144 results about "Rf components" patented technology

The utility model discloses a large-bevel-angle FAKRA-to-SMP port connector. A radio frequency assembly is provided with an outer conductor, a main body, a sealing member, a central pin and an insulator. The main body is combined with the outer conductor, a sealing groove is formed in the outer side wall of the main body and is coated with sealant, and the sealing element is installed in the main body; one end of the center pin is inclined, the insulator is encapsulated on the center pin, the upper end of the center pin is arranged in the main body, and the lower end of the center pin is arranged in the outer conductor to form an SMP port; the periphery of the radio frequency assembly is wrapped and molded with a shell, a first mounting cavity is formed in the shell, the shell, the main body and the central needle form an FAKRA port, and the FAKRA port or the SMP port is an inclined port; the first installation cavity is provided with a sealant, and the outer conductor is provided with a sealant. The inclined connector butting port is provided, the inclined height of the port is reduced, and the waterproof performance of the connector is improved.

Reducing interference between communications performed by a Wi-Fi transceiver and coexisting wireless communications performed by a second transceiver in a dual wireless communication system. A method includes receiving, by a controller of the second transceiver, a Wi-Fi state signal from the Wi-Fi transceiver. The Wi-Fi state signal indicates timing of a transmit mode and a receive mode of the Wi-Fi transceiver. The method further includes outputting, by the controller of the second transceiver, a control signal for a radio-frequency (RF) component to cause switching between a first mode of the RF component, corresponding to a normal transmit mode, and a second mode of the RF component, corresponding to a receive mode or a low power mode, based at least in part on the Wi-Fi state signal, and a transmit or receive mode status of the second transceiver to reduce interference with the receive mode of the Wi-Fi transceiver.

The invention provides semiconductor process equipment and an etching method. The equipment comprises a plasma excitation device and a process chamber, and the plasma excitation device comprises a first sub-cavity, a second sub-cavity, a first radio frequency assembly and a second radio frequency assembly, the first sub-cavity and the second sub-cavity are communicated with each other, and the first radio frequency assembly and the second radio frequency assembly are connected with the first sub-cavity and the second sub-cavity respectively. The first sub-cavity is communicated with a first gas source, and the first gas source can convey first process gas to the first sub-cavity; the first radio frequency assembly is used for exciting a first gas source into first plasma; the second sub-cavity is communicated with a second gas source, and the second gas source can convey second process gas to the second sub-cavity; the second radio frequency assembly is used for exciting the gas and / or the first plasma in the second sub-cavity, so that the gas and / or the first plasma react in the second sub-cavity, and a reaction product containing free radicals is generated. And the free radicals can chemically react with the material on the surface of the wafer, so that chemical dry etching on the wafer by using the free radicals is realized, and the damage to the surface of the wafer is reduced.

Provided are a radio frequency assembly and a communication device. The radio frequency assembly includes a plurality of power supply modules, a radio frequency transceiver, and a plurality of radio frequency modules. The radio frequency transceiver includes a first group of transmit channels and a second group of transmit channels, and at least one target radio frequency module among the plurality of radio frequency modules can be switchably connected to any power supply module and any radio frequency channel. Different radio frequency module is configured to support power amplification for radio frequency signals at different frequency bands, two radio frequency modules operating simultaneously among the plurality of radio frequency modules have different target power modules, and the two radio frequency modules operating simultaneously have different target radio frequency channels.

The invention relates to a radio frequency coil assembly suitable for a magnetic resonance system, the magnetic resonance system and a control method. The radio frequency coil assembly comprises a coil body formed by arranging a plurality of coil units, and the mode switching circuit is connected with at least one coil unit and used for controlling the coil unit to be switched from a transmitting mode to a receiving mode or from the receiving mode to the transmitting mode. The mode switching circuit is arranged between the radio frequency power amplifier and the coil unit, the pre-amplifier is used for amplifying magnetic resonance signals received by the coil unit, and the matching circuit is arranged between the mode switching circuit and the pre-amplifier and is used for realizing power matching between the radio frequency power amplifier and the coil unit or realizing noise matching between the coil unit and the pre-amplifier. By adopting the arrangement of the invention, the working mode of the radio frequency coil can be conveniently and quickly switched, and the radio frequency assembly and the receiving coil are used for receiving magnetic resonance signals to obtain richer acquisition information, so that the signal-to-noise ratio of a reconstructed image is improved.

