340results about How to "Improve RF performance" patented technology

A mixed-signal, multilayer printed wiring board fabricated in a single lamination step is described. The PWB includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the PWB. The PWB includes a number of unit cells with radiating elements and an RF cage disposed around each unit cell to isolate the unit cell. A plurality of flip-chip circuits are disposed on an external surface of the PWB and a heat sink can be disposed over the flip chip components.

A new method to form shielded vias with microstrip ground plane in the manufacture of an integrated circuit device is achieved. The method comprises, first, providing a substrate. The substrate is etched through to form holes for planned shielded vias with microstrip ground plane. A first dielectric layer is formed overlying the top side of the substrate and lining the holes. A first conductive layer is deposited overlying the first dielectric layer and lining the holes. A second dielectric layer is deposited overlying the first conductive layer and lining the holes. A second conductive layer is deposited overlying the second dielectric layer and filling the holes. The second conductive layer is planarized to confine the second conductive layer to the holes and to thereby complete the shielded vias with microstrip ground plane. Silicon carrier modules and stacked, multiple integrated circuit modules are formed using shielded vias with microstrip ground plane to improve RF performance.

A variable inductor can be formed on an integrated circuit with a primary conductor, a secondary conductor, and a switch. The primary conductor implements an inductor and may be formed in various patterns (e.g., a spiral). The secondary conductor forms a loop in proximity to (e.g., on the outside of) the primary conductor. The switch couples in series with the secondary conductor and opens or closes the loop. The inductance of the inductor is varied by closing and opening the loop with the switch. A current source may also be coupled in series with the secondary conductor and used to control the current flow in the secondary conductor to either increase or decrease the inductance. Multiple loops may be formed to change the inductance in more than two discrete steps. The variable inductor may be used for various applications such as filters, VCOs, and impedance matching networks.

A printed quasi-tapered tape helical element and printed helical array antenna arc disclosed. The helical element comprises a thin helix conductor having a uniform section associated with a tapered section. The helix conductor can be printed on a thin dielectric sheet and bonded to a hollow composite dielectric support. A solid copper conductor is configured to provide electrical connection between a feeding point of the helix conductor and a microstrip line of a microstrip feed network. The uniform and tapered helix turns are respectively wrapped around the uniform and tapered sections, which enables impedance matching, axial mode excitation, gain and radiation patterns, and damping out of standing waves generated in current distribution over the helix conductor. Conductive composite cups surrounding each helical element reduces mutual coupling in array environment. Thus, the helical element and the array antenna achieve low on-axis and off-axis axial ratio performance over the wideband for global coverage.

The invention discloses a method and terminal supporting carrier aggregation. The terminal comprises a radio frequency front-end device. The radio frequency front-end device comprises an antenna switch. The terminal also comprises a multiband antenna assembly. The multiband antenna assembly supports N work frequency bands. The multiband antenna assembly includes a radiator, N feeding points and N matching networks. The radiator is electrically connected to the N feeding points. Each of the N feeding points is electrically connected to one output end of the antenna switch through one corresponding matching network. The antenna switch includes N output ends, N being integer greater than or equal to 2. A Diplexer in a radio frequency link can be omitted, so the path loss of a wireless link can be obviously reduced, and the radio frequency performance of the terminal is improved.

The invention discloses a floating-structured radio frequency coaxial connector, which is characterized in that a lower socket is in inserted connection with an upper socket through an adaptor; the adaptor is formed by sleeving two outer conductors, an insulating body and an inner conductor through a sleeve and a spring; and the two outer conductors are glidingly connected. Compared with the prior art, the floating-structured radio frequency coaxial connector disclosed by the invention has a simple structure, and a certain floating quantity for matching can be provided in radial and axial directions, so that the effective contact between a panel and a shell of the radio frequency coaxial connector is ensured, the matching reliability is improved, and the precision among plates or modules and the manufacture cost of the whole device are reduced; the floating-structured radio frequency coaxial connector is especially applicable to the situation that a plurality of products of the floating-structured radio frequency coaxial connectors are arranged on one panel at the same time; the good radio frequency performance and the higher power handling capability are kept; and the electrical property consistency is ensured.

A three dimensional microwave switch having a plurality of waveguide transmission lines configured in an octahedral shape having microwave I/O ports at the corners. Individual actuators selectively move respective reeds within the waveguide transmission lines between a signal-attenuating position abutting the interior surface of the waveguide transmission line and a signal-conducting position substantially coaxial with the waveguide transmission line and abutting the signal lines of the I/O microwave ports couple to opposite ends of the waveguide transmission line.

