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2results about How to "Prevent bad connection" patented technology

An aluminum electrolytic capacitor with a novel lead-out structure

This utility model relates to the field of aluminum electrolytic capacitors and discloses an aluminum electrolytic capacitor with a novel lead-out structure. The capacitor includes a capacitor body with a sealing layer fixedly connected to its outer wall. A lead-out terminal assembly is disposed at the bottom of the capacitor body. The lead-out terminal assembly includes an anode terminal and a cathode terminal, both of which adopt a segmented structure, including an internal connecting section, a sealed transition section, and an external connecting section. The internal connecting section is welded to the internal electrodes of the capacitor body, and the sealed transition section penetrates the sealing layer at the bottom of the capacitor body. In this utility model, the segmented design improves connection stability, and the flat, bent design increases the heat dissipation area, thus achieving applicability to various electronic devices and demonstrating good application prospects. It avoids problems such as poor sealing, poor heat dissipation, and inconvenient installation associated with traditional lead-out structures, thereby improving the practicality of the aluminum electrolytic capacitor with the novel lead-out structure.
Owner:JILIN VOCATIONAL COLLEGE OF IND & TECH

Light-emitting diodes (LEDs), their fabrication methods, light-emitting panels, and display devices

PendingCN122094259Aprevent bad connectionavoid short circuitDisplay deviceAuxiliary electrode
This disclosure provides a light-emitting diode (LED) and its fabrication method, a light-emitting panel, and a display device. The LED includes: a first semiconductor layer; a plurality of columnar structures separated from each other and located on one side of the first semiconductor layer, each columnar structure including at least an active layer, a second semiconductor layer, and an auxiliary electrode layer stacked sequentially, with trenches between adjacent columnar structures; a dielectric layer located between any two columnar structures, the distance between the surface of the dielectric layer facing away from the first semiconductor layer and the first semiconductor layer being greater than the distance between the surface of the active layer facing away from the first semiconductor layer and the first semiconductor layer; a first electrode located on the side of the dielectric layer and columnar structures facing away from the first semiconductor layer, the auxiliary electrode layers in each columnar structure being coupled to each other through the first electrode; and a second electrode coupled to the first semiconductor layer. This disclosure avoids short circuits in the active layers of different columnar structures, improving product yield.
Owner:BOE TECHNOLOGY GROUP CO LTD