37results about How to "Spread heat" patented technology

Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., greater than 1,000 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate having conductors is then laminated over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. The light sheets may be formed to emit light from opposite surfaces of the light sheet, enabling it to be used in a hanging fixture to illuminate the ceiling as well as the floor.

Apparatus and method for distributed absorption of pump light over a length of delivery fiber that is, for example in some embodiments, fusion spliced to an end of a multiply clad gain fiber that has significant unused pump light at the end of the gain fiber. In some embodiments, this includes coupling a fiber amplifier to a passive-core delivery fiber that includes a distributed pump dump. In some embodiments, at an output end of the amplifying fiber there is still a significant amount of pump power. If all this pump power is dumped in one small place (e.g., at a splice between the amplifying fiber and a passive delivery fiber) a hot spot will result, leading to unreliable devices that fail (have catastrophic changes in operating performance). The present invention provides a distributed pump dump built into a delivery fiber that is passive to the signal in its core.

Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

Vertically oriented carbon nanotubes (CNT) arrays have been simultaneously synthesized at relatively low growth temperatures (i.e., <700° C.) on both sides of aluminum foil via plasma enhanced chemical vapor deposition. The resulting CNT arrays were highly dense, and the average CNT diameter in the arrays was approximately 10 nm, A CNT TIM that consist of CNT arrays directly and simultaneously synthesized on both sides of various types of foil has been fabricated. The TIM is insertable and allows temperature sensitive and / or rough substrates to be interfaced by highly conductive and conformable CNT arrays. The use of foil, including substrates fabricated from carbon (CNT woven arrays, exfoliated graphite sheets, bucky paper, and the like) is disclosed.

A structural printed wiring board panel includes a multilayer printed wiring board having opposing, outer faces and interlayer interconnects that route RF, power and control signals. Connection areas are formed in or on at least on one face for connecting the interlayer interconnects and any electrical components. A metallic face sheet is secured onto at least one outer face, adding structural rigidity to the multilayer printed wiring board. A metallic face sheet can have apertures positioned to allow access to connection areas. RF components can be carried by a face sheet and operatively connected to connection areas. Antenna elements can be positioned on the same or an opposing face sheet and operatively connected to RF components to form a phased array printed wiring board (PWB) panel.

Apparatus and method for distributed absorption of pump light over a length of delivery fiber that is, for example in some embodiments, fusion spliced to an end of a multiply clad gain fiber that has significant unused pump light at the end of the gain fiber. In some embodiments, this includes coupling a fiber amplifier to a passive-core delivery fiber that includes a distributed pump dump. In some embodiments, at an output end of the amplifying fiber there is still a significant amount of pump power. If all this pump power is dumped in one small place (e.g., at a splice between the amplifying fiber and a passive delivery fiber) a hot spot will result, leading to unreliable devices that fail (have catastrophic changes in operating performance). The present invention provides a distributed pump dump built into a delivery fiber that is passive to the signal in its core.

Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

A heat sink is provided. The heat sink comprises a hollow chassis having a contact face at a bottom portion thereof for attaching to an electronic component and a heat dissipating face at a top portion thereof. A plurality of circularly arranged fins extend from an inner sidewall of the hollow chassis towards a center of the hollow chassis so that gaps between the fins gradually decrease from the inner sidewall of said hollow chassis towards the center of said hollow chassis. At least a heat pipe is positioned between the contact face and the heat dissipating face. At least a fan is positioned at a side of the hollow chassis for generating air to increase an amount of air blowing through wider gaps between said fins to increase the speed of heat dissipation.

The description relates to a heatable pump housing part comprising a heat distribution sheet fixed on the housing part and a tubular heating element fixed on the heat distribution sheet. According to the invention the tubular heating element is positioned in a groove or a step on the housing part that is covered by the heat distribution sheet.

