137 results about "Reference patterns" patented technology

The systems and methods disclosed herein monitor application (e.g., artificial intelligence (AI) model) operations using interactions between the application and a kernel. The systems and methods disclosed herein intercept, using a kernel interface, one or more function invocations transmitted from the application (e.g., an AI model without model modification). Event record(s) are generated for one or more functions to define process identifiers, resource interaction types, timestamps, and / or resource identifiers. Observed pattern(s) for the application are identified by comparing current event record(s) with previous record(s), and the identified observed pattern(s) are evaluated against reference pattern(s) to generate score(s). Data packet(s) that indicate observed pattern(s), corresponding score(s), and / or cryptographic digital fingerprint(s) of the one or more functions are generated. The data packet(s) are transmitted to distributed ledgers for immutable storage.

The systems and methods disclosed herein receive a dataset including an observed set of values for a set of variables. The system can use a first set of AI models to identify a set of anomalies in the observed set of values by comparing an observed set of patterns against multiple reference patterns. The system can use a second set of AI models to evaluate the identified anomalies by comparing an observed set of association rules with an expected set of association rules. The system can use a third set of AI models to generate reconfiguration commands to remove the identified anomalies. The reconfiguration commands can be automatically executed to modify the observed association rules to align with the expected association rules.

Methods, systems, apparatuses, and computer program products are described. A system may obtain a set of metadata associated with multiple entities of a datastore, the multiple entities including at least two different data types. The system may augment, using a generative artificial intelligence (AI) model, the set of metadata resulting in a set of augmented metadata for the multiple entities of the datastore. The system may generate, using the set of augmented metadata, a set of entity objects for the multiple entities of the datastore and in accordance with a reference schema. The system may identify, using the generative AI model and the set of entity objects as inputs into the generative AI model, first relationships between two or more first entities of the multiple entities of the datastore. Based on the identified relationships and a reference schema relationship model, the system may generate a schema relationship model.

The invention relates to the technical field of electric heat tracing intelligent temperature control, and discloses a control box electric heat tracing band intelligent temperature control system and method. The method comprises the steps of collecting data of a plurality of temperature sensors in a control box, constructing a temperature sequential sequence, and forming a sequential diagram structure reflecting correlation strength among the sensors by calculating spatial proximity and time correlation. And inputting the sequential graph into a state space model, and dynamically adjusting a state transition matrix of the model according to an edge weight of the graph so as to accurately simulate a heat transfer dynamic process in the box. A state output by the model is separated into a periodic component and a trend component, the periodic component is matched with a reference pattern library to identify an abnormal fluctuation phase, and multi-scale decomposition and slope curvature analysis are performed on the trend component to quantify a change trend. According to the method, dynamic and accurate modeling of the complex thermal environment is realized, the temperature can be controlled more accurately, and abnormity can be warned in advance.

The systems and methods disclosed herein receive a dataset including an observed set of values for a set of variables. The system can use a first set of AI models to identify a set of anomalies in the observed set of values by comparing an observed set of patterns against multiple reference patterns. The system can use a second set of AI models to evaluate the identified anomalies by comparing an observed set of association rules with an expected set of association rules. The system can use a third set of AI models to generate reconfiguration commands to remove the identified anomalies. The reconfiguration commands can be automatically executed to modify the observed association rules to align with the expected association rules.

The invention discloses an optical proximity correction method, a mask plate and a semiconductor structure forming method, and the optical proximity correction method comprises the steps: obtaining a reference layout which comprises a plurality of first metal wire patterns, a plurality of second metal wire patterns and a plurality of cutting patterns; a to-be-corrected graph is obtained from the multiple cut-off graphs, the to-be-corrected graph comprises a first to-be-corrected graph and a second to-be-corrected graph, the first to-be-corrected graph and the second to-be-corrected graph are adjacent, and the distance between the first to-be-corrected graph and the second to-be-corrected graph is smaller than a first preset size; determining a target reference pattern corresponding to the to-be-corrected pattern from the plurality of second metal wire patterns; on the basis of the target reference graph, the first to-be-corrected graph and the second to-be-corrected graph are combined and corrected, a combined graph is obtained, the combined graph is formed, and the situation that a mask design rule is violated is avoided.

