Each of the coaxial cable has a center conductor, an insulator covering the center conductor, a braid as an external conductor covering the insulator, and a sheath covering the braid. The flexible printed circuit board has lands each connected to the center conductor of the coaxial cable and land portions to which the ground bar is connected. The grand bar has a main portion adapted to contact the braids of the coaxial cables, and fixed portions each positioned contiguously with the main portion and connected to the land portion. The electrical connector achieves the low height geometry of the plug connector and hence that of the receptacle connector and precludes any failed connection between the ground bar and the coaxial cables.

An electronic part compression bonding apparatus includes a compression bonding unit which bonds the electronic parts onto the substrate by thermocompression, a pressure supply unit, a pressure control unit which controls pressure, a heating unit which heats the compression bonding unit, a temperature control unit, and a thermocompression bonding control unit which controls the pressure control unit and the heating unit based on thermocompression bonding condition data in which at least one of pressure and heating temperature is variably set during a process from start until completion of a thermocompression bonding operation of the electronic parts. In the thermocompression bonding condition data, the pressure is set to a first pressure in a first stage in a process of the thermocompression bonding operation and a second pressure, which is lower than the first pressure, in a second stage that follows the first stage.

A semiconductor device or a radiographic imaging apparatus includes a substrate and a supporting member, the substrate having a semiconductor element or a conversion element and being bonded to the supporting member with a laminating member. The semiconductor device or the radiographic imaging apparatus further includes at least one cushioning member in at least one space between the substrate and the supporting member at least in a region including an electrical connection portion connected to at least one electrical component. Thus, when a malfunction or a defect is found in the at least one electrical component, such as TCP, on the periphery of the substrate, the defective electrical component can easily be replaced.

An object of the present invention is to provide a radio frequency integrated circuit module that is less susceptible to the electromagnetic influence and that is not degraded in electric connection. The radio frequency circuit module of the present invention including circuit elements mounted on a multi-layer circuit substrate having dielectric layers is characterized in that an exposed connection portion is provided by removing a part of the dielectric, and a strip line connected to said circuit elements and a co-axial line for transmitting a radio frequency signal from/to said strip line are connected together in a bottom portion of said exposed connection portion so as to be rectilinear in a three dimensional way.

A liquid ejecting head includes a passage-forming substrate, a plurality of pressure-generating elements, and an IC chip. The passage-forming substrate has a nozzle opening, and a pressure-generating chamber communicating with the nozzle opening. The plurality of pressure-generating elements are provided on a surface of the passage-forming substrate with a diaphragm interposed therebetween. The pressure-generating elements have electrodes and cause pressure change in the pressure-generating chamber. The IC chip is mounted on the surface of the passage-forming substrate with the pressure-generating elements. In this liquid ejecting head, the electrodes of the pressure-generating elements include individual electrodes, and at least the individual electrodes are electrically connected to the driver circuit via the through electrode.

Embodiments of the invention proxy control the establishment or continued existence of a WLAN connection by using the back end authentication mechanism to authenticate/de-authenticate a WLAN session in dependence on the experienced quality of the connection during the set-up phase or session itself. This has the effect of preventing a bad quality connection from being established or from continuing, and hence should improve the user experience, and help a WLAN network operator maintain a service with high Quality of Service (QoS).

[Problem] To provide a hybrid connector and a cable with the connector which correct a positional error of connector units and enable to connect connectors when they are connected and even if there is a small positional error of the connection unit.

[Solving Means] A hybrid connector holds plural connector units 2a to 4b in a common connector housing 5a, 5b. Each of the plural connector units is held individually movably in a direction (XY) orthogonal to an axial direction (Z) of connection. The connector unit is preferably movably held through a holding member 18 formed by an elastic matter. Front edges at the fitting start of the plural connector units 2a to 4b are tapered, and the connector units move along tapered portions in the connection fitting time. The plural connector units may be different in front-edge fitting start position along a connecting direction.

An imaging device unit comprises a CCD chip and a substrate on which the CCD chip is soldered. A light receiving surface is provided in the front surface of the CCD chip. A dustproof member for protect the light receiving surface from dust is attached around the light receiving surface. Chip terminals are arranged between the light receiving surface and the dustproof member. When the CCD chip is pressed against the rear surface of the substrate, the dustproof member is elastically deformed and tightly makes contact with the substrate. Since ultrasound is applied to the chip terminals and the substrate terminals in this state to melt them, the CCD chip is positioned in parallel with the substrate. Upon stopping ultrasound horns, both of the terminals are immediately soldered to each other, so that the CCD chip is securely fixed on the substrate with ease.

