3747 results about "Inspection method" patented technology

For angular resolved spectrometry a radiation beam is used having an illumination profile having four quadrants is used. The first and third quadrants are illuminated whereas the second and fourth quadrants aren't illuminated. The resulting pupil plane is thus also divided into four quadrants with only the zeroth order diffraction pattern appearing in the first and third quadrants and only the first order diffraction pattern appearing in the second and third quadrants.

An apparatus and method to determine a property of a substrate by measuring, in the pupil plane of a high numerical aperture lens, an angle-resolved spectrum as a result of radiation being reflected off the substrate. The property may be angle and wavelength dependent. The radiation that is reflected off the substrate is radially polarized.

A method and apparatus for inspecting a photolithography mask for defects is provided. The inspection method comprises providing a defect area image to an image simulator wherein the defect area image is an image of a portion of a photolithography mask, and providing a set of lithography parameters as a second input to the image simulator. The defect area image may be provided by an inspection tool which scans the photolithography mask for defects using a high resolution microscope and captures images of areas of the mask around identified potential defects. The image simulator generates a first simulated image in response to the defect area image and the set of lithography parameters. The first simulated image is a simulation of an image which would be printed on a wafer if the wafer were to be exposed to an illumination source directed through the portion of the mask. The method may also include providing a second simulated image which is a simulation of the wafer print of the portion of the design mask which corresponds to the portion represented by the defect area image. The method also provides for the comparison of the first and second simulated images in order to determine the printability of any identified potential defects on the photolithography mask. A method of determining the process window effect of any identified potential defects is also provided for.

An excisional biopsy device includes a tubular member having a window near a distal tip thereof; a cutting tool, a distal end of the cutting tool being attached near the distal tip of the tubular member, at least a distal portion of the cutting tool being configured to selectively bow out of the window and to retract within the window; and a tissue collection device externally attached at least to the tubular member, the tissue collection device collecting tissue excised by the cutting tool as the biopsy device is rotated and the cutting tool is bowed. An excisional biopsy method for soft tissue includes the steps of inserting a generally tubular member into the tissue, the tubular member including a cutting tool adapted to selectively bow away from the tubular member and an external tissue collection device near a distal tip of the tubular member; rotating the tubular member; selectively varying a degree of bowing of the cutting tool; collecting tissue severed by the cutting tool in the tissue collection device; and retracting the tubular member from the soft tissue. The tubular member may include an imaging transducer and the method may include the step of displaying information received from the transducer on a display device and the step of varying the degree of bowing of the cutting tool based upon the displayed information from the imaging transducer. Alternatively, the imaging transducer may be disposed within a removable transducer core adapted to fit within the tubular member.

Abstract of the Disclosure In a network security system, clients search for neighbor access points (APs) in order to establish wireless connections to a LAN. As a result of the search, each of the clients dispatches a list of access points obtained to a controller. The controller detects non-registered access points by comparing a list of previously registered access points with the lists dispatched by the clients.

First, a pattern inspection apparatus detects the first edge from an image of a pattern to-be-inspected. Next, the pattern inspection apparatus conducts matching of the image of the pattern to-be-inspected and the first reference pattern by comparing the first edge and an edge of the first reference pattern. Since, as a result of the matching, a shift quantity S₁ can be obtained, and then the first reference pattern is shifted by this shift quantity S₁. Subsequently the pattern to-be-inspected is inspected by comparing the first edge and the edge of the first reference pattern so shifted. In this first inspection, pattern deformation quantities are obtained and defects are detected. A shift quantity S₂ can be obtained as one of the pattern deformation quantities. Next, in order to detect the second edge from the pattern image to-be-inspected, the corresponding second reference pattern is shifted by a shift quantity S₁+S₂. Using the second reference pattern so shifted, a profile is obtained on the pattern image to-be-inspected and the second edge is detected. Then, by comparing the second edge and the edge of the second reference pattern so shifted, the pattern to-be-inspected is inspected. Also in this second inspection, the pattern deformation quantities are obtained and defects are detected. A shift quantity S₃ can be obtained as one of the pattern deformation quantities.

Disclosed is a semiconductor die having a lower test structure formed in a lower metal layer of the semiconductor die. The lower conductive test structure has a first end and a second end. The first end is coupled to a predetermined voltage level. The semiconductor die also includes an insulating layer formed over the lower metal layer. The die further includes an upper test structure formed in an upper metal layer of the semiconductor die. The upper conductive test structure is coupled with the second end of the lower conductive test structure. The upper metal layer is formed over the insulating layer. In a specific implementation, the first end of the lower test structure is coupled to ground. In another embodiment, the semiconductor die also includes a substrate and a first via coupled between the first end of the lower test structure and the substrate. In yet another aspect, the lower test structure is an extended metal line, and the upper test structure is a voltage contrast element. Methods for inspecting and fabricating such semiconductor die are also disclosed.