The invention provides a steel wire rope broken wire detection device, and belongs to the technical field of steel wire rope detection. The multiple detection assemblies are installed in the circular inner cavity of the annular support in the annular array mode, and each detection assembly is connected with the corresponding roller and the corresponding recognition part through the corresponding telescopic piece, so that when the to-be-detected steel wire rope penetrates through the circle center of the circular inner cavity, the to-be-detected steel wire rope is recognized; the roller of each detection assembly abuts against the outer side of the to-be-detected steel wire rope, when the size of the cross section of the to-be-detected steel wire rope is changed due to wire breakage, the change can be transmitted to the telescopic part through the roller, and the recognition part is triggered through the movement of the telescopic part. The recognition part recognizes the stretching or retracting movement of the telescopic piece so as to correspond to the internal wire breakage or external wire breakage condition of the steel wire rope, detection is more comprehensive, data are more accurate, detection directly acts on the steel wire rope, reference styles do not need to be additionally arranged, the detection efficiency and the accuracy of the detection result are improved, and the detection cost is also reduced.

The invention provides an infrared detector readout circuit repairing method, and relates to the technical field of silicon readout circuit repairing, and the method comprises the steps: screening chips with abnormal electrical properties from processed circuit chips, and determining the relative coordinates of a problem line and a nearest bonding pad according to the fault type; under an FIB-SEM double-beam scanning electron microscope, the sample table is moved to reach the relative coordinates, and a reference pattern with the depth shallower than the thickness of the metal layer is formed through etching with the relative coordinates as the center; measuring a problem line operation point coordinate by taking the reference graphic feature point as a zero point; performing etching exposure on the coordinate area of the operation point by using an FIB-SEM double-beam scanning electron microscope; and carrying out line repairing operation. The problems that the reference point distance is long and the positioning deviation is large are effectively solved, and accurate positioning of a small-feature-size circuit needing to be operated in the infrared detector reading circuit repairing process is achieved.

The present disclosure provides a mode representation recall method and a memory branch network training method and device, relates to the technical field of large models, and in particular relates to the technical field of artificial intelligence such as natural language processing, and the method comprises the following steps: obtaining a target memory branch network of a large model, and obtaining an associated latent feature representation of an input token sequence in an input text of the large model through the target memory branch network; obtaining a reference mode representation set of the large model; based on the associated latent feature representation and the reference mode representation set, performing recall of a mode representation corresponding to the input token sequence to obtain a target mode representation of the input token sequence.

1. The name of the design product: TARS-ACC-MM1. 2. The use of the design product: TARS-ACC-MM1 is a calibration board used for computer vision and medical procedure auxiliary positioning. It is mainly applied in the calibration of oral implant navigation systems, AR glasses, surgical medical instruments, and oral surgery simulation training and teaching systems. By providing accurate visual reference patterns, it is used for camera system calibration to improve image processing accuracy and stability. 3. The design points of the design product: The combination of shape and pattern. 4. The picture or photo that best indicates the design points: perspective view.