Respective attracting openings of a bonding head are disposed so as to avoid joining regions at which bump electrodes (obverse electrodes) of a semiconductor chip are joined with bump electrodes of a package substrate. Bump electrodes (reverse electrodes) that are connected to the bump electrodes are provided at a reverse side of the semiconductor chip at positions opposing the bump electrodes. Because the attracting openings do not overlap the joining regions, the bump electrodes (reverse electrodes) are not suctioned at the joining regions.

The invention provides an electrostatic actuator, etc. which is capable of miniaturizing the size, and preventing moisture, etc. from entering a gap in an effective manner. An electrostatic actuator includes an electrode substrate 10 having individual electrodes 12 as fixed electrodes, and a cavity substrate 20 having diaphragms 22 as movable electrodes which are disposed so as to be opposed to the fixed electrodes 12 with a predetermined distance, and operated due to an electrostatic force occurring between the cavity substrate 20 and the individual electrodes 12. Sealing portions 26 a are formed on one of the electrode substrate 10 and the cavity substrate 20, each of the sealing portions 26 a has a plurality of sealing layers (a TEOS layer 25 a, a moisture permeation preventing layer 25 b) laminated one another, and each of the sealing layers is made of a sealing material 25 for isolating a space formed between the individual electrode 12 and the diaphragm 22.

The invention discloses an automatic tin adding machine, which comprises a controller, a horizontal transmission mechanism and an automatic tin adding mechanism. The automatic tin adding mechanism is connected with the horizontal transmission mechanism via a connecting support and comprises a vertical transmission mechanism, a squeezing flange and a fixing flange, the vertical transmission mechanism is connected with the connecting support, the squeezing flange is connected with the vertical transmission mechanism and used for downwards squeezing a tin cream box, the fixing flange is connected with the connecting support and used for fixing the tin cream box, and the horizontal transmission mechanism and the vertical transmission mechanism are electrically connected with the controller. The automatic tin adding machine can achieve purposes of uniformly squeezing out tin cream, increasing the quality of products and saves resources.

The invention relates to the technical field of pressure sensing, and in particular to a pressure sensing device which can be used for detecting the pressure intensity. The pressure sensing device comprises a substrate, a conductive pattern layer and a pressure sensing signal wire, wherein the substrate comprises a first surface and a second surface; the first surface and the second surface are oppositely arranged; the conductive pattern layer is arranged on the first surface, comprises a plurality of pressure sensing electrodes and is used for sensing the touch pressure intensity; the pressure sensing signal wire is used for connecting the pressure sensing electrodes to a detection chip in a conducting manner and is of a hollow-out structure.

An assembled battery includes a plurality of battery cells, a bus bar that electrically connects the battery cells with each other, and a circuit board that is electrically connected with the battery cells. The bus bar has a first connection part that is electrically connected with the battery cells, and a second connection part that is electrically connected with a connection part of the circuit board via a conductive adhesive. The second connection part has a concave portion that contains the conductive adhesive.

In a planar view of a ceramic capacitor that has low ESL and is embeddable into a substrate, lengths of first and second external electrodes are L1, lengths from portions of the first and second external electrodes farthest from a capacitor main body to portions closer to the capacitor main body by about 40% of a thickness of the first or second external electrode in a laminating direction are L2, a ratio L2/L1 is about 80% or more and about 90% or less. In the planar view, a length of a third external electrode is L3, a length from a portion of the third external electrode farthest from the capacitor main body to a portion closer to the capacitor main body by about 40% of a thickness of the third external electrode in the laminating direction is L4, a ratio L4/L3 is about 80% or more.

A chip package and a package process thereof are provided. The chip package comprises a package substrate, a chip, a plurality of spacers, an adhesive layer, and a plurality of wires. The package substrate has a carrying surface. The chip is disposed on the carrying surface. The spacers are formed between the chip and the carrying surface to maintain an interval between the chip and the package substrate. The adhesive layer is disposed between the chip and carrying surface to encapsulate the spacers. The chip is electrically connected to the package substrate via the wires.

A lighting device is provided with a power circuit part (23) which comprises power terminals (25, 25, 25) supplied with power from a power source, harnesses (29, 29, 29) which supply a discharge lamp (9) with the power supplied to the power circuit part, a terminal housing (34) which is formed of resin material, has respectively one ends of the harnesses arranged inside, and comprises a harness holding part (48) inside for holding the respectively one ends of the harnesses, and welded terminals (28, 28, 28) composed of portions arranged inside of the terminal housing and portions projecting outward from the terminal housing. The one ends ofthe welded terminals are joined respectively with the one ends of the electric wires of the harnesses, and the other ends of the welded terminals are respectively welded to the power terminals of the power circuit part. This improves workability of connection work with the power circuit part and secures the satisfactory connection of the harnesses.