397results about How to "Reliable forming" patented technology

The substrate processing apparatus according to the present invention is aimed to stably and efficiently perform a deposition process on a substrate W. The substrate processing apparatus supports the substrate W in a position facing a heater portion and thus rotates a holding member holding the substrate W. Furthermore, the heating portion houses a SiC heater and a heat reflecting member in an internal portion of a quartz bell jar made of transparent quartz, and depressurizes an internal space of a processing vessel and an internal space of the quartz bell jar at the same time; thereby allowing the thickness of the quartz bell jar to be thinner, and thus improving thermal conductivity of heat from the SiC heater and preventing contamination by the SiC heater.

Ink-jet inks for ink-jet printing are provided which include a vehicle and a colorant, the colorant associated with a primer core / shell polymer to form a primer / colorant combination, and the primer / colorant combination, upon printing on a print medium, encapsulated by a durable core / shell polymer. The primer core / shell polymer serves to promote adhesion of the durable core / shell polymer to the colorant and to disperse the colorant in the ink and the durable core / shell polymer serves to provide a smear-fast film upon drying of the ink on a print medium. The primer core / shell polymer comprises a hydrophobic core and a hydrophilic shell comprising a polar component, while the durable core / shell polymer comprises a hydrophobic core comprising a first Tg component, which, when homopolymerized, has a glass trnnsition temperature, Tg, between -150 DEG C. to +25 DEG C. and a second Tg component, which, when homopolymerized, has a glass transition temperature above +25 DEG C. and a hydrophilic shell selected from the group consisting of neutral shells, cationic shells, and anionic shells.

Methods of fabricating an energy-assisted magnetic recording (EAMR) head to compensate for a heat-induced protrusion of a near field transducer formed therein are disclosed. The methods can include applying optical power to the near field transducer to generate heat therein. The near field transducer protrudes beyond an air bearing surface of the EAMR head by the generated heat. The methods can further include removing a protruded portion of the near field transducer.

Methods of producing magnetic recording heads are disclosed. The methods can include providing a wafer comprising a substrate layer in which are disposed a plurality of damascene trenches. The method can further include depositing a pole material across the whole wafer, wherein the plurality of trenches are filled with the pole material. The methods can further include depositing a mask material over the pole material across the whole wafer. The methods can further include performing a first material removal process across the whole wafer to remove the mask material and a first portion of the pole material at a same material removal rate. The methods can further include performing a second material removal process to remove a second portion of the pole material above the substrate layer.

An energy assisted magnetic recording head comprises a slider having a leading edge, a trailing edge, and an air bearing surface (ABS), and a near field transducer (NFT) disposed in the slider and having a distal end proximate the ABS. The distal end is recessed from the ABS when no optical power is applied to the NFT, and is co-planar with the ABS when a predetermined amount of optical power is applied to the NFT. A portion of the slider surrounding the distal end forms a concave surface having a continuously varying slope when no optical power is applied to the NFT, and a flat surface coplanar with the ABS and the distal end when the predetermined amount of optical power is applied to the NFT. Applying optical power comprises coupling light into a waveguide formed in the head and directing the coupled light to the NFT via the waveguide.

A semiconductor device includes: a semiconductor substrate; a diode having a cathode formed on a first surface side of the semiconductor substrate and an anode formed on a second surface side of the semiconductor substrate; and a transistor formed over the semiconductor substrate. The transistor includes a semiconductor layer laminate formed over the semiconductor substrate, a source electrode and a drain electrode that are formed spaced apart from each other over the semiconductor layer laminate, and a gate electrode formed between the source electrode and the drain electrode. The source electrode is electrically connected to the anode, and the drain electrode is electrically connected to the cathode.

A method for producing a high density inductor includes the steps of forming a coil having a spiral shape, sealing the coil in the interior of a core member, and forming a terminal electrode for allowing electric conduction to said coil on the outside of said core member. In this method, the coil is formed by repeating a process of forming a wire layer by means of a thin film forming process and a process of forming an additional wire layer on top of the wire layer by means of the thin film forming process to pile up the wire layers. With this production method, it is possible to form a coil with a high aspect ratio. In addition, the inductor is designed in such a way that the core member envelopes only the coil. With that design, it is possible to make the inductor compact.

The liner hanger assembly seals with casing 8 and supports a liner 98 within a well. The tubular liner hanger 48 and a tubular expander 40 may be position downhole on a running tool at a desired depth along the casing string 8. An actuator assembly 6 may forcably move the tubular expander 40 into the tubular hanger, expanding the liner hanger to seal and secure the hanger against the casing string 8. After the running tool has been removed, a seal nipple may be sealed to the sealing sleeve of the tubular expander. A selectively releasable clutch 73 is provided for allowing rotation of the liner to rotate the liner with the running tool, and thereafter to disengage and release the running tool from the set liner hanger.

A radio communications system has subscriber stations and a base station that is provided with an antenna system with a plurality of antenna elements that emit a downlink signal in a weighted manner with coefficients of a weighting vector. In order to form a beam, a plurality of weighting vectors is determined at the subscriber station and the determined weighting vectors are transmitted to the base station. In a subsequent working phase, the subscriber station selects a dominant vector among the determined weighting vectors and transmits an indicator of the selected weighting vector to the base station.

