196 results about "Rf components" patented technology

A three dimensional waveguide is integrated with a MEMS structure to control a signal in various RF components. The components include switches, variable capacitors, filters and phase shifters. A controller controls movement of the MEMS structure to control a signal within the component. A method of construction and a method of operation of the component are described. The switches have high power handling capability and can be operated at high frequencies. By integrating a three dimensional waveguide with a MEMS structure, the components can be small in size with good operating characteristics.

A method for full duplex communication includes creating a canceling self interference signal using active noise cancelation in RF circuits and transmission lines with a plurality of receive antennas being used and a signal received by the antennas are destructively combined in the transmission lines and passive RF components, and attaining full-duplex simultaneous in time and overlapping in space wireless transmission and reception on same frequency band responsive to the step of creating a canceling self interference signal.

Systems and methods utilized a wireless transceiver (5008) having a low power radio frequency (LPRF) component (5010) that powers down to conserve energy and powers up in response to a signal; and a second receiver (5014) that provides the signal via line (5018) in response to receipt of a radio frequency broadcast. The broadcast is targeted to activate particular transceivers by including in the broadcast identifications such as class designations, in which case the transceivers power up and form networks. A transceiver may include one or more identifications and may include a unique identification of the transceiver itself. The LPRF component may be a Bluetooth radio, but in such case the overall transceiver itself only draws about 10 to 15 μA while actively awaiting and screening for a targeted broadcast.

A switchless combiner for high-power broadcast signals incorporates a circular waveguide configured as an orthogonal mode transducer to provide a coherent signal and a phase rotator to steer the combined signal to an output coupler. Out-of-phase RF is absorbed by a station load. The phase rotator is capable of redirecting the output from either of the sources or all of the combined output to the station load. Switching between destinations for the RF components may be made with power applied. The input and output characteristics and mechanical configuration permit the switchless combiner to be integrated with other high-power RF broadcast signal manipulation devices.

An antenna apparatus for a portable terminal is provided. The portable terminal includes a printed circuit board (PCB) having a ground surface and RF components to process a wireless signal received through at least one antenna element. A housing forms an external appearance of the portable terminal, and has a non-conductive member with a plurality of metal fragments attached thereto. At least one of the metal fragments is electrically connected to the ground surface. The metal fragments may enhance the texture and durability of the housing. Preferably, the shapes, sizes and distances separating the metal fragments are designed to minimally impact, or improve, the antenna performance provided by the at least one antenna element.

A wireless terminal includes a housing (10) containing a substrate (12) having a ground plane, RF components mounted on the substrate, a PIFA (Planar Inverted-F Antenna) (16) carried by the substrate and coupled electrically to the RF components for transmitting and receiving signals and a notch antenna (14) in the substrate for receiving signals in a frequency band at least partially overlapping the transmission bandwidth of some of the signals transmitted by the PIFA. The notch antenna is de-activated when the PIFA (16) is being used for transmitting a signal lying within the said transmission bandwidth.

A structural printed wiring board panel includes a multilayer printed wiring board having opposing, outer faces and interlayer interconnects that route RF, power and control signals. Connection areas are formed in or on at least on one face for connecting the interlayer interconnects and any electrical components. A metallic face sheet is secured onto at least one outer face, adding structural rigidity to the multilayer printed wiring board. A metallic face sheet can have apertures positioned to allow access to connection areas. RF components can be carried by a face sheet and operatively connected to connection areas. Antenna elements can be positioned on the same or an opposing face sheet and operatively connected to RF components to form a phased array printed wiring board (PWB) panel.

A digital interface between analogue RF hardware and digital processing hardware which (a) defines how the analogue RF hardware and digital processing hardware send and receive digital data to one another and (b) is open in order to decouple the design of the analogue RF hardware from the design of the digital processing hardware. The adoption of such an interface will facilitate the uptake of software defined radio (SDR), both as a design-time and run-time technology, as it enables the production of analogue/RF components independently from the digital domain hardware and software.

An automobile radar module and method include a PCB having a first side on which RF electronic components are mounted and a second side on which digital electronic components are mounted. An EMI shield is mounted over the first side of the PCB, and a radome is mounted over the EMI shield. The EMI shield comprises an aperture exposing RF components on the first side of the PCB. The radome comprises a protrusion which protrudes into the aperture in the EMI shield. The protrusion and sidewalls of the aperture define a shielded region above the RF components on the first side of the PCB. The sidewalls extend at an acute angle with respect to a plane of the primary surface of the EMI shield, the acute angle being selected based on operational parameters of the radar module such that a predetermined shielding performance is realized.

