8438 results about "Inspection method" patented technology

For angular resolved spectrometry a radiation beam is used having an illumination profile having four quadrants is used. The first and third quadrants are illuminated whereas the second and fourth quadrants aren't illuminated. The resulting pupil plane is thus also divided into four quadrants with only the zeroth order diffraction pattern appearing in the first and third quadrants and only the first order diffraction pattern appearing in the second and third quadrants.

An apparatus and method to determine a property of a substrate by measuring, in the pupil plane of a high numerical aperture lens, an angle-resolved spectrum as a result of radiation being reflected off the substrate. The property may be angle and wavelength dependent. The radiation that is reflected off the substrate is radially polarized.

A method and apparatus for inspecting a photolithography mask for defects is provided. The inspection method comprises providing a defect area image to an image simulator wherein the defect area image is an image of a portion of a photolithography mask, and providing a set of lithography parameters as a second input to the image simulator. The defect area image may be provided by an inspection tool which scans the photolithography mask for defects using a high resolution microscope and captures images of areas of the mask around identified potential defects. The image simulator generates a first simulated image in response to the defect area image and the set of lithography parameters. The first simulated image is a simulation of an image which would be printed on a wafer if the wafer were to be exposed to an illumination source directed through the portion of the mask. The method may also include providing a second simulated image which is a simulation of the wafer print of the portion of the design mask which corresponds to the portion represented by the defect area image. The method also provides for the comparison of the first and second simulated images in order to determine the printability of any identified potential defects on the photolithography mask. A method of determining the process window effect of any identified potential defects is also provided for.

An excisional biopsy device includes a tubular member having a window near a distal tip thereof; a cutting tool, a distal end of the cutting tool being attached near the distal tip of the tubular member, at least a distal portion of the cutting tool being configured to selectively bow out of the window and to retract within the window; and a tissue collection device externally attached at least to the tubular member, the tissue collection device collecting tissue excised by the cutting tool as the biopsy device is rotated and the cutting tool is bowed. An excisional biopsy method for soft tissue includes the steps of inserting a generally tubular member into the tissue, the tubular member including a cutting tool adapted to selectively bow away from the tubular member and an external tissue collection device near a distal tip of the tubular member; rotating the tubular member; selectively varying a degree of bowing of the cutting tool; collecting tissue severed by the cutting tool in the tissue collection device; and retracting the tubular member from the soft tissue. The tubular member may include an imaging transducer and the method may include the step of displaying information received from the transducer on a display device and the step of varying the degree of bowing of the cutting tool based upon the displayed information from the imaging transducer. Alternatively, the imaging transducer may be disposed within a removable transducer core adapted to fit within the tubular member.

Abstract of the Disclosure In a network security system, clients search for neighbor access points (APs) in order to establish wireless connections to a LAN. As a result of the search, each of the clients dispatches a list of access points obtained to a controller. The controller detects non-registered access points by comparing a list of previously registered access points with the lists dispatched by the clients.

First, a pattern inspection apparatus detects the first edge from an image of a pattern to-be-inspected. Next, the pattern inspection apparatus conducts matching of the image of the pattern to-be-inspected and the first reference pattern by comparing the first edge and an edge of the first reference pattern. Since, as a result of the matching, a shift quantity S₁ can be obtained, and then the first reference pattern is shifted by this shift quantity S₁. Subsequently the pattern to-be-inspected is inspected by comparing the first edge and the edge of the first reference pattern so shifted. In this first inspection, pattern deformation quantities are obtained and defects are detected. A shift quantity S₂ can be obtained as one of the pattern deformation quantities. Next, in order to detect the second edge from the pattern image to-be-inspected, the corresponding second reference pattern is shifted by a shift quantity S₁+S₂. Using the second reference pattern so shifted, a profile is obtained on the pattern image to-be-inspected and the second edge is detected. Then, by comparing the second edge and the edge of the second reference pattern so shifted, the pattern to-be-inspected is inspected. Also in this second inspection, the pattern deformation quantities are obtained and defects are detected. A shift quantity S₃ can be obtained as one of the pattern deformation quantities.

Disclosed is a semiconductor die having a lower test structure formed in a lower metal layer of the semiconductor die. The lower conductive test structure has a first end and a second end. The first end is coupled to a predetermined voltage level. The semiconductor die also includes an insulating layer formed over the lower metal layer. The die further includes an upper test structure formed in an upper metal layer of the semiconductor die. The upper conductive test structure is coupled with the second end of the lower conductive test structure. The upper metal layer is formed over the insulating layer. In a specific implementation, the first end of the lower test structure is coupled to ground. In another embodiment, the semiconductor die also includes a substrate and a first via coupled between the first end of the lower test structure and the substrate. In yet another aspect, the lower test structure is an extended metal line, and the upper test structure is a voltage contrast element. Methods for inspecting and fabricating such semiconductor die are also disclosed.

