An object of the present invention is to suppress damage of an electrostatic chuck, by controlling stress exerted on each part of a table, which includes an
electrically conductive material, i.e., an
electrode for generating
plasma, a
dielectric layer for enhancing the in-plane uniformity of a
plasma process, and an electrostatic chuck. The table for a
plasma processing apparatus includes an
electrically conductive member connected with a
high frequency power source and adapted for plasma generation, for drawing ions present in the plasma, or for both thereof; a
dielectric layer provided on a top face of the
electrically conductive member, having a central portion and a
peripheral portion that are different in thickness relative to each other, and adapted for providing uniformity of
high frequency electric field intensity in a plane over the substrate to be processed; and an
electrode film for an electrostatic chuck, provided in the
dielectric layer and adapted for electrostatically chucking the substrate onto a top face of the
dielectric layer. With such configuration, the stress exerted on the electrostatic chuck due to temperature change can be controlled.