345results about How to "Improve RF performance" patented technology

A mixed-signal, multilayer printed wiring board fabricated in a single lamination step is described. The PWB includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the PWB. The PWB includes a number of unit cells with radiating elements and an RF cage disposed around each unit cell to isolate the unit cell. A plurality of flip-chip circuits are disposed on an external surface of the PWB and a heat sink can be disposed over the flip chip components.

A three dimensional waveguide is integrated with a MEMS structure to control a signal in various RF components. The components include switches, variable capacitors, filters and phase shifters. A controller controls movement of the MEMS structure to control a signal within the component. A method of construction and a method of operation of the component are described. The switches have high power handling capability and can be operated at high frequencies. By integrating a three dimensional waveguide with a MEMS structure, the components can be small in size with good operating characteristics.

A new method to form shielded vias with microstrip ground plane in the manufacture of an integrated circuit device is achieved. The method comprises, first, providing a substrate. The substrate is etched through to form holes for planned shielded vias with microstrip ground plane. A first dielectric layer is formed overlying the top side of the substrate and lining the holes. A first conductive layer is deposited overlying the first dielectric layer and lining the holes. A second dielectric layer is deposited overlying the first conductive layer and lining the holes. A second conductive layer is deposited overlying the second dielectric layer and filling the holes. The second conductive layer is planarized to confine the second conductive layer to the holes and to thereby complete the shielded vias with microstrip ground plane. Silicon carrier modules and stacked, multiple integrated circuit modules are formed using shielded vias with microstrip ground plane to improve RF performance.

A variable inductor can be formed on an integrated circuit with a primary conductor, a secondary conductor, and a switch. The primary conductor implements an inductor and may be formed in various patterns (e.g., a spiral). The secondary conductor forms a loop in proximity to (e.g., on the outside of) the primary conductor. The switch couples in series with the secondary conductor and opens or closes the loop. The inductance of the inductor is varied by closing and opening the loop with the switch. A current source may also be coupled in series with the secondary conductor and used to control the current flow in the secondary conductor to either increase or decrease the inductance. Multiple loops may be formed to change the inductance in more than two discrete steps. The variable inductor may be used for various applications such as filters, VCOs, and impedance matching networks.

An electrical connector, a ring-like locking sheet with inner and outer teeth of which is fixed at the end of its plug connector; and a circumferential bulge, with trapezoid cross section which has an upslope, a flat top and a down-slope, is provided on the surface of the outer conductor of the socket connector. Therefore, in the process of connection, the inner teeth reach the max flexural deformation when go up along the slope to the flat top. When reach the down-slope, the deformed inner teeth gradually restore the original state in tangential direction of the down-slope, and finally stop at the down-slope or at the juncture of the down-slope and the flat top. The electrical connector according to the present invention can have a rigid zero clearance between the interfaces in connection, and at the same time can keep a very strong axial force. The RF coaxial connector according to the present invention has continuous impedance between the contact surfaces, reliable and stable contact, greatly reduced RF emission, as well as the same operating frequency, excellent RF performance and good passive intermodulation as those with threaded connection.

A printed quasi-tapered tape helical element and printed helical array antenna arc disclosed. The helical element comprises a thin helix conductor having a uniform section associated with a tapered section. The helix conductor can be printed on a thin dielectric sheet and bonded to a hollow composite dielectric support. A solid copper conductor is configured to provide electrical connection between a feeding point of the helix conductor and a microstrip line of a microstrip feed network. The uniform and tapered helix turns are respectively wrapped around the uniform and tapered sections, which enables impedance matching, axial mode excitation, gain and radiation patterns, and damping out of standing waves generated in current distribution over the helix conductor. Conductive composite cups surrounding each helical element reduces mutual coupling in array environment. Thus, the helical element and the array antenna achieve low on-axis and off-axis axial ratio performance over the wideband for global coverage.

A system and method for forming post passivation metal structures is described. Metal interconnections and high quality electrical components, such as inductors, transformers, capacitors, or resistors are formed on a layer of passivation, or on a thick layer of polymer over a passivation layer.

A silicon and silicon germanium based semiconductor MODFET device design and method of manufacture. The MODFET design includes a high-mobility layer structure capable of ultra high-speed, low-noise for a variety of communication applications including RF, microwave, sub-millimeter-wave and millimeter-wave. The epitaxial field effect transistor layer structure includes critical (vertical and lateral) device scaling and layer structure design for a high mobility strained n-channel and p-channel transistor incorporating silicon and silicon germanium layers to form the optimum modulation-doped heterostructure on an ultra thin SOI or SGOI substrate capable of achieving greatly improved RF performance.

