High power LED two-dimension light source

Abstract

The invention provides a high-power LED two-dimension light source, wherein an aluminum-base printed circuit board is directly welded or adhered with a high-power LED chip, the chip welded area is processed with a bowl-shape concave which circumference is furnished and plated with silver to form a light reflective area, the chip is arranged with a light reflective bowl with silver plated at inner surface to be fixed on the aluminum-base circuit board, a chip light outlet is packed with silicon-type transparent resin, in curvature shape, the light reflective bowl is covered with a lens unit, arranged with an electric connecting structure. The invention can be used to produce mono product or multiple beamed product, with standard distance connecting port, surface light source with low cost and high integration, better heat radiation, and uniform lighting effect, which can be used as general semi-conductor lighting source of variable lamps.

Description

technical field [0001] The invention relates to a high-power light-emitting diode (LED) two-dimensional light source, belonging to the technical field of semiconductor lighting. Background technique [0002] In recent years, LED light sources have been increasingly widely used, but the development of single-chip packaged LEDs in the direction of high power has been greatly restricted. The traditional power LED packaging structure is shown in Figure 1, including LED chip 1, heat sink 2, metal wire 3, silica gel 4, bracket 5, plastic seat 6, and lens 7. The bracket 5 is punched out of copper sheet, and the plastic seat 6 with the bracket is included through secondary injection molding; the heat sink 2 is formed by stamping and electroplated, and the heat sink 2 and the plastic seat 6 are embedded, which may be affected by the tolerance of the parts. More defective products with weak assembly are produced; the high-power and large-size LED chip 1 is placed on the heat sink 2, ...

AI Technical Summary

Problems solved by technology

There are two major problems in this process: 1. The eccentric positioning will cause the eccentricity of the light spot in the later application of LED products; 2. Improper application of thermal conductive adhesive will cause excessive thermal resistance between the heat sink and the heat dissipation aluminum substrate The heat of the LED cannot be fully dissipated, resulting in an increase in the internal temperature of the LED chip, which seriously affects the light output efficiency and working life of the LED light source

Moreover, when qualified single-chip packaged LED products are finally used, they still cannot be mass-produced by SMT, nor can they be electrically connected by standard connectors; Difficult, it is very cumbersome in structural design and assembly, the heat conduction path of each combined LED is very different, and the heat of some single LEDs cannot be fully dissipated, which will affect the overall work

[0004] At present, the packaging of LED chips above 3 W has encountered great difficulties in heat dissipation. The packaging cost of high-power LED single lamps is relatively high, which will directly increase the cost of lamps and directly affect the promotion and application of high-power LEDs in the lighting field.

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