The invention discloses an intelligent inspection system and an inspection method for an electric transmission line by an unmanned aerial vehicle. The intelligent inspection system comprises an inspection mission planning system, a dispatching system, a monitoring system, an inspection result processing platform and mobile branch stations, wherein the inspection mission planning system communicates with the inspection result processing platform and the dispatching system respectively; the inspection result processing platform and the dispatching system communicates with the monitoring system respectively; the monitoring system is connected and communicate with the mobile branch stations. The inspection method has the benefits that factors of the inspection unmanned aerial vehicle, inspection equipment, an inspector, and the like accessing the dispatching platform through a dispatching terminal can be dispatched effectively to realize equipped configuration of unmanned aerial vehicle inspection resource; the usage rates of personnel and equipment can be improved; the no-load rate and vacancy rate of the inspection equipment are reduced; through centralized monitoring of condition information inspected by the unmanned aerial vehicle, unmanned aerial vehicle inspection dispatching personnel can master unmanned aerial vehicle inspection in the large effectively; the service life of the unmanned aerial vehicle is prolonged.

A servo writer of the invention writes a servo signal in a magnetic tape, reads and inspects the signal, and has a servo writer main body and a plurality of unit panels changeably loaded to a panel change unit provided at the main body according to a product class of the tape, wherein any of the unit panels has a servo write head for writing the signal in the tape and a write-sub-control mechanism for controlling a writing of the signal by the write head, wherein the write head and the sub-control mechanism write a predetermined signal in the tape, and wherein the main body has a signal main control mechanism for mainly controlling a writing of the signal in the tape by the write head, a servo read head for reading the signal written in the tape, and a signal inspection mechanism for processing and inspecting the signal.

A method for inspecting a honeycomb structured body of the present invention is a method for inspecting a honeycomb structured body comprising a pillar-shaped honeycomb fired body having a multitude of cells placed in parallel with one another in the longitudinal direction with a cell wall therebetween, the method comprising: measuring the shape of the honeycomb structured body in the longitudinal direction through preparing a contact measurement apparatus including a reference surface, a rail disposed perpendicularly to the reference surface, and a measurement probe including a contacting probe configured to move along the rail; contacting one end face of the honeycomb structured body with the reference surface; and moving the measurement probe in a direction nearing the reference surface to contact the contacting probe with the other end face of the honeycomb structured body.

A dark spot defect caused by short-circuiting of an EL element is detected based on an emission brightness or a current flowing through the EL element when an element driving transistor which controls a drive current to be supplied to the EL element is operated in its linear operating region and the EL element is set to an emission level. A dim spot defect caused by a characteristic variation of the element driving transistor can be detected based on a current flowing through the EL element when the element driving transistor is operated in its saturation operating region and the EL element is set to the emission level. When an abnormal display pixel is detected based on an emission brightness, a pixel which is determined as an abnormal display pixel and which is not determined as a dark spot defect during a dark spot inspection is determined, and the pixel is detected as a dim spot defect caused by the characteristic variation of the element driving transistor.

Methods and apparatus for categorizing defects on workpieces, such as semiconductor wafers and masks used in lithographically writing patterns into such wafers are provided. For some embodiments, by analyzing the layout in the neighborhood of the defect, and matching it to similar defected neighborhoods in different locations across the die, defects may be categorized by common structures in which they occur.

Methods and apparatus are provided involving adaptive content inspection. In one embodiment, a content inspection processor may identify information with respect to input data and provide the information to a host controller. The host controller may adapt search criteria or other parameters and provide the adapted parameter to the content inspection processor. Other embodiments may include a content inspection processor having integrated feedback, such that results data is fed back to the content inspection processor. The results data may be processed before being provided to the content inspection processor.

A method of inspecting defects of a plurality of patterns that are formed on a substrate to have naturally the same shape. According to this method, in order to detect very small defects of the patterns with high sensitivity without being affected by irregular brightness due to the thickness difference between the patterns formed on a semiconductor wafer, a first pattern being inspected is detected to produce a first image of the first pattern, the first image is stored, a second pattern being inspected is detected to produce a second image of said second pattern, the stored first image and the second image are matched in brightness, and the brightness-matched first and second images are compared with each other so that the patterns can be inspected.