The invention discloses a semiconductor process chamber and semiconductor process equipment. The disclosed semiconductor process chamber comprises a chamber body, a plurality of boat bearing frames and a plurality of electrode groups, the chamber body is provided with an inner cavity, the boat bearing frames are oppositely arranged in the inner cavity at intervals in the bearing direction, the boat bearing frames are used for supporting the bearing boats respectively, and the electrode sets are used for being connected with the bearing boats in a one-to-one correspondence mode. One of the two electrode ends of each electrode group is used for realizing the electric connection between the corresponding bearing boat and the positive electrode of the radio frequency assembly, and the other one of the two electrode ends of each electrode group is used for realizing the electric connection between the corresponding bearing boat and the negative electrode of the radio frequency assembly. According to the scheme, the problem that the process yield is difficult to guarantee while the process efficiency is improved due to the fact that a silicon wafer in a semiconductor process chamber related to the related technology is easy to damage due to the fact that the bearing boat is easy to deform after being extruded can be solved.

The invention relates to the technical field of wireless communication equipment, and particularly discloses a high-integration brick type TR module. Comprising a packaging shell which is provided with a packaging cavity and is provided with a radio frequency connection assembly, a substrate I arranged in the packaging shell, a substrate II parallel to the substrate I, a radio frequency assembly A arranged on the substrate II, a radio frequency assembly B arranged above the substrate I, and a radio frequency assembly C arranged at the bottom of the substrate I, a gap is formed between the first substrate and the second substrate, a radio frequency connecting structure connected with the radio frequency assembly C and the radio frequency connecting assembly is arranged in the gap, a low-frequency connector b connected with the radio frequency assembly B is arranged on the packaging shell, and the radio frequency assembly C and the radio frequency assembly B are connected through a low-frequency connector a. And the radio frequency component A is connected with the radio frequency component B. According to the invention, more channels can be arranged, the integration level is higher, the cavity utilization rate is higher, the cost is low, and the miniaturization is realized.

The invention discloses a transceiving full-duplex dual-mode three-beam radio frequency component architecture and system, relates to the technical field of radio frequency communication and radar perception integrated front ends, and comprises the following steps: improving the stability of a system power-on process by combining an FPGA (Field Programmable Gate Array) unified trigger mechanism with graded power-on time sequence control of a radio frequency switch, a power amplifier and an LNA (Low Network Alliance); flexible reconstruction of channels 1-4 is realized through combination of a 2 * 2 switch matrix structure and dynamic interconnection of a circulator and a dual circular polarization port, real-time rotation of a polarization state and dynamic adjustment of a beam main lobe direction are realized through combination of a Berry geometric phase algorithm and a dual-stage regulation and control strategy of a reflection array rotation element, the flexibility of beam generation is improved, and the beam generation efficiency is improved. The dual-mode polarization reflection array is combined with the full duplex circulator and the time sequence control module, so that three polarization combination modes under the same hardware platform are realized, and the polarization multiplexing efficiency of the communication system is improved.

The invention relates to the technical field of data transmission, and discloses an FPGA-based radar network real-time data transmission system, method, device and medium, the system comprises a network port transmission module, a high-speed interface transmission module and a high-speed optical port transmission module, radar instruction control information of a central machine is transmitted to an FPGA through a network port chip, and the high-speed optical port transmission module transmits the radar instruction control information to the FPGA; the radar state information is transmitted back to the central machine; the high-speed transmission interface is used for transmitting the radar instruction control information in the FPGA to the digital signal processor, the radar instruction control information transmitted to the digital signal processor is subjected to signal processing, radar control parameters are obtained, and the radar control parameters are transmitted to the FPGA through the high-speed transmission interface; the radar control parameters in the FPGA are transmitted to the radio frequency front end through the high-speed optical port, the radio frequency assembly is configured according to the radar control parameters in the radio frequency front end, and echo information of the configured radio frequency assembly is transmitted to the FPGA. According to the invention, the efficiency of radar network data transmission can be improved.