An object to be processed can be cut highly accurately along a line to cut.An object to be processed 1 is irradiated with laser light while locating a converging point within a silicon wafer 11, and the converging point is relatively moved along a line to cut 5, so as to form modified regions M1, M2 positioned within the object 1 along the line to cut 5, and then a modified region M3 positioned between the modified regions M1, M2 within the object 1.

Provided herein is a composite, comprising: a polymer host selected from the group consisting of low-density polyethylene (LDPE), linear low-density polyethylene (LLDPE), polyethylene terephthalate (PET), polytetrafluoroethylene (PTFE), and polypropylene (PP), polyurethane, polycaprolactone (PCL), polydimethylsiloxane (PDMS), polymethylmethacrylate (PMMA), and polyoxymethylene (POM); and a guest molecule comprising hyaluronic acid; wherein the guest molecule is disposed within the polymer host, and wherein the guest molecule is covalently bonded to at least one other guest molecule. Also provided herein are methods for forming the composite, and blood-contracting devices made from the composite, such as heart valves and vascular grafts.

Disclosed herein is an insulated gate field effect transistor including: (A) a source / drain region and a channel formation region; (B) a gate electrode formed above the channel formation region; and (C) a gate insulating film; wherein the gate insulating film is composed of a gate insulating film main body portion formed between the gate electrode and the channel formation region, and a gate insulating film extension portion extending from the insulating film main body portion to a middle of a side surface portion of the gate electrode, and when a height of the gate electrode is HGate and a height of the gate insulating film extension portion is HIns with a surface of the channel formation region as a reference, a relationship of HIns<HGate is fulfilled.

A disposable diaper is formed in a crotch region with a body fluid absorbent panel extending in a back-and-forth direction of the diaper and in the vicinity of transversely opposite side edges of the crotch region with elastic leak-barrier cuffs extending in the back-and-forth direction. The leak-barrier cuffs are normally under a tension in the back-and-forth direction. The body fluid absorbent panel is formed with first folding guide means extending across the body fluid absorbent panel, along which the body fluid absorbent panel can be folded to bring the body fluid absorbent panel close to the diaper wearer.

A method for manufacturing a wiring board with built-in component. The method provides a secure connection between a component and interlayer insulating layers so that the wiring board with built-in component has excellent reliability. The wiring board is manufactured through a core board preparation step, a component preparation step, an accommodation step and a height alignment step. In the core board preparation step, a core board having an accommodation hole therein is prepared. In the component preparation step, a ceramic capacitor having therein a plurality of protruding conductors which protrudes from a capacitor rear surface is prepared. In the accommodation step, the ceramic capacitor is accommodated in the accommodation hole with the core rear surface facing the same side as the capacitor rear surface. In the height alignment step, a surface of a top portion of the protruding conductor and a surface of a conductor layer formed on the core rear surface are aligned to the same height.

An ablation device for cardiac tissue, in particular for forming a circular lesion around a vessel orifice in the heart, comprisesa catheter which, in the region of its distal end, is provided with an abutment device for holding the distal end on a cardiac vessel orifice, anda linear ablation applicator which is disposed proximally or distally relative to the abutment device of the catheter and is movable from a straight passive position into a radially expanded, approximately circular-arc-type encircling ablation position.

A thin-film magnetic head is constructed such that a main magnetic pole layer having a magnetic pole end face on a side of a medium-opposing surface opposing a recording medium, a write shield layer opposing the main magnetic pole layer on the medium-opposing surface side, a gap layer formed between the main magnetic pole layer and write shield layer, and a thin-film coil wound about the write shield layer or main magnetic pole layer are laminated on a substrate. This thin-film magnetic head has an equidistant two-stage structure in which a first turn part of a first conductor layer and a second turn part of a second conductor layer overlap vertically along the medium-opposing surface while having the same front distance from respective front side faces closer to the medium-opposing surface to the medium-opposing surface.

A semiconductor device includes: a first insulation film formed over a semiconductor substrate; and a plurality of first interconnects selectively formed in the first insulation film. A plurality of gaps are formed in part of the first insulation film located between adjacent ones of the first interconnects so that each of the gaps has a cylindrical shape extending vertically to a principal surface of the semiconductor substrate. A cap film is formed of metal or a material containing metal in upper part of each of the first interconnects.

In order to provide a battery in which a molded section can be fixed to a battery cell, a battery comprises a battery cell, a circuit board which is attached to the battery cell, an electrode terminal which connects the battery cell and the circuit board electrically, a molded section which adheres the circuit board and the electrode terminal to the battery cell as an entire unit, adhesion strengthened areas which are formed between the electrode terminal and the battery, and electrode terminal inner surface resin sections which are formed in a part of the molded section of the adhesion strengthened area.

A device and method for the manufacture of medical devices, specifically, endovascular grafts, or sections thereof. Layers of fusible material are disposed upon a shape forming member and seams formed between the layers in a configuration that can produce inflatable channels in desired portions of the graft. After creation of the seams, the fusible material of the inflatable channels may be fixed while the channels are in an expanded state. A five axis robotic seam forming apparatus may be used to create the seams in the layers of fusible material.