Methods and systems for determining a position of inspection data with respect to a stored high resolution die image are provided. One method includes aligning data acquired by an inspection system for alignment sites on a wafer with data for predetermined alignment sites. The predetermined alignment sites have a predetermined position in die image space of a stored high resolution die image for the wafer. The method also includes determining positions of the alignment sites in the die image space based on the predetermined positions of the predetermined alignment sites in the die image space. In addition, the method includes determining a position of inspection data acquired for the wafer by the inspection system in the die image space based on the positions of the alignment sites in the die image space.

A system for inspecting an object has at least one light projector and at least one camera jointly defining a field of view and a computer operatively connected thereto. The computer is configured to acquire object data representative of the outer surface of the object through projection of light thereon by the light projector and acquisition of return light by the camera. The object data relates surface points on the outer surface of the object to one or more source point of the light projector. The computer is further configured to generate inspection information data based on the acquired object data and project the inspection information data on at least some of the surface points of the outer surface of the object using the corresponding source points of the at least one light projector. A method inspects an outer surface of an object.

The invention discloses an inspection system based on a mobile inspection apparatus of a transformer station and an inspection method thereof. The inspection system comprises a monitoring center; and the monitoring center is connected with at least one station-level mobile inspection apparatus intelligent inspection system of a transformer station through a network. And all station-level mobile inspection apparatus intelligent inspection systems include at least one base station. Meanwhile, an environmental information collection subsystem and fixed point auxiliary monitoring subsystems that are installed at places needing monitoring equipment in the transformer station are arranged in the transformer station. A detection unit comprises an infrared detection unit and an ultraviolet detection unit; and the ultraviolet detection unit is composed of an ultraviolet video server and an ultraviolet detection apparatus. According to the invention, an inspection path is optimized; the safety protection is good; and the intelligent degree is high; moreover, the inspection system has advantages of whole time fault detection and seamless video monitoring; and a novel technical detection means and omnibearing safety guarantee are provided for an intelligent transformer station.

The inspection methods and systems of the present invention are mobile, rapidly deployable, and capable of scanning a wide variety of receptacles cost-effectively and accurately on uneven surfaces. The present invention is directed toward a portable inspection system for generating an image representation of target objects using a radiation source, comprising a mobile vehicle, a detector array physically attached to a movable boom having a proximal end and a distal end. The proximal end is physically attached to the vehicle. The invention also comprises at least one source of radiation. The radiation source is fixedly attached to the distal end of the boom, wherein the image is generated by introducing the target objects in between the radiation source and the detector array, exposing the objects to radiation, and detecting radiation.

A pulsed eddy current sensor probe includes a sensor array board. A number of sensors are arranged on the sensor array board and are operable to sense and generate output signals from the transient electromagnetic flux in a part being inspected. Each of the sensors has a differential output with a positive and a negative output. At least one drive coil is disposed adjacent to the sensors and is operable to transmit transient electromagnetic flux into the part. A first and a second multiplexer are arranged on the sensor array board and are operable to switch between the sensors. The first and second multiplexers are connected to the positive and negative outputs of the sensors, respectively.

An eddy current probe and associated method of inspecting a structure are provided that are capable of generating a two-dimensional image of the structure, generally in real time. The eddy current probe includes an eddy current probe array having a plurality of first and second coils that cross one another to define a plurality of sensing elements. The eddy current probe array may also include a plurality of magnetically permeable core elements located coincident with respective sensing elements and at least partially encircled by respective first and second coils. The eddy current probe may also include an alternating current source electrically connected to the first coils and sense electronics for sensing current induced in the second coils. In operation, the current sensed in the second coils represents at least one characteristic of the structure, such as the electrical conductivity of the structure.

A pattern inspection apparatus which compares images of regions, corresponding to each other, of patterns that are formed so as to be identical and judges that non-coincident portions in the images are defects. The pattern inspection apparatus is equipped with an image comparing section which plots individual pixels of an inspection subject image in a feature space and detects excessively deviated points in the feature space as defects. Defects can be detected correctly even when the same patterns in images have a brightness difference due to a difference in the thickness of a film formed on a wafer.

In an inspection subject substrate, there is a problem that a defect signal is overlooked due to scattered light from a pattern and sensitivity decreases in an irregular circuit pattern part. The inventors propose a defect inspection method, characterized by comprising: an illumination step of guiding light emitted from a light source to a predetermined area on an inspection subject substrate under a plurality of predetermined optical conditions; a detection step of obtaining an electric signal by guiding scattered light components propagating in a predetermined range of azimuthal angle and in a predetermined range of elevation angle to a detector for each of a plurality of scattered light distributions occurred correspondingly to the plurality of optical conditions in the predetermined area; and a defect determination step of determining a defect based on the plurality of electric signals obtained in the detection step.