To prevent a reduction in measurement accuracy in a three-dimensional scanner.SOLUTION: An optical module is used for a three-dimensional scanner that acquires three-dimensional shape information of an object with light from a light source by using a focusing method, and comprises a sensor, a beam splitter, a pattern plate, a housing, and a shim. The sensor detects the light from the light source reflected on the object, and the beam splitter splits the light into an optical path reaching the object from the light source and an optical path reaching the sensor from the object. The pattern plate is arranged between the light source and the beam splitter and configured to project a reference pattern on the sensor with the light from the light source. The sensor, the beam splitter, and the pattern plate are arranged in the housing. The shim adjusts the distance between the pattern plate and the beam splitter. The housing has a recess for arranging the pattern plate. The pattern plate is rotatably supported in the recess within a predetermined angle range around an optical axis of the light from the light source.SELECTED DRAWING: Figure 3

A self-detection circuit is used in a self-adaptation circuit to detect the convergence of the self-adaptation process and / or for self-adapting of the training circuit parameters. The self-detection circuit includes a decision history circuit to track the history of the training decisions made by the self-adaptation circuit and determine a pattern for a number of decisions, which is compared with reference patterns by a pattern recognition circuit. The reference patterns correspond to decision patterns when a self-training process has concluded or when the adapted parameters have reached target values. Based on the comparison result of the pattern recognition circuit, the progress of the self-training / self-adaptation process is determined and corresponding actions are performed (e.g., ending the self-training process, increase / decrease the training circuit parameters). The self-detection circuit enables time and power efficient self-training processes and on-the-fly adjustments (e.g., real-time adjustment, unexpected adjustment) to the training circuit parameters.

The invention relates to the technical field of optical measurement, in particular to an optical measurement system and a measurement method thereof.The optical measurement system comprises a light source, a projection assembly, an imaging assembly and a receiving assembly, the projection assembly modulates light beams emitted by the light source through an optical mask, generates detection light carrying geometric patterns and projects the detection light to the surface of a sample to be measured; the detection light forms return light comprising reflected light and diffracted light on the surface of the to-be-detected sample, and the diffracted light is formed by diffraction of the detection light through a physical structure on the surface of the to-be-detected sample; the imaging assembly generates signal light carrying moire fringe information and diffracted light information by superposing the return light through a reference pattern structure; the receiving assembly comprises a filtering structure and a receiving module, diffraction light of the signal light is filtered out through the filtering structure to form target signal light, and the receiving module obtains defocus data based on the target signal light. According to the invention, diffracted light in signal light can be effectively filtered out, optical interference is avoided, and the accuracy of automatic focusing is improved.

The invention is suitable for the technical field of mask plate automatic detection, and provides a thermal compensation intelligent control method and system for a mask plate A0I detection platform, and the method comprises the steps: carrying out the scanning detection of a mask plate, carrying out the interval collection of a reference pattern on the mask plate in the scanning detection process, solving to obtain a drift compensation parameter, and carrying out the calculation of the drift compensation parameter. And triggering interruption calibration when the detection confidence is lower than a critical threshold. The method has the advantages that thermal drift can be inhibited without changing the thermal state or structure of the detection equipment, a high-standard constant-temperature chamber does not need to be constructed, and the cost can be remarkably reduced; in a current thermal state, a drift compensation parameter in coordinate mapping is re-estimated by expanding reference observation, so that geometric errors caused by thermal drift are corrected in a detection result or a detection process which may cause problems is interrupted in time, and the detection precision is maintained without depending on a constant-temperature environment.

A method of conducting operations for an IPG adapted to provide electrical pulses to tissue of a patient for medical therapy is provided. The IPG provides the medical therapy according to pulse parameter data executed according to an execution path. The method can include identifying a root node repeated within the execution path of a first set of the pulse parameter data, identifying a stimulation pulse pattern repeated in the first set between occurrences of the root node, replacing the repeated pattern with (a) a single instance and a recurrence count or (b) a pointer to a reference pattern to generate a second set of the pulse parameter data, and communicating the second set between the external controller and the IPG and / or storing the second set within a memory of the IPG.

