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188results about How to "Achieve ultra-thin" patented technology

Semiconductor packaging method of wafer level silicon-based through hole

The invention discloses a semiconductor packaging method of wafer level silicon-based through hole, belonging to the field of semiconductor packaging. The packaging method substantially comprises the following steps: 1, making a cavity structure on a cover plate; 2, bonding the front surface of the cover plate with the front surface of a wafer through a bonding machine; 3, grinding the rear surface of the wafer by a grinder, and implementing a stress plasma etching on the rear surface of the wafer; 4, removing all silicon belonging to a scribe line region starting from the rear surface of the wafer; 5, etching the rear surface of the wafer in order to form silicon through holes, and exposing a bonding pad; 6, making passivation layers, metal layers and solder mask layers sequentially in the rear surface of the wafer and the silicon through holes, so as to compose a redistributed circuit layer, thereby conducting the solder pad to a designated solder ball position on the rear surface of the wafer; 7, making solder balls and cutting along the scribe line. By the implementation of the semiconductor packaging method of wafer level silicon-based through hole, the yield rate of wafer cutting technique is increased, the stress level in package structure is reduced, and the boundary dimension of the package structure is decreased.
Owner:BEIJING UNIV OF TECH

Super-thin broadband wave-absorbing metamaterial

The invention discloses super-thin broadband wave-absorbing metamaterial. The super-thin broadband wave-absorbing metamaterial comprises at least two layers of dielectric slabs which are laminated together. In the laminated dielectric slabs, a matching layer covers the upper surface of the dielectric slab at the top layer, a metal floor layer covers the lower surface of the dielectric slab at the bottom layer, and a non-closed annular metal layer further covers the upper surface of the dielectric slab at each layer. The non-closed annular metal layers located on the different dielectric slabs are same in shapes and mutually different in terms of sizes. The non-closed annular metal layers are distributed according to the pyramid structure, wherein the non-closed annular metal layer with the largest size is located on the dielectric slab at the bottom layer. According to the wave-absorbing metamaterial, due to the fact that electromagnetic parameters of each layer of structure are changed, phase positions of a reflected wave and a refracted wave are changed. Therefore, a final reflected wave and an incident wave are counteracted, so that the same effect that electromagnetic waves are absorbed by the metamaterial is achieved. Due to the fact that a metamaterial structure composed of the three dielectric slabs, three metal rings and the metal floor is adopted, the broadband wave-absorbing metamaterial is super-thin.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA

Flexible screen mobile terminal

The invention discloses a flexible screen mobile terminal. The flexible screen mobile terminal comprises a terminal main body which has a first main body surface for mounting a flexible screen and a second main body surface opposite to the first main body surface; a terminal accessory body which is arranged at one end of the terminal main body and has a first accessory body surface for mounting the flexible screen and a second accessory body surface opposite to the first accessory body surface; the flexible screen which is synchronously overlapped on the first main body surface and the first accessory body surface and is at least movably connected with one of the terminal main body and the terminal accessory body; and at least two camera modules which are arranged on the terminal accessory body and are synchronously positioned on the first accessory body surface or the second accessory body surface, wherein the terminal main body is connected with the terminal accessory body in a relative movement way; and the terminal main body and the terminal accessory body can rotate relatively about an axis which is parallel to a plane on which the flexible screen is positioned. The flexible screen movable terminal has the advantages of simple structure, long service life and small thickness.
Owner:GUANGDONG OPPO MOBILE TELECOMM CORP LTD

Splitting shaping device and splitting shaping method of ultrathin carbon fiber bundle