The invention discloses a design of an electrically controlled movable antenna array, a multi-user communication method and an electrically controlled movable antenna array, and the method comprises the steps: constructing an electrically controlled movable antenna through controlling the state of a radio frequency assembly between pixel antennas in a reconfigurable pixel antenna; a plurality of electrically-controlled movable antennas are combined and connected with radio frequency links one by one, and a partially-connected electrically-controlled movable antenna array is constructed; an electrically-controlled movable antenna is expanded and is connected with a radio frequency link through a switching network, so that a full-connection electrically-controlled movable antenna array is constructed; under the condition that the transmitting power constraint and the hardware constraint are met, antenna selection of partially-connected and fully-connected electric control movable antenna arrays and corresponding baseband multi-user beam forming are designed, and the multi-user communication and rate are maximized. According to the invention, the position of the antenna array can be rapidly adjusted through electric control, a rapidly changing channel environment can be effectively dealt with, and the performance of multi-user communication is improved.

The application discloses a radio frequency bandwidth determination method and device, equipment and a storage medium, and relates to the field of mobile communication. The method comprises the following steps: determining a first working bandwidth of a radio frequency component based on a CORESET configuration; and adjusting the working bandwidth of the radio frequency component to the first working bandwidth. The terminal device can determine the first working bandwidth of the radio frequency component through the CORESET configuration, so that the terminal device works on the actually required bandwidth, and the waste of bandwidth is avoided, and the power consumption of the terminal device is saved.

The invention discloses a multi-channel radio frequency assembly power supply fault detection circuit, and belongs to the technical field of electronic information. The circuit comprises a voltage weighted summation circuit module, the voltage weighted summation circuit module is used for endowing power supply voltages of a plurality of radio frequency components with different weights and carrying out weighted summation, each radio frequency component corresponds to an input resistor, and different values of the input resistors are used for endowing the radio frequency components with different weight values; and the anti-phase acquisition circuit module is used for inverting the weighted summation result of the voltage weighted summation circuit module and outputting a code through an analog-to-digital converter to judge whether the power supply voltage of the channel where each radio frequency component is located is normal or not. According to the invention, the complexity of the circuit is greatly reduced, the use number of digital processor interfaces is reduced, and the cost is effectively reduced.

The radio frequency front-end module comprises a substrate and a radio frequency assembly, the substrate comprises multiple metal layers, the multiple metal layers at least comprise a top metal layer and a bottom metal layer, and multiple bonding pads are formed on the bottom metal layer; the radio frequency assembly is arranged on the substrate, a metal wire is formed on the metal layer, and at least one terminal of the radio frequency assembly is connected with the bonding pad through the metal wire; wherein the metal wires comprise bottom metal wires, and the bottom metal wires are formed on the bottom metal layer. According to the radio frequency front-end module, the bottom metal wires are arranged on the bottom metal layer, the terminals of the radio frequency assembly can be connected with the bonding pads of the bottom metal layer through the bottom metal wires, the bottom metal wires are arranged at intervals between the bonding pads of the bottom metal layer, the area of the substrate can be more fully utilized, and miniaturization of the radio frequency front-end module is facilitated.

