The invention discloses an 
epoxy resin dough moulding compound and a preparation method thereof. The 
epoxy resin dough moulding compound is prepared by evenly kneading 35-40 parts by 
mass of 
epoxy resin paste, 4-5 parts by 
mass of curing agent mixture and 65-70 parts by 
mass of chopped 
fiber, wherein the epoxy resin paste comprises the following components in parts by mass: 80-120 parts of epoxy resin, 5-10 parts of 
plasticizer, 4-8 parts of filler, 3-6 parts of mould 
release agent and 0.5-2 part(s) of 
coupling agent; the curing agent mixture comprises the following components in parts by mass: 4-7 parts of latent curing agent, 1-3 part(s) of accelerator and 6-10 parts of amine curing agent, and the length of the 
chopper fiber is one eighth to one half inch. Compared with the traditional method, the preparation method eliminates the curing process, and the dough moulding compound is prepared by adding modifying components and different curing systems into the epoxy resin. The method has the advantages of simple operation, high production efficiency, long 
working life and easy formation. Since the baking oven and other heating equipment are not needed, the method can reduce the 
energy consumption. Moreover, the method is applicable to fields of structural materials and composite materials with high requirements for insulation and electrical properties, and can be easily promoted and implemented.