1143results about How to "Efficiently dissipated" patented technology

A seal and a mask having a seal adapted for confronting engagement with a surface of a user to form an interface therewith. The seal includes a first portion defined by a gel substance and a second portion associated with the first portion. The second portion includes a selectively formable substance adapted to be molded from a first pattern into a second pattern and to retain the second pattern responsive to being so molded. The seal and mask having the seal is tailored to patient by causing the formable portion of the seal to be placed in a malleable state, applying the seal to the patient while the formable portion is in the malleable state, and causing the formable portion to be placed in a fixed state to retain a shape generally conforming to the portion of the patient underlying the seal.

A high power light emitting diode (LED) lighting assembly incorporated with heat dissipation module is provided. The LED lighting assembly includes a heat exchange base, at least one LED array, at least one heat pipe and a heat dissipation module. The heat exchange base includes at least one LED configuration plan for mounting of the LED array and at least a hollow part for insertion of the heat pipe. The LED array is arranged at a predetermined projecting angle at the LED configuration plane. The heat pipe includes a heated section, a cooling section and a conducting section, and contains a working fluid therein. The heat exchange base is mounted to the heated section and the heat dissipation module is mounted to the cooling section. The thermal energy generated by the LEDs is conducted from the heat exchange base to the heated section of the heat pipe, whereby allowing the working fluid in the heat pipe to be heated and vaporized, and flows, from the conducting section to the cooling section for dissipation at the heat dissipation module.

The present invention provides an adhesion method of improving the heat conduction in a fixed direction by using a heat conductive adhesive made by blending boron nitride powder and adhesive polymer and adhering by orienting boron nitride powder in the heat conductive adhesive to the fixed direction under the magnetic atmosphere and an electronic component for effectively dissipating heat generated from semiconductor device 2, power source 4, light source or other components used for the electric products, and an electronic component excellent in radiation.

There is provided a light fixture, comprising a heat sink element and an upper housing mounted to the heat sink element, the heat sink element extending farther in a first direction in a first plane than a largest dimension of the upper housing in any plane parallel to the first plane. In addition, a light fixture, comprising a heat sink element, an upper housing mounted to the heat sink element and an additional component (e.g., a power supply module or a junction box) in contact with the heat sink element. Also, a light fixture, comprising a heat sink element, an upper housing thermally coupled to the heat sink element and at least one solid state light emitter thermally coupled to the heat sink element.

A high brightness LED apparatus with an integrated heat sink includes a heat sink base and at least one LED mounted in the heat sink base. The heat sink base includes multiple dissipating fins formed integrally on the substrate. Each of the at least one LED includes a body and multiple dies. The body is mounted in the substrate and includes a conductive seat with a top recess. The dies are mounted on the conductive seat in the top recess and produce a great amount of light beams for an enhanced brightness of illumination. The dissipating fins will efficiently dissipate heat produced by the at least one LED to prevent each LED from brightness decay and extend the useful life of each LED.

Solder compositions are introduced to interface between an IC chip and its associated heat exchanger cover. The solder compositions have a solidus-liquidus temperature range that encompasses the IC chip operational temperature range. The solder composition has the desired property of absorbing and rejecting heat energy by changing state or phase with each temperature rise and decline that result from temperature fluctuations associated with the thermal cycles of the integrated circuit chips. A path for high thermal conduction (low thermal resistance) from the IC chip to the heat exchanger to the ambient air is provided by an electronic module cover, configured as a cap with a heat exchanger formed or attached as a single construction, and made of the same material as the substrate, or made with materials of compatible thermal coefficients of expansion to mitigate the effects of vertical displacement during thermal cycling. The cap-heat exchanger cover is constructed to be compliant, and to contact both the IC chip and substrate.

An illumination apparatus of light emitting diodes and method of heat dissipation thereof are provided. The present illumination apparatus is associated with a loop heat pipe (LHP) device. The LHP device includes a condenser communicating with an evaporator. The illumination apparatus includes a base having a plurality of light emitting diodes disposed thereon and a cover with a light exit enclosing the base. The evaporator is associated with the base and the condenser is associated with the cover. The heat generated from the light emitting diodes is conducted to the cover, and thereby dissipated away.

A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.

An LED assembly including a wiring substrate with an opening at its center; a heat sink housed inside the opening; an LED chip mounted on the heat sink; a connecting section for electrically coupling the LED chip and wiring substrate; and a transparent resin covering the LED chip and connecting section. Heat generated from the LED chip is efficiently dissipated, and high productivity is also achievable.

There is presented a high frequency module, in which a recess 2a for mounting power amplifier device is formed on a lower surface of a dielectric substrate 2, and a recess 2b for mounting surface acoustic wave filter is formed on an upper surface of the dielectric substrate 2, and a power amplifier device 4 and a surface acoustic wave filter 8 are mounted through conductive bumps 3a and 3b on the recesses 2a and 2b, respectively. In addition, a through-hole conductor 11 whose one end is exposed at the lower surface of the dielectric substrate 2 is provided between the recesses 2a and 2b. The exposed end of the through-hole conductor 11 is attached to a thermal dissipation conductor 15 on an upper surface of an external electric circuit board 7 through a brazing material 13.