The invention discloses a method and terminal supporting carrier aggregation. The terminal comprises a radio frequency front-end device. The radio frequency front-end device comprises an antenna switch. The terminal also comprises a multiband antenna assembly. The multiband antenna assembly supports N work frequency bands. The multiband antenna assembly includes a radiator, N feeding points and N matching networks. The radiator is electrically connected to the N feeding points. Each of the N feeding points is electrically connected to one output end of the antenna switch through one corresponding matching network. The antenna switch includes N output ends, N being integer greater than or equal to 2. A Diplexer in a radio frequency link can be omitted, so the path loss of a wireless link can be obviously reduced, and the radio frequency performance of the terminal is improved.

A system and method for forming post passivation metal structures is described. Metal interconnections and high quality electrical components, such as inductors, transformers, capacitors, or resistors are formed on a layer of passivation, or on a thick layer of polymer over a passivation layer.

The invention discloses a floating-structured radio frequency coaxial connector, which is characterized in that a lower socket is in inserted connection with an upper socket through an adaptor; the adaptor is formed by sleeving two outer conductors, an insulating body and an inner conductor through a sleeve and a spring; and the two outer conductors are glidingly connected. Compared with the prior art, the floating-structured radio frequency coaxial connector disclosed by the invention has a simple structure, and a certain floating quantity for matching can be provided in radial and axial directions, so that the effective contact between a panel and a shell of the radio frequency coaxial connector is ensured, the matching reliability is improved, and the precision among plates or modules and the manufacture cost of the whole device are reduced; the floating-structured radio frequency coaxial connector is especially applicable to the situation that a plurality of products of the floating-structured radio frequency coaxial connectors are arranged on one panel at the same time; the good radio frequency performance and the higher power handling capability are kept; and the electrical property consistency is ensured.

A mixed-signal, multilayer printed wiring board fabricated in a single lamination step is described. The PWB includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the PWB. The PWB includes a number of unit cells with radiating elements and an RF cage disposed around each unit cell to isolate the unit cell. A plurality of flip-chip circuits are disposed on an external surface of the PWB and a heat sink can be disposed over the flip chip components.

A three dimensional microwave switch having a plurality of waveguide transmission lines configured in an octahedral shape having microwave I / O ports at the corners. Individual actuators selectively move respective reeds within the waveguide transmission lines between a signal-attenuating position abutting the interior surface of the waveguide transmission line and a signal-conducting position substantially coaxial with the waveguide transmission line and abutting the signal lines of the I / O microwave ports couple to opposite ends of the waveguide transmission line.

The present invention comprises an antenna device for a portable radio communication device operable in at least a first and a second frequency band. The antenna device comprises a first electrically conductive radiating element having a feeding portion connectable to a feed device (RF) of the radio communication device for feeding and receiving radio frequency signals, a first ground plane portion arranged at a distance from the first radiating element, a second ground plane portion, and a controllable switch arranged between the first and second ground plane portion for selectively interconnecting or disconnecting the first and second ground plane portion.

A system and method for forming post passivation passive components, such as resistors and capacitors, is described. High quality electrical components, are formed on a layer of passivation, or on a thick layer of polymer over a passivation layer.

A semiconductor package comprising a non-conductive film which defines opposed top and bottom film surfaces and includes a plurality of vias disposed therein. Disposed on the top film surface is a plurality of upper leads which circumvent respective ones of the vias. Similarly, disposed on the bottom film surface is a plurality of lower leads which circumvent respective ones of the vias and are electrically connected to respective ones of the upper leads. At least one transmission line element is also disposed on the top film surface and electrically connected to at least one of the upper leads. Attached to the top film surface and electrically connected to at least one of the upper leads and the transmission line element is at least one semiconductor die. A package body at least partially covers the semiconductor die, the upper leads, the transmission line element, and the top film surface.

According to one aspect of the present invention, a method of forming a microelectronic assembly, such as an integrated passive device (IPD) (72), is provided. An insulating dielectric layer (32) having a thickness (36) of at least 4 microns is formed over a silicon substrate (20). At least one passive electronic component (62) is formed over the insulating dielectric layer (32).

The invention discloses a radio-frequency front-end transceiver which comprises an antenna module, radio-frequency modules in various modes and a multiplexer module, wherein the multiplexer module is used for separating signals received by the antenna module to obtain frequency-band signals in various modes and transmitting the frequency-band signals in various modes to the corresponding radio-frequency modules in various modes; or the multiplexer module is used for receiving the frequency-band signals sent by the radio-frequency modules in various modes and transmitting the frequency-band signals to the antenna module. The invention also discloses a multi-mode mobile terminal. By adopting the radio-frequency front-end transceiver and the multi-mode mobile terminal, only one antenna is used, thus occupying less space, avoiding mutual interference of signals between two or more antennas, and having good radio-frequency performance.