The utility model provides a centering calibration device which is used for a single crystal furnace, the single crystal furnace comprises a crucible and a crystal rope vertically arranged above the crucible, and the centering calibration device is used for enabling the axis of the crystal rope and the axis of the crucible to be collinear; the centering calibration device comprises a heavy hammer, the heavy hammer is connected to the bottom end of the crystal rope in the vertical direction, and the bottom of the heavy hammer is provided with a centering conical tip; the center point of the centering compass is located on the axis extension line of the crucible, and the center point of the centering compass is located below the heavy hammer in the vertical direction; the adjusting structure comprises a plurality of adjusting components, one end of each adjusting component is an operation supply end, and the other end of each adjusting component can adjust the position of the crystal rope in the preset direction under the operation of the operation supply end; wherein a plurality of reference patterns are distributed on the surface of the centering compass along the circumferential direction, and the position of one adjusting component corresponds to the position of one reference pattern. According to the centering calibration device provided by the invention, the adjustment time can be saved, and the centering calibration efficiency can be improved.

The invention discloses a clipping influence verification method for an engineering mode network, and relates to the technical field of water conservancy projects. According to the method, a reference mode network and a plurality of cutting networks with different scales are constructed, and the influence of cutting on a target function value is analyzed, so that the change relation of the target function value along with the water flow mode network scale is detected. The method specifically comprises the following steps: generating a reference mode network, generating a plurality of cutting nets of different scales based on the reference mode network, solving a stochastic programming model corresponding to each cutting net, substituting the solutions of the cutting nets into an equivalent model of the reference mode network, and calculating the total expected generating capacity, thereby verifying the influence of cutting on a target function value. The method can effectively evaluate the influence of the water flow pattern net cutting on the target function value, and provides a scientific basis for the optimization design of a water conservancy project.

The application discloses a structured light emission module and a self-calibration method and device thereof and a medium, relates to the technical field of optical three-dimensional perception, and is applied to a preset integrated structured light emission module, and comprises the following steps: synchronously turning on working light sources and calibration light sources in a VCSEL array under current working parameters; wherein the working light sources are projected to a working area of a metasurface diffractive optical element after being collimated by a preset collimating optical system, so as to generate a working speckle pattern for three-dimensional detection; the calibration light sources are projected to a calibration area of the metasurface diffractive optical element after being collimated by the preset collimating optical system, so as to generate a preset reference pattern; an actual reference pattern generated by the calibration area is collected by using an embedded detector, the actual reference pattern is compared with the preset reference pattern, and a pattern deviation is obtained; a temperature drift compensation amount is calculated based on the pattern deviation and module temperature data collected by a temperature sensor; and the current working parameters of the VCSEL array are adjusted according to the temperature drift compensation amount.

An optical proximity correction method and system, a mask, a device and a storage medium, the optical proximity correction method comprising: providing a design pattern; along the contour of the design pattern, obtaining a step edge as a broken line edge, the broken line edge being alternately composed of a plurality of first line segments extending along the extension direction of the broken line edge, and second line segments connecting adjacent first line segments; performing step elimination processing on the broken line edge of the design pattern, replacing the broken line edge with a straight line type reference edge with the same extension direction as the first line segment, and enclosing a reference pattern corresponding to the design pattern; setting a plurality of initial evaluation points on the reference edge; mapping the plurality of initial evaluation points to the broken line edge along a direction perpendicular to the reference edge to form evaluation points located on the broken line edge; performing optical proximity correction processing on the design pattern until the edge placement error at the evaluation points meets a preset condition to form a corrected pattern. The present application improves the accuracy of optical proximity correction.

The invention discloses a multi-birth chip, a wafer and a wafer cutting method, and is applied to the technical field of chip preparation. A plurality of functional areas located on the surface of one side of the substrate; the functional areas are separated by non-functional areas, and reference patterns are arranged in the non-functional areas; the reference patterns are used for identifying the test units and generating an electronic Map when the chip is subjected to an electrical test, so that the contour line of the multiple-birth chip corresponds to the test units in the electronic Map, and the reference patterns which can be identified in the wafer correspond to the test units in the electronic Map one by one. The reference patterns are arranged in the multiple-birth chip, and the recognizable reference patterns in the wafer are in one-to-one correspondence with the test units in the electronic Map, so that the multiple-birth chip can be recognized based on the reference patterns in one-to-one correspondence during cutting recognition, the fixation of the cutting position of the multiple-birth chip is ensured, and the cutting accuracy of the multiple-birth chip is improved. And the chip layout after cutting is matched with the electronic Map, so that the product yield is ensured.