A direct connection multi-chip semiconductor element structure is proposed. A plurality of semiconductor chips are mounted and supported on a metal heat sink, such that heat generated by the chips during operation can be dissipated via the heat sink. A circuit structure is extended from the chips to provide direct electrical extension for the chips and improve the electrical performances. And exposed electrical connection terminals can be formed in the circuit structure extended from the chips to be directly electrically connected to an external electronic device.

A composite cover for dust, dirt and incidental moisture protection over an extended temperature range, EMI shielding to prevent radiation of internal circuit energy and preventing the entrance of external EMI. Also the cover provides mechanical strength and protection of circuitry and radiates heat created by internal circuitry. The cover provides lower levels of radiated emissions and improved resistance to incident external radiation. Electric and magnetic shielding is also provided.

A solid state lighting subassembly or fixture includes an anisotropic heat spreading material. A heat spreading layer may be placed between a light emitting diode (LED) and luminaire or reflector and serves to spread heat laterally away from the LED. Low profile, low weight heat spreading may be utilized both to retrofit existing light fixtures with. LEDs or to replace existing incandescent and fluorescent fixtures with LED based fixtures.

An FPC (31) on which LEDs (32) are mounted at predetermined intervals in the longitudinal direction is secured to a lower chassis (21b) used also as a heat-dissipating plate through an elastic heat conductive sheet (34). With a retaining plate (33) is overlapped on the mounting surface of the FPC (31), a screw (S) is inserted into the retaining plate (33) from the outside of a bezel (5) to fix the retaining plate. Furthermore, the FPC (31) is held between the retaining plate (33) and the lower chassis (21b).

The object of the present invention is to provide a light-emitting element mounting member and a semiconductor device using the same that is easy to process and that allows adequate heat dissipation. A light-emitting element mounting member 200 includes: a substrate 2 including an element mounting surface 2a mounting a semiconductor light-emitting element 1 and first and second conductive regions 21, 22 disposed on the element mounting surface 2a and connected to the semiconductor light-emitting element 1; a reflective member 6 including a reflective surface 6a defining an internal space 6b for housing the semiconductor light-emitting element 1 and containing a metal disposed on the element mounting surface 1a; and a metal layer 13 disposed on the reflective surface 6a. The reflective surface 6a is sloped relative to the element mounting surface 2a so that a diameter of the internal space 6b is greater away from the element mounting surface 2a.

A compact solar concentrator photovoltaic module assembly includes a plurality of rear contact solar cells configured in a matrix array on a substrate. The substrate is comprised of conductors laminated to an insulator sheet to form a receiver sheet. A lens sheet on which many lenses have been formed is disposed in a fixed spaced relation to the substrate and operates to focus sunlight onto the active surfaces of the PV cells. The overall thickness of the concentrator module is less than four inches thick. The receiver sheet may be assembled using standard, surface mount printed circuit board assembly techniques. The receiver sheet may have a secondary optical element and may also serve as part of the encapsulant for environmental protection.

A thermal dissipator disposable in a heat transfer relationship with a heat-generating source, such as an electronic component, which is mounted on a substrate, such as a printed circuit board. The dissipator includes a thermal dissipation member having a top and bottom surface, and a pressure sensitive adhesive layer disposed on the thermal dissipation member to cover at-least a portion of the bottom surface thereof. The dissipation member is formed of a thermally-conductive, electrically-nonconductive ceramic material. The pressure sensitive adhesive layer has an inner surface adhered to the bottom surface of the thermal dissipation member, and an outer surface bondable to a heat transfer surface of the source for attaching the dissipator to the source in a heat transfer relationship therewith.

An illumination device having enhanced thermal dissipating capacity is provided. The illumination device includes a heat sink, an LED module, a cover, an LED driver, and a lamp base. The LED module is disposed at one end of the heat sink. The cover covers the LED module. The LED driver is in connection with the LED module, and includes a circuit board and at least one electrical contact member disposed on the circuit board. The lamp base is connected to the other end of the heat sink, and comprises an insulating unit, a first electrode, a second electrode and at least one contact port. The contact port is arranged on the lateral interior of the insulating unit, so that the electrical contact member of the LED driver may establish electrical connection with the lamp base.

By filling a predetermined amount of conductive paste into an opening for forming a through hole or a VH formed in a resin insulating layer of a circuit board, and pressurizing the filled conductive paste under the condition of reduced pressure, removing air bubble strapped in the conductive paste.

An illumination apparatus of light emitting diodes and method of heat dissipation thereof are provided. The present illumination apparatus is associated with a loop heat pipe (LHP) device. The LHP device includes a condenser communicating with an evaporator. The illumination apparatus includes a base having a plurality of light emitting diodes disposed thereon and a cover with a light exit enclosing the base. The evaporator is associated with the base and the condenser is associated with the cover. The heat generated from the light emitting diodes is conducted to the cover, and thereby dissipated away.