The invention discloses a high-density and high-integration millimeter-wave tile-type phased-array antenna T assembly and aims to provide a T assembly design scheme which is reliable in performance, easy to integrate and low in profile. According to the high-density and high-integration millimeter-wave tile-type phased-array antenna T assembly provided by the technical schemes of the inventio, radio frequency signals are directly fed from the common end of the bottom of the lower cavity of the T assembly through a radio frequency coaxial connector; direct transition to a T-junction is realized; each chip integrates the functions of power pre-amplification, a power division network, amplitude-phase control, serial-parallel conversion, power source management and digital control; GaAs poweramplifier chips with corresponding quantities of channels are cascaded to form a multi-channel 2.5-dimensional heterogeneous extensible subarray unit; a low-frequency signal network directly controlsthe chips and the GaAs power amplifiers of the T assembly; multiple paths of signals are subjected to phase shift, amplitude attenuation and power amplification; the processed signals are sent to thefiltering function layer of the upper end multi-layer circuit board of the T assembly through a coplanar waveguide-to-coaxial conversion vertical interconnection structure; the filtered signals are finally sent to a microstrip patch antenna, so that radio frequency signals are transmitted.

The invention discloses a separate communication device and a mobile host. The device comprises a mobile display terminal and a mobile host, the mobile display terminal comprises a first wireless communication module, and an instruction input module, an information collection module and an information output module connected with the first wireless communication module, the mobile host comprises a second wireless communication module, a processing module and a mobile communication module, which are connected in sequence, and the first wireless communication module communicates with the second wireless communication module. The existing mobile terminal is set into the mobile display terminal and the mobile host, only necessary components of user interaction are arranged in the mobile display terminal handheld operated by a user, and an SIM card, a base band, a radio frequency antenna, a processing module, a memory and other power consumption components and parts of the mobile communication module are omitted, thereby greatly reducing the power consumption of the mobile display terminal and improving the cruising ability of the mobile display terminal and the lighting and thinning of a battery, and thus the lighting and thinning design of the mobile display terminal is facilitated.

A system and method for forming post passivation inductors, and related structures, is described. High quality electrical components, such as inductors and transformers, are formed on a layer of passivation, or on a thick layer of polymer over a passivation layer.

A millimeter wave filter for surface mount applications includes at least one low temperature, co-fired ceramic layer defining an outer filter surface. A plurality of parallel, coupled line millimeter wavelength hairpin resonators, each formed from a single stripline or microstrip, are positioned on the outer filter surface. Each hairpin resonator is folded back upon itself into substantially parallel resonator lines.

A system and method for forming post passivation discrete components, is described. High quality discrete components are formed on a layer of passivation, or on a thick layer of polymer over a passivation layer.

A semiconductor material which has a high carbon dopant concentration includes gallium, indium, arsenic and nitrogen. The disclosed semiconductor materials have a low sheet resistivity because of the high carbon dopant concentrations obtained. The material can be the base layer of gallium arsenide-based heterojunction bipolar transistors and can be lattice-matched to gallium arsenide emitter and / or collector layers by controlling concentrations of indium and nitrogen in the base layer. The base layer can have a graded band gap that is formed by changing the flow rates during deposition of III and V additive elements employed to reduce band gap relative to different III-V elements that represent the bulk of the layer. The flow rates of the III and V additive elements maintain an essentially constant doping-mobility product value during deposition and can be regulated to obtain pre-selected base-emitter voltages at junctions within a resulting transistor.

A thermal barrier coated radio frequency (RF) radome is provided having a radio frequency (RF) radome with an exterior surface, an interior surface, a tip, and a base, wherein the RF radome is designed to transmit RF signals. A thermal barrier coating is applied to an exterior surface of the radome, wherein the thermal barrier coating has a dielectric constant of less than about 2.0, and further wherein the thermal barrier coating reduces a structure temperature of the RF radome by greater than 300 degrees Fahrenheit to enhance thermo-mechanical properties and performance of the RF radome.

The invention discloses a radio frequency coaxial connector, which comprises a socket and a plug, wherein the plug is formed by sleeving an outer conductor B, an insulator B and an inner conductor B. The radio frequency coaxial connector is characterized in that: a spring casing is clamped in a jack of an inner conductor A; an annular groove (13) is formed on the inner wall of an outer conductor A; the outer conductor B is a sleeve of which one end is provided with a raised punching encasing structure; the B inner conductor is a rod-like plug of which one end is provided with a spheroidal structure; the socket is spliced with the plug; the spheroidal structure on the end part of the inner conductor B is clamped with the spring sleeve clamped in the inner conductor A; and the raised punching encasing structure of the outer conductor B is clamped with the annular groove of the outer conductor A. Compared with the prior art, the radio frequency coaxial connector has high and stable electric and radio frequency performance, a simple structure and high fit reliability, ensures reliable and stable connection in a given frequency range, and is particularly applied to the high-frequency signal transmission of the field of communication.