The invention discloses an intelligent inspection system and an inspection method for an electric transmission line by an unmanned aerial vehicle. The intelligent inspection system comprises an inspection mission planning system, a dispatching system, a monitoring system, an inspection result processing platform and mobile branch stations, wherein the inspection mission planning system communicates with the inspection result processing platform and the dispatching system respectively; the inspection result processing platform and the dispatching system communicates with the monitoring system respectively; the monitoring system is connected and communicate with the mobile branch stations. The inspection method has the benefits that factors of the inspection unmanned aerial vehicle, inspection equipment, an inspector, and the like accessing the dispatching platform through a dispatching terminal can be dispatched effectively to realize equipped configuration of unmanned aerial vehicle inspection resource; the usage rates of personnel and equipment can be improved; the no-load rate and vacancy rate of the inspection equipment are reduced; through centralized monitoring of condition information inspected by the unmanned aerial vehicle, unmanned aerial vehicle inspection dispatching personnel can master unmanned aerial vehicle inspection in the large effectively; the service life of the unmanned aerial vehicle is prolonged.

A servo writer of the invention writes a servo signal in a magnetic tape, reads and inspects the signal, and has a servo writer main body and a plurality of unit panels changeably loaded to a panel change unit provided at the main body according to a product class of the tape, wherein any of the unit panels has a servo write head for writing the signal in the tape and a write-sub-control mechanism for controlling a writing of the signal by the write head, wherein the write head and the sub-control mechanism write a predetermined signal in the tape, and wherein the main body has a signal main control mechanism for mainly controlling a writing of the signal in the tape by the write head, a servo read head for reading the signal written in the tape, and a signal inspection mechanism for processing and inspecting the signal.

A method for inspecting a honeycomb structured body of the present invention is a method for inspecting a honeycomb structured body comprising a pillar-shaped honeycomb fired body having a multitude of cells placed in parallel with one another in the longitudinal direction with a cell wall therebetween, the method comprising: measuring the shape of the honeycomb structured body in the longitudinal direction through preparing a contact measurement apparatus including a reference surface, a rail disposed perpendicularly to the reference surface, and a measurement probe including a contacting probe configured to move along the rail; contacting one end face of the honeycomb structured body with the reference surface; and moving the measurement probe in a direction nearing the reference surface to contact the contacting probe with the other end face of the honeycomb structured body.

A dark spot defect caused by short-circuiting of an EL element is detected based on an emission brightness or a current flowing through the EL element when an element driving transistor which controls a drive current to be supplied to the EL element is operated in its linear operating region and the EL element is set to an emission level. A dim spot defect caused by a characteristic variation of the element driving transistor can be detected based on a current flowing through the EL element when the element driving transistor is operated in its saturation operating region and the EL element is set to the emission level. When an abnormal display pixel is detected based on an emission brightness, a pixel which is determined as an abnormal display pixel and which is not determined as a dark spot defect during a dark spot inspection is determined, and the pixel is detected as a dim spot defect caused by the characteristic variation of the element driving transistor.

The invention discloses an inspection method and an inspection system. The inspection method comprises the steps that: inspection items, inspectors and inspection time corresponding to different inspection devices are set in an inspection server in advance; the inspection server generates inspection work orders according to the inspection items, the inspectors and the inspection time corresponding to the different inspection devices; the inspection server verifies the identity of a portable terminal and sends the inspection work orders to the portable terminal; the portable terminal downloads the inspection work orders, receives and stores inspection data of an inspected device inspected according to the inspection work orders by the inspector, and uploads the inspection data to the inspection server; the inspection server performs statistic analysis on the inspected data to generate a corresponding inspection report, and the inspection data of devices are reported through the hand-held portable terminal, so that the workload of inspection is greatly reduced and the inspection efficiency is significantly improved. Therefore, the collection and the analysis of the inspection data are realized, thereby providing the great convenience for users to know the condition of an inspected device in real time and perform the corresponding maintenance.

The present invention provides a transparent liquid inspection apparatus capable of identifying a boundary between a transparent liquid applied on a base material which provides a multi-piece product and the base material, and automatically inspecting an applied condition of the transparent liquid without influence of a background of the base material. A projected image of an illumination source (2) is reflected on a surface of the transparent liquid as a mirror, the projected image is picked up by cameras (41 to 44), and the image is analyzed by an image processing unit (8), thereby inspecting an amount of displacement of the transparent liquid from a predetermined application position and expansion of the surface of the transparent liquid.

Methods and apparatus for categorizing defects on workpieces, such as semiconductor wafers and masks used in lithographically writing patterns into such wafers are provided. For some embodiments, by analyzing the layout in the neighborhood of the defect, and matching it to similar defected neighborhoods in different locations across the die, defects may be categorized by common structures in which they occur.

A remote education system includes a Web server, a bidirectional communication server, a content distribution server, an operations management system, a lecturer terminal, and a communication line connection device, and provides remote education to student terminals via the Internet. The operations management system includes a lecture information database for storing lecture schedules, attendance records, and personal information, facial images, and audio, of the students, and performs a lecture establishment processing, an attendance registration processing, a lecture opening processing, an attendance confirmation processing, and the like. The attendance confirmation processing includes a student image acquisition processing, a facial image matching processing, an action request processing, and an action detection processing, which match facial images of students, and detect image changes that occur in response to requested actions.