882results about How to "Shorten inspection time" patented technology

The present invention discloses an object image detection method, which uses a coarse-to-fine strategy to detect objects. The method of the present invention comprises steps: acquiring an image and pre-processing the image to achieve dimensional reduction and information fusion; using a trained filter to screen features; and sequentially using a coarse-level MLP verifier and a fine-level MLP verifier to perform a neural network image detection to determine whether the features of the image match the features of the image of a target object. The present invention simultaneously uses three mainstream image detection methods, including the statistic method, neural network method and adaboost method, to perform image detection. Therefore, the present invention has the advantages of the rapidity of the adaboost method and the accuracy of the neural network method at the same time.

A method of determining a presence of items of interest within a cargo container is disclosed. The method includes obtaining information from an initial radiation scan of at least one of the cargo container and contents therein, identifying a target portion of the cargo container in response to the information obtained, transmitting a target radiation beam along the target portion of the cargo container, and detecting radiation received in response to the transmitting. The method further includes analyzing the detected radiation for a presence of items of interest, and in response to the analyzing, generating a first signal indicative of the presence of the items of interest, or generating a second signal indicative of an absence of the items of interest.

A semiconductor device includes a first semiconductor element; a first thick plate portion that is electrically connected to an electrode on a lower surface side of the first semiconductor element, and is formed by a conductor; a second semiconductor element that is arranged such that a main surface of the second semiconductor element faces a main surface of the first semiconductor element; a second thick plate portion that is electrically connected to an electrode on a lower surface side of the second semiconductor element, and is formed by a conductor; a third thick plate portion that is electrically connected to an electrode on an upper surface side of the first semiconductor element, and is formed by a conductor; a fourth thick plate portion that is electrically connected to an electrode on an upper surface side of the second semiconductor element, and is formed by a conductor; a first thin plate portion that is provided on the second thick plate portion, is formed by a conductor, and is thinner than the second thick plate portion; and a second thin plate portion that is provided on the third thick plate portion, is formed by a conductor, and is thinner than the third thick plate portion. The first thin plate portion and the second thin plate portion are fixed together and electrically connected.

An optically scanning apparatus and defect inspection system able to detect a defect with a high resolution and able to greatly shorten the inspection time. An radiation beam generated from a light source is converted to a light beam array of an m×n matrix by a two-dimensional diffraction grating. The light beams of the light beam array are focused into micro spots by an objective lens and projected on a sample. Therefore, a two-dimensional light spot array of an m×n matrix is formed on a sample. The sample stage rotates and moves rectilinearly in an r direction, so the sample surface is scanned by the m×n matrix of light spots. As a result, the sample surface is spirally scanned by a light beam of a belt shape of the scan width, so can be scanned at a high speed. Further, the beams reflected by the sample surface are received by light receiving elements separated by light blocking members, so a confocal optical system is formed and as a result the resolution of detection of defects becomes much higher.

The invention provides a code inspection method and device. The code inspection method comprises the following steps: obtaining a file list with to-be-modified codes; and carrying out error inspection, alarm inspection and prompt inspection on the file list with the to-be-modified codes according to a preset code analysis rule, generating an inspection result and outputting the same. By adoption of the code inspection method provided by the invention, all codes in the file list with the to-be-modified codes can be scanned to inspect the codes not satisfying a development rule, bad editing habits of online banking developers in a development process can be corrected, and the online banking developers can follow the standard encoding rule so as to improve the code quality, improve the code inspection efficiency and shorten the code inspection time. In addition, the code inspection device provided by the embodiment of the invention adopts an Eclipse plug-in development mode, thereby being less in investment, fast to become effective, customizable, open in code sources and capable of satisfying the online banking code review requirements at present and in the future.

A reactor service manipulator delivery system supported on a remotely operated trolley that travels on top of a track attached to the steam dam of a BWR shroud. The trolley has a mast and pulley system designed to manipulate a TV camera for inspection of various reactor components inboard and outboard of the shroud at the same time that fuel is being moved within the core during a refueling operation so that refueling can be performed in parallel with the inspection.

A pattern inspection apparatus has a setting unit of a plurality of cell areas A and B of different cell comparison pitches and inspects the plurality of cell areas of the different cell comparison pitches in accordance with settings of the setting unit. As information to read out image data for an inspection image and a reference image from an image memory, in addition to position information of a defective image, identification information showing either a cell comparison or a die comparison and relative position information of the reference image can be set. The apparatus also has a unit for setting a plurality of inspection threshold values every inspection area and inspects a plurality of inspection areas by the plurality of inspection threshold values.

Because a mirror electron imaging type inspection apparatus for obtaining an inspection object image with mirror electrons has been difficult to optimize inspection conditions, since the image forming principles of the apparatus are different from those of conventional SEM type inspection apparatuses. In order to solve the above conventional problem, the present invention has made it possible for the user to examine such conditions as inspection speed, inspection sensitivity, etc. intuitively by displaying the relationship among the values of inspection speed S, inspection object digital signal image pixel size D, inspection object image size L, and image signal acquisition cycle P with use of a time delay integration method as a graph on an operation screen. The user can thus determine a set of values of a pixel size, an inspection image width, and a TDI sensor operation cycle easily with reference to the displayed graph.

Provided are a method and apparatus for inspecting a defect on a plane, such as a surface or a section, of an object to be inspected. The object is, for instance, a silicon wafer. A whole area of a plane of the object is first imaged by an optical system to gain image signals. Then, a particular region on the plane is positionally detected from the image signals. The particular region includes a blot and a defect and has a higher luminance than a remaining region on the plane. A blot is distinguishably detected from the particular region. A specified region on the plane is then subjected to a detailed inspection under a microscope. The region is set to avoid the blot even if the blot is on the region. The detailed inspection under the microscope is performed toward only the region with no blot.

A system is provided for remotely detecting and locating damaged conductors. The system includes at least one slave controller disposed proximate at least one load and electrically connected to the loads via at least one conductor. The slave controller includes at least one solid-state switch capable of controllably altering the input current to the loads, as well as at least one measuring element for measuring at least one parameter associated with the loads and the solid-state switches. The solid-state switch can controllably alter the input current to the loads according to the parameters. The system also includes at least one damaged wire detector electrically connected to the conductors between the slave controller and the loads. The damaged wire detector is capable of detecting and/or locating at least one damaged conductor.

The embodiment of the invention discloses an inspection method, installation, device and storage medium for vehicle automatic driving algorithm. The method comprises the following steps of: acquiringrelative physical information of the self-driving vehicle and other reference objects in the driving scene, and determining a destination driving state parameter of the self-driving vehicle accordingto the relative physical information, inputting the relative physical information into the automatic driving algorithm to obtain the driving control parameters output by the automatic driving algorithm. The driving control parameters include the direction to be traveled and the speed to be traveled; when the deviation value of the to-be-traveled direction and the destination traveling direction isless than or equal to the direction deviation threshold and the difference between the to-be-traveled speed and the target traveling speed is less than or equal to the speed difference threshold, theautomatic driving algorithm passes the inspection. The method performs an algorithm level test on the automatic driving algorithm, effectively checks whether the automatic driving algorithm is qualified, and reduces the inspection cost.