We provide the system. [Solution] A means for collecting data from multiple terminals within a distributed network in order to detect abnormal patterns in real time, A data analysis means for generating normal activity patterns and creating a reference pattern based on the aforementioned data, A threat prediction method using generative AI that detects anomalies that deviate from the aforementioned standard pattern and predicts future attack patterns, An automated response means that automatically generates and executes countermeasures in response to anomalies detected by the threat prediction means, Alert sending means for notifying the administrator of the results of the response by the automated response means. A system that includes this.

An optical proximity correction method comprises: providing an initial design layout, the initial design layout having a reference pattern and a plurality of main patterns, the reference pattern having a reference edge, and each main pattern having a plurality of main edges; taking each main edge as a reference, obtaining a first search parameter to determine a first search region; when the reference edge has an overlapping part with any one of the first search regions, marking the main edge corresponding to the first search region as a candidate edge; taking the reference edge as a reference, obtaining a second search parameter according to the first search parameter to determine a second search region; and when any one of the candidate edges has an overlapping part with the second search region, marking the candidate edge as a selected edge. The bidirectional edge selection mechanism of the first search region and the second search region is used for edge selection operation, the cases of multiple selection or misselection are reduced, the edge selection result is more accurate, and the effect of subsequent optical proximity correction is improved.

The invention belongs to the technical field of electrical digital data processing, and discloses a design method for adaptively generating an optical micropattern based on substrate parameters, which comprises the following steps of: acquiring a non-uniform physical parameter diagram of an actual substrate, constructing an optical residual potential field for representing optical performance deviation on the basis of the non-uniform physical parameter diagram, and then, taking a reference pattern as an initial pattern, the method comprises the following steps: carrying out iterative optimization on a micro-pattern unit in a potential field, carrying out coordination on adjustment based on potential field gradient and smoothing correction based on neighborhood influence in each step of iteration, updating the potential field in real time, and finally, after iteration convergence, carrying out spatial derivation analysis on a final residual potential field to generate manufacturing tolerance guidance information. According to the method, the non-uniformity of the substrate is used as an internal constraint of design, and a closed-loop feedback system is used, so that a design result is matched with physical reality.

The invention relates to an electric energy meter which comprises an electric energy meter body and a reactive electric energy meter body state judgment system. The composition curve of the pattern occupied in the last-stage enhanced image obtained after targeted optimization processing of the reactive electric energy meter can be analyzed, the composition curve of the reference pattern corresponding to the reactive electric energy meter is obtained, and then whether the current shape of the reactive electric energy meter reaches the standard or not is judged; therefore, targeted visual identification of the distortion state of the reactive electric energy meter body is completed.

The invention provides a method for correcting a layout. The method comprises the following steps of: acquiring a to-be-corrected main graph from all main graphs; in the direction perpendicular to the first edge, the first edge of the to-be-corrected main graph is moved in the direction facing the adjacent reference graph until the second interval is reduced to a third preset value, so that the interval between the two adjacent to-be-corrected main graphs is increased, and the limitation rule is not violated; judging the size relationship between the third spacing and a second preset value, so as to obtain a first edge of the to-be-corrected main graph of which the third spacing is smaller than the second preset value according to a judgment result; the obtained first edge of the to-be-corrected main graph with the third interval smaller than a second preset value is cut into a plurality of line segments, and a to-be-corrected line segment is obtained from all the line segments; in the direction perpendicular to the first edge, the line segment to be corrected is moved towards the direction facing the adjacent reference pattern. Therefore, the distance between the two adjacent main patterns to be corrected can be increased without violating restriction rules, and the problem of bridging between photoetching patterns is reduced or avoided.

