The invention belongs to the technical field of
semiconductor processing, and particularly relates to a
semiconductor cavity high-precision
polishing machine which comprises a guide rail base, a motor, a shaft sleeve, a supporting plate, a transmission cylinder and a
polishing assembly which are fixedly connected. The
grinding assembly comprises a support, a protective shell, a shell, a take-up box, a spliced
grinding belt, a supporting roller and an adjusting roller. The adjusting roller pulls the spliced
grinding belt, the spliced grinding belt drives the second sliding roller on the supporting roller to slide along the first sliding groove, the size of the grinding
assembly is reduced, the grinding assembly can easily stretch into a small-
caliber cavity, the operation space of the grinding assembly is increased, and the probability that the grinding assembly collides with the cavity is reduced. While the size of the grinding assembly is reduced, the coarse grain grinding belt is switched to the
fine grain grinding belt, the small-
caliber cavity is polished through the coarse grain grinding belt, the
polishing precision can be ensured, and the situation that the precision of a high-precision device is reduced due to the fact that the
surface roughness of the small-
caliber cavity is too high is avoided.