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5290 results about "Visual inspection" patented technology

Visual inspection is a common method of quality control, data acquisition, and data analysis. Visual Inspection, used in maintenance of facilities, mean inspection of equipment and structures using either or all of raw human senses such as vision, hearing, touch and smell and/or any non-specialized inspection equipment. Inspections requiring Ultrasonic, X-Ray equipment, Infra-red, etc. are not typically regarded as Visual Inspection as these Inspection methodologies require specialized equipment, training and certification.

Visual inspection and verification system

A method and apparatus for inspecting a photolithography mask for defects is provided. The inspection method comprises providing a defect area image to an image simulator wherein the defect area image is an image of a portion of a photolithography mask, and providing a set of lithography parameters as a second input to the image simulator. The defect area image may be provided by an inspection tool which scans the photolithography mask for defects using a high resolution microscope and captures images of areas of the mask around identified potential defects. The image simulator generates a first simulated image in response to the defect area image and the set of lithography parameters. The first simulated image is a simulation of an image which would be printed on a wafer if the wafer were to be exposed to an illumination source directed through the portion of the mask. The method may also include providing a second simulated image which is a simulation of the wafer print of the portion of the design mask which corresponds to the portion represented by the defect area image. The method also provides for the comparison of the first and second simulated images in order to determine the printability of any identified potential defects on the photolithography mask. A method of determining the process window effect of any identified potential defects is also provided for.
Owner:SYNOPSYS INC

Authentication of a host processor requesting service in a data processing network

An object is authenticated by transmitting a random number to the object. The object has an integrated circuit chip including a memory and encryption circuitry. The memory stores information defining an encryption scheme preassigned to the object. The encryption circuitry reads the memory, and encrypts the random number according to the encryption scheme defined by the information read from the memory to produce encrypted data. The memory cannot be read from any output of the integrated chip, and the chip is constructed so that it is virtually impossible to recover the information contained in the memory by visual inspection, probing, or disassembly of the chip. The object is authenticated by checking whether the encrypted data is a correct result of encrypting the data using the encryption scheme pressigned to the object. The method can be used in a data processing system to authenticate each message transmitted by a host processor to a data processing device. For example, when a host logs into the data processing device, the data processing device transmits a series of random numbers to the host. The host encrypts the random numbers to produce a series of encrypted data, and the data processing device concurrently encrypts the random numbers to produce a series of encrypted values. The host inserts respective encrypted data into each message, and the data processing device authenticates each message by comparing the encrypted data in the message to a corresponding encrypted value.
Owner:EMC IP HLDG CO LLC

High-speed scanning and overall imaging three-dimensional (3D) measurement method

InactiveCN102589476AFast measurementLittle effect on reflectivityUsing optical meansThree dimensional measurementPrism
The invention relates to a visual inspection technology. In order to meet the requirements of fast and high-accurate surface three-dimensional (3D) topography online measurement and the detection requirements of a production line on intelligence, fastness, high accuracy and low cost, the invention adopts the technical scheme that: a high-speed scanning and overall imaging 3D measurement method comprises the following steps of: carrying out external modulation on a driving power supply by using a laser so as to control the output of a word line laser; rotating a multifaceted prism under the drive of a high-speed motor, wherein line-structured light outputted by the laser is reflected and projected to the surface of a measured object by the multifaceted prism; and placing a photoelectric detector at a position which is the limit position projected by the line-structured light during the rotating process of the multifaceted prism, carrying out exposure on an area-array CCD (Charge-Coupled Device) camera during the process that the line-structured light scans the whole area, and establishing a measurement model, wherein the 3D coordinate (xp, yp, zp) of the surface feature point of the measured object is obtained according to a formula by using an image coordinate (u[theta]p, v[theta]p) formed by the area-array CCD camera and [theta]p. The high-speed scanning and overall imaging 3D measurement method is mainly applied to the fast and high-accurate surface 3D topography online measurement.
Owner:TIANJIN UNIV

Visual inspection and verification system

A method and apparatus for inspecting a photolithography mask for defects is provided. The inspection method comprises providing a defect area image to an image simulator wherein the defect area image is an image of a portion of a photolithography mask, and providing a set of lithography parameters as a second input to the image simulator. The defect area image may be provided by an inspection tool which scans the photolithography mask for defects using a high resolution microscope and captures images of areas of the mask around identified potential defects. The image simulator generates a first simulated image in response to the defect area image and the set of lithography parameters. The first simulated image is a simulation of an image which would be printed on a wafer if the wafer were to be exposed to an illumination source directed through the portion of the mask. The method may also include providing a second simulated image which is a simulation of the wafer print of the portion of the design mask which corresponds to the portion represented by the defect area image. The method also provides for the comparison of the first and second simulated images in order to determine the printability of any identified potential defects on the photolithography mask. A method of determining the process window effect of any identified potential defects is also provided for.
Owner:SYNOPSYS INC
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