Systems and methods are provided for optimizing the placement of RF components within an environment. The system operates by defining a spatial model associated with the environment, determining a first placement location of the RF device within the spatial model, defining a localized reference area, determining a coverage area associated with the RF device, identifying a set of gaps associated with the coverage area within the reference area, determining a second placement location of the RF device within the spatial model based on the set of gaps, and placing the AP in the second placement location within the environment.

Systems and methods are provided for optimizing the placement of wireless transmitters or other RF components within an environment. A first one of the plurality of RF devices is initially placed at a first initial location within the spatial model, wherein the first initial location is determined with respect to the reference point. The coverage area for the first RF device is determined, and a second one of the plurality of RF devices is initially placed at a second initial location within the spatial model, wherein the second initial location is determined with respect to the coverage area of the first RF device. At least one of the first and second initial locations can be adjusted to improve the combined coverage area of the first and second RF devices.

The device includes radio frequency (RF) communication components installed within a case of the device and an antenna with an inverted E shape mounted within a header of the device. The antenna has three branches extending from a main arm: a capacitive branch connecting one end of the main arm to the case; an RF signal feed branch connecting a middle portion of the main arm to the internal RF components of the device via a feedthrough; and an inductive branch connecting the opposing (far) end of the main arm to the case to provide a shunt to ground.

A process of manufacturing parallel-plate microstructures by integrating the microstructures in a chip using a CMOS process is provided. A MEMS variable capacitor, a tunable band-pass filter, tunable matching networks, and capacitive RF-MEME switches all having vertically movable components and are integrated into a chip.

The invention relates to the field of liquid level measurement device, specifically a method of liquid level measurement with radar and radar liquid level instrument with this method. To solve the current problems of low accuracy of measurement result and high cost, the invention employs the technical project: a method of liquid level measurement with radar, the liquid level to be measured can be obtained based on the formula L=H-c1(Deltphi11/4 piDeltf1); a radar liquid level instrument with this method includes radio-frequency unit, transmitting element, receiving element and processing unit, radio-frequency unit includes reference clock source and clock source, reference clock source is connected with the clock source in radio-frequency unit; said transmitting element comprises digit up converter, D/A converter and low-pass filter, said receiving element includes low-pass filter and digit down converter and D/A converter.

A leadframe and a semiconductor package including such a lead frame, are provided by embodiments of the invention. The leadframe includes a die flag, leads, and a radio frequency (RF) passive component integrally formed into the leadframe. Examples of the RF passive component can be an antenna, such as a spiral or serpentine antenna or one or more transmission lines that can be used as a coupler or filter. The RF passive component can also be tuned to particular frequency values and ranges depending on the particular location of attachment to the RF passive component. The semiconductor package further comprises a semiconductor die and a coupling means with which to connect to the RF passive component to another location on the leadframe, such as the leads and/or the semiconductor die. The semiconductor package may also be encapsulated in a non-conductive material to protect the semiconductor die, coupling means and RF passive component.

The invention provides a maritime emergency communication system which is used for realizing communication in a maritime emergency state and meeting emergency communication requirements in a highly confronting environment in the emergency state. The maritime emergency communication system comprises a main communication system and a mobile access communication system. The main communication systemis composed of at least two buoys, carries a broadband reconfigurable radio frequency assembly, a communication gateway, an optical signal processor, an industrial WIFI subsystem, a short-wave communication subsystem, a Beidou navigation subsystem and a hybrid energy subsystem, and is in wireless communication with an overhead airplane and a ship platform. The mobile access communication system iscomposed of a plurality of water surface robots, carries a multi-system full duplex underwater acoustic communication machine, an underwater optical communication machine, a broadband software reconfigurable radio frequency module, a short wave communication subsystem, a Beidou navigation subsystem, an underwater acoustic communication subsystem and an underwater optical communication subsystem,communicates with an underwater battle platform through an underwater acoustic communication machine and an underwater optical communication machine, and communicates with an overhead aircraft and a ship platform in a wireless communication mode.

A communications apparatus, such as a portable radiotelephone, comprises a housing (40) containing a printed circuit board (PCB) (12) having a ground plane (16) and electronic components in rf shields (18) thereon. A planar antenna (10), for example a planar inverted-L antenna (PILA), is mounted spaced from the ground plane and a dielectric (14), for example, air, is present in a space between the PCB and the planar antenna. A feed (36) couples the planar antenna (10) to the rf components. The feed comprises parallel L-C resonator circuit components (42), a transmission line, or any other predominantly reactive network for reactively tuning the antenna. In the case of a dual band antenna the components are selected so that a lower frequency is tuned inductively and a higher frequency is tuned capacitively. The components, which may be discrete or distributed, are mounted on the PCB or a part of the planar antenna structure which is not subject to detuning by the user in normal operation of the apparatus.