A method of visualizing a sample in a wet environment including introducing a sample into a specimen enclosure in a wet environment and scanning the sample in the specimen enclosure in a scanning electron microscope, thereby visualizing the sample.

There are provided an LED package using a Si substrate and a fabricating method of the LED package. In the LED package, a supporting structure includes a Si substrate and an insulating layer formed on top and bottom surfaces of the Si substrate, and the supporting structure defines at least one groove in a bottom surface by partially removing the Si substrate and the insulating layer. A plurality of upper electrodes is formed on a top surface of the supporting structure. At least one LED is mounted on the top surface of the supporting structure, and the LED includes both terminals electrically connected to the upper electrodes. A metal filler is filled in the groove defined in the bottom surface of the supporting structure.

A light source apparatus including: a solid state light source that includes a pair of electrodes and emits light in response to power being supplied with from the electrodes; a liquid medium that removes heat that is generated in the solid state light source; and a mounting unit which is provided a flow path in an interior thereof in which the liquid medium flows, including: a base that defines the flow path; and a placement member which defines a remainder of the flow path and on which the solid state light source is mounted.

In a read / write device for writing and reading a storage medium by way of a heat assisted magnetic recording / reproduction scheme, the read / write device including an elevated slider provided with a semiconductor laser, provided is a heat dissipation mechanism for dissipating heat generated in the elevated slider to an outside of a housing of the read / write device. Further, the storage medium has a second heatsink layer formed of an Al film having a thickness of 50 μm, a backing layer, a heat barrier layer, a first heatsink layer, a magnetic recording layer, and a protection film on a glass substrate. With this arrangement, in a read / write device which performs a heat assisted magnetic recording and reproduction by a semiconductor laser provided on the elevated slider, the occurrence of malfunction due to temperature rises in the storage medium is prevented.

A light bulb shaped lamp according to the present invention includes: a hollow globe; an LED module including a base platform and an LED chip mounted on the base platform, the LED module being provided in the globe; a lead wire for supplying power to the LED module; and a stem extending toward the interior of the globe, in which the base platform is directly fixed to the stem.

A high power light emitting diode (LED) lighting assembly incorporated with heat dissipation module is provided. The LED lighting assembly includes a heat exchange base, at least one LED array, at least one heat pipe and a heat dissipation module. The heat exchange base includes at least one LED configuration plan for mounting of the LED array and at least a hollow part for insertion of the heat pipe. The LED array is arranged at a predetermined projecting angle at the LED configuration plane. The heat pipe includes a heated section, a cooling section and a conducting section, and contains a working fluid therein. The heat exchange base is mounted to the heated section and the heat dissipation module is mounted to the cooling section. The thermal energy generated by the LEDs is conducted from the heat exchange base to the heated section of the heat pipe, whereby allowing the working fluid in the heat pipe to be heated and vaporized, and flows, from the conducting section to the cooling section for dissipation at the heat dissipation module.

A thermally enhanced semiconductor package and a fabrication method thereof are provided. A plurality of conductive bumps are formed on bond pads on an active surface of a chip. A heat sink is attached to an inactive surface of the chip and has a surface area larger than that of the chip. An encapsulation body encapsulates the heat sink, chip and conductive bumps, while exposing a bottom or surfaces, not for attaching the chip, of the heat sink and ends of the conductive bumps outside. A plurality of conductive traces are formed on the encapsulation body and electrically connected to the ends of the conductive bumps. A solder mask layer is applied over the conductive traces and formed with a plurality of openings for exposing predetermined portions of the conductive traces. A solder ball is implanted on each exposed portion of the conductive traces.

A heat dissipation device includes a first heat sink (10) mounted on one side of a video graphics adapter (VGA) card (70) on which a heat generating componnent (74) is mounted to dissipate heat generated by the heat generating componnent, a second heat sink (30) mounted on an opposite side of the card, a first heat pipe (50, 50′) thermally connected to the first heat sink, a second heat pipe (60, 60′) discrete from the first heat pipe thermally connected to the second heat sink, and a connecting member (80, 80′) connected between the first and second heat pipes for transferring heat from the first heat pipe to the second heat pipe.

A refraction-type LED ceiling lamp, especially a plate-type ceiling lamp which is used on an indoor ceiling, includes primarily a fiber light guide plate, a reflection surface of which is provided with multiple chip-shape reflection elements, distributed in arrays. A chip size of the reflection elements decreases gradually toward an entrance surface by a geometric series; whereas, a gap between the reflection elements increases gradually. A reflection curve of the reflection element allows light to be projected out uniformly and a required illumination angle to be achieved.

A vehicle lighting unit can not only promote the dissipation of heat from a semiconductor light emitting device and a drive circuit for the device, both of which are the heat generation members, but also improve its maintenance workability. The vehicle lighting unit can include a light source module having a module main body. The module main body can include first and second semiconductor light emitting devices, drive circuits configured to drive and control the first and second semiconductor light emitting devices, and a heat dissipation fin for dissipating heat generated by the semiconductor light emitting devices and the drive circuits. Both the semiconductor light emitting devices and the drive circuit are directly attached to the module main body.