The invention discloses a splitting shaping device and a splitting shaping method of an ultrathin carbon fiber bundle. The splitting shaping device comprises a plurality of groups of filament spreading double-rollers, a heat roller and a levelness adjusting roller, which are sequentially arranged; each group of filament spreading double-rollers is provided with a hydraulic lifting machine, each hydraulic lifting machine is fixed on a support, two ends of the heat roller are fixedly connected to the support, and two ends of a rotating shaft of the levelness adjusting roller are also fixedly connected to the support; when the carbon fiber bundle is transported, the heat roller is fixed and does not rotate. The splitting and shaping method comprises the steps of enabling the carbon fiber bundle with serous fluid on the surface to sequentially pass through the filament spreading double-rollers, uniformly spreading the carbon fiber bundle under the extruding effect of the filament spreading double-rollers and the lubricating effect of the serous fluid, and pressing and flattening the fluctuated fibers in the carbon fiber bundle; enabling the carbon fiber bundle to pass through the heat roller, enabling the heat roller to be fixed and not to rotate, drying the carbon fiber bundle by virtue of the heat roller, and enabling the carbon fiber bundle to maintain the filament width after he carbon fiber bundle is spread. After the splitting shaping device and the splitting shaping method is applied to the carbon fiber production process, the ultrathin and online continuous and rapid production of the carbon fiber bundle can be realized, and the development of a downstream ultralight ultrathin product can be satisfied.
Owner:GUANGZHOU KINGFA CARBON FIBER NEW MATERIALS DEV +1

Reverse osmosis membrane, preparation method and application thereof

The invention discloses a reverse osmosis membrane, a preparation method and application thereof. The reverse osmosis membrane comprises a porous filter membrane supporting layer, a carbon nanotube membrane middle layer and a polyamide membrane selection layer which are arranged in sequence. According to the invention, the reverse osmosis membrane is a stable composite membrane integrating a porous filter membrane, a carbon nano tube membrane and a polyamide membrane, wherein the porous filter membrane serves as the substrate loaded by the carbon nano tube membrane and provides good mechanicalstrength, the carbon nano tube membrane has uniformly distributed nano-sized apertures and high porosity, and is used as a support for an interfacial polymerization reaction so as to achieve uniformdistribution of a monomer solution and controllable release of a monomer to prepare an ultrathin and high-quality polyamide membrane, and the polyamide membrane as a performance determination layer has the characteristic of ultra-thinness, and makes the novel reverse osmosis membrane have the flux far higher than that of the traditional reverse osmosis membrane while retaining the high rejection rate. According to the reverse osmosis membrane disclosed by the invention, the carbon nano tube membrane middle layer with uniformly distributed nano-sized apertures and high porosity is introduced for the first time, so that the performance is substantially improved.
Owner:SUZHOU INST OF NANO TECH & NANO BIONICS CHINESE ACEDEMY OF SCI

Integrated liquid-crystal display television

The present invention relates to an integrated liquid-crystal display television. The television comprises a front frame, a liquid crystal display panel, a backlight module and electronic elements. The backlight module comprises a middle frame and a back board. The middle frame is sheathed in the back board and is firmly connected with the back board so as to form an accommodation cavity. The accommodation cavity is internally provided with a backlight source, a reflective sheet, a diffusion board and an optical diagraph group. The front frame is sheathed at the periphery of the back board and is firmly connected with the back board. The liquid crystal display panel is clamped between the front frame and the middle frame. The electronic elements comprise a power supply board, a movement mainboard and a horn. A bulge is disposed in the inner side of the back board in a protruding manner. The bulge is provided with a plurality of through holes. The electronic elements are disposed in the bulge. A first support foot is integrated at the lower edge of the back board. A second support foot and a third support foot are integrated at the lower edge of the front frame. The first support foot, the second support foot and the third support foot form a base supporting the liquid-crystal display television. The integrated liquid-crystal display television has a simple and elegant structure and a novel appearance, is simple to assemble, has few steps, can be assembled efficiently, is low-cost, and is easy to be ultra-thin.
Owner:TPV DISPLAY TECH (XIAMEN) CO LTD

Continuous carbon fiber-reinforced PA6 composite with high strength, high modulus, electrical conductivity and thermal conductivity, and preparation method thereof

