75results about How to "Improve wiring reliability" patented technology

A touch-sensitive device includes a transparent substrate, a decoration layer and a touch-sensing electrode layer. The decoration layer is disposed on the transparent substrate and includes a plurality of medium layers stacked with each other, and the decoration layer has at least one step portion and the step portion is defined by edges of two adjacent medium layers. The touch-sensing electrode layer is disposed on the transparent substrate and overlaps at least the step portion.

In order to provide a built-in capacitor type wiring board capable of preventing misalignment of the capacitor, a capacitor built-in type wiring board is provided which includes a core board; a multilayer portion disposed on at least one side of the core board and formed by a plurality of interlayer insulating layers; and a plurality of conductor layers alternately laminated on the core board. The capacitor is of a chip-like shape with first and second main surfaces and includes a dielectric layer; electrode layers laminated on the dielectric layer; and a hole portion opening at least at the second main surface. The capacitor is embedded in the interlayer insulating layers so that the second main surface faces the core board.

An interconnect structure including a lower interconnect level with a first dielectric layer having a first conductive material embedded therein; a dielectric capping layer located on the first dielectric layer and some portions of the first conductive material; an upper interconnect level including a second dielectric layer having at least one via opening filled with a second conductive material and at least one overlying line opening filled with the second conductive material disposed therein, wherein the at least one via opening is in contact with the first conductive material in the lower interconnect level by a via gouging feature; a dielectric liner on sidewalls of the at least one via opening; and a first diffusion barrier layer on sidewalls and a bottom of both the at least one via opening and the at least one overlying line opening. A method of forming the interconnect structure is also provided.

Embodiments provide a wiring board which is structured to be suitable for connection with components, whereby its reliability can be improved. An embodied wiring board of the invention has pads and a solder resist in which opening portions which expose the pads are formed. Protrusion-shaped members are fixed to some of the surfaces of the pads. The surfaces of the pads and the surfaces of the protrusion-shaped members are covered with solder bumps. The height of the solder bumps is larger than the height H1 and H2 of the protrusion-shaped members. The opening portions have different inner diameters, and the volume of the protrusion-shaped members increases as the diameter of the opening portion decreases.

The invention discloses a touch control device which comprises a transparent base plate, a touch control sensing electrode layer and a decorating layer. The decorating layer is arranged on the transparent base plate and comprises a plurality of mutually stacked dielectric layers, and a class structure is arranged between end edges of every two adjacent dielectric layers. The touch control sensing electrode layer is arranged on the transparent base plate and at least overlaps class structures. By means of the design, the decorating layer adopts layering indentation class design so that a transparent electrode or a transparent electrode connecting wire can gradually climb along each step of gentle slope when extends and is distributed onto the decorating layer, wire breaking probability can be reduced remarkably, the wire distribution reliability can be improved, and reject ratio of products can be effectively reduced.

A wiring board has a wiring member, a first reinforcing member and a second reinforcing member. The wiring member has wiring layers and insulating layers which are stacked, and the wiring layers include a first connecting electrode formed on a surface of the wiring member and a second connecting electrode formed on a back surface of the wiring member. A pin is formed on the second connecting electrode. The second reinforcing member is formed by a resin and serves to reinforce the wiring member. The first reinforcing member is formed on the whole back surface of the wiring member except for the pin provided on the second connecting electrode.

A semiconductor apparatus is constructed such that the top surface, contacting a barrier metal film, of a conducting film embedded in a trench is located below the top surface of a second interlayer insulating film. The semiconductor apparatus is fabricated such that a plasma treatment is performed in a non-nitriding environment after a polishing process using CMP, so as to form a damaged layer on top of the second interlayer insulating film and the conducting film, and a portion of the damaged layer is removed by etching.

A method for the formation of copper wiring films includes the steps of forming a first copper film by means of a CVD method on an insulating diffusion barrier film, which insulating diffusion barrier film has been formed on a semiconductor substrate and in which a concavity has been established; heating the first copper film to a temperature within the range from 200 to 500° C.; and subsequently forming a second copper film on the first copper film by a plating method using the first copper film as an electrode.

