Inserting electrode lead-out method for micro platinum thermal resistance temperature sensor

A temperature sensor, platinum thermal resistance technology, applied in the direction of resistors, non-adjustable metal resistors, resistors with lead-out terminals, etc. Effect

Inactive Publication Date: 2007-08-22
HARBIN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The electrodes of the traditional platinum thermal resistance temperature sensor are drawn out in Al 2 o 3 The surface of the Pt film on the ceramic is achieved by welding the electrode through high-temperature adhesive sintering. There must be a solder joint at the pad that is close to the thickness of the substrate (about 0.55mm), so that the thickness of the entire sensor can reach more than 1.1mm, and the response time It is also more than 30s, this method of electrode extraction cannot meet the requirements of ultra-thin body

Method used

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  • Inserting electrode lead-out method for micro platinum thermal resistance temperature sensor
  • Inserting electrode lead-out method for micro platinum thermal resistance temperature sensor

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specific Embodiment approach 1

[0013] Specific embodiment one: illustrate this embodiment in conjunction with Fig. 1 and Fig. 2, the steps of this embodiment are as follows:

[0014] Step 1: Clean Al 2 o 3 Substrate 1;

[0015] Step 2: Laser grooving: use laser to process Al 2 o 3 Substrate 1, in Al 2 o 3 Two electrode grooves 2 are opened at about 1 / 3 of one end of the substrate 1;

[0016] Step 3: Embedding of electrode 3: Embedding electrode 3 in electrode groove 2, filling the gap between electrode 3 and electrode groove 2 with high-temperature conductive adhesive, heat treatment at 700-900°C for 1 hour and sintering A high-temperature conductive adhesive to fix the electrode 3 in the electrode groove 2;

[0017] Step 4: sputtering platinum film 4;

[0018] Step 5: Plate making and resistance adjustment.

specific Embodiment approach 2

[0019] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the high-temperature conductive adhesive is a mixture of glass frit and platinum paste in a ratio of 1:5 to 1:10; other compositions and connection methods are the same as in Embodiment 2 One is the same.

specific Embodiment approach 3

[0020] Specific embodiment three: This embodiment is described in conjunction with FIG. 3. The difference between this embodiment and specific embodiment one is that the overall thickness of the embedded electrode miniature platinum thermal resistance temperature sensor is 0.15-0.65 mm, which reduces the overall thickness of the sensor. Reaching the ultra-thin requirement; other composition and connection methods are the same as those in Embodiment 1.

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Abstract

A method leads out electrode of micro-platinum thermo-resistance temperature sensor. In order to meet requirement of ultrathin body, its steps are: (1) Wash Al2O3 base plate<1>. (2) Laser notch: use laser to process <1> and open two electrode grooves <2> at 1/3 of its one end. (3) Electrode<3> embedment: embed <3> into <2> and fill slack between them with high-temperature conductive agglomerant. Heat treat the agglomerant under 700-900deg.C for 1h to fix <3> in <2>. (4) Sputter platinum film <4>. (5) Plate-making and resistance adjusting. In this invention, sensitive film surface smooth without tubercle, wiped joint of electrode can not add sensor thickness, which can realize detecting temperature information of micro-parts including slit, slip and micro-space etc. The invention realizes microminiaturization and ultrathin of platinum thermo-resistance temperature sensor. It has merits of simple technology and strong operation.

Description

technical field [0001] The invention relates to an electrode drawing method. Background technique [0002] The measuring range of the platinum thermal resistance temperature sensor can be from -250 to 640°C, and the performance is the most stable among the metal thermal resistance temperature sensors. For the platinum thermal resistance temperature sensor, the thicker the substrate, the greater the heat capacity of the sensor, and the shorter the response time. slower. Moreover, special parts (such as slits, narrow strips, micro spaces, etc.) in the fields of modern industry and weaponry need to detect tiny local temperature information, and require extremely fast response. Therefore, miniature ultra-thin temperature sensors are urgently needed in engineering. [0003] The electrodes of the traditional platinum thermal resistance temperature sensor are drawn out in Al 2 o 3 The surface of the Pt film on the ceramic is realized by welding the electrode through high-temper...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K7/18H01C7/00H01C7/02H01C7/04H01C17/28
Inventor 施云波郭建英张洪泉丁喜波时强冯桥华
Owner HARBIN UNIV OF SCI & TECH
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