The invention relates to a continuous carbon fiber-reinforced PA6 composite with high strength, high modulus, electrical conductivity and thermal conductivity, and a preparation method thereof. The composite comprises, by weight, (1) 100 parts of PA6 resin, (2) 0.2 to 1 part of an anti-oxidant, (3) 0.2 to 1.2 parts of a flow promoter, (4) 2 to 10 parts of a flexibilizer and (5) 1 to 5 parts of a compatilizer. The preparation method comprises the following steps: premixing the above components according to a certain ratio, carrying out melting and mixing via a double/single-screw set and then extruding the obtained mixture into a die head for flow splitting and impregnation so as to prepare the continuous carbon fiber-reinforced PA6 composite with high strength, high modulus, electrical conductivity and thermal conductivity. Compared with conventional staple carbon fiber-reinforced PA6 composites, the continuous carbon fiber-reinforced PA6 composite prepared by using a special impregnation process in the invention has greatly improved mechanical properties since the length retention rate of carbon fibers in a PA6 carrier is high or continuous and has substantially improved electrical conductivity and thermal conductivity due to a continuous network structure, so the application range of the composite is greatly broadened.
Owner:浙江胜钢新材料有限公司

Surface deformation distribution test sensing element

The invention discloses a surface deformation distribution test sensing element which comprises a flexible sensing thin film, electrodes arranged at the periphery of the flexible sensing thin film uniformly at intervals, lead wires which are connected with the electrodes, an upper flexible insulation layer and a lower flexible insulation layer. Composite materials with strain sensitivity characteristics are utilized to prepare the flexible sensing thin film; and the electrodes and the lead wires are used for outputting specific resistivity information at different positions of the flexible sensing thin film. When in test, the lead wires and a testing instrument are connected; collection test and calculation are carried out by utilizing the electrical impedance imaging technology, the specific resistivity distribution at different positions of the flexible sensing thin film is obtained, and the strain size distribution is obtained through the specific relationship between the strain size of the sensing thin film and the size of the specific resistivity again. The test of two-dimensional deformation field quantity can be realized by the sensing element disclosed by the invention, and the sensing element has the characteristics of simple and ultrathin structure, flexibility, high resolution ratio and precision, great strain range and low cost.
Owner:CHINA UNIV OF MINING & TECH

Collimating film and preparation method of collimating film

The invention relates to a collimating film, in particular to a collimating film in the field of image recognition and a preparation method of the collimating film. In order to solve the problem that two layers of collimating diaphragms in a traditional rigid collimating sheet are difficult to align, the invention provides a collimating film and a preparation method of the collimating film. The collimating film sequentially comprises a collimating lens layer, a flexible substrate layer and a collimating hole layer; the collimating lens layer comprises a micro-lens array and a lens layer, and the collimating hole layer comprises a collimating hole array; the distribution of the collimation hole array is completely consistent with that of the micro-lens array; and the micro lens arrays of the collimating lens layer are arranged in order. The collimating film provided by the invention only comprises one collimating hole layer, so that the problem that two collimating diaphragms are difficult to align is solved. The collimating film can collimate and filter diffused light at a single-point pixel of an image to a certain extent to form a normal small-beam optical signal, transmits the normal small-beam optical signal to a corresponding photoelectric sensor, and is particularly suitable for a large-size, ultrathin and even flexible image recognition module.
Owner:NINGBO EXCITON TECH

Low-thickness and low-cost chip size package with cavity

The invention discloses a low-thickness and low-cost chip size package with a cavity, and belongs to the field of packaging of semiconductors. The package structure comprises a cover plate, a wafer, a function region, bonding pads, bonding glue, silicon through holes, a redistribution circuit layer and a solder ball, wherein a cavity structure is formed in the front surface of the cover plate; the wafer comprises a wafer front surface and a wafer back surface; the function region and the bonding pads are distributed on the wafer front surface; the bonding pads are distributed on the periphery of the function region and are communicated with one another; the bonding glue is positioned between the cover plate and the wafer; the cover plate and the wafer are bonded together by the bonding glue; the bonding pads are exposed via the silicon through holes, so that the bonding pads are communicated with the a follow-up redistribution layer; the redistribution circuit layer is positioned on the wafer back surface and comprises a passivation layer, a metal layer and a solder layer; the bonding pads are communicated with the solder ball via the redistribution circuit layer; and the solder ball is positioned on the redistribution circuit layer of the wafer back surface. The thickness of the package is reduced, and the stress in the structure is also reduced. Moreover, the yield of a cutting process and the reliability of the package are improved.
Owner:BEIJING UNIV OF TECH