The invention discloses a non-invasive comprehensive trowel face repair device, the trowel face repair device is configured to be in communication association with an external 3D camera or a structured light mobile phone, the trowel face repair device comprises a self-adaptive mask assembly, a capacitive radio frequency assembly and a main control unit, the self-adaptive mask assembly comprises a mask main body and an adjusting assembly, and the adjusting assembly is connected with the capacitive radio frequency assembly. The mask body comprises a mask framework and a silica gel layer, the mask framework is a bionic curved surface type framework matched with the face of the human body, the mask framework is provided with openings corresponding to the eyes and the mouth of the human body, and the silica gel layer is arranged on the side, attached to the face of the human body, of the mask framework; the capacitive radio frequency assembly is arranged on the adjusting assembly of the mask body and comprises a capacitive radio frequency module, and the capacitive radio frequency module is a multi-frequency composite radio frequency electrode capable of achieving three-frequency cooperative output. Through cooperative arrangement of the self-adaptive mask assembly, the main control unit and the capacitive radio frequency assembly, intelligent and multi-mode intervention of trowel face repair is realized.

The invention relates to the technical field of hydrogeological detection, and discloses an ultrasonic guided wave underground water level detection device which comprises an ultrasonic probe shell, a radio frequency assembly is arranged in the ultrasonic probe shell, and a probe rod assembly is arranged at the bottom of the ultrasonic probe shell. The probe rod assembly comprises a longitudinal wave coupling solid rod, a hollow connecting rod, a guided wave propagation hollow rod and a blade foot, the radio frequency assembly comprises an inner layer sleeve, a plurality of wire bundles are arranged in the inner layer sleeve, and the bottom of each wire bundle is fixedly connected with a phased array infinitesimal element. Ultrasonic longitudinal waves are transmitted through a phased array infinitesimal in an ultrasonic probe shell, so that the longitudinal waves repeatedly interfere in a longitudinal wave coupling solid rod to form cylindrical guided waves propagating along the inner wall of a guided wave propagation hollow rod, the cylindrical guided waves propagate to the deep part of a stratum and are reflected by underground water, and the infinitesimal receives and analyzes the propagation time of the reflected waves to calculate the water level depth. The problem that traditional drilling measurement and an electromagnetic method are low in detection efficiency is solved, and the water level detection accuracy and efficiency are improved.

1. Name of this design product: Thermal conduction device for antenna (solder-free and splicable). 2. Purpose of this design product: Used for communication payloads, to achieve multi-sided antenna installation and fixation, and to achieve efficient heat conduction between RF components and channel circuits. 3. The key point of the design of this product lies in its shape. 4. The picture or photo that best illustrates the design points: three-dimensional picture.

Integrated circuit chip comprising a radiofrequency component The present description relates to an integrated circuit chip (100) comprising at least one component (120), arranged in and / or on a structure (110) comprising a semiconductor substrate (111) on which rests an insulating layer (112) on which rests a semiconductor layer (113), in which at least two PN junctions are arranged at the interface between said substrate (111) and said insulating layer (112). Figure for abstract: Fig. 1

A glass substrate architecture for mounting RF components may be configured for heat dissipation. Existing millimeter wave radiofrequency (RF) systems mount the radiofrequency integrated circuits (RFICs) on a printed circuit board on the opposite side of a heat sink, making it difficult to dissipate heat away from the RFICs during operation. This architecture mounts the RFICs directly to a back side of a glass waveguide substrate, and thermally couples the top side of the RFICs to a conductive pad on the underlying printed circuit board with a thermal pathway to the heatsink. This leads to a much more effective dissipation of heat away from the RFICs and eliminates the need for additional cooling systems or throttling the performance of the radar system.

The application relates to a mobile phone direct connection S-band phased array radio frequency system based on a multi-layer mixed pressing plate technology, and belongs to the technical field of low-orbit satellite wireless communication, and specifically relates to a mobile phone direct connection S-band phased array radio frequency system based on a multi-layer mixed pressing plate technology. The phased array radio frequency system contains a plurality of single-channel radio frequency components, each single-channel radio frequency component is internally integrated with a radio frequency SIP module, a power supply SIP module, a radio frequency PA and a transceiving filter; the complete radio frequency transceiving link and the calibration branch are highly integrated in the single-channel TR component with the size of 60*50*8mm, the overall structure and the peripheral interconnection design of the component are greatly simplified, the single-channel radio frequency component multiplexing and the small-size and light-weight design of the component are realized, and the S-band low-orbit satellite engineering application is adapted.