The inspection methods and systems of the present invention are mobile, rapidly deployable, and capable of scanning a wide variety of receptacles cost-effectively and accurately on uneven surfaces. The present invention is directed toward a portable inspection system for generating an image representation of target objects using a radiation source, comprising a mobile vehicle, a detector array physically attached to a movable boom having a proximal end and a distal end. The proximal end is physically attached to the vehicle. The invention also comprises at least one source of radiation. The radiation source is fixedly attached to the distal end of the boom, wherein the image is generated by introducing the target objects in between the radiation source and the detector array, exposing the objects to radiation, and detecting radiation.

A wafer edge defect inspection method and apparatus for use in an integrated circuit fabrication system includes an image capturing device for capturing images of the edges of wafers, a database in which the images are stored and accessible for analysis and a computer for analyzing the images of one or more wafer edges to locate edge defects and for evaluating the performance of the fabrication system. The inspection and data storage are performed automatically. The database storage enables detailed analysis of many wafers and fabrication process steps.

Even when the magnifying power is reduced, an image can be obtained at high resolution without significantly reducing the numerical aperture, and examination accuracy is improved. There is provided a microscope examination apparatus including a light source for emitting excitation light or illumination light to a specimen placed on a stage; an objective lens opposing the stage and capable of focusing fluorescence or reflected light from the specimen; an image-forming lens for forming an image of the specimen obtained by the objective lens; and an image-capturing unit for capturing the image of the specimen forming by the image-forming lens, wherein a plurality of the objective lenses having different magnifying powers is provided, and an objective-lens switching mechanism for switching among the objective lenses is provided, and wherein a plurality of the image-forming lenses having different magnifying powers is provided, and an image-forming-lens switching mechanism for switching among the image-forming lenses 5a and 5b is provided.

An electron beam inspection system of the image projection type includes a primary electron optical system for shaping an electron beam emitted from an electron gun into a rectangular configuration and applying the shaped electron beam to a sample surface to be inspected. A secondary electron optical system converges secondary electrons emitted from the sample. A detector converts the converged secondary electrons into an optical image through a fluorescent screen and focuses the image to a line sensor. A controller controls the charge transfer time of the line sensor at which the picked-up line image is transferred between each pair of adjacent pixel rows provided in the line sensor in association with the moving speed of a stage for moving the sample.

In a detection step, light produced on a sample in plural directions are collectively detected using a plurality of detectors. Multidimensional features containing information about scattered light distributions are extracted based on a plurality of detector outputs obtained. The feature is compared with data in a scattered light distribution library thereby to determine the types and sizes of defects. In a feature extraction step, a feature outputted based on the magnitude of each of scattered light detected signals of scatterers already known in refractive index and shape, which are obtained in the detection step, is corrected, thereby realizing high precision determination.

An inspection method which simplifies an inspection step by eliminating the need to set probes on wiring or probe terminals, and an inspection device for performing the inspection step. A voltage is applied to each of inspected circuits or circuit elements to operate the same. Signal processing is performed on an output from each inspected circuit or circuit element during operation to form a signal (operation information signal) including information on the operating condition of the circuit or the circuit element. The operation information signal is amplified and the amplitude of an alternating current voltage separately input is modulated with the amplified operation information signal. The voltage of the modulated alternating current is read in a non-contact manner to determine whether the corresponding circuit or circuit element is non-defective or defective.

Disclosed is a semiconductor die having a plurality of dummy fillings positioned and sized to minimize defects during chemical mechanical polishing is disclosed. At least one of the dummy fillings is coupled to an underlying test structure. In a preferred embodiment, the semiconductor die also includes a plurality of conductive layers and a substrate. The underlying test structure includes a first layer portion formed from a first one of the plurality of conductive layer and a via coupling the first layer portion to the at least one dummy filling. In another aspect, the underlying test structure also has a via coupling the first layer portion to the substrate, and the underlying test structure comprises a plurality of layer portions and vias to form a multilevel test structure.

A system for identifying and positioning pipelines that accurately and unequivocally marks a section of pipeline and tubular goods located anywhere for subsequent identification. The pipeline positioning system comprises a permanent, passive, non-obtrusive, and systematic placement of marker coupons upon pipe diameters for uniquely identifying a pipeline or specific location therein. Identification and location codes incorporated into the markers may be readily detected by inspection methods known in the art. Codes may be applied to new tubes or pipelines during manufacturing, during pipeline laying operations, or during maintenance being rendered by the pipeline owner or operator.