The invention discloses a four-color splitting method based on relevant layer assistance. The method comprises the steps that S1, a layout file of a target metal truncation layer is provided; s2, providing a matrix general solution conforming to a preset splitting rule; s3, according to the matrix general solution, writing a script to carry out Y-direction image splitting on the layout file of the target metal truncation layer to obtain a Y-direction reference graph; s4, according to the matrix general solution, writing a script to perform mask splitting on the layout file of the metal layer of the target active region; wherein the target active region metal layer is a related layer of the target metal truncation layer; s5, taking the splitting result in the step S4 as an anchor point, and performing X-direction image splitting on the layout file of the target metal truncation layer to obtain an X-direction reference graph; and S6, according to the Y-direction reference graph and the X-direction reference graph, writing a script to perform ordered splitting on all basic graph units in the layout file of the target metal truncation layer to obtain a final four-color splitting result.

The invention discloses a layout splitting method and system, equipment, a storage medium and a computer program product, and the method comprises the steps: obtaining a to-be-split mask layout which comprises a plurality of original graphs; distinguishing the plurality of original graphs along a second direction based on the derivative graph layer of the first reference graph; performing first splitting processing on the first original pattern, wherein the first original pattern in each sub-mask layout is staggered in the second direction and the first direction; carrying out second splitting processing on the second original graph along the first direction based on the first reference graph, so that the first sub-graphs are distributed in a plurality of sub-mask layouts, the first sub-graph and the first original graph in each sub-mask layout are staggered in the second direction, and the first sub-graph and the first original graph in each sub-mask layout are staggered in the first direction. Therefore, a better splitting effect is obtained, and the process window of the photoetching process based on the pattern of each sub-mask layout is improved.

Based on the reference waveform (112) and the BSE signal waveform (211) representing the intensity of the backscattered electron signal from the pattern along the first direction extracted from the backscattered electron image, a difference waveform is generated, representing the relationship between the difference between the coordinates of the BSE signal waveform with the same backscattered electron signal intensity and the coordinates of the reference waveform, and the backscattered electron signal intensity. Based on the difference waveform, it is determined whether there is a shielding area (203) on the sidewall of the pattern that was not irradiated by the primary electron beam. Here, the reference waveform represents the intensity of the backscattered electron signal from the reference pattern along the first direction when a primary electron beam is scanned on the reference pattern, wherein the reference pattern is a pattern with sidewalls formed perpendicularly to the surface and bottom surface of the pattern.

Systems and methods for preventing prediction performance degradation by detecting and extracting skews in data during both training and production environments is described herein. Feature extraction may be performed on training data during the training phase, followed by pattern analysis that assesses similarities across labeled training data sets. A reference pattern may be derived from the pattern analysis and feature extraction of the training data. Feature extraction and pattern analysis may be performed on production data during the serving phase, and a target pattern may be derived from the pattern analysis and feature extraction of the production data. The reference pattern and target pattern may be fed to a discrepancy detection functionality to detect discrepancies by using a sliding window to move the target pattern across the reference pattern to make comparisons between the patterns. The comparison may provide a quantitative skew across the training and production data.

Provided is a gaze detection device that can suppress reduction in detection accuracy regardless of the imaging method of an imaging system. The gaze detection device according to the present technique includes a patterned-light illumination system that irradiates an eyeball with patterned light, an imaging system that captures an image of the eyeball irradiated with the patterned light, and a gaze detection system that detects a gaze as the direction of the eyeball on the basis of the captured image of the imaging system. The patterned light has a shape along the reference pattern having at least three lines not parallel to one another, the reference pattern having an intersection point where at least two lines of the at least three lines cross each other. According to the gaze detection device of the present technique, the gaze detection device can be provided to suppress reduction in detection accuracy regardless of the imaging method of the imaging system.