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Inserting electrode lead-out method for micro platinum thermal resistance temperature sensor

A technology of temperature sensor and platinum thermal resistance, applied in the direction of resistors, non-adjustable metal resistors, resistors with lead-out terminals, etc., can solve the problems that cannot meet the requirements of ultra-thin body, and achieve strong operability and simple process Effect

Inactive Publication Date: 2009-06-24
HARBIN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The electrodes of the traditional platinum thermal resistance temperature sensor are drawn out in Al 2 o 3 The surface of the Pt film on the ceramic is achieved by welding the electrode through high-temperature adhesive sintering. There must be a solder joint at the pad that is close to the thickness of the substrate (about 0.55mm), so that the thickness of the entire sensor can reach more than 1.1mm, and the response time It is also more than 30s, this method of electrode extraction cannot meet the requirements of ultra-thin body

Method used

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  • Inserting electrode lead-out method for micro platinum thermal resistance temperature sensor
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  • Inserting electrode lead-out method for micro platinum thermal resistance temperature sensor

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specific Embodiment approach 1

[0013] Specific implementation mode one: combine figure 1 and figure 2 Describe this embodiment, the steps of this embodiment are as follows:

[0014] Step 1: Clean Al 2 o 3 Substrate 1;

[0015] Step 2: Laser grooving: use laser to process Al 2 o 3 Substrate 1, in Al 2 o 3 Two electrode grooves 2 are opened at about 1 / 3 of one end of the substrate 1;

[0016] Step 3: Embedding of electrode 3: Embedding electrode 3 in electrode groove 2, filling the gap between electrode 3 and electrode groove 2 with high-temperature conductive adhesive, heat treatment at 700-900°C for 1 hour and sintering A high-temperature conductive adhesive to fix the electrode 3 in the electrode groove 2;

[0017] Step 4: sputtering platinum film 4;

[0018] Step 5: Plate making and resistance adjustment.

specific Embodiment approach 2

[0019] Specific embodiment 2: The difference between this embodiment and specific embodiment 1 is that the high-temperature conductive adhesive is a mixture of glass frit and platinum paste in a ratio of 1:5 to 1:10; other compositions and connection methods are the same as the specific embodiment One is the same.

specific Embodiment approach 3

[0020] Specific implementation mode three: combination image 3 Describe this embodiment, the difference between this embodiment and the specific embodiment is that the overall thickness of the embedded electrode miniature platinum thermal resistance temperature sensor is 0.15-0.65 mm, which reduces the overall thickness of the sensor and meets the ultra-thin requirement; other components The connection method is the same as that in the first embodiment.

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Abstract

The invention relates to an inlaid electrode extraction method of a miniature platinum thermal resistance temperature sensor, which relates to an electrode extraction method. In order to meet the requirements of ultra-thin body, the steps of the present invention are as follows: 1: cleaning the Al2O3 substrate (1); 2: laser grooving: using a laser to process the Al2O3 substrate (1), about 1 / 3 of one end of the Al2O3 substrate (1) Two electrode grooves (2) are opened at the place; three: the electrode (3) is embedded: the electrode (3) is embedded in the electrode groove (2), and then the electrode (3) and the electrode (3) are filled with a high-temperature conductive adhesive. The gap between the electrode grooves (2) is heat treated at a temperature of 700 to 900° C. for 1 h to sinter a high-temperature conductive adhesive, and the electrode (3) is fixed in the electrode groove (2); four: sputtering platinum film (4) ); five: plate-making adjustment resistance. It makes the surface of the sensitive film flat and free of protrusions, and the electrode welding point does not increase the thickness of the sensor, so as to realize the purpose of detecting tiny local temperature information such as slits, narrow strips, and micro spaces. The invention realizes the miniaturization and ultra-thinization of the platinum thermal resistance temperature sensor, and has the characteristics of simple process, strong operability and the like.

Description

technical field [0001] The invention relates to an electrode drawing method. Background technique [0002] The measuring range of the platinum thermal resistance temperature sensor can be from -250 to 640 °C, and the performance is the most stable among the metal thermal resistance temperature sensors. For the platinum thermal resistance temperature sensor, the thicker the substrate, the greater the heat capacity of the sensor, and the shorter the response time. slower. Moreover, special parts (such as slits, narrow strips, microspaces, etc.) in the fields of modern industry and weaponry need to detect tiny local temperature information, and require extremely fast response. Therefore, miniature ultra-thin temperature sensors are urgently needed in engineering. [0003] The electrodes of the traditional platinum thermal resistance temperature sensor are drawn out in Al 2 o 3 The surface of the Pt film on the ceramic is achieved by welding the electrode through high-temper...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01K7/18H01C7/00H01C7/02H01C7/04H01C17/28
Inventor 施云波郭建英张洪泉丁喜波时强冯桥华
Owner HARBIN UNIV OF SCI & TECH
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