The present invention provides a bidirectional coupler and a radio frequency module. The bidirectional coupler includes a silicon oxide layer, an insulating layer, a first metal layer, a second metal layer, and a third metal layer that are sequentially stacked and fixed, a transmission line fixed in the third metal layer, a patch cord fixed in the second metal layer, a coupling line fixed in the first metal layer, a connection hole penetrating from the first metal layer to the second metal layer, and a connection line; the area of the positive projection of the first metal layer on the third metal layer is 30-40% of the side area of the third metal layer; the width of the coupling line is less than 10 μm, the distance between the patch cord and the transmission line is less than 5 μm, and the distance between the patch cord and the coupling line is less than 5 μm. The present invention can improve the coupling degree and isolation degree of the bidirectional coupler, reduce its insertion loss, achieve large bandwidth and miniaturization, and at the same time achieve high-density integration in radio frequency components.

A photonic integrated circuit including bond pads, RF components, a first layer stack having a doped epitaxial semiconductor layer, a second layer stack that is associated with the first layer stack, and a first set of elongated tracks of electrically conductive material that are associated with the second layer stack and in use of the photonic integrated circuit can carry an RF signal between the bond pads and the RF components. The second layer stack includes an electrical ground shield that is sandwiched between a first dielectric layer and a second dielectric layer. In use of the photonic integrated circuit, the electrical ground shield minimizes or prevents overlap between an electric field caused by the RF signal and the doped epitaxial semiconductor layer. An opto-electronic system including the photonic integrated circuit.

An embodiment provides a measurement arrangement for characterizing a radio frequency arrangement comprising a plurality of antennas. Measurement arrangement comprises a dielectric waveguide slab with a plurality of frequency converting structures, arranged in or on the dielectric waveguide slab. Measurement arrangement further comprises a plurality of waveguide transitions arranged at different positions of the dielectric waveguide slab and are coupled to respective radio frequency components. Radio frequency components are configured to transmit and / or receive radio signals. Frequency converting structures are associated with respective antennas of the plurality of antennas, and are configured to perform a frequency conversion on signals received, resulting in frequency-converted signals. Frequency converting structures are further configured to couple respective antennas with the dielectric slab in a frequency converting manner to establish a frequency-converting coupling between the antennas and the plurality of waveguide transitions to cause a frequency-converting coupling between the antennas and the radio frequency components.

The utility model belongs to the technical field of instrument boxes, particularly relates to a small-size light-weight instrument box, and aims to solve the problems that the conventional instrument box is often large in size, heavier in weight and unfavorable for installation and transportation, the following scheme is provided: the small-size light-weight instrument box comprises an instrument box body, the instrument box body comprises a box rear cover and a box front cover, and the box front cover is arranged on the upper side of the box rear cover; a PCBA is fixed in the box rear cover, a radio frequency module is arranged on the upper side of the PCBA, the PCBA and the radio frequency module are assembled into a module assembly in a plug-in mode through an FMC connector, a radio frequency module installation plate is fixedly connected to the radio frequency module through screws, and the radio frequency module and the radio frequency module installation plate form a radio frequency assembly. The main body frame is arranged in the PCBA, the radio frequency assembly is fixed on the lower side of the main body frame, and a group of antenna assemblies are arranged on the upper side of the main body frame; the device is compact in structure and small in size, the size of the instrument box is greatly reduced through reasonable layout and design, and installation and transportation are facilitated.

Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.

This application provides a radio frequency (RF) front-end module and an electronic device. The RF front-end module includes a substrate, a shielding structure, RF components, and multiple grounding branches. The substrate includes a metal layer. The shielding structure includes a shielding layer disposed on top of the substrate and shielding sidewalls, with the shielding sidewalls extending from the shielding layer toward the substrate. At least one RF component is disposed within the projection of the shielding structure onto the substrate. The grounding branches connect the metal layer and the shielding sidewalls, and are grounded through metal vias, with a gap between adjacent grounding branches. By grounding the shielding structure through the grounding branches disposed on the side of the substrate, the electromagnetic shielding effect of the shielding structure can be enhanced. Furthermore, interference signals generated inside the shielding structure can be efficiently transmitted to ground, preventing these interference signals from resonating inside the shielding structure and affecting the overall performance of the RF front-end module, thereby improving the out-of-band rejection performance of the RF front-end module.