Split liquid crystal television and realizing method thereof

The invention discloses a split liquid crystal television and a realizing method thereof. The split liquid crystal television comprises a liquid crystal module, a backlight module and a television signal box, which are split, wherein the liquid crystal module comprises a liquid crystal CELL and a supporting glass back plate, which are tightly pressed against and matched in shape with each other; an outer frame I is arranged on the edges of the liquid crystal cell and the supporting glass back plate; the backlight module comprises a square outer frame II, and a protective layer, an optical film, a diffusion plate, a lamp tube and a back plate are arranged in turn in the outer frame II along the opening direction of the outer frame II; and the television signal box comprises a television circuit, a power supply, and a lamp driving and TCON signal processing circuit. The liquid crystal television can be made ultrathin by accommodating a backlight module and a television signal box in an indoor wall body or a television cabinet; more importantly, the backlight module can be used alone for lighting, and the liquid crystal cell and the backlight module are partially separated, so the maintenance and replacement of the lamp tube of the backlight module are as simple as the replacement of a fluorescent lamp tube at home.
Owner:深圳康佳控股集团有限公司

Method for realizing ultra-thin television and device thereof

The invention relates to a method for realizing an ultra-thinned television and a device thereof. The ultra-thin television device comprises a television body, a base support case and a base support, wherein the base support case is arranged on the television body through the base support; a display screen and a first integrated interface are arranged on the television body, and the first integrated interface is connected with the display screen; a second integrated interface and a power supply, an inverter and a mainboard which are connected with the second integrated interface are arranged in the base support case; the first integrated interface is mutually connected with the second integrated interface; and the power supply, the inverter and the mainboard supply power and transmit data signals to the display screen through the connection of the first integrated interface and the second integrated interface. The television disassembles a video display part and signal processing parts reasonably, utilizes the thickness and space of the base support case reasonably, and transfers the signal process parts such as the power supply, the inverter, the mainboard and the like to the base support case, so that the ultra-thin and narrow border of the television can be realized simultaneously, and the television is convenient to assemble, disassemble and maintain.
Owner:KONKA GROUP

Ultra-thin dynamic combined cap for lithium battery

The invention relates to the technical field of lithium battery assemblies, in particular to an ultra-thin dynamic combined cap for a lithium battery. The ultra-thin dynamic combined cap comprises a top cover, an explosion-proof plate, a spacing ring, a connecting plate and a sealing ring, wherein the explosion-proof plate is arranged below the top cover; the connecting plate is arranged below the explosion-proof plate; a covered edge which is rolled up inwards is arranged on the edge of the explosion-proof plate; the covered edge wraps the edge of the top cover; the explosion-proof plate is fixedly connected with the middle part of the connecting plate; the spacing ring is arranged between the edge of the connecting plate and the explosion-proof plate; and the sealing ring sleeves the outside of the top cover, the explosion-proof plate, the spacing ring and the connecting plate. According to the ultra-thin dynamic combined cap for the lithium battery provided by the invention, the height of the cap can be reduced to below 3mm; the height of an internal space of the battery is increased; the height of a roll core of the lithium battery can be increased by about 1mm; and the energy density of the battery is effectively improved. The structures of the spacing ring, the explosion-proof plate and the connecting plate are changed, so that the target of reducing the overall height of the cap is achieved; ultra-thinning of the cap is achieved; the ultra-thin dynamic combined cap is high in shock resistance and reliable in application; and massive automatic production is facilitated.
Owner:CHANGZHOU WUJIN ZHONGRUI ELECTRONICS
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