Embodiments provide a wiring board which is structured to be suitable for connection with components, whereby its reliability can be improved. An embodied wiring board of the invention has pads and a solder resist in which opening portions which expose the pads are formed. Protrusion-shaped members are fixed to some of the surfaces of the pads. The surfaces of the pads and the surfaces of the protrusion-shaped members are covered with solder bumps. The height of the solder bumps is larger than the height H1 and H2 of the protrusion-shaped members. The opening portions have different inner diameters, and the volume of the protrusion-shaped members increases as the diameter of the opening portion decreases.

A processing method of a polishing pad for semiconductor wafer capable of forming a groove, a concave portion, a through hole and the like having a small surface roughness of the inner surface of the groove and the like of 20 mum or less, a high dimensional accuracy and a uniform cross-sectional shape, and a polishing pad for semiconductor wafer. In the processing method, a surface of a polishing pad including a water-insoluble matrix containing a crosslinked polymer and a water-soluble particle dispersed in the water-insoluble matrix is processed by cutting and the like. Additionally, when a groove and the like are formed, it is preferable that a polishing pad is placed on one surface side of a machining table having a sucking hole, the pad is fixed on the one surface side of the machining table by vacuuming sucking it from the other surface of the machining table, and then a groove and the like are formed.

The invention discloses a punching device for a buffer support of a rear shock absorber of an automobile, which comprises an upper die plate, a lower die plate, a die plate motion guide device, a male die, an upper stripper plate, a female die and a lower stripper plate, and is characterized in that the male die is fixed on the lower surface of the upper die plate, the upper stripper plate is fixed on the lower surface of the upper die plate through a stripper bolt penetrating a stripper spring, the female die is fixed on the upper surface of the lower die plate, the lower surface of the upper striper plate is in contact with the female die, the lower stripper plate is fixed with a tray of a punch through a pull rod penetrating the lower die plate, a stripper push rod is further arranged between the lower stripper plate and the tray of the punch, the male die and the upper stripper plate can slide relatively, and the female die and the lower stripper plate can slide relatively. The punching device can well realize blanking and forming once in the device, save a large number of process steps, greatly save the production cost, improve the production efficiency and ensure the product quality; furthermore, the punching device has low manufacturing cost, economy and durability.

In order to provide a new production method of a suspension board with circuit capable of preventing deterioration of the outward appearance and defects in products caused by a metal supporting layer, and further capable of forming an electroless nickel plating layer having an even thickness in a reliable manner, an insulating base layer is first formed on a supporting board, and a chromium thin film and a copper thin film are formed next sequentially on the surface of the supporting board exposed from the insulating base layer and on the entire surface of the insulating base layer. Subsequently, a plating resist is formed in a reversal pattern with respect to the wired circuit pattern on the surface of the copper thin film, and a conductor layer is formed on the surface of the copper thin film exposed from the plating resist by electrolytic plating. The plating resist is removed after an electroless nickel plating layer is formed on the conductor layer. Subsequently, the copper thin film and the chromium thin film are removed sequentially, and an insulating cover layer is formed next.

Crystal lattice dislocations in material surrounding trench capacitors and other trench structures are avoided by alteration of stresses such as decreasing compressive stresses and / or development of persistent tensile forces within material deposited in the trench and thus at the material interface formed by the trench. Such alteration of stresses is achieved by volume reduction of a film deposited in the trench. The material is preferably a hydrogenated nitride of silicon, boron or silicon-carbon alloy which may be reduced in volume by partial or substantially complete dehydrogenation during subsequent heat treatment at temperatures where the film will exhibit substantial creep resistance. The amount of volume reduction can be closely controlled by control of concentration of hydrogen or other gas or volatile material in the film. Further fine adjustment of stresses can be achieved in combination with this mechanism by volume reduction of other materials which may be used, in part, to confine the film through other mechanisms such as annealing.

According to the present invention, in a carrying system comprising a carrying vehicle and a manufacturing apparatus the interior of which is kept cleaner than a surrounding environment, manufactured articles to be transferred are prevented from being contaminated by foreign matter or the like attached to transfer ports. A carrying vehicle includes a running unit 14 that runs along a predetermined carrying path, a cleaning unit 12 that supplies cleaned air, a housing section 13 to which the cleaned air is supplied and in which manufactured articles are housed, a transfer port 11 which is formed in a side of a housing and through which a manufactured article is loaded into or unloaded from the housing section 13, and an air injecting section 19A that blows out air toward the transfer port 11.

A top-fill hummingbird feeder has a generally upstanding liquid container with a large opening at its top end that is closed and sealed by a removable top or cap. The cap has a two-part construction including an outer shell and an inner sealing member. The inner sealing member includes a sealing element in the form of a vertically elongated, reinforced sealing ring that is received within the top of the container with a friction fit to automatically form a cork-type seal when the outer shell is threaded onto the container. Unthreading of the outer shell pulls the sealing ring out of engagement with the container to remove the cap.