The utility model discloses a transportable low-orbit satellite communication antenna, and belongs to the technical field of antennas. The antenna is composed of a base, an X-Y-shaped seat frame, a reflecting surface, a feed source network, a radio frequency assembly and the like, the base is formed by combining an annular base plate and a stand column and stably supports the antenna, the X-Y-shaped seat frame achieves tracking and pointing of the antenna and has the top-crossing tracking capacity, the reflecting surface is designed in a split mode and is convenient to store and transport, and the antenna is arranged on the X-Y-shaped seat frame. The feed source network is composed of a feed source assembly and a ring focus type auxiliary face, the auxiliary face has the adjusting capacity and can adjust the phase center of a feed source, the radio frequency assembly is integrally designed, and transceiving processing of radio frequency signals is achieved. According to the utility model, based on the development of low-orbit Internet constellations, the low-orbit satellite communication system has a transportable function and a top-crossing tracking communication capability, and can realize continuous tracking communication of low-orbit satellites.

The antenna apparatus includes an antenna substrate having a first surface and an opposing second surface with an antenna ground plane on the second surface. An antenna element is on the first surface of the antenna substrate. A first RF component is attached to the second surface of the antenna substrate and includes RF circuitry for conditioning signals communicated with the antenna element. A second RF component is attached to the second surface of the antenna substrate. A coplanar waveguide (CPW) interconnect couples the first RF component to the second RF component and includes a center conductor and first and second ground conductors on either side of the center conductor. The center conductor has a profile within an opening in the antenna ground plane.

Disclosed are photocurable compositions and processes for fabricating 3D high-frequency dielectric materials for use as insulators in circuits, for example, high-performance RF components such as antennas, filters, transmission lines, or high-frequency interconnects for electromagnetic transmission. The high-frequency circuit structures exhibit very low dielectric loss at operating frequencies (1-60 GHz).

The utility model discloses a cross-layer interconnection structure, a radio frequency assembly, an antenna and a communication device, which are applied to the communication field, and comprise a first dielectric substrate and a second dielectric substrate, the first surface and the second surface of the first dielectric substrate are correspondingly provided with a surface microstrip line function layer and a first grounding layer, a third surface and a fourth surface of the second dielectric substrate are correspondingly provided with a strip line functional layer and a second grounding layer; the first dielectric substrate and the second dielectric substrate are stacked through a semi-cured layer, and the first grounding layer and the strip line functional layer are close to the semi-cured layer; the semi-cured layer is a semi-cured layer with a specified thickness set according to a required impedance value; micro-strip lines are arranged in the surface micro-strip line functional layer, and strip lines in conductive connection with the micro-strip lines are arranged in the strip line functional layer. According to the utility model, the space between the first grounding layer and the strip line function layer is arranged to be the semi-solidified layer with the specified thickness, so that the preparation complexity is reduced while the functionality is ensured.

This utility model relates to the field of radar technology and proposes a miniaturized radar reconnaissance device. By separately mounting the high-power power module and acquisition module within the housing in a first and second heat dissipation area positioned opposite each other, high-power operation heat dissipation is facilitated. Furthermore, a support structure within the housing is used to place the lower-power radio frequency component between the power module and the acquisition module. This separates the high-power operating module and improves the utilization of the internal space, accelerating overall heat dissipation efficiency. The functional components are stacked within the housing cavity to form the main functional structure. The antenna assembly and connector assembly are located within the housing, in the area between the first and second functional surfaces of the main functional structure, maximizing the use of the housing cavity space. Through optimized internal structural design of the radar reconnaissance device, the device size is reduced while ensuring efficient heat dissipation.