A structural printed wiring board panel includes a multilayer printed wiring board having opposing, outer faces and interlayer interconnects that route RF, power and control signals. Connection areas are formed in or on at least on one face for connecting the interlayer interconnects and any electrical components. A metallic face sheet is secured onto at least one outer face, adding structural rigidity to the multilayer printed wiring board. A metallic face sheet can have apertures positioned to allow access to connection areas. RF components can be carried by a face sheet and operatively connected to connection areas. Antenna elements can be positioned on the same or an opposing face sheet and operatively connected to RF components to form a phased array printed wiring board (PWB) panel.

A resistor includes first and second opposite terminations, a resistive element formed from a plurality of resistive element segments between the first and second opposite terminations, at least one segmenting conductive strip separating two of the resistive element segments, and at least one open area between the first and second opposite terminations and separating at least two resistive element segments. Separation of the plurality of resistive element segments assists in spreading heat throughout the resistor. The resistor or other electronic component may be packaged by bonding to a heat sink tab with a thermally conductive and electrically insulative material. The resistive element may be a metal strip, a foil, or film material.

A heat spreader provided having: as ceramic substrate; and metallization layer structure disposed on at least one surface of the substrate. The metallization layer structure includes: a thick film layer disposed on the at least one surface of the substrate; a diffusion barrier layer on, and in direct contact with the thick film layer; and as heat conducting layer disposed on, and in direct contact with, the diffusion barrier layer. The diffusion barrier layer inhibits material in the thick film layer and material in the heat conducting layer from diffusing between the thick film layer and the heat conductive layer. The metallization layer structure is disposed on a plurality of sides of the substrate.

A steel piston for an internal combustion including a cooling gallery containing a solid coolant, such as an aluminum-based material, is provided. The solid coolant has a thermal conductivity which is greater than the thermal conductivity of the steel material and fills at least 15 volume percent (vol. %) of the cooling gallery. The solid coolant provides for exceptional cooling along a crown of the piston, reduces corrosion and erosion along the crown, and avoids the problem of oil coking.

The invention relates to a heat sink assembly and a method for producing the same. The invention can be applied, for example, in solid state lighting in order to improve the efficiency of heat dissipation. The object of the invention is achieved with a solution where effective thermal connection is provided from opto-electrical component in which thermally active inserts are embedded in an injection moulding to plastic heat sink. Solution of the invention can also provide also electrical connections for opto-electrical components.

A heat dissipation device includes a base for contacting an electronic device, a fin set located on the base and first, second heat pipes thermally engaged in the base. The first heat pipe comprises a first transferring portion and two second transferring portions extending from two opposite free ends of the first transferring portion. The second heat pipe has first and second transferring sections. The first transferring section of the second heat pipe is located adjacent to the first transferring portion of the first heat pipe and between the first transferring portion and one of the second transferring portions of the first heat pipe, and the second transferring section of the second heat pipe is located adjacent to the one of the second transferring portions of the first heat pipe.

The invention relates to a heat sink assembly and a method for producing the same. The invention can be applied, for example, in solid state lighting in order to improve the efficiency of heat dissipation. The object of the invention is achieved with a solution where effective thermal connection is provided from opto-electrical component in which thermally active inserts are embedded in an injection moulding to plastic heat sink. Solution of the invention can also provide also electrical connections for opto-electrical components.

A process and apparatus for separating element isotopes in a microgravity or low-gravity environment using electromagnetic radiation, e.g., sunlight, to heat and ionize a stream of raw materials, followed by electromagnetic separation, and collection of the desired isotopes in or on one or more collection surfaces or receptacles, such as a rotating surface. A cylindrical mirror can serve to collect and concentrate the electromagnetic radiation, permitting the stream of material to be heated and ionized while the path of the stream of material is oriented other than parallel to the direction of the radiation.

Economical sunlight collection panels are constructed to minimize the cost to generate electricity from solar radiation. The panels use a plurality of fixed plastic linear lenses to collect sunlight over a wide arc of solar movement and concentrate the collected light onto a plurality of relatively expensive narrow strips of photovoltaic material. The photovoltaic strips are moved in an arculate path and maintained parallel to the lenses so that the lines of light concentrated by the lens remain on the strips and produce electricity over a wide portion of the sun's path across the sky, even though the area of the photovoltaic strips is minimized for economy.