A wiring substrate is provided with an insulating resin film; and first and second conductive films provided on the back side and top side of the insulating resin film, respectively. The wiring substrate includes a via formed to fill a recess provided in the insulating resin film and electrically connecting the top side and back side of the insulating resin film. The via includes a first metal film formed to cover the side wall of the recess, an oxide film formed to cover the first meal film, and a second metal film formed on the metal oxide film.

The objective of the present invention is to prevent damage to an interlayer insulation film when forming a structure having a first wiring and a second wiring, which is laminated on the first wiring and connected to the first wiring, and are filled in the interlayer insulation film. After forming a first pattern corresponding to the first wiring on a first sacrificial film, fill a metal in the first pattern. Next, after forming a second sacrificial film on the first sacrificial film, form a second pattern corresponding to the second wiring, and fill a metal in the second pattern. Thereafter, remove the first sacrificial film and the second sacrificial film to form the first wiring and the second wiring, and further form the interlayer insulation film so as to coat the barrier film after coating the first wiring and the second wiring.

A coupling structure of electronic components, by which the break down of drive wiring at the time of folding a flexible substrate is prevented and the reliability of wiring is increased, is realized. In the coupling structure of electronic components of the present invention, a liquid crystal driver and a liquid crystal panel are arranged such that a surface of the flexible substrate, that surface being provided with the drive wiring and a solder resist, faces a surface of an element substrate, that surface being provided with display wiring. Furthermore, the drive wiring and the display wiring are electrically coupled to each other, and the solder resist is in contact with the element substrate.

A method of forming wires of a semiconductor device including forming a first metal wire on a semiconductor substrate; forming a first insulating film on the first metal wire; etching a portion of the first insulating film to expose a surface portion of the first metal wire; forming a first barrier metal film on sidewalls of the opening and the exposed first metal wire; etching a portion of the first barrier metal film on the first metal wire to expose a surface portion of the first metal wire; performing a heat treatment process on the exposed surface portion of the first metal wire to improve surface roughness; and forming a second wire by filling the opening using a conductive material.

A clutchless wire cutting apparatus for successively cutting off leading end portions of a predetermined length of wire from a wire stock. The wire is advanced through a cutting station which includes the cutting apparatus. The cutting apparatus includes an electrical motor whose output is coupled to the cutter mechanism which performs the successive wire cuts. A proximity switch or sensor located downstream of the cutting station signals a controller each time the wire reaches the desired length to periodically generate an electrical current to the electrical motor for selectively intermittently driving the motor at a relatively high frequency corresponding to the frequency at which wire cuts are made. The motor may also be continuously driven for cutting shorter wire lengths. The motor has an output on an motor shaft which is coupled to a cutter shaft via a belt drive. The cutter shaft includes an eccentric cam which acts directly on the wire cutter. A proximity sensor or switch is also provided at the cutting station to determine the location of the wire cutter to provide a home position for the system.

The invention relates to a half-module pivoted window mechanism applied to a sub transonic speed wind tunnel. The half-module pivoted window mechanism comprises a driving transmission module, a feedback and measurement module and a rotating module, wherein the driving transmission module consists of a support seat, a large cylindrical straight gear, an alternating current servo motor, a speed reducer, a gear press cover, a small cylindrical straight gear, a compression cover and a compression screw, the feedback and measurement module consists of a potentiometer support seat, a potentiometer, a press sheet, a shaft coupler, a small shaft and a connecting cover, and the rotating module consists of a right bearing cover, a bearing seat, a pair of precise conical roller bearings, a left bearing cover and a main shaft. Through the adoption of a cylindrical straight gear group, the half-module pivoted window mechanism can realize the movement for positive 360 degrees and negative 360 degrees, in addition, the integral hosting of the mechanism can be realized, a measurement part adopting the potentiometer as the core is adopted for the transmission matching of the cylindrical straight gear group, and the attack angle control precision being +/-3' can be realized.