The present invention comprises an antenna device for a portable radio communication device operable in at least a first and a second frequency band. The antenna device comprises a first electrically conductive radiating element having a feeding portion connectable to a feed device (RF) of the radio communication device for feeding and receiving radio frequency signals, a first ground plane portion arranged at a distance from the first radiating element, a second ground plane portion, and a controllable switch arranged between the first and second ground plane portion for selectively interconnecting or disconnecting the first and second ground plane portion.

A system and method for forming post passivation passive components, such as resistors and capacitors, is described. High quality electrical components, are formed on a layer of passivation, or on a thick layer of polymer over a passivation layer.

A semiconductor package comprising a non-conductive film which defines opposed top and bottom film surfaces and includes a plurality of vias disposed therein. Disposed on the top film surface is a plurality of upper leads which circumvent respective ones of the vias. Similarly, disposed on the bottom film surface is a plurality of lower leads which circumvent respective ones of the vias and are electrically connected to respective ones of the upper leads. At least one transmission line element is also disposed on the top film surface and electrically connected to at least one of the upper leads. Attached to the top film surface and electrically connected to at least one of the upper leads and the transmission line element is at least one semiconductor die. A package body at least partially covers the semiconductor die, the upper leads, the transmission line element, and the top film surface.

According to one aspect of the present invention, a method of forming a microelectronic assembly, such as an integrated passive device (IPD) (72), is provided. An insulating dielectric layer (32) having a thickness (36) of at least 4 microns is formed over a silicon substrate (20). At least one passive electronic component (62) is formed over the insulating dielectric layer (32).

The invention discloses a high-density and high-integration millimeter-wave tile-type phased-array antenna T assembly and aims to provide a T assembly design scheme which is reliable in performance, easy to integrate and low in profile. According to the high-density and high-integration millimeter-wave tile-type phased-array antenna T assembly provided by the technical schemes of the inventio, radio frequency signals are directly fed from the common end of the bottom of the lower cavity of the T assembly through a radio frequency coaxial connector; direct transition to a T-junction is realized; each chip integrates the functions of power pre-amplification, a power division network, amplitude-phase control, serial-parallel conversion, power source management and digital control; GaAs poweramplifier chips with corresponding quantities of channels are cascaded to form a multi-channel 2.5-dimensional heterogeneous extensible subarray unit; a low-frequency signal network directly controlsthe chips and the GaAs power amplifiers of the T assembly; multiple paths of signals are subjected to phase shift, amplitude attenuation and power amplification; the processed signals are sent to thefiltering function layer of the upper end multi-layer circuit board of the T assembly through a coplanar waveguide-to-coaxial conversion vertical interconnection structure; the filtered signals are finally sent to a microstrip patch antenna, so that radio frequency signals are transmitted.

The invention discloses a separate communication device and a mobile host. The device comprises a mobile display terminal and a mobile host, the mobile display terminal comprises a first wireless communication module, and an instruction input module, an information collection module and an information output module connected with the first wireless communication module, the mobile host comprises a second wireless communication module, a processing module and a mobile communication module, which are connected in sequence, and the first wireless communication module communicates with the second wireless communication module. The existing mobile terminal is set into the mobile display terminal and the mobile host, only necessary components of user interaction are arranged in the mobile display terminal handheld operated by a user, and an SIM card, a base band, a radio frequency antenna, a processing module, a memory and other power consumption components and parts of the mobile communication module are omitted, thereby greatly reducing the power consumption of the mobile display terminal and improving the cruising ability of the mobile display terminal and the lighting and thinning of a battery, and thus the lighting and thinning design of the mobile display terminal is facilitated.

A millimeter wave filter for surface mount applications includes at least one low temperature, co-fired ceramic layer defining an outer filter surface. A plurality of parallel, coupled line millimeter wavelength hairpin resonators, each formed from a single stripline or microstrip, are positioned on the outer filter surface. Each hairpin resonator is folded back upon itself into substantially parallel resonator lines.

The invention discloses a radio frequency coaxial connector, which comprises a socket and a plug, wherein the plug is formed by sleeving an outer conductor B, an insulator B and an inner conductor B. The radio frequency coaxial connector is characterized in that: a spring casing is clamped in a jack of an inner conductor A; an annular groove (13) is formed on the inner wall of an outer conductor A; the outer conductor B is a sleeve of which one end is provided with a raised punching encasing structure; the B inner conductor is a rod-like plug of which one end is provided with a spheroidal structure; the socket is spliced with the plug; the spheroidal structure on the end part of the inner conductor B is clamped with the spring sleeve clamped in the inner conductor A; and the raised punching encasing structure of the outer conductor B is clamped with the annular groove of the outer conductor A. Compared with the prior art, the radio frequency coaxial connector has high and stable electric and radio frequency performance, a simple structure and high fit reliability, ensures reliable and stable connection in a given frequency range, and is particularly applied to the high-frequency signal transmission of the field of communication.