The present invention relates to different embodiments of high bay lighting fixtures comprising many improved features, such as the ability to dissipate heat from a light source in a non-traditional manner. One such example is the elimination of a traditional heat sink by placing housings and / or a heat spreader plate in thermal contact with the light emitting elements. By doing so, the housings and / or heat spreader plate can dissipate heat from the light emitting elements and spread it throughout the lighting fixture. Different embodiments also help dissipate heat from the light source by spreading out the light emitting elements. Other embodiments improve heat dissipation by using air slots, so that heat can more easily escape from the lighting fixture. Still another example of dissipating heat from the light source can be to use heat fins.

A method of manufacturing a wiring board according to one embodiment of the present disclosure includes: providing at least one first conductive member that serves as part of a wiring; covering the at least one first conductive member with an insulating member that has at least one opening; disposing at least one second conductive member on the opening of the insulating member, the second conductive member serving as part of the wiring; electrically joining the at least one first conductive member and the at least one second conductive member to each other at the opening; and cutting a region including the at least one first conductive member, the insulating member, and the at least one second conductive member, to form an element mounting surface.

A thermoelectric device suitable for power generation by the Seebeck effect or heating and cooling by the Peltier effect includes a flexible thermoelectric layer with a flexible heatsink layer. A thermally conductive layer can optionally be included on the side of the thermoelectric layer opposite the flexible heatsink layer. Because of its flexibility and durability, the thermoelectric device can be utilized for products such as a thermoelectric generator or cooling / heating system for consumer products, such as a bedding, clothing, hats, seat cushions, and personal portable devices.

An LED light fixture including a heat-sink body having a circuit-board mounting surface and an aperture member supported over the circuit-board mounting surface and forming an optical aperture. An LED circuit board is affixed in thermal-contact relationship to the circuit-board mounting surface in position between the mounting surface and the aperture member, the circuit board having an LED-populated area and a surrounding non-LED-populated area which extends beyond the optical aperture. In some other embodiments, the fixture is a low-profile LED light fixture including a cover and a base plate which has a substantially planar back surface, a front surface and heat-dissipating surfaces extending forward from the front surface. An LED circuit board and at least one LED power-circuitry unit, which are secured with respect to the front surface along side the heat-dissipating surfaces, do not extend behind the back surface of the base plate. The aspect ratio of the cross-section of the fixture orthogonal to the base plate between the back surface of the base plate and a forwardmost surface of the cover is greater than about 6.

A semiconductor package having a structure in which heat produced in the interior of the package is effectively spread to the outside of the package is provided. The semiconductor package includes one or more semiconductor chips, one or more substrates (PCBs) having the semiconductor chips respectively attached thereto, a plurality of conductive balls such as a plurality of solder balls to provide voltages and signals to the one or more semiconductor chips, and a heat sink positioned to spread heat produced in the interior of the package to the outside and directly connected to at least one of the plurality of solder balls.

A process and apparatus for separating element isotopes in space by heating a stream of raw materials using concentrated sunlight and ionizing radiation, followed by electromagnetic separation, and collection of the desired isotopes in appropriate receptacles. The unique design of this invention allows flexibility of implementation, very high separation efficiency, and minimal waste. The intent of collecting a multiplicity of isotopes simultaneously is a key feature of this invention. The goal for this work is to greatly reduce the cost of producing purified finished materials in space. This capability makes economical the fabrication of complex and large structures for space-based industry and habitation. This invention builds upon the sciences of plasma physics, ion separation, and microgravity processing, and incorporates new concepts of the integral design and efficient process operation, taking advantage of the peculiar properties of a microgravity environment. The output stream of pure isotopes can be directed, focused, and shuttered to allow the creation of composite materials, superlattices, or three-dimensional structures of